Electronic device and circuit board

Abstract

The application provides an electronic device and a circuit board, and relates to the field of electronic devices. The electronic device comprises a circuit board, a capacitance detection circuit and a processor. The circuit board comprises an electrode plate group and a dielectric layer. The electrode plate group comprises a first electrode plate and a second electrode plate arranged at intervals. The first electrode plate and the second electrode plate are located on at least one side of the dielectric layer. A first surface of the first electrode plate and a second surface of the second electrode plate are arranged oppositely. The material of the dielectric layer is a water-absorbing material. The capacitance detection circuit is electrically connected to the first electrode plate and the second electrode plate, and is used for detecting the capacitance value between the first electrode plate and the second electrode plate. The processor is electrically connected to the capacitance detection circuit, and is used for determining the humidity of the electronic device according to the capacitance value. The electronic device integrates the humidity detection function in the circuit board, so that the device structure can be simplified, and the space utilization of the electronic device can be improved.

Description

Technical Field

[0001] This application relates to the field of electronic devices, and more particularly to an electronic device and a circuit board. Background Technology

[0002] In existing electronic devices, humidity detection typically relies on a separate humidity sensor. These sensors require additional internal space, increasing circuit complexity and assembly costs. In flexible circuit boards or miniaturized devices, the placement of a separate sensor limits the design of the device and may lead to connection failures due to vibration and temperature changes, affecting detection stability. Utility Model Content

[0003] This application provides an electronic device and a circuit board that, by integrating a humidity detection function into the circuit board, simplifies the device structure and improves the space utilization of the electronic device.

[0004] In a first aspect, an electronic device is provided, comprising a circuit board, the circuit board including an electrode plate assembly and a dielectric layer, the electrode plate assembly including a first electrode plate and a second electrode plate spaced apart, the first electrode plate and the second electrode plate being located on at least one side of the dielectric layer, the first electrode plate including a first surface, the second electrode plate including a second surface, the first surface and the second surface being disposed opposite to each other, and the dielectric layer being made of a water-absorbing material; a capacitance detection circuit electrically connected to the first electrode plate and the second electrode plate, the capacitance detection circuit being used to detect the capacitance value between the first electrode plate and the second electrode plate; and a processor electrically connected to the capacitance detection circuit, the processor being used to determine the humidity of the electronic device based on the capacitance value.

[0005] In this embodiment, the first and second electrode plates and the dielectric layer required for humidity detection are directly integrated into the circuit board. The dielectric layer is made of a water-absorbing material. After the dielectric layer absorbs water, the capacitance between the first and second electrode plates changes. Therefore, the humidity of the electronic device can be determined by detecting the capacitance value between the first and second electrode plates. In this way, there is no need to add an independent humidity sensor module, saving internal installation space of the electronic device. At the same time, by utilizing the collaboration between the capacitance detection circuit and the processor, the capacitance value can be collected in real time and the humidity can be determined. This takes into account the needs of miniaturized device design and environmental adaptability, and improves the overall integration and operational stability of the electronic device.

[0006] In conjunction with the first aspect, in some implementations of the first aspect, the first electrode plate and the second electrode plate are respectively located on both sides of the dielectric layer along a first direction; wherein, the first direction is the thickness direction of the dielectric layer.

[0007] In this embodiment, the first electrode plate and the second electrode plate are respectively disposed on both sides of the dielectric layer along its thickness direction, forming a capacitor with the dielectric layer as the dielectric, which is used to subsequently combine the capacitance value to realize humidity detection. The vertical stacked structure utilizes the thickness space of the dielectric layer, with the two electrode plates located on both sides of the dielectric layer, which can adapt to the wiring requirements of a double-layer circuit board without occupying the limited space on the same side, thus improving the flexibility of the circuit board layout.

[0008] In conjunction with the first aspect, in some implementations of the first aspect, the orthographic projection of the first surface along the first direction is located within the range of the orthographic projection of the second surface along the first direction.

[0009] In this embodiment, by limiting the orthographic projection of the first surface of the first electrode plate along the first direction to be within the orthographic projection range of the second surface of the second electrode plate along the same direction, the two electrode plates can form a complete electric field coupling region, improve the uniformity of electric field distribution, reduce detection interference caused by unstable coupling area, and make moisture diffusion more concentrated in the effective coupling region, thereby improving the stability and accuracy of humidity detection signal and improving the reliability of liquid ingress detection of electronic equipment.

