A detection light source for semiconductor wafer positioning and cutting

Abstract

The utility model discloses a detection light source for semiconductor wafer positioning cutting, including bottom plate, be provided with at least one mounting hole on the bottom plate, the mounting hole one end is provided with diffusion structure, the other end is provided with light source subassembly, the light source subassembly is provided on diffusion structure, the light source subassembly one end is equipped with the cover plate subassembly, the cover plate subassembly is connected with the power cord of light source subassembly electricity and signal connection, the bottom plate one end is connected with the air inlet pipe for communicating with the gas source, the bottom plate inside is provided with the air pipe, diffusion structure one end is provided with the air vent, the air inlet pipe, air pipe, air vent are connected in turn.

Description

Technical Field

[0001] This utility model relates to the technical field of inspection light sources for semiconductor wafers, and particularly to an inspection light source for positioning and cutting semiconductor wafers. Background Technology

[0002] In the semiconductor wafer dicing process, wafers are separated into individual chips, and there are two main methods: mechanical dicing and laser dicing. Due to cost considerations, mechanical dicing is more commonly used. The machine dicing process uses diamond blades to cut along the dicing path, while deionized water is sprayed to cool and wash away debris.

[0003] In the inspection of wafer positioning and cutting, coaxial light sources are commonly used to illuminate the wafer.

[0004] For example, the structure of a coaxial light source is described in Chinese Utility Model Patent No. CN215489281U, entitled "An Adjustable Rectangular Coaxial Light Source". The basic structure of the coaxial light source is: light source → light-emitting plate → semi-transparent lens → transparent glass sheet. The semi-transparent lens converts the light from the light source into vertical light that hits the wafer to be tested through a tilted structure and the principle of semi-transmission and semi-reflection, while providing observation for the camera above.

[0005] However, in the field of wafer positioning and cutting inspection, the use of coaxial light source for wafer positioning and cutting inspection has the following drawbacks: During the wafer positioning and cutting process, mechanical cutting of the wafer can cause wafer debris or deionized water splashed liquid to adhere to the light-transmitting glass plate of the coaxial light source, thereby blocking or scattering the light from the coaxial light source and affecting the camera's observation and imaging. Utility Model Content

[0006] The purpose of this invention is to overcome the above-mentioned defects in the prior art and provide a detection light source for semiconductor wafer positioning and cutting. An air curtain is formed on one side of the diffuser structure through an air inlet pipe, a ventilation pipe, and a ventilation opening. The air curtain can blow away debris and dust or block liquid splashes, thereby ensuring the normal propagation of light from the light source component and ensuring imaging quality.

[0007] To achieve the above objectives, this utility model provides a detection light source for semiconductor wafer positioning and cutting, including a base plate. At least one mounting hole is provided on the base plate. A diffuser structure is fitted at one end of the mounting hole, and a light source assembly is fitted at the other end. The light source assembly is fitted onto the diffuser structure. A cover plate assembly is installed at one end of the light source assembly. A power line for electrical and signal connection to the light source assembly is externally connected to the cover plate assembly. An air inlet pipe for connecting to an air source is externally connected to one end of the base plate. A ventilation pipe is provided inside the base plate. A ventilation opening is provided at one end of the diffuser structure. The air inlet pipe, ventilation pipe, and ventilation opening are sequentially connected.

[0008] Preferably, the number of mounting holes, diffuse structure, and light source components are all set to two.

[0009] Preferably, the diffuse structure includes a first annular structure and a second annular structure installed at one end of the first annular structure. The first annular structure is located at one end of the light source assembly, and the second annular structure is respectively sleeved on the light source assembly and the cover plate assembly. The inner wall of one end of the first annular structure is provided with a frustum-shaped cavity, and the ventilation opening is opened at one end of the frustum-shaped cavity. An observation hole is opened in the middle of the second annular structure.

