In-situ thermoelectric experiment platform of transmission electron microscope

Abstract

The utility model relates to transmission electron microscope in situ experiment technical field especially, and more particularly to a kind of transmission electron microscope in situ thermoelectric experiment platform, including operating lever, bearing, chip module and flexible short line row, the output end of operating lever is provided with the tilting table that can double-axis tilt;Bearing is set on tilting table;Chip module is set on bearing, for carrying sample, chip module includes metal electrode layer, and metal electrode layer is used to provide controllable electric field and temperature field for sample;Flexible short line row includes: multilayer insulation layer, sequentially set along the thickness direction of flexible short line row;Wire, set between adjacent two layers of insulation layer, one end of wire and the wiring end of operating lever are electrically connected, the other end and metal electrode layer are electrically connected, this thermoelectric experiment platform under the premise of guaranteeing enough insulation distance between wire, effectively control the line row width, reduce the hindrance to double-axis tilting movement, realize the compatibility of multi-channel signal transmission and tilting function.

Description

Technical Field

[0001] This utility model relates to the field of in-situ transmission electron microscopy (TEM) experimental technology, and in particular to an in-situ thermoelectric experimental platform for TEM. Background Technology

[0002] In-situ transmission electron microscopy (TEM) technology enables the observation of material microstructure while simultaneously testing its properties in real time, providing an important tool for materials science research. Performance evaluation of thermoelectric materials requires the simultaneous measurement of both electrical and thermal properties; therefore, in-situ TEM thermoelectric experimental platforms need to integrate multiple functions such as heating, temperature measurement, and power supply.

[0003] A transmission electron microscope (TEM) in-situ thermoelectric experimental platform typically includes components such as a control lever, a tilting stage, a support structure, and a chip module. To achieve different functions, the chip module needs to be equipped with multiple metal electrodes, including heating electrodes, temperature measuring electrodes, and energizing electrodes. These electrodes require independent signal transmission channels, typically requiring 8-12 wires for connection.

[0004] Transmission electron microscope (TEM) stages are typically equipped with biaxial tilt functionality to adjust the observation angle of the sample. However, existing technologies face significant technical challenges in achieving multi-electrode signal transmission. Current flexible busbars employ a single-layer wiring method, with all conductors arranged side-by-side in the same plane. When connecting multiple metal electrodes, sufficient conductor spacing must be maintained to avoid electrical interference and short circuits between adjacent conductors, resulting in a significant increase in the width of the flexible busbar, typically reaching 10-15 mm.

[0005] Such a width would severely impact the biaxial tilting motion within the confined working space of a transmission electron microscope. The wide array of wires generates significant bending resistance during tilting, limiting the range and smoothness of the tilting stage and affecting observation results. Furthermore, reducing the wire spacing to decrease the wire width can easily lead to electrical crosstalk or short circuits between adjacent metal electrodes. Especially at high temperatures, such short circuits can severely affect the accuracy of thermoelectric experiments. Utility Model Content

[0006] This invention provides an in-situ thermoelectric experimental platform for transmission electron microscopy. While ensuring sufficient insulation distance between the conductors, the platform effectively controls the width of the wire array, reduces the obstruction to the biaxial tilting motion, and achieves compatibility between multi-channel signal transmission and tilting function.

[0007] This invention provides an in-situ thermoelectric experimental platform for transmission electron microscopy, comprising: an operating lever with a tilting stage capable of biaxial tilting at its output end; a support component disposed on the tilting stage; a chip module disposed on the support component for supporting a sample, the chip module including a metal electrode layer for providing a controllable electric and temperature field to the sample; and a flexible short busbar comprising: multiple insulating layers arranged sequentially along the thickness direction of the flexible short busbar; and a wire disposed between adjacent insulating layers, one end of the wire being electrically connected to the terminal of the operating lever and the other end being electrically connected to the metal electrode layer.

[0008] In one possible implementation, the metal electrode layer includes multiple metal electrodes, and the flexible short busbar further includes: multiple electrode interfaces disposed on the surface of the flexible short busbar for electrically connecting the multiple metal electrodes; and multiple conductive posts penetrating the insulating layer, with one end of each conductive post electrically connected to the multiple electrode interfaces and the other end electrically connected to the multiple wires.

[0009] In one possible implementation, a clearance hole is provided on the flexible short line, the chip module is located inside the clearance hole, and multiple electrode interfaces are arranged around the clearance hole.

[0010] In one possible implementation, the electrode interface is located on the side of the flexible short busbar away from the carrier, so that the electrode interface can be connected to the metal electrode by pressure welding.