[0010] In conjunction with the first aspect, in some implementations of the first aspect, the surface of the dielectric layer facing the first electrode plate includes a first region located on the outer surface of the circuit board and surrounding the outer periphery of the first electrode plate; and / or the surface of the dielectric layer facing the second electrode plate includes a second region located on the outer surface of the circuit board and surrounding the outer periphery of the second electrode plate.

[0011] In this embodiment of the application, taking the first electrode plate as an example, by setting the area surrounding the outer periphery of the first electrode plate on the surface of the dielectric layer facing the first electrode plate as the outer surface of the circuit board, the contact area between the dielectric layer and the ambient moisture can be increased, enabling the dielectric layer to quickly and fully absorb moisture, while forming a sensing band around the first electrode plate, thereby improving the sensitivity, timeliness and comprehensiveness of humidity detection, and optimizing the response efficiency and judgment accuracy of electronic devices to humidity anomalies.

[0012] In conjunction with the first aspect, in some implementations of the first aspect, the first electrode plate includes a first through-hole, and the first electrode plate is located on the outermost layer of the circuit board; and / or the second electrode plate includes a second through-hole, and the second electrode plate is located on the outermost layer of the circuit board.

[0013] In this embodiment of the application, by providing a first through hole on the first electrode plate of the outermost layer of the circuit board and / or providing a second through hole on the second electrode plate, the dielectric layer can be connected to the space on the side of the electrode plate away from the dielectric layer. This facilitates the rapid action of external moisture and other substances on the dielectric layer through the through hole, thereby enhancing the dielectric layer's response sensitivity to changes in ambient humidity, improving the timeliness and accuracy of detecting changes in capacitance value with humidity, and optimizing the humidity monitoring effect.

[0014] In conjunction with the first aspect, in some implementations of the first aspect, the first electrode plate and the second electrode plate are located on the same side of the dielectric layer.

[0015] In this embodiment, by placing the first electrode plate and the second electrode plate on the same side of the dielectric layer, the electric field distribution between the electrode plates is more regular, which is conducive to stable signal transmission and electric field interaction, simplifies the interaction path between the humidity field and the electrode, reduces detection deviation caused by interlayer differences, simplifies the assembly process of single-sided layout, improves production efficiency, and because of the same-side layout, the electrode spacing and relative position can be optimized without increasing the dielectric layer thickness, which is suitable for miniaturized and high-density circuit design requirements.

[0016] In conjunction with the first aspect, in some implementations of the first aspect, the minimum distance between the first surface and the second surface is a first distance d, and the range of the first distance d is: 5μm≤d≤100μm.

[0017] In this embodiment, by limiting the minimum distance between the first surface and the second surface to 5μm to 100μm, a stable electric field coupling can be formed between the two electrode plates to ensure the sensitivity of humidity detection, while avoiding the risk of short circuit due to excessive distance or the signal attenuation due to excessive distance. At the same time, this range is adapted to the adsorption and conduction characteristics of the dielectric layer on moisture, which can improve the detection accuracy and reliability.

[0018] In conjunction with the first aspect, in some implementations of the first aspect, the dimension h of the first surface and the second surface along the first direction is in the range of 5μm≤h≤200μm; wherein, the first direction is the thickness direction of the first electrode plate.

[0019] In this embodiment, by limiting the size h of the first surface and the second surface along the first direction to 5μm to 200μm, it can not only adapt to the thin design of the first electrode plate and the second electrode plate to meet the miniaturization requirements of electronic devices, but also provide sufficient and stable working space for electric field coupling between the two surfaces, avoiding electric field interference or sensitivity reduction due to the relative area being too small or too large.

[0020] In conjunction with the first aspect, in some implementations of the first aspect, the first electrode plate includes a plurality of staggered first recesses and a plurality of first protrusions, wherein the first recesses are formed to be recessed from the first electrode plate toward the direction away from the second electrode plate, and the first protrusions are formed to be formed to be protruded from the first electrode plate toward the direction closer to the second electrode plate; the second electrode plate includes a plurality of staggered second protrusions and a plurality of second recesses, wherein the second protrusions are formed to be formed to be protruded from the second electrode plate toward the direction closer to the first electrode plate, and the second recesses are formed to be recessed from the second electrode plate toward the direction away from the first electrode plate; wherein the plurality of first recesses and the plurality of second protrusions are mutually engaged, and the plurality of first protrusions and the plurality of second recesses are mutually engaged.

[0021] In this embodiment, compared to flat parallel electrode plates, the staggered interlocking structure, through the lateral alignment of the concave and convex portions, increases the relative area between the first and second electrode plates within the same planar space, making humidity detection more sensitive. It achieves a large aligned area within a limited circuit board space without increasing the overall area occupied by the electrode plates, making it suitable for the internal layout of miniaturized electronic devices. Compared to a straight structure, the curved staggered structure also increases the contact area between the dielectric layer and the air, improving humidity detection sensitivity.