[0010] Preferably, the inner wall of the mounting hole is provided with an annular wall, which divides the mounting hole into a first mounting hole located at one end of the annular wall and a second mounting hole located at the other end of the annular wall. The first annular structure of the diffuser structure is provided with a first stepped platform at one end. The first annular structure is sleeved on the first mounting hole, the first stepped platform is sleeved on the annular wall, and the light source assembly is sleeved on the second mounting hole.

[0011] Preferably, the light source assembly includes a ring-shaped PCB board, an LED bead area mounted at one end of the ring-shaped PCB board, and a wiring area mounted at the other end of the ring-shaped PCB board, wherein the wiring area is electrically connected to the power supply line and signal line.

[0012] Preferably, the LED bead area includes an upper bead area, a lower bead area, a left bead area, and a right bead area. The upper bead area, lower bead area, left bead area, and right bead area are used for individual lighting or for combined lighting. Each of the upper bead area, lower bead area, left bead area, and right bead area includes a plurality of evenly distributed LED beads.

[0013] Preferably, the outer side of the annular PCB board is fitted onto the mounting hole, and the inner side of the annular PCB board is fitted onto the diffuse structure.

[0014] Preferably, the side wall of the base plate is provided with a number of evenly distributed screw holes, and the diffuse structure is fixed by tightening the screw holes of the base plate with a screw.

[0015] Preferably, one end of the mounting hole has a mounting groove, and the cover plate assembly includes an upper cover plate mounted on one end of the light source assembly and a lower cover plate mounted on the bottom of the upper cover plate. One end of the upper cover plate has an annular double-sided adhesive coating, and one end of the light source assembly is attached to the annular double-sided adhesive coating. The upper cover plate has at least one through hole corresponding to the number of mounting holes, and the through hole is fitted onto the diffuser structure. The upper cover plate is fitted onto the upper part of the mounting groove, and the power cord is inserted into the lower cover plate. The lower cover plate is fitted onto the lower part of the mounting groove.

[0016] Preferably, adhesive is used to seal the area between the edge of the diffused structure and the mounting hole, the area between the edge of the upper cover plate and the upper part of the mounting groove, and the area between the lower cover plate and the lower part of the mounting groove.

[0017] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0018] 1. This utility model provides a detection light source for positioning and dicing semiconductor wafers. Through an air inlet pipe → air outlet pipe → air opening, an air curtain is formed on one side of the diffuser structure (the side in front of the light source assembly). This air curtain, once formed, has the following three effects:

[0019] A. Prevent splashed liquid (cooling and lubricating liquid such as deionized water) from adhering to one side of the diffuser structure to prevent splashed liquid from interfering with the light path emitted by the light source component.

[0020] B. Prevent or blow away debris and dust to avoid interference with the light path emitted by the light source components;

[0021] The above A and B ensure that the optical path is not disturbed, ensure the intensity and uniformity of light, and ensure the quality of photographic images;

[0022] C. The air curtain plays a role in heat dissipation when it flows.

[0023] 2. Further discussion and analysis,

[0024] Existing coaxial light sources have the following drawbacks: the semi-transparent lens in the coaxial light source operates on the principle of a beam splitter that is half-reflective and half-transparent. It is positioned at a 90-degree angle to both the light source and the wafer under test, and the semi-transparent lens is tilted at a certain angle. This semi-transparent lens has the following two drawbacks:

[0025] A. As the semi-transparent mirror ages, its brightness will decrease by approximately 5%-8% per year;

[0026] B. Mechanical vibration can easily cause the semi-transparent mirror of the coaxial light source to shift, causing the semi-transparent mirror to change a certain tilt angle, which can easily lead to optical path deviation, requiring daily calibration.

[0027] In this invention, the positions of the light source component and the diffuser structure are both horizontal with the wafer to be tested. Mechanical vibration will not cause the position angle of the light source component and the diffuser structure to shift. Therefore, the optical path of this invention is simpler, the calibration is simpler, and the optical path is more stable, avoiding the problem of needing daily calibration due to mechanical vibration.

[0028] 3. Further discussion and analysis revealed that the number of mounting holes, diffused structure, and light source components is set to two, meaning that this utility model adopts a dual-station light source that works simultaneously, thereby improving efficiency.