[0011] In one possible implementation, a reinforcing rib is provided on the side of the flexible short line facing the carrier, the reinforcing rib abuts against the carrier and is positioned opposite to the electrode interface.

[0012] In one possible implementation, the flexible short line has strip-shaped holes along its extension direction, which are used to release bending stress during the biaxial tilting motion of the tilting table.

[0013] In one possible implementation, a wire is provided between two adjacent insulating layers, with the wire located on one side of the slot; or, two wires are provided between two adjacent insulating layers, with the two wires located on opposite sides of the slot.

[0014] In one possible implementation, the carrier is provided with a first positioning part and a positioning groove; a second positioning part that cooperates with the first positioning part is provided on the side of the flexible short line facing the carrier; wherein the chip module is disposed in the positioning groove.

[0015] In one possible implementation, the control lever is provided with a first busbar at its terminal, and a flexible short busbar is electrically connected to the first busbar via a plug-in connector.

[0016] In one possible implementation, the chip module includes: a chip substrate with a central hole; a thin film carrier layer disposed on the surface of the chip substrate, the thin film carrier layer having a carrier position for carrying a sample located within the central hole, the thin film carrier layer having an observation window for an electron beam to pass through and irradiate the sample at the carrier position, a metal electrode layer disposed on the surface of the thin film carrier layer; and a protective layer disposed on the surface of the thin film carrier layer and covering at least a portion of the metal electrode layer.

[0017] This invention provides an in-situ thermoelectric experimental platform for transmission electron microscopy. It utilizes a flexible short wire array, comprising multiple insulating layers arranged sequentially along the thickness direction, with the wires positioned between adjacent insulating layers. This multi-layered, three-dimensional wiring method solves the technical problem of excessive wire array width affecting biaxial tilting motion in multi-electrode connections during thermoelectric experiments. Thermoelectric experiments require various functional electrodes, including heating electrodes, temperature measuring electrodes, and energizing electrodes, necessitating a total of 8-12 wires for signal transmission. In existing single-layer wiring methods, all wires are arranged side-by-side on the same plane, resulting in a flexible wire array width of 10-15 mm considering wire spacing and insulation requirements. This invention's multi-layered insulating structure distributes the wires across different layers, reducing the required planar width by increasing space utilization in the thickness direction. When the tilting stage performs biaxial tilting, traditional wide wire arrays generate significant bending resistance, limiting the tilting angle range and affecting the smoothness of movement. The multi-layered structure significantly reduces the wire array width, lowering bending stiffness and resistance during tilting, allowing the tilting stage to smoothly complete biaxial tilting movements. In related technologies, single-layer planar wiring requires sufficient conductor spacing to avoid interference and short circuits, resulting in excessively wide cable trays that severely affect the tilting stage's motion performance within the confined space of a transmission electron microscope. This invention, however, utilizes multi-layered insulating three-dimensional wiring to effectively control cable tray width while ensuring sufficient insulation distance between conductors. This reduces obstruction to dual-axis tilting motion and achieves compatibility between multi-channel signal transmission and tilting functionality. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 This is an exploded structural diagram of a tilting table, a carrier, a chip module, and a flexible short line provided by this utility model.

[0020] Figure 2 This is a schematic diagram of the structure of an operating lever provided by this utility model.

[0021] Figure 3 This is a cross-sectional structural diagram of a flexible short line bar provided by this utility model.

[0022] Figure 4 This is a three-dimensional structural diagram of a flexible short line bar provided by this utility model.

[0023] Figure 5 This is a schematic diagram of the structure of a flexible short line and a first line provided by this utility model.

[0024] Figure 6 This is a three-dimensional structural diagram of a chip module provided by this utility model.

[0025] Figure 7 This is a schematic diagram of the planar structure of a chip module provided by this utility model.

[0026] Figure label: 1. Control lever; 11. Tilting table; 12. Handheld cavity; 13. First cable tray; 2. Supporting component; 21. First positioning part; 22. Positioning groove; 3. Chip module; 31. Metal electrode; 32. Chip substrate; 321. Center hole; 33. Thin film carrier layer; 331. Carrier position; 332. Observation window; 4. Flexible short cable; 41. Insulation layer; 42. Conductor; 43. Electrode interface; 44. Conductive post; 45. Clearance hole; 46. Reinforcing rib; 47. Strip hole; 48. Second positioning part; 49. Plug-in connector. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0028] The following is combined Figure 1-7 This invention describes an in-situ thermoelectric experimental platform for transmission electron microscopy, comprising: an operating lever 1, a support member 2, a chip module 3, and a flexible short wire array 4, wherein: The output end of the control lever 1 is equipped with a tilting table 11 that can be tilted on both axes.