[0022] In conjunction with the first aspect, in some implementations of the first aspect, the electrode plate assembly is located at the sealing part of the electronic device or at the functional hole of the electronic device.

[0023] In this embodiment, the different locations are set to match the humidity detection function with the structural characteristics and protection requirements of the equipment. This not only allows for targeted monitoring of the humidity status of a specific space, but also leverages the location advantage to improve the timeliness and effectiveness of the detection, providing multi-dimensional protection for the safe operation of electronic equipment.

[0024] In conjunction with the first aspect, in some implementations of the first aspect, the electronic device includes multiple electrode plate groups.

[0025] In this embodiment, the circuit board integrates multiple electrode groups, which can expand the humidity detection range to achieve full-area or zone monitoring through multiple group arrangements and independent / cooperative detection modes. The redundant design also avoids functional interruption due to the failure of a single group. Without increasing the volume and cost, it takes into account the comprehensiveness, reliability and scene adaptability of detection, and meets the diverse humidity monitoring needs of different electronic devices.

[0026] In a second aspect, a circuit board is provided, including a dielectric layer and an electrode plate assembly, the electrode plate assembly including a first electrode plate and a second electrode plate spaced apart, the first electrode plate and the second electrode plate being located on at least one side of the dielectric layer, the first electrode plate including a first surface, the second electrode plate including a second surface, the first surface and the second surface being disposed opposite to each other, and the material of the dielectric layer being a water-absorbing material.

[0027] In conjunction with the second aspect, in some implementations of the second aspect, the first electrode plate and the second electrode plate are respectively located on both sides of the dielectric layer along the first direction; wherein, the first direction is the thickness direction of the dielectric layer.

[0028] In conjunction with the second aspect, in some implementations of the second aspect, the orthographic projection of the first surface along the first direction is located within the range of the orthographic projection of the second surface along the first direction.

[0029] In conjunction with the second aspect, in some implementations of the second aspect, the surface of the dielectric layer facing the first electrode plate includes a first region located on the outer surface of the circuit board and surrounding the outer periphery of the first electrode plate; and / or the surface of the dielectric layer facing the second electrode plate includes a second region located on the outer surface of the circuit board and surrounding the outer periphery of the second electrode plate.

[0030] In conjunction with the second aspect, in some implementations of the second aspect, the first electrode plate includes a first through-hole, and the first electrode plate is located on the outermost layer of the circuit board; and / or the second electrode plate includes a second through-hole, and the second electrode plate is located on the outermost layer of the circuit board.

[0031] In conjunction with the second aspect, in some implementations of the second aspect, the first electrode plate and the second electrode plate are located on the same side of the dielectric layer.

[0032] In conjunction with the second aspect, in some implementations of the second aspect, the minimum distance between the first surface and the second surface is a first distance d, and the range of the first distance d is: 5μm≤d≤100μm.

[0033] In conjunction with the second aspect, in some implementations of the second aspect, the dimension h of the first surface and the second surface along the first direction is in the range of 5μm≤h≤200μm; wherein, the first direction is the thickness direction of the first electrode plate.

[0034] In conjunction with the second aspect, in some implementations of the second aspect, the first electrode plate includes a plurality of staggered first recesses and a plurality of first protrusions, wherein the first recesses are formed to be recessed from the first electrode plate toward the direction away from the second electrode plate, and the first protrusions are formed to be formed to be protruded from the first electrode plate toward the direction closer to the second electrode plate; the second electrode plate includes a plurality of staggered second protrusions and a plurality of second recesses, wherein the second protrusions are formed to be formed to be protruded from the second electrode plate toward the direction closer to the first electrode plate, and the second recesses are formed to be recessed from the second electrode plate toward the direction away from the first electrode plate; wherein the plurality of first recesses and the plurality of second protrusions are mutually engaged, and the plurality of first protrusions and the plurality of second recesses are mutually engaged. Attached Figure Description

[0035] Figure 1 A structural diagram of the electronic device provided in the embodiments of this application;

[0036] Figure 2 This is a structural diagram of the circuit board provided in an embodiment of this application;

[0037] Figure 3 A flowchart for humidity detection provided in an embodiment of this application;

[0038] Figure 4 Another structural diagram of the circuit board provided in the embodiments of this application;

[0039] Figure 5 Another structural diagram of the circuit board provided in the embodiments of this application;

[0040] Figure 6 Another structural diagram of the circuit board provided in the embodiments of this application;