[0029] 4. Further discussion and analysis,

[0030] The existing coaxial light source technology has the following drawbacks: the coaxial light source achieves perpendicular illumination of the light path onto the wafer to be inspected through a semi-transparent mirror. The perpendicularly illuminated light path is not sensitive enough to features with low height difference (such as shallow scratches), which can easily lead to an increase in the edge breakage rate of subsequent cutting by 10%-15%.

[0031] The light emitted by the light source assembly of this invention hits the outer side of the first annular structure, the frustum-shaped cavity inside the first annular structure, and the second annular structure of the diffuse structure, respectively. This results in both vertical and high / low angle illumination, effectively avoiding the problem of increased dicing and chipping rates caused by the inability to detect shallow scratches on the wafer.

[0032] 5. Further discussion and analysis,

[0033] Existing coaxial light sources have the following drawbacks: the wafer itself has material thickness differences, uneven thin film deposition, or patterned structures (such as integrated current layers), which can lead to inconsistencies in reflected / scattered light signals in the vertical optical path of the coaxial light source, thus affecting the detection effect;

[0034] This invention improves upon this defect through point 4 above. Furthermore, this invention divides the LED beads into four areas: an upper LED bead area, a lower LED bead area, a left LED bead area, and a right LED bead area, allowing for individual or combined lighting.

[0035] When individual or combined LEDs are lit, the light intensity of each LED area can be dynamically adjusted for different regions, thereby solving the problem of inconsistent reflected / scattered light signals caused by material thickness differences on the wafer surface.

[0036] When the center of the wafer to be inspected is relatively dense (high-density chip), it can reduce the light intensity of one of the LED areas, thereby reducing the light intensity to avoid overexposure and improving defect contrast.

[0037] 6. This utility model seals the gaps between the edge of the diffuse structure and the mounting hole, the edge of the upper cover plate and the upper part of the mounting groove, and the lower cover plate and the lower part of the mounting groove by filling them with glue. This prevents water vapor generated by cooling and lubricating liquids such as deionized water from evaporating into the light source and causing damage to the light source. It also avoids the problem of light path damage and image impact caused by fogging of the semi-transparent lens of the coaxial light source. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 This is a schematic diagram of the structure of a detection light source for positioning and cutting semiconductor wafers, provided by an embodiment of this utility model;

[0040] Figure 2 This is an exploded structural diagram of a detection light source for positioning and cutting semiconductor wafers, provided by an embodiment of this utility model.

[0041] Figure 3 This is a front cross-sectional view of a detection light source for semiconductor wafer positioning and cutting provided by an embodiment of the present invention;

[0042] Figure 4 This is a schematic diagram of a beveled section of a detection light source for positioning and cutting semiconductor wafers, provided by an embodiment of this utility model.

[0043] Figure 5 This is a schematic diagram of the diffuse structure provided in an embodiment of the present invention;

[0044] Figure 6 This is a schematic diagram of a slanted section of the base plate provided in an embodiment of this utility model;

[0045] Figure 7 This is an exploded structural diagram of the diffuse structure, light source assembly, annular double-sided adhesive coating, cover plate assembly, and power line provided in one of the embodiments of this utility model.

[0046] Figure 8 This is an exploded structural diagram from another perspective of the diffuse structure, light source assembly, annular double-sided adhesive coating, cover plate assembly, and power line provided in an embodiment of this utility model.

[0047] The diagram includes:

[0048] 1. Base plate; 11. Mounting hole; 111. First mounting hole; 112. Second mounting hole; 113. Annular wall; 15. Screw hole; 16. Mounting groove; 2. Diffuse structure; 20. Vent opening; 21. First annular structure; 210. Frustum-shaped cavity; 215. First stepped platform; 22. Second annular structure; 220. Observation hole; 225. Second stepped platform; 3. Light source assembly; 31. Annular PCB board; 311. Upper LED bead area; 312. Lower LED bead area; 313. Left LED bead area; 314. Right LED bead area; 32. LED bead area; 33. Wiring area; 35. Annular double-sided adhesive coating; 4. Cover plate assembly; 41. Upper cover plate; 415. Through hole; 416. Inner convex wall; 42. Lower cover plate; 5. Power cord; 6. Air inlet pipe; 7. Vent pipe. Detailed Implementation