[0029] The support component 2 is mounted on the tilting table 11.

[0030] The chip module 3 is disposed on the carrier 2 and is used to carry the sample. The chip module 3 includes a metal electrode layer, which is used to provide a controllable electric field and temperature field for the sample.

[0031] The flexible short wire bar 4 includes: multiple insulating layers 41 arranged sequentially along the thickness direction of the flexible short wire bar 4; and a wire 42 disposed between two adjacent insulating layers 41, with one end of the wire 42 electrically connected to the terminal of the operating rod 1 and the other end electrically connected to the metal electrode layer.

[0032] In this invention, a flexible short wire array 4, comprising multiple insulating layers 41 arranged sequentially along the thickness direction and wires 42 disposed between adjacent insulating layers 41, solves the technical problem of excessive wire array width affecting dual-axis tilting motion in multi-electrode connections during thermoelectric experiments through a multi-layer, three-dimensional wiring method. Thermoelectric experiments require various functional electrodes, such as heating electrodes, temperature measuring electrodes, and energizing electrodes, necessitating a total of 8-12 wires 42 for signal transmission. In existing single-layer wiring methods, all wires 42 are arranged side-by-side on the same plane, requiring a flexible wire array width of 10-15mm considering wire spacing and insulation requirements. The multi-layer insulating layer 41 structure of this invention distributes the wires 42 across different layers, reducing the planar width requirement by increasing space utilization in the thickness direction. When the tilting platform 11 tilts in both directions, traditional wide wire arrays generate significant bending resistance, limiting the tilting angle range and affecting the smoothness of movement. With the multi-layer structure, the wire array width is significantly reduced, lowering the bending stiffness and resistance during tilting, allowing the tilting platform 11 to smoothly complete the dual-axis tilting motion. In related technologies, single-layer planar wiring requires maintaining sufficient spacing between conductors 42 to avoid interference and short circuits, resulting in excessively wide wires, which severely affects the motion performance of the tilting stage 11 within the confined space of a transmission electron microscope. However, this invention, through three-dimensional wiring with multiple insulating layers 41, effectively controls the wire width while ensuring sufficient insulation distance between conductors 42, reducing obstruction to dual-axis tilting motion and achieving compatibility between multi-channel signal transmission and tilting functions.

[0033] Specifically, thermoelectric experiments require multiple functional electrodes, such as energizing electrodes, heating electrodes, and temperature measuring electrodes. Each type of electrode typically requires 2-4 units, totaling 8-12 wires 42 for signal transmission. In traditional single-layer wiring, all wires 42 can only be arranged side-by-side on the same plane. Considering the spacing and insulation requirements of the wires 42, the width of the flexible cable tray would be quite large. However, the multi-layer insulation layer 41 structure distributes the wires 42 across different layers between adjacent insulation layers 41, significantly reducing the planar width by increasing the thickness slightly.

[0034] In one specific embodiment, when performing in-situ characterization of thermoelectric materials, the tilting stage 11 needs to tilt along two axes to obtain observation fields at different angles. Traditional wide wire arrays generate significant bending resistance during tilting, limiting the tilting angle range or causing the tilting motion to be less smooth. By adopting a multi-layered flexible short wire array 4, the wire array width is significantly reduced, lowering the bending stiffness and resistance during tilting, allowing the tilting stage 11 to complete the biaxial tilting action more smoothly.

[0035] In related technologies, multi-electrode signal transmission typically employs a single-layer planar wiring method, with all conductors 42 arranged side-by-side within the same layer. To avoid interference and short circuits between adjacent conductors 42, sufficient spacing between conductors 42 is required, resulting in a large overall width of the wiring array. This significantly impacts the motion performance of the tilting stage 11 within the confined space of a transmission electron microscope. However, in this embodiment of the invention, through the three-dimensional wiring of multiple insulating layers 41 and conductors 42, the width of the wiring array is controlled within a smaller range while ensuring sufficient insulation distance between conductors 42. This effectively reduces the obstruction to the dual-axis tilting motion and achieves compatibility between multi-channel signal transmission functionality and the motion performance of the tilting stage 11.

[0036] like Figure 2 As shown, the control lever 1 includes: an outer rod of the control lever 1, serving as the overall mechanical structure carrier; a tilting stage 11, located at the output end of the control lever 1 and encapsulated within the outer rod of the control lever 1, used to support the in-situ thermoelectric experimental stage; a dual-axis tilting drive shaft, located in the middle section of the control lever 1 and encapsulated within the outer rod of the control lever 1, with its front end connected to the tilting stage 11; a linear stepper motor, located at the rear end of the control lever 1 and connected to the dual-axis tilting drive shaft, encapsulated within the handheld cavity 12, providing driving force for the tilting stage 11; and a handheld cavity 12, located at the rear end of the control lever 1, internally housing the linear stepper motor and wiring terminals, and externally providing the wiring terminals of the control lever 1 for electrical connection with an external control system.