[0041] Figure 7 Another structural diagram of the circuit board provided in the embodiments of this application;

[0042] Figure 8 Another structural diagram of the circuit board provided in the embodiments of this application;

[0043] Figure 9 Another structural diagram of the circuit board provided in the embodiments of this application;

[0044] Figure 10 Another structural diagram of the circuit board provided in the embodiments of this application;

[0045] Figure 11 Another structural diagram of the circuit board provided in the embodiments of this application;

[0046] Figure 12 Another structural diagram of the circuit board provided in the embodiments of this application;

[0047] Figure 13 Another structural diagram of the circuit board provided in the embodiments of this application;

[0048] Figure 14 A graph showing the relationship between humidity value and time provided in an embodiment of this application.

[0049] Figure label:

[0050] 1-Electronic device; 10-Circuit board; 11-Electrode plate assembly; 111-First electrode plate; 112-Second electrode plate; 113-First protrusion; 114-First recess; 115-Second protrusion; 116-Second recess; 117-First through hole; 12-Dielectric layer; 13-Metal layer; 131-Signal conduction layer; 20-Capacitance detection circuit; 30-Processor; 40-Air vent. Detailed Implementation

[0051] The technical solutions in this application will now be described with reference to the accompanying drawings.

[0052] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized.

[0053] In the various embodiments of this application, the terms "first," "second," etc., are merely to indicate that multiple objects are different. For example, "first support member" and "second support member" are only to indicate different support members. They should not have any impact on the support members themselves or their number, and the aforementioned "first," "second," etc., should not impose any limitations on the embodiments of this application.

[0054] The terms “including,” “comprising,” “having,” and variations thereof all mean “including but not limited to,” unless otherwise specifically emphasized.

[0055] In existing electronic devices, humidity detection typically relies on a separate humidity sensor. These sensors require additional internal space, increasing circuit complexity and assembly costs. In flexible circuit boards or miniaturized devices, the placement of a separate sensor limits the design of the device and may lead to connection failures due to vibration and temperature changes, affecting detection stability.

[0056] To perform humidity detection while saving internal space in electronic devices, this application provides an electronic device including a circuit board, a capacitance detection circuit, and a processor. The circuit board includes an electrode assembly and a dielectric layer. The electrode assembly includes a first electrode plate and a second electrode plate spaced apart, located on at least one side of the dielectric layer. The first electrode plate includes a first surface, and the second electrode plate includes a second surface, with the first and second surfaces facing each other. The dielectric layer is made of a water-absorbing material. The capacitance detection circuit is electrically connected to the first and second electrode plates and is used to detect the capacitance value between the first and second electrode plates. The processor is electrically connected to the capacitance detection circuit and is used to determine the humidity of the electronic device based on the capacitance value.

[0057] In this embodiment, the first and second electrode plates and the dielectric layer required for humidity detection are directly integrated into the circuit board. The dielectric layer is made of a water-absorbing material. After the dielectric layer absorbs water, the capacitance between the first and second electrode plates changes. Therefore, the humidity of the electronic device can be determined by detecting the capacitance value between the first and second electrode plates. In this way, there is no need to add an independent humidity sensor module, saving internal installation space of the electronic device. At the same time, by utilizing the collaboration between the capacitance detection circuit and the processor, the capacitance value can be collected in real time and the humidity can be determined. This takes into account the needs of miniaturized device design and environmental adaptability, and improves the overall integration and operational stability of the electronic device.

[0058] In this embodiment, the circuit board can be used in consumer electronics products such as mobile phones or wearable devices, using a capacitor formed by the first electrode plate and the second electrode plate as a humidity detection structure to detect liquid ingress or ambient humidity in the cavity of the consumer electronics product.

[0059] Figure 1 This is a structural diagram of an electronic device provided in an embodiment of this application. Figure 1 As shown, the electronic device 1 includes a circuit board 10, a capacitance detection circuit 20, a processor 30, and an air vent 40. It may also include a breathable membrane and other electronic modules interconnected by the FPC.

[0060] The dashed area can be the waterproof cavity of electronic device 1. The waterproof cavity has high requirements for internal humidity and requires a humidity detection structure to detect the humidity.

[0061] The vent 40 can be a sound hole or a pressure equalization hole for the electronic device 1. External moisture can enter the interior of the electronic device 1 through the vent 40. Therefore, the electronic device 1 needs a humidity detection structure to detect the moisture entering through the vent 40, thereby reducing the possibility of damage caused by excessive internal humidity of the electronic device 1.