[0049] The technical solution of this embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiment is one embodiment of the present invention, and not all embodiments thereof. Based on this embodiment of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0050] Please see Figures 1 to 8 This utility model provides a detection light source for semiconductor wafer positioning and cutting, including a base plate 1. The base plate 1 has at least one mounting hole 11. A diffuser structure 2 is fitted at one end of the mounting hole 11, and a light source assembly 3 is fitted at the other end. The light source assembly 3 is fitted on the diffuser structure 2. A cover plate assembly 4 is installed at one end of the light source assembly 3. A power line 5 that is electrically and signal-connected to the light source assembly 3 is connected to the cover plate assembly 4. An air inlet pipe 6 for connecting to an air source is connected to one end of the base plate 1. A ventilation pipe 7 is opened inside the base plate 1. A ventilation opening 20 is opened at one end of the diffuser structure 2. The air inlet pipe 6, the ventilation pipe 7, and the ventilation opening 20 are connected in sequence.

[0051] Furthermore, the number of mounting holes 11, diffuse structure 2, and light source assembly 3 are all set to two. By setting the number of mounting holes 11, diffuse structure 2, and light source assembly 3 to two, the detection light source for semiconductor wafer positioning and cutting in this embodiment of the present invention adopts dual-station light source working simultaneously, thereby improving efficiency.

[0052] The diffuse structure 2 includes a first annular structure 21 and a second annular structure 22 installed at one end of the first annular structure 21. The first annular structure 21 is located at one end of the light source assembly 3, and the second annular structure 22 is respectively fitted onto the light source assembly 3 and the cover plate assembly 4. The inner wall of one end of the first annular structure 21 has a frustum-shaped cavity 210, which gradually decreases in size from the outside to the inside. The frustum-shaped cavity 210 allows the light path emitted by the light source assembly 3 to illuminate at both high and low angles. A vent opening 20 is opened at one end of the frustum-shaped cavity 210, and an observation hole 220 is opened in the middle of the second annular structure 22. The advantage of this diffuse structure 2 is that it allows the light path emitted by the light source assembly 3 to form both vertical illumination and high and low angle illumination, thereby effectively avoiding the problem of increased dicing chipping rate caused by the inability to detect shallow scratches on the wafer.

[0053] An annular wall 113 protrudes from the inner wall of the mounting hole 11, dividing the mounting hole 11 into a first mounting hole 111 at one end and a second mounting hole 112 at the other end. A first stepped platform 215 is provided at one end of the first annular structure 21 of the diffuser structure 2. The first annular structure 21 is fitted onto the first mounting hole 111, and the first stepped platform 215 is fitted onto the annular wall 113. The light source assembly 3 is fitted onto the second mounting hole 112. The first stepped platform 215 being fitted onto the annular wall 113 makes the installation of the diffuser structure 2 more stable.

[0054] The light source assembly 3 includes a ring-shaped PCB board 31, an LED bead area 32 mounted on one end of the ring-shaped PCB board 31, and a wiring area 33 mounted on the other end of the ring-shaped PCB board 31. The wiring area 33 is electrically and signal-connected to the power line 5.

[0055] The LED bead area 32 includes an upper LED bead area 311, a lower LED bead area 312, a left LED bead area 313, and a right LED bead area 314. Each of these areas is used for either individual or combined lighting. Each area contains a number of evenly distributed LED beads. The advantage of this arrangement is that when individually or in combination, each LED bead area can dynamically adjust the light intensity for different regions, thus solving the problem of inconsistent reflected / scattered light signals caused by differences in material thickness on the wafer surface.

[0056] for example:

[0057] When the dicing track in the upper edge region of the wafer to be inspected is wide, the upper LED bead area 311 can be brightened and other LED bead areas dimmed to enhance the illumination and compensate for the dark edge effect.

