A disc type measuring device

Abstract

The application discloses a disc type measuring device, which comprises a display assembly and a measuring assembly; the measuring assembly comprises a support frame, a track and a probe; the support frame has a support surface, the track is arranged on the support surface, and the track is provided with a sliding block in sliding fit; the probe is detachably connected to the sliding block and can move along the length direction of the track with the sliding block; the probe is used for collecting surface information of a grinding and polishing disc; the display assembly is used for receiving the surface information of the grinding and polishing disc and displaying the surface information of the grinding and polishing disc received. In the technical scheme, the display assembly and the measuring assembly are cooperated to measure the flatness of the grinding and polishing disc.

Description

Technical Field

[0001] This application relates to the field of wafer fabrication technology, and in particular to a disk-shaped measuring device. Background Technology

[0002] With the rapid development of integrated circuit manufacturing technology, semiconductor materials, as ideal core materials for electronic devices, have been widely used in this field. Wafer processing technology is an important foundation for the fabrication of electronic devices, and mature and reliable processing technology is indispensable for fully utilizing the excellent performance of semiconductor materials. Among them, grinding and polishing are crucial processes in wafer processing. The good flatness of the grinding and polishing pad is a core prerequisite for ensuring the accuracy of the wafer's final shape after processing. However, in existing technologies, the flatness of the grinding and polishing pad is difficult to measure. Utility Model Content

[0003] This application proposes a disc-shaped measuring device for measuring the flatness of a grinding and polishing disc.

[0004] To achieve the above objectives, this application discloses the following technical solutions:

[0005] A disc-shaped measuring device includes: a display component and a measuring component;

[0006] The measuring assembly includes: a support frame, a track, and a probe; the support frame has a support surface, the track is disposed on the support surface, and the track is provided with a sliding block; the probe is detachably connected to the slider and can move along the length of the track with the slider.

[0007] The probe is used to collect surface information of the grinding and polishing disc, and the display component is used to receive the surface information of the grinding and polishing disc and display the received surface information of the grinding and polishing disc.

[0008] In some embodiments, the support frame further has support legs connected to the edge of the support surface, and the number of support legs is at least four.

[0009] In some embodiments, the support leg is a telescopic support rod.

[0010] In some embodiments, the track includes: an X-axis track and a Y-axis track;

[0011] The X-axis track and the Y-axis track are intersecting. The X-axis track is equipped with an X-axis slider, and the Y-axis track is equipped with a Y-axis slider. Both the X-axis slider and the Y-axis slider are detachably connected to the probe.

[0012] In some embodiments, the intersection of the X-axis track and the Y-axis track is a smooth transition, and the X-axis slider and the Y-axis slider are the same slider.

[0013] In some embodiments, the slider and the probe are snapped together.

[0014] In some embodiments, the support surface has a central opening;

[0015] The X-axis track is located on the width side of the central opening, and the Y-axis track is located on the length side of the central opening;

[0016] The probe includes an upper probe and a lower probe arranged vertically; the upper probe collects the surface condition of one grinding and polishing disc, and the lower probe collects the surface condition of another grinding and polishing disc.

[0017] In some embodiments, the upper probe and the lower probe are located on the same straight line.

[0018] In some embodiments, the track is made of stainless steel.

[0019] In some embodiments, the display component includes: a display screen and a digital oscilloscope;

[0020] The digital oscilloscope is used to process the surface information received from the grinding and polishing disc, and the display screen is used to display the processed surface information of the grinding and polishing disc.

[0021] As can be seen from the above technical solution, a disc-shaped measuring device can measure the flatness of a grinding and polishing disc through the synergistic effect of the display component and the measuring component. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some examples or embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort, and this application can be applied to other similar scenarios based on the provided drawings, all of which fall within the scope of protection of this utility model. Unless obvious from the linguistic context or otherwise specified, the same reference numerals in the drawings represent the same structure or operation.

[0023] Figure 1 A schematic diagram of the overall structure of the disc-shaped measuring device provided in the embodiments of this application;

[0024] Figure 2 This is a schematic diagram of the track and probe structure;

[0025] Figure 3 This is a schematic diagram of the surface of the grinding and polishing disc.

[0026] Wherein: 10 is the display component, 11 is the display screen, 12 is the digital oscilloscope, and 13 is the driver control component;

[0027] 20 is the measuring component, 21 is the support frame, 211 is the support surface, 212 is the support leg, 22 is the track, 221 is the X-axis track, 222 is the Y-axis track, and 23 is the probe;

[0028] 30 is for grinding and polishing discs. Detailed Implementation

[0029] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are merely illustrative of the application and not intended to limit it. The described embodiments are only a part of the embodiments of the present application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without inventive effort are within the scope of protection of the present application.