[0062] In some embodiments, the circuit board 10 can be a double-layer flexible printed circuit board (FPC). A double-layer FPC is a flexible circuit carrier with two conductive circuit layers. It is usually composed of a three-layer structure: an upper conductive circuit layer, a polymer substrate layer, and a lower conductive circuit layer. Some also have a cover film added to the surface to enhance insulation and protection.

[0063] Figure 2 This is a structural diagram of a circuit board provided in an embodiment of this application. Figure 2As shown, the electronic device 1 includes a circuit board 10, a capacitance detection circuit 20, and a processor 30. The circuit board 10 includes an electrode plate assembly 11 and a dielectric layer 12. The electrode plate assembly 11 includes a first electrode plate 111 and a second electrode plate 112 spaced apart, located on at least one side of the dielectric layer 12. The first electrode plate 111 includes a first surface, and the second electrode plate 112 includes a second surface. The first and second surfaces are disposed opposite to each other. The dielectric layer 12 is made of a water-absorbing material. The capacitance detection circuit 20 is electrically connected to the first electrode plate 111 and the second electrode plate 112, and is used to detect the capacitance value between the first electrode plate 111 and the second electrode plate 112. The processor 30 is electrically connected to the capacitance detection circuit 20, and is used to determine the humidity of the electronic device 1 based on the capacitance value.

[0064] The dielectric layer 12 is made of polymer materials such as epoxy resin, polyimide, and silicone, and has hygroscopic properties. When the humidity changes, the water content changes, and the dielectric constant changes accordingly. The dielectric layer 12 can serve as both an interlayer isolation structure for the circuit board 10 and a sensitive medium for humidity detection.

[0065] The electrode plate assembly 11 includes a first electrode plate 111 and a second electrode plate 112, which are made of conductive materials such as copper, silver, and conductive ink. The two are spaced apart to meet the conditions for forming a capacitor.

[0066] The first electrode plate 111 and the second electrode plate 112 are located on at least one side of the dielectric layer 12, that is, they are both located on the same side, or they are located on opposite sides respectively.

[0067] The first surface of the first electrode plate 111 and the second surface of the second electrode plate 112 are disposed opposite to each other, so that a capacitor is formed between the spaced-apart first electrode plate 111 and second electrode plate 112.

[0068] The first electrode plate 111 and the second electrode plate 112 can form a capacitor with the dielectric layer 12 as the dielectric. The electrode plates serve as the two plates of the capacitor, and the dielectric layer 12 serves as the dielectric, thus forming a detection capacitor with humidity sensitivity.

[0069] The first electrode plate 111 and the second electrode plate 112 can also form a capacitor using air as the dielectric. Since the first electrode plate 111 and the second electrode plate 112 are in contact with the dielectric layer 12, they can also form a capacitor using the edge dielectric layer 12 and air as the dielectric at the same time.

[0070] In some embodiments, the first electrode plate 111 and the second electrode plate 112 may also use air near the dielectric layer 12 as a dielectric to assist in forming a capacitor, that is, air and the dielectric layer 12 together serve as the dielectric.

[0071] When the ambient humidity changes, the dielectric constant of dielectric layer 12 will change, based on the formula:

[0072]

[0073] It can be seen that ε is the dielectric constant of dielectric layer 12, S is the relative area of ​​the first electrode plate 111 and the second electrode plate 112, that is, the relative area of ​​the first surface and the second surface, and d is the distance between the first electrode plate 111 and the second electrode plate 112, that is, the distance between the first surface and the second surface.

[0074] When humidity changes, the dielectric constant ε changes. By detecting the change in ΔC between the two metal plates, the change in the current ambient humidity can be inferred.

[0075] The capacitance detection circuit 20 is electrically connected to the first electrode plate 111 and the second electrode plate 112, such as through wires or conductive lines on the circuit board 10. Its function is to detect the capacitance value. Specifically, conventional capacitance detection schemes such as capacitance-to-voltage conversion circuits and oscillation circuits can be used.

[0076] The processor 30 is electrically connected to the capacitance detection circuit 20 and is used to receive the capacitance value data output by the capacitance detection circuit 20 and determine the humidity of the electronic device 1 based on the capacitance value. Since the dielectric constant of the dielectric layer 12 increases with the increase of humidity, the capacitance value will change regularly with the change of humidity. The processor 30 can convert the capacitance value change into humidity change data through the preset capacitance value-humidity correspondence.

[0077] Figure 3 A flowchart illustrating humidity detection provided in an embodiment of this application. Figure 3 As shown, when the ambient humidity changes, the dielectric constant of the PI will change accordingly; the change in dielectric constant causes the capacitance value formed by the PI to change; the capacitor voltage conversion circuit converts the capacitance change into a voltage signal; the processor 30 receives the voltage signal, processes it, and outputs the corresponding humidity value to realize humidity detection.