[0058] When the center of the wafer to be inspected is relatively dense (high-density chip), it can reduce the light intensity of one of the LED areas, thereby reducing the light intensity to avoid overexposure and improving defect contrast.

[0059] The outer side of the annular PCB board 31 is fitted onto the mounting hole 11, and the inner side of the annular PCB board 31 is fitted onto the diffuse structure 2. Specifically, the outer side of the annular PCB board 31 is fitted onto the second mounting hole 112 of the mounting hole 11, and the inner side of the annular PCB board 31 is fitted onto the second annular structure 22 of the diffuse structure 2.

[0060] The base plate 1 has several evenly distributed screw holes 15 on its side wall. The base plate 1 screw holes 15 are tightened with screws to fix the diffuse structure 2.

[0061] The mounting hole 11 has a mounting groove 16 at one end. The cover plate assembly 4 includes an upper cover plate 41 mounted on one end of the light source assembly 3 and a lower cover plate 42 mounted on the bottom of the upper cover plate 41. The upper cover plate 41 has an annular double-sided adhesive coating 35 at one end. The light source assembly 3 is attached to the annular double-sided adhesive coating 35. The upper cover plate 41 has at least one through hole 415 corresponding to the number of mounting holes 11. The through hole 415 is fitted onto the diffuser structure 2. The upper cover plate 41 is fitted onto the upper part of the mounting groove 16. The power cord 5 is inserted into the lower cover plate 42. The lower cover plate 42 is fitted onto the lower part of the mounting groove 16.

[0062] Furthermore, the through hole 415 on the upper cover plate 41 is provided with an inner convex wall 416, and the second annular structure 22 of the diffuse structure 2 is provided with a second stepped platform 225 at one end, which is fitted onto the inner convex wall 416.

[0063] The edges of the diffuse structure 2 and the mounting hole 11, the edges of the upper cover plate 41 and the upper part of the mounting groove 16, and the lower cover plate 42 and the lower part of the mounting groove 16 are sealed with glue.

[0064] Furthermore, the first annular structure 21 of the diffuse structure 2 is sealed with glue between it and the mounting hole 11. Several threaded holes are opened on the upper cover plate 41 and the lower cover plate 42 respectively. Bolts are installed through the threaded holes to fix the upper cover plate 41 and the lower cover plate 42 to the mounting groove 16 respectively. Glue is filled into the threaded hole for sealing. The advantage of doing this is to prevent water vapor generated by cooling and lubricating liquids such as deionized water from evaporating and entering the light source, which could damage the light source.

[0065] An embodiment of this utility model provides a detection light source for positioning and cutting semiconductor wafers, the assembly principle of which is as follows:

[0066] S1: Take out the base plate 1, put the diffuse structure 2 into the mounting hole 11, that is, put the first annular structure 21 of the diffuse structure 2 into the first mounting hole 111, put the first stepped platform 215 of the first annular structure 21 of the diffuse structure 2 into the annular wall 113, and then screw the ferrule into the screw hole 15 on the side wall of the base plate 1 to fix the diffuse structure 2.

[0067] S2: Insert the power cord 5 into the lower cover plate 42, solder the wiring area 33 at the other end of the ring PCB board 31 of the light source assembly 3 to the power cord 5, and after soldering, put the light source assembly 3 into the second mounting hole 112, and put the light source assembly 3 into the second ring structure 22 of the diffuse structure 2.

[0068] S3: The other end of the annular PCB board 31 of the light source assembly 3 is attached with an annular double-sided adhesive coating 35. The upper cover plate 41 is fitted onto the upper part of the mounting groove 16. One end of the upper cover plate 41 is abutted and attached to the light source assembly 3. The through hole 415 of the upper cover plate 41 is fitted onto the second annular structure 22 of the diffuse structure 2. The inner convex wall 416 on the through hole 415 is fitted onto the second stepped platform 225 of the second annular structure 22. Bolts are screwed into the threaded hole of the upper cover plate 41 for fixation.