[0037] In some embodiments, the metal electrode layer includes a plurality of metal electrodes 31, and the flexible short busbar 4 further includes: a plurality of electrode interfaces 43 disposed on the surface of the flexible short busbar 4 for electrically connecting the plurality of metal electrodes 31 respectively; a plurality of conductive posts 44 penetrating the insulating layer 41, one end of the plurality of conductive posts 44 being electrically connected to the plurality of electrode interfaces 43 respectively, and the other end being electrically connected to the plurality of wires 42 respectively.

[0038] In this invention, the metal electrode layer includes multiple metal electrodes 31, and the flexible short busbar 4 includes multiple electrode interfaces 43 disposed on its surface, and multiple conductive posts 44 penetrating the insulating layer 41 and electrically connected to the electrode interfaces 43 and wires 42 respectively. The vertical penetration of the conductive posts 44 enables the construction of independent signal channels for the multiple metal electrodes 31. The structure of the conductive posts 44 penetrating the insulating layer 41 makes full use of the thickness space of the flexible short busbar 4 for signal distribution, avoiding the increase in width caused by the planar arrangement of multiple electrode interfaces 43.

[0039] Specifically, multiple electrode interfaces 43 are distributed on the surface of the flexible short line 4, corresponding one-to-one with different metal electrodes 31 on the chip module 3. Conductive posts 44 penetrate vertically downwards from the electrode interfaces 43 through each insulating layer 41, reaching the corresponding wires 42 and establishing an electrical connection. Each conductive post 44 provides a dedicated signal transmission channel for its corresponding metal electrode 31. Signals from different functional electrodes are transmitted independently through their respective conductive posts 44 and wires 42 without interference.

[0040] In one specific embodiment, when the chip module 3 includes multiple functional electrodes such as heating electrodes, temperature measuring electrodes, and energized electrodes, each electrode requires independent control and measurement signals. Through the vertical connection of the conductive posts 44, a dedicated channel can be allocated to each electrode within a limited line width. The heating electrode receives power control signals, the temperature measuring electrode outputs temperature feedback signals, and the energized electrode performs electrical measurements. All functional electrodes work simultaneously without signal crosstalk.

[0041] In related technologies, multi-electrode connections often employ planar wiring, with the electrode interface 43 and wire 42 arranged in the same plane. When the number of electrodes increases, to avoid short-circuit risks between adjacent connection points, the spacing between the electrode interfaces 43 needs to be increased, leading to an increase in the overall connection area width and affecting the compactness of the busbar. However, in this embodiment, the vertical through-connection of the conductive post 44 transforms planar wiring into three-dimensional wiring. While ensuring independent signal transmission for each electrode, it effectively controls the planar dimensions of the busbar, improving the integration and reliability of multi-electrode connections.

[0042] In some embodiments, a clearance hole 45 is provided on the flexible short line 4, the chip module 3 is located in the clearance hole 45, and multiple electrode interfaces 43 are arranged around the clearance hole 45.

[0043] In this invention, a clearance hole 45 is provided on the flexible short line 4, and the chip module 3 is located within the clearance hole 45. Multiple electrode interfaces 43 are arranged around the clearance hole 45. The embedded layout minimizes the distance between the electrode interfaces 43 and the metal electrodes 31 on the chip module 3. The clearance hole 45 provides space for the chip module 3, allowing the electrode interfaces 43 to be distributed close to the edge of the chip module 3, significantly shortening the length of the wires 42 during pressure bonding.

[0044] Specifically, the size of the clearance hole 45 matches the external dimensions of the chip module 3. After the chip module 3 is embedded in the clearance hole 45, the multiple metal electrodes 31 on its surface correspond closely to the electrode interfaces 43 arranged around the clearance hole 45. During pressure bonding, only a very short wire 42 is needed to connect the electrode interfaces 43 to the corresponding metal electrodes 31, reducing the bending of the wires 42 and the complexity of the wiring.

[0045] In this embodiment of the invention, the embedded design of the clearance hole 45 minimizes the distance between the electrode interface 43 and the metal electrode 31, simplifies the pressure welding process, and improves the accuracy and reliability of the connection, making it particularly suitable for applications with dense multi-electrode connections.