[0030] For the purposes of this application, the following structures are described in detail with reference to the accompanying drawings:

[0031] like Figures 1 to 3 As shown, this application provides a disc-shaped measuring device, which may include a display component 10 and a measuring component 20.

[0032] like Figure 1 As shown, the measuring component 20 may include: a support frame 21, a track 22, and a probe 23; the support frame 21 has a support surface 211, the track 22 is disposed on the support surface 211, and the track 22 is provided with a sliding block; the probe 23 is detachably connected to the slider and can move along the length direction of the track 22 with the slider.

[0033] like Figure 1 and Figure 3 As shown, probe 23 is used to collect surface information of grinding and polishing disk 30, and display component 10 is used to receive surface information of grinding and polishing disk 30 and display the received surface information of grinding and polishing disk 30.

[0034] In the above technical solution, a track 22 is set on the support surface 211 of the support frame 21, and the track 22 and the probe 23 are slidably connected by a slider. When it is necessary to inspect the surface of the grinding and polishing disk 30, the surface of the grinding and polishing disk 30 is placed within the acquisition range of the probe 23, and then the probe 23 is used to acquire data on the surface of the grinding and polishing disk 30. The data is then displayed on the display component 10. The operator can judge the flatness of the surface of the grinding and polishing disk 30 based on the displayed image. The operator can grind and polish the areas with abnormalities to achieve the flatness of the surface of the grinding and polishing disk 30, thereby ensuring the yield rate of wafer processing.

[0035] Based on the above technical solutions, such as Figure 1 As shown, the support frame 21 also has support legs 212, which are connected to the edge of the support surface 211. The number of support legs 212 is at least four, which is enough to isolate the probe 23 from moisture and extend the service life of the probe 23.

[0036] The above technical solution is optimized by making the support leg 212 a telescopic support rod, so that the relative height can be adjusted according to the needs of the probe 23 to meet the needs of different scenarios.

[0037] In order to expand the motion range of probe 23, such as Figure 2 As shown, track 22 may include: X-axis track 221 and Y-axis track 222.

[0038] The X-axis track 221 and the Y-axis track 222 are intersected. The X-axis track 221 is equipped with an X-axis slider, and the Y-axis track 222 is equipped with a Y-axis slider. Both the X-axis slider and the Y-axis slider are detachably connected to the probe 23.

[0039] In the above technical solution, if the probe 23 needs to be located at a certain position in the X direction, the probe 23 is connected to the X-direction slider on the X-direction track 221, and then slides to a certain position in the X direction; if the probe 23 needs to be located at a certain position in the Y direction, the probe 23 is connected to the Y-direction slider on the Y-direction track 222, and then slides to a certain position in the Y direction.

[0040] Based on the above solution, in order to save materials, the intersection of the X-axis track 221 and the Y-axis track 222 is a smooth transition, and the X-axis slider and the Y-axis slider are the same slider. In this technical solution, the slider can pass through the smooth transition, so that it can slide on the X-axis track 221 and the Y-axis track 222.

[0041] In order to enable a detachable connection between the slider and the probe 23, the slider and the probe 23 are snapped together.

[0042] To improve measurement efficiency, a central opening is provided in the middle of the support surface 211; the X-axis track 221 is provided on the width side of the central opening, and the Y-axis track 222 is provided on the length side of the central opening.

[0043] The probe 23 may include an upper probe and a lower probe arranged vertically; the upper probe collects the surface state of one grinding and polishing disk 30, and the lower probe collects the surface state of another grinding and polishing disk 30.

[0044] In the above technical solutions, you can refer to Figure 1 As shown, the upper probe is used to measure the grinding and polishing disk 30 located above the support surface, and the lower probe is used to measure the grinding and polishing disk 30 located below the support surface.

[0045] Based on the above technical solution, in order to make the structure of this disc-shaped measuring device more compact, the upper probe and the lower probe are located on the same straight line.

[0046] To make this measuring device more durable, the track 22 is made of stainless steel.