[0069] S4: Fit the lower cover plate 42 onto the lower part of the mounting groove 16, and screw bolts into the threaded holes of the lower cover plate 42 to fix it;

[0070] S6: Insert the air intake pipe 6 into one end of the base plate 1;

[0071] S7: Seal the space between the first annular structure 21 of the diffuse structure 2 and the mounting hole 11 by filling with glue, seal the space between the edge of the upper cover plate 41 and the upper part of the mounting groove 16 and between the lower cover plate 42 and the lower part of the mounting groove 16 by filling with glue, and seal the threaded holes of the upper cover plate 41 and the lower cover plate 42 by filling with glue.

[0072] An embodiment of this utility model provides a detection light source for positioning and cutting semiconductor wafers, the working principle of which is as follows:

[0073] S1: Place the wafer to be tested on one side of the diffuse structure 2, place the camera on one side of the cover plate assembly 4, connect the power line 5 to the power and signal, and the light source assembly 3 emits light to the diffuse structure 2, so that the diffuse structure 2 forms both vertical illumination light path and high and low angle illumination light path, and hits the wafer to be tested with the vertical illumination light path and the high and low angle illumination light path.

[0074] S2: The LED bead area 32 of the light source component 3 is divided into four areas: upper bead area 311, lower bead area 312, left bead area 313 and right bead area 314, which can be lit individually or in combination. When lit individually or in combination, the light intensity of each bead area can be dynamically adjusted for different areas.

[0075] S3: The camera observes and images the wafer under inspection through the observation hole 220.

[0076] An embodiment of this utility model provides a detection light source for positioning and cutting semiconductor wafers, the advantages of which are:

[0077] 1. By passing through the air inlet pipe 6 → air vent pipe 7 → air vent 20, an air curtain is formed on one side of the diffuser structure 2 (the front side of the light source component 3). After the air curtain is formed, it not only plays a role in heat dissipation, but also prevents liquid, debris and dust from adhering, thereby ensuring that the light path is not interfered with, ensuring the light intensity and uniformity, and ensuring the quality of the photographic image.

[0078] 2. The optical path of this utility model is simpler and more stable. Mechanical vibration will not cause the position and angle of the light source component 3 + diffuse structure 2 to shift, and daily calibration is not required.

[0079] 3. This utility model adopts dual-station light sources working simultaneously, with a smaller layout structure and higher detection efficiency;

[0080] 4. This utility model forms both vertically irradiated light paths and light paths with high and low angle irradiation, thereby effectively avoiding the problem of increased cutting edge breakage rate caused by the inability to detect shallow scratches on the wafer.

[0081] 5. This utility model has an upper LED bead area 311, a lower LED bead area 312, a left LED bead area 313, and a right LED bead area 314. When the four LED bead areas are lit individually or in combination, each LED bead area can dynamically adjust the light intensity of different areas to solve the problem of inconsistent reflected / scattered light signals caused by material thickness differences on the wafer surface.

[0082] 6. This utility model fills the space between the first annular structure 21 of the diffuse structure 2 and the mounting hole 11, between the edge of the upper cover plate 41 and the upper part of the mounting groove 16, and between the lower cover plate 42 and the lower part of the mounting groove 16 with glue for sealing, and fills the threaded holes of the upper cover plate 41 and the lower cover plate 42 with glue for sealing, so as to prevent water vapor from evaporating into the light source and causing damage to the light source.

[0083] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A detection light source for positioning and dicing semiconductor wafers, characterized in that, The system includes a base plate (1), on which at least one mounting hole (11) is provided. A diffuser structure (2) is fitted at one end of the mounting hole (11), and a light source assembly (3) is fitted at the other end. The light source assembly (3) is fitted on the diffuser structure (2). A cover plate assembly (4) is installed at one end of the light source assembly (3). A power line (5) is connected to the cover plate assembly (4) for electrical and signal connection with the light source assembly (3). An air inlet pipe (6) for connecting to a gas source is connected at one end of the base plate (1). A ventilation pipe (7) is provided inside the base plate (1). A ventilation opening (20) is provided at one end of the diffuser structure (2). The air inlet pipe (6), ventilation pipe (7), and ventilation opening (20) are connected in sequence.