[0046] In some embodiments, the electrode interface 43 is disposed on the side of the flexible short busbar 4 away from the carrier 2, so that the electrode interface 43 can be connected to the metal electrode 31 by pressure welding.

[0047] In this invention, the electrode interface 43 is located on the side of the flexible short line 4 away from the carrier 2, allowing the electrode interface 43 to be connected to the metal electrode 31 via pressure welding. This reasonable interface placement provides an ideal geometric configuration for the pressure welding operation. After the flexible short line 4, carrier 2, and chip module 3 are assembled, the electrode interface 43 is located on the surface of the flexible short line 4, adjacent to the metal electrode 31 on the chip module 3 within the clearance hole 45, facilitating pressure welding from above.

[0048] Specifically, the electrode interface 43 is located on the upper surface of the flexible short line 4, and the metal electrode 31 is located on the surface of the chip module 3, forming a face-to-face configuration in the vertical direction. The pressure welding tool can directly approach the electrode interface 43 from above and apply pressure and ultrasonic energy to the connection point between the electrode interface 43 and the metal electrode 31 to achieve a reliable metal-to-metal bond. The arrangement away from the carrier 2 avoids spatial interference from the carrier 2 on the pressure welding operation.

[0049] In one specific embodiment, when performing batch pressure welding of multiple electrodes, the working head of the pressure welding equipment needs to precisely position and operate each connection point. The electrode interface 43 is located on the upper surface of the flexible short wire bar 4, providing the pressure welding equipment with a unified operating plane and sufficient access space, allowing multiple electrodes to be pressure welded sequentially in a preset order, thus improving assembly efficiency.

[0050] In this embodiment of the invention, the arrangement of the electrode interface 43 on the side away from the carrier 2 fully considers the operational requirements of the pressure welding process, provides ideal working conditions for the pressure welding tool, and ensures the process feasibility and connection reliability of multi-electrode connection.

[0051] In some embodiments, the flexible short line 4 is provided with a reinforcing rib 46 on the side facing the carrier 2. The reinforcing rib 46 abuts against the carrier 2 and is disposed opposite to the electrode interface 43.

[0052] In this invention, a reinforcing rib 46 is provided on the side of the flexible short wire busbar 4 facing the support member 2. The reinforcing rib 46 abuts against the support member 2 and is positioned opposite to the electrode interface 43. The back support structure improves the structural stability during the pressure welding connection process. The reinforcing rib 46 provides reverse support force during the pressure welding operation, preventing the flexible short wire busbar 4 from deforming due to the pressure welding pressure, and ensuring that the pressure welding force can be effectively transmitted to the connection interface.

[0053] Specifically, the reinforcing rib 46 is disposed on the lower surface of the flexible short wire busbar 4, forming a back-to-back support relationship with the electrode interface 43 on the upper surface. When the welding tool applies downward pressure to the electrode interface 43, the reinforcing rib 46 provides an upward reaction force to the electrode interface 43 through its contact with the bearing member 2, thereby enabling a stable pressure distribution between the electrode interface 43 and the metal electrode 31. The local thickening design of the reinforcing rib 46 improves the rigidity of this area.

[0054] In one specific embodiment, during ultrasonic pressure welding, the pressure applied by the welding head to the electrode interface 43 is typically tens to hundreds of Newtons. Without sufficient back support, the flexible short wire strip 4 will bend and deform downwards, resulting in pressure dispersion and poor contact. The presence of the reinforcing rib 46 provides sufficient rigidity to the welding area, ensuring that all the pressure from the welding head can be effectively applied to the connection interface and guaranteeing welding quality.

[0055] In this embodiment of the invention, the back support design of the reinforcing rib 46 effectively solves the deformation problem of the flexible substrate during the pressure welding process, ensuring the stability and repeatability of the pressure welding process, and improving the success rate and consistency of multi-electrode connections.

[0056] In some embodiments, the flexible short line 4 is provided with strip-shaped holes 47 along its extension direction. The strip-shaped holes 47 are used to release bending stress during the biaxial tilting motion of the tilting table 11.

[0057] In this invention, the flexible short wire strip 4 is provided with strip-shaped holes 47 along its extension direction. These holes 47 release bending stress during the biaxial tilting motion of the tilting table 11. This stress-relieving structure significantly improves the fatigue performance of the flexible short wire strip 4 under dynamic conditions. The presence of the strip-shaped holes 47 allows the flexible short wire strip 4 to undergo localized deformation during bending, dispersing concentrated bending stress to the edge region of the holes 47 and reducing the overall stress level of the material.