[0078] For example, taking a flexible smartwatch as an example, its circuit board 10 adopts a double-layer FPC, and the dielectric layer 12 is a polyimide film. The first electrode plate 111 and the second electrode plate 112 are formed on the surface facing the dielectric layer 12 through an etching process, and the dielectric layer 12 forms a capacitor. The capacitance detection circuit 20 adopts a capacitance-to-voltage conversion chip, which is connected to the two electrode plates through the conductive lines of the FPC, and converts the capacitance value into a voltage signal and outputs it to the processor 30. When the humidity of the watch's wearing environment changes, the water content of the dielectric layer 12 changes, causing its dielectric constant to change, and the capacitance value of the capacitor C changes accordingly: when the humidity increases, the dielectric constant increases, and the capacitance value increases; when the humidity decreases, the dielectric constant decreases, and the capacitance value decreases. The processor 30 has a pre-stored calibrated "capacitance value-humidity" correspondence table. By comparing the real-time capacitance value with the calibration data, it calculates the current ambient humidity and displays it on the watch screen or triggers an alert when the humidity exceeds the standard.

[0079] In this embodiment, the first electrode plate 111, the second electrode plate 112, and the dielectric layer 12 required for humidity detection are directly integrated into the circuit board 10. The dielectric layer 12 is made of a water-absorbing material. After the dielectric layer 12 absorbs water, the capacitance between the first electrode plate 111 and the second electrode plate 112 changes. Therefore, the humidity of the electronic device 1 can be determined by detecting the capacitance value between the first electrode plate 111 and the second electrode plate 112. This eliminates the need for an additional independent humidity sensor module, saving internal installation space in the electronic device 1. Furthermore, by utilizing the collaboration between the capacitance detection circuit 20 and the processor 30, real-time acquisition of capacitance values ​​and humidity determination are achieved, balancing the requirements of device miniaturization and environmental adaptability, and improving the overall integration and operational stability of the electronic device 1.

[0080] Figure 4 This is another structural diagram of the circuit board provided in an embodiment of this application. For example... Figure 4 As shown, the first electrode plate 111 and the second electrode plate 112 are located on the same side of the dielectric layer 12.

[0081] In some embodiments, the first electrode plate 111 and the second electrode plate 112 are disposed opposite to each other along a second direction, that is, the first surface and the second surface are disposed opposite to each other along a second direction, wherein the second direction is perpendicular to the thickness direction of the dielectric layer 12.

[0082] In some embodiments, the first electrode plate 111 and the second electrode plate 112 may be disposed on the upper or lower surface of the dielectric layer 12, and the two are distributed opposite to each other along a second direction. The second direction is any direction in a plane perpendicular to the thickness direction of the dielectric layer 12. For example, if the thickness direction of the dielectric layer 12 is the Z-axis, then the second direction may be the X-axis or the Y-axis.

[0083] The first electrode plate 111 and the second electrode plate 112 are arranged parallel or approximately parallel on the same surface of the dielectric layer 12. Their opposing regions extend along the second direction, and the spacing between them is maintained within a certain range, forming a planar capacitor structure. Because the first electrode plate 111 and the second electrode plate 112 are located on the surface of the dielectric layer 12, part of the electric field will pass through the dielectric layer 12. The dielectric of the capacitor includes the air between the first electrode plate 111 and the second electrode plate 112 and the dielectric layer 12 below.

[0084] In some embodiments, the circuit board 10 includes a metal layer 13 or a conductive layer. The metal layer 13 may include a first electrode plate 111 and / or a second electrode plate 112. In addition, the metal layer 13 may also include a signal transmission layer 131, such as copper traces, for transmitting electrical signals.

[0085] In some embodiments, to avoid short circuits caused by the connection between the first electrode plate 111 and / or the second electrode plate 112 and the metal traces, the first electrode plate 111 and / or the second electrode plate 112 are spaced apart from the metal traces, i.e., they are not in contact.

[0086] In some embodiments, the first electrode plate 111 and the second electrode plate 112 can be implemented by conventional planar processing technology of the circuit board 10, for example, two independent electrode plates are etched on the metal layer 13 on the surface of the dielectric layer 12, forming a gap directly in the same plane.

[0087] In some embodiments, the positional relationship between the metal layer 13 and the dielectric layer 12 can be configured according to the internal structural requirements of the electronic device 1. Figures 5-8 Example of the positional relationships between the various structures.