2. The detection light source for semiconductor wafer positioning and cutting according to claim 1, characterized in that, The number of mounting holes (11), diffuse structure (2), and light source components (3) are all set to two.

3. The detection light source for semiconductor wafer positioning and cutting according to claim 1, characterized in that, The diffuse structure (2) includes a first annular structure (21) and a second annular structure (22) installed at one end of the first annular structure (21). The first annular structure (21) is located at one end of the light source assembly (3). The second annular structure (22) is respectively sleeved on the light source assembly (3) and the cover plate assembly (4). A frustum-shaped cavity (210) is provided on the inner wall of one end of the first annular structure (21). The ventilation opening (20) is opened at one end of the frustum-shaped cavity (210). An observation hole (220) is opened in the middle of the second annular structure (22).

4. The detection light source for semiconductor wafer positioning and cutting according to claim 3, characterized in that, The inner wall of the mounting hole (11) is provided with an annular wall (113), which divides the mounting hole (11) into a first mounting hole (111) located at one end of the annular wall (113) and a second mounting hole (112) located at the other end of the annular wall (113). The first annular structure (21) of the diffuser structure (2) is provided with a first stepped platform (215) at one end. The first annular structure (21) is sleeved on the first mounting hole (111), and the first stepped platform (215) is sleeved on the annular wall (113). The light source assembly (3) is sleeved on the second mounting hole (112).

5. The detection light source for semiconductor wafer positioning and cutting according to claim 1, characterized in that, The light source assembly (3) includes an annular PCB board (31), an LED bead area (32) mounted on one end of the annular PCB board (31), and a wiring area (33) mounted on the other end of the annular PCB board (31). The wiring area (33) is electrically and signal connected to the power line (5).

6. A detection light source for semiconductor wafer positioning and cutting according to claim 5, characterized in that, The LED bead area (32) includes an upper bead area (311), a lower bead area (312), a left bead area (313), and a right bead area (314). The upper bead area (311), lower bead area (312), left bead area (313), and right bead area (314) are used for individual lighting or for combined lighting, respectively. The upper bead area (311), lower bead area (312), left bead area (313), and right bead area (314) each include a number of evenly distributed LED beads.

7. A detection light source for semiconductor wafer positioning and dicing according to claim 5, characterized in that, The outer side of the annular PCB board (31) is fitted onto the mounting hole (11), and the inner side of the annular PCB board (31) is fitted onto the diffuse structure (2).

8. A detection light source for positioning and cutting semiconductor wafers according to claim 1, characterized in that, The base plate (1) has several evenly distributed screw holes (15) on its side wall. The screw holes (15) of the base plate (1) are tightened by screws to fix the diffuse structure (2).

9. A detection light source for positioning and cutting semiconductor wafers according to claim 1, characterized in that, The mounting hole (11) has a mounting groove (16) at one end. The cover plate assembly (4) includes an upper cover plate (41) installed at one end of the light source assembly (3) and a lower cover plate (42) installed at the bottom of the upper cover plate (41). The upper cover plate (41) has an annular double-sided adhesive coating (35) at one end. The light source assembly (3) is pasted on the annular double-sided adhesive coating (35). The upper cover plate (41) has at least one through hole (415) corresponding to the number of mounting holes (11). The through hole (415) is fitted on the diffuser structure (2). The upper cover plate (41) is fitted on the upper part of the mounting groove (16). The power cord (5) is inserted on the lower cover plate (42). The lower cover plate (42) is fitted on the lower part of the mounting groove (16).

10. A detection light source for semiconductor wafer positioning and cutting according to claim 9, characterized in that, The edges of the diffuse structure (2) and the mounting hole (11), the edges of the upper cover plate (41) and the upper part of the mounting groove (16), and the lower cover plate (42) and the lower part of the mounting groove (16) are sealed with glue.

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