[0058] Specifically, the strip-shaped hole 47 is formed along the length of the flexible short wire array 4, and its position is selected in the area where bending deformation is most concentrated during tilting motion. When the tilting table 11 tilts along two axes, the flexible short wire array 4 undergoes bending deformation accordingly, and the material at the edge of the strip-shaped hole 47 can undergo local deformation inward towards the hole, absorbing and releasing bending stress. The elongated shape of the strip-shaped hole 47 ensures the continuity of the stress release effect along the length direction.

[0059] In this embodiment of the invention, the stress relief design of the strip hole 47 effectively extends the service life of the flexible short wire row 4, ensures the long-term stable operation of the multi-electrode connection system under frequent tilting conditions, and meets the high reliability requirements of transmission electron microscope equipment.

[0060] In some embodiments, a wire 42 is provided between two adjacent insulating layers 41, and the wire 42 is located on one side of the strip hole 47; or, two wires 42 are provided between two adjacent insulating layers 41, and the two wires 42 are located on both sides of the strip hole 47 respectively.

[0061] In this invention, a conductor 42 can be placed between two adjacent insulating layers 41 on one side of the slot 47, or two conductors 42 can be placed on both sides of the slot 47 respectively. Different conductor 42 layout schemes provide design options for different application requirements. The position of the conductor 42 relative to the slot 47 directly affects the stress distribution pattern during bending and can be optimized according to channel density requirements and space constraints.

[0062] Specifically, in a single-guide wire 42 layout, the guide wire 42 is located on one side of the slot 47. During bending, the slot 47 bears the main stress-relieving function, and the stress in the guide wire 42 area is relatively small. In a double-guide wire 42 layout, the two guide wires 42 are located on either side of the slot 47, with the slot 47 in a relatively neutral position. Bending stress is distributed more evenly between the two guide wires 42. Depending on actual needs, other configurations such as three-guide wire 42 can also be set, allowing for flexible trade-offs between wire width and thickness.

[0063] In one specific embodiment, when the number of electrodes is small and space requirements are strict, a single-wire 42 layout can be used to reduce thickness; when high reliability and signal redundancy are required, a dual-wire 42 layout can be used to provide backup channels; when the number of electrodes is large, a three-wire 42 layout can be used to meet channel requirements while controlling width. This flexible configuration adapts to the connection requirements of chip modules 3 of different specifications.

[0064] In some embodiments, the carrier 2 is provided with a first positioning part 21 and a positioning groove 22; the flexible short line 4 is provided with a second positioning part 48 that cooperates with the first positioning part 21 on the side facing the carrier 2; wherein the chip module 3 is disposed in the positioning groove 22.

[0065] In this invention, the carrier 2 is provided with a first positioning part 21 and a positioning groove 22, the flexible short wire strip 4 is provided with a second positioning part 48 that cooperates with the first positioning part 21, and the chip module 3 is disposed in the positioning groove 22. Through a multi-positioning mechanism, a precise positional relationship between the chip module 3 and the flexible short wire strip 4 is achieved. The positioning groove 22 provides a reference position for the chip module 3, and the cooperation of the first positioning part 21 and the second positioning part 48 ensures accurate alignment between the flexible short wire strip 4 and the chip module 3.

[0066] Specifically, the positioning groove 22 forms an installation reference for the chip module 3 on the carrier 2, restricting the planar position and orientation of the chip module 3. The first positioning part 21 forms a positioning reference structure on the carrier 2, and the second positioning part 48 forms a complementary structure on the flexible short wire strip 4. During assembly, the chip module 3 is first positioned in the positioning groove 22 to determine its basic position, and then the flexible short wire strip 4 achieves precise alignment with the chip module 3 through the mechanical cooperation between the second positioning part 48 and the first positioning part 21.

[0067] In one specific embodiment, when the size of the metal electrode 31 pads on the chip module 3 is tens of micrometers and the spacing between adjacent pads is tens of micrometers, the alignment accuracy between the electrode interface 43 and the metal electrode 31 needs to reach the micrometer level. Through the dual positioning of the positioning groove 22 and the positioning part, it can be ensured that the electrode interface 43 can be accurately aligned with the corresponding metal electrode 31 during each assembly, avoiding errors and repeated adjustments caused by manual alignment.

[0068] In this embodiment of the invention, the mechanical positioning structure design achieves automatic and precise positioning, eliminates the influence of human factors on assembly accuracy, improves the positioning accuracy and assembly efficiency of multi-electrode connections, and ensures the stability and repeatability of product quality.

[0069] In some embodiments, the terminal of the operating lever 1 is provided with a first busbar 13, and the flexible short busbar 4 is electrically connected to the first busbar 13 through a plug-in connector 49.