[0047] In order to more clearly observe the surface information of the grinding and polishing disk 30, the display component 10 includes: a display screen 11 and a digital oscilloscope 12;

[0048] The digital oscilloscope 12 is used to process the surface information received from the polishing disc 30, and the display screen 11 is used to display the processed surface information of the polishing disc 30. Specifically, the digital oscilloscope 12 receives the surface electrical signal of the polishing disc 30 transmitted by the probe, and after filtering and analysis, converts it into identifiable surface state information. The display screen 11 is signal-connected to the digital oscilloscope 12, and displays the processed information intuitively in numerical and waveform form, realizing real-time monitoring of the surface state of the polishing disc 30. The digital oscilloscope 12 and the probe 23 are electrically connected.

[0049] Based on the above technical solution, the display component 10 further includes a driver control unit 13, and a driver is provided on the track 22. The driver control unit 13 controls the driver to drive the probe 23 to move along the track 22.

[0050] It should be noted that the surface information is converted into a digital signal by the digital oscilloscope 12, analyzed by software, and a simulated image is generated and displayed on the screen 11. This allows personnel to view the image and make subsequent adjustments, while the original data is retained to generate a table for easy storage and statistics.

[0051] In some technical solutions, the position and number of probes 23 are selected according to actual needs before testing. Furthermore, since the size of the polishing discs 30 varies between different devices, full-plane measurement is not required. Therefore, before testing, a circular / annular area centered on the center of the supporting plane can be set based on the diameter data of the polishing disc 30 to be tested. This serves as the basis for setting the range of the test area. Before testing, probe 23 is positioned at the center of the supporting plane. After testing begins, probe 23 descends and moves to directly above the test area, starting measurement according to the pre-set pattern. Blank areas within the annular area are automatically subtracted. After completion, the test results are output in a table and image format. The test area can be divided into squares of different sizes according to actual needs, facilitating the viewing of differences in values ​​between areas at different accuracies.

[0052] In the above context, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0053] In the description of the embodiments of this application, unless otherwise stated, " / " means "or". For example, A / B can mean A or B. "And / or" in this article is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone.

[0054] It should be noted that, for ease of description, only the parts relevant to the application are shown in the accompanying drawings. Unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0055] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed, and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. The scope of this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-described application concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A disc-shaped measuring device, characterized in that, include: Display component (10) and measurement component (20); The measuring component (20) includes: a support frame (21), a track (22), and a probe (23); the support frame (21) has a support surface (211), the track (22) is disposed on the support surface (211), and the track (22) is provided with a sliding block; the probe (23) is detachably connected to the slider and can move along the length direction of the track (22) with the slider; The probe (23) is used to collect surface information of the grinding and polishing disc (30), and the display component (10) is used to receive the surface information of the grinding and polishing disc (30) and display the surface information of the grinding and polishing disc (30) received thereon.

2. The disc-shaped measuring device as described in claim 1, characterized in that, The support frame (21) also has support legs (212) that are connected to the edge of the support surface (211), and the number of support legs (212) is at least four.

3. The disc-shaped measuring device as described in claim 2, characterized in that, The support leg (212) is a telescopic support rod.

4. The disc-shaped measuring device as described in claim 2, characterized in that, The track (22) includes: an X-axis track (221) and a Y-axis track (222); The X-axis track (221) and the Y-axis track (222) are intersected. The X-axis track (221) is provided with an X-axis slider, and the Y-axis track (222) is provided with a Y-axis slider. Both the X-axis slider and the Y-axis slider are detachably connected to the probe (23).

5. The disc-shaped measuring device as described in claim 4, characterized in that, The intersection of the X-axis track (221) and the Y-axis track (222) is a smooth transition, and the X-axis slider and the Y-axis slider are the same slider.

6. The disc-shaped measuring device as described in claim 1, characterized in that, The slider and the probe (23) are engaged.

7. The disc-shaped measuring device as described in claim 4, characterized in that, The support surface (211) has a central opening in the middle; The X-axis track (221) is disposed on the width side of the central opening, and the Y-axis track (222) is disposed on the length side of the central opening; The probe (23) includes an upper probe and a lower probe arranged vertically; the upper probe collects the surface state of one grinding and polishing disc (30), and the lower probe collects the surface state of another grinding and polishing disc (30).

8. The disc-shaped measuring device as described in claim 7, characterized in that, The upper probe and the lower probe are located on the same straight line.

9. The disc-shaped measuring device as described in claim 1, characterized in that, The track (22) is made of stainless steel.

10. The disc-shaped measuring device as described in claim 1, characterized in that, The display component (10) includes: a display screen (11) and a digital oscilloscope (12). The digital oscilloscope (12) is used to process the surface information received from the grinding and polishing disk (30), and the display screen (11) is used to display the processed surface information of the grinding and polishing disk (30).

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