[0088] Figure 5 Another structural diagram of the circuit board provided in an embodiment of this application. For example... Figure 5 As shown, metal layers 13 are respectively provided on the upper and lower surfaces of the dielectric layer 12; a first electrode plate 111, a second electrode plate 112 and a signal conduction layer 131 are distributed on the upper surface of the dielectric layer 12.

[0089] Figure 6 This is another structural diagram of the circuit board provided in an embodiment of this application. For example... Figure 6 As shown, the dielectric layer 12 serves as the basic support layer, and a first electrode plate 111, a second electrode plate 112, and a signal conduction layer 131 are arranged on top of it.

[0090] Figure 7 This is another structural diagram of the circuit board provided in an embodiment of this application. For example... Figure 7As shown, the circuit board 10 is multi-layered, including multiple metal layers 13. The circuit board 10 includes dielectric layers 12 distributed vertically for electrical isolation; metal layers 13 are provided between and on the outside of the dielectric layers 12 for circuit conduction; a first electrode plate 111, a second electrode plate 112, and a signal conduction layer 131 are also distributed therein, which perform humidity detection while transmitting electrical signals.

[0091] Figure 8 Another structural diagram of the circuit board provided in an embodiment of this application. For example... Figure 8 As shown, the middle layer is a dielectric layer 12, which serves as an electrical isolation layer. Metal layers 13, including a first electrode plate 111, a second electrode plate 112, and a signal conduction layer 131, are respectively arranged on the upper and lower surfaces of the dielectric layer 12. On the same side of the dielectric layer 12, the first electrode plate 111 and the second electrode plate 112 form a capacitor. The electrode plates on the upper and lower surfaces are symmetrically distributed. The dielectric layer 12 is conductive on both sides and can also be used for humidity detection.

[0092] In this embodiment, by placing the first electrode plate 111 and the second electrode plate 112 on the same side of the dielectric layer 12, the electric field distribution between the electrode plates is more regular, which is conducive to stable signal transmission and electric field interaction, simplifies the interaction path between the humidity field and the electrode, reduces detection deviation caused by interlayer differences, simplifies the assembly process of single-sided layout, improves production efficiency, and because of the same-side layout, the electrode spacing and relative position can be optimized without increasing the thickness of the dielectric layer 12, which is suitable for miniaturized and high-density circuit design requirements.

[0093] In some embodiments, the distance between the first electrode plate 111 and the second electrode plate 112 is a first distance d, that is, the minimum distance between the first surface and the second surface is the first distance d, and the range of the first distance d is 5μm≤d≤100μm.

[0094] The distance between the first electrode plate 111 and the second electrode plate 112 is a first distance d, and the value of the first distance d is within the range of d≥5μm. When the first distance d is not less than 5μm, it can meet the accuracy requirements of the circuit board 10 processing technology, avoid problems such as short circuits and edge burrs caused by the electrode plate spacing being too close during processing, and ensure the yield in the mass production process; it can also make a stable electric field distribution between the electrodes, and when the ambient humidity changes, it can be reflected by the fluctuation of the capacitance value, providing sufficient signal change for humidity detection, thus taking into account both process feasibility and detection sensitivity.

[0095] In some embodiments, the first distance d can be in the range of 10μm≤d≤100μm.

[0096] For example, the first distance d between the first surface and the second surface can be 5μm, 10μm, 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 90μm, or 100μm.

[0097] In this embodiment, by limiting the minimum distance between the first surface and the second surface to 5μm to 100μm, a stable electric field coupling can be formed between the two electrode plates to ensure the sensitivity of humidity detection, while avoiding the risk of short circuit due to excessive distance or the signal attenuation due to excessive distance. At the same time, this range is adapted to the adsorption and conduction characteristics of moisture by the dielectric layer 12, which can improve the detection accuracy and reliability.

[0098] In some embodiments, the dimension h of the first surface and the second surface along the first direction is in the range of 5μm≤h≤200μm; wherein, the first direction is the thickness direction of the first electrode plate 111.

[0099] In some embodiments, the thickness h of the first electrode plate 111 and / or the second electrode plate 112 is in the range of 5 μm ≤ h ≤ 200 μm.

[0100] The thickness h of the first electrode plate 111 and / or the second electrode plate 112 is in the range of 5μm ≤ h ≤ 200μm. A thickness of not less than 5μm ensures good conductivity for both the first and second electrode plates, reducing current transmission losses and providing structural strength to withstand mechanical stress and environmental corrosion during assembly and use. A thickness of not more than 200μm controls the space occupied by the electrode plates, preventing an increase in the overall thickness of the circuit board 10 due to excessive electrode thickness. This adapts to the design requirements of a thinner and lighter electronic device 1 without increasing material usage or processing costs, achieving a balance between performance and practicality.