[0070] In this invention, the control lever 1 has a first busbar 13 at its terminal. A flexible short busbar 4 is electrically connected to the first busbar 13 via a plug-in connector 49. This segmented connection structure changes the impact of the traditional direct connection method on the dual-axis tilting motion. The first busbar 13 is responsible for long-distance signal transmission within the control lever 1, while the flexible short busbar 4 serves as a short-distance tilting adaptation section. The plug-in connector 49 enables a separable connection between the two sections.

[0071] Specifically, the first busbar 13 is located inside the operating lever 1, extending from the terminal to near the tilting platform 11, and performs the main signal transmission function but does not participate in the tilting movement. The flexible short busbar 4 is relatively short in length, with one end connected to the first busbar 13 via a plug-in connector 49, and the other end connected to the chip module 3, moving together with the tilting platform 11. The plug-in connector 49 is located in a relatively fixed position, providing a reliable electrical connection between the two busbars while allowing for disassembly and assembly.

[0072] In one specific embodiment, in the conventional solution, a long cable is directly connected from the rear end of the operating lever 1 to the chip module 3. The entire cable must move with the tilting table 11. The cable is long and rigid, which greatly hinders the tilting motion. In this embodiment of the present invention, the segmented connection separates the long-distance transmission and tilting adaptation functions. By shortening the length of the cable involved in the tilting motion, the interference with the dual-axis tilting motion is effectively reduced, and the motion performance and positioning accuracy of the tilting table 11 are improved.

[0073] In some embodiments, the chip module 3 includes: a chip substrate 32, on which a central hole 321 is formed; a thin film carrier layer 33 disposed on the surface of the chip substrate 32, the thin film carrier layer 33 having a carrier position 331 for carrying a sample, the carrier position 331 being located within the central hole 321, the thin film carrier layer 33 having an observation window 332 for an electron beam to pass through and irradiate the sample at the carrier position 331, a metal electrode layer disposed on the surface of the thin film carrier layer 33; and a protective layer disposed on the surface of the thin film carrier layer 33 and covering at least a portion of the metal electrode layer.

[0074] In this invention, the chip module 3 includes a chip substrate 32 with a central hole 321, a thin film carrier layer 33 disposed on the surface of the chip substrate 32, a metal electrode layer disposed on the surface of the thin film carrier layer 33, and a protective layer covering at least part of the metal electrode layer. This multi-layer structure design achieves a harmonious balance between the imaging requirements of transmission electron microscopy and the functions of multiple electrodes. The central hole 321 and the observation window 332 provide a low-obstruction transmission channel for the electron beam, the thin film carrier layer 33 provides a carrier for the sample and electrodes, and the protective layer provides environmental protection for the electrodes.

[0075] Specifically, the chip substrate 32 provides overall mechanical support, and the central aperture 321 reduces the material thickness along the electron beam path. The thickness of the thin film support layer 33 is optimized to support the sample without causing excessive scattering of the electron beam. The support site 331 is located on the thin film within the central aperture 321, and the observation window 332 corresponds to the support site 331. The electron beam passes sequentially through the observation window 332, the sample, and the central aperture 321. A metal electrode layer is fabricated on the surface of the thin film and distributed around the support site 331 to provide electric and temperature fields for the sample. A protective layer selectively covers the metal electrode 31, protecting the electrode from environmental influences while preserving the connection area.

[0076] In use, the in-situ thermoelectric experimental platform for transmission electron microscopy provided by this utility model uses instant adhesive to fix the chip module 3 onto the positioning groove 22 of the carrier 2. Using ultrasonic welding technology, wires 42 are led from the connection ends of the heating electrode, temperature measuring electrode, and energized electrode to the electrode interface 43 of the flexible short wire array 4 in the connecting assembly, establishing a complete electrical connection path. Using micro-nano sample fabrication technology, the sample to be tested is mounted on the carrier position 331 of the chip module 3, ensuring good electrical contact between the sample and the energized electrode. The assembled in-situ thermoelectric experimental platform is then installed on the tilting stage 11 at the output end of the operating lever 1, and a secure mechanical connection is achieved using screws.

[0077] During the experiment, operating lever 1 is inserted into the sample chamber of the transmission electron microscope (TEM) to adjust the microscope parameters to the optimal observation state. After the sample and system reach a stable state, corresponding current or voltage signals are applied to the heating electrode, temperature measuring electrode, and energized electrode according to experimental requirements. Through the independent control of at least two sets of heating electrodes, the required temperature gradient is established in different regions of the sample. Simultaneously, at least two sets of temperature measuring electrodes are used to monitor the temperature changes in each region in real time, forming precise temperature feedback control. The energized electrode is used to apply an electric field or measure the electrical performance parameters of the sample. While precisely controlling the temperature and electric fields of the sample, the microstructure evolution process of the material is observed in situ using the TEM, and the changes in the physical and chemical properties of the material under different temperature gradients and electric field conditions are measured simultaneously, achieving a comprehensive characterization of the thermoelectric material's properties.

[0078] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0079] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A transmission electron microscope in-situ thermoelectric experimental platform, characterized in that, include: The operating lever (1) is equipped with a tilting table (11) that can be tilted in two axes at its output end. The support member (2) is disposed on the tilting table (11); A chip module (3) is disposed on the carrier (2) for carrying the sample. The chip module (3) includes a metal electrode layer for providing a controllable electric field and temperature field for the sample. Flexible short wire bar (4), the flexible short wire bar (4) includes: Multiple insulating layers (41) are sequentially arranged along the thickness direction of the flexible short wire bar (4); A wire (42) is disposed between two adjacent insulating layers (41). One end of the wire (42) is electrically connected to the terminal of the operating rod (1), and the other end is electrically connected to the metal electrode layer.

2. The in-situ thermoelectric experimental platform for transmission electron microscopy according to claim 1, characterized in that, The metal electrode layer includes a plurality of metal electrodes (31), and the flexible short line bus (4) further includes: Multiple electrode interfaces (43) are disposed on the surface of the flexible short line (4) and are used to electrically connect multiple metal electrodes (31). Multiple conductive posts (44) penetrate the insulating layer (41). One end of each of the multiple conductive posts (44) is electrically connected to a multiple of the electrode interfaces (43), and the other end is electrically connected to a multiple of the wires (42).

3. The in-situ thermoelectric experimental platform for transmission electron microscopy according to claim 2, characterized in that, The flexible short line (4) is provided with a clearance hole (45), the chip module (3) is located in the clearance hole (45), and a plurality of electrode interfaces (43) are arranged around the clearance hole (45).

4. The in-situ thermoelectric experimental platform for transmission electron microscopy according to claim 2, characterized in that, The electrode interface (43) is located on the side of the flexible short line (4) away from the carrier (2) so that the electrode interface (43) can be connected to the metal electrode (31) by pressure welding.

5. The in-situ thermoelectric experimental platform for transmission electron microscopy according to claim 4, characterized in that, The flexible short wire bar (4) is provided with a reinforcing rib (46) on the side facing the carrier (2). The reinforcing rib (46) abuts against the carrier (2) and is disposed opposite to the electrode interface (43).

6. The in-situ thermoelectric experimental platform for transmission electron microscopy according to claim 1, characterized in that, The flexible short line (4) is provided with strip holes (47) along the extension direction. The strip holes (47) are used to release bending stress when the tilting table (11) tilts in a biaxial tilting motion.

7. The in-situ thermoelectric experimental platform for transmission electron microscopy according to claim 6, characterized in that, A conductor (42) is provided between two adjacent insulating layers (41), and the conductor (42) is provided on one side of the strip hole (47); Alternatively, two wires (42) may be provided between two adjacent insulating layers (41), with the two wires (42) located on both sides of the strip hole (47).

8. The in-situ thermoelectric experimental platform for transmission electron microscopy according to any one of claims 1-7, characterized in that, The carrier (2) is provided with a first positioning part (21) and a positioning groove (22); The flexible short line (4) is provided with a second positioning part (48) that cooperates with the first positioning part (21) on the side facing the carrier (2). The chip module (3) is disposed in the positioning groove (22).

9. The in-situ thermoelectric experimental platform for transmission electron microscopy according to any one of claims 1-7, characterized in that, The operating lever (1) is provided with a first busbar (13) at its terminal, and the flexible short busbar (4) is electrically connected to the first busbar (13) via a plug-in connector (49).

10. The in-situ thermoelectric experimental platform for transmission electron microscopy according to any one of claims 1-7, characterized in that, The chip module (3) includes: A chip substrate (32) has a central hole (321) on it. A thin film carrier layer (33) is disposed on the surface of the chip substrate (32). The thin film carrier layer (33) is provided with a carrier position (331) for carrying the sample. The carrier position (331) is located in the central hole (321). The thin film carrier layer (33) is provided with an observation window (332). The observation window (332) allows an electron beam to pass through and irradiate the sample on the carrier position (331). The metal electrode layer is disposed on the surface of the thin film carrier layer (33). A protective layer is disposed on the surface of the thin film carrier layer (33) and covers at least a portion of the metal electrode layer.

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