[0101] In some embodiments, the thickness h of the first electrode plate 111 and / or the second electrode plate 112 can be in the range of 50 μm ≤ h ≤ 150 μm.

[0102] For example, the thickness h of the first electrode plate 111 and / or the second electrode plate 112 can be 5μm, 10μm, 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 90μm, 100μm, 110μm, 120μm, 130μm, 140μm, 150μm, 160μm, 170μm, 180μm, 190μm, or 200μm.

[0103] In this embodiment, by limiting the size h of the first surface and the second surface along the first direction to 5μm to 200μm, it can not only adapt to the thin design of the first electrode plate 111 and the second electrode plate 112 to meet the miniaturization requirements of the electronic device 1, but also provide sufficient and stable working space for the electric field coupling between the two surfaces, avoiding electric field interference or sensitivity reduction due to the relative area being too small or too large.

[0104] Figure 9 This is another structural diagram of the circuit board provided in an embodiment of this application. For example... Figure 9 As shown, the first electrode plate 111 includes a plurality of staggered first recesses 114 and a plurality of first protrusions 113. The first recesses 114 are recessed from the first electrode plate 111 in a direction away from the second electrode plate 112, and the first protrusions 113 are protruded from the first electrode plate 111 in a direction closer to the second electrode plate 112. The second electrode plate 112 includes a plurality of staggered second protrusions 115 and a plurality of second recesses 116. The second protrusions 115 are protruded from the second electrode plate 112 in a direction closer to the first electrode plate 111, and the second recesses 116 are recessed from the second electrode plate 112 in a direction away from the first electrode plate 111. The plurality of first recesses 114 and the plurality of second protrusions 115 are interlocked with each other, and the plurality of first protrusions 113 and the plurality of second recesses 116 are interlocked with each other.

[0105] The first electrode plate 111 has a plurality of alternating first recesses 114 and a plurality of first protrusions 113. The first recesses 114 are notches formed by recesses from the edge of the first electrode plate 111 toward the direction away from the second electrode plate 112, such as rectangular or trapezoidal notches. The first protrusions 113 are protrusions formed between two adjacent first recesses 114 extending toward the direction closer to the second electrode plate 112, such as serrations.

[0106] The second electrode plate 112 is arranged parallel to the first electrode plate 111, and its overall shape is adapted to the first electrode plate 111. Multiple alternating second protrusions 115 and multiple second recesses 116 are formed on it. The second protrusions 115 are protrusions extending from the edge of the second electrode plate 112 toward the first electrode plate 111, and the second recesses 116 are notches formed between adjacent second protrusions 115 in a direction away from the first electrode plate 111.

[0107] In some embodiments, the width and depth of the first recess 114, the first protrusion 113, the second protrusion 115, and the second recess 116 can be set according to design requirements.

[0108] The plurality of first recesses 114 of the first electrode plate 111 are correspondingly fitted with the plurality of second protrusions 115 of the second electrode plate 112, and the plurality of first protrusions 113 of the first electrode plate 111 are correspondingly fitted with the plurality of second recesses 116 of the second electrode plate 112, forming a comb-like structure. After fitting, a uniform gap is maintained between the first protrusions 113 and the second recesses 116, and between the first recesses 114 and the second protrusions 115, so that the electrode plates are insulated and the electric field distribution is stable.

[0109] In some embodiments, the first recess 114 and the first protrusion 113 can be regular shapes, such as rectangles, triangles or trapezoids, or they can be wavy. The second protrusion 115 and the second recess 116 are similar. As long as they fit together, this application does not impose any limitations.

[0110] In this embodiment, compared to flat parallel electrode plates, the staggered interlocking structure increases the relative area of ​​the first electrode plate 111 and the second electrode plate 112 in the same planar space by laterally facing the concave and convex portions. According to the capacitance formula, when the medium and spacing remain unchanged, the capacitance value is proportional to the facing area S, thus significantly improving the absolute change in capacitance value and making humidity detection more sensitive.

[0111] In this embodiment, the relative areas of the first electrode plate 111 and the second electrode plate 112 are the areas directly opposite each other of the first recess 114 and the second protrusion 115, that is, the projected area of ​​the first recess 114 toward the second protrusion 115 or the projected area of ​​the second protrusion 115 toward the first recess 114. Similarly, the relative areas of the first protrusion 113 and the second recess 116 are the projected area of ​​the first protrusion 113 toward the second recess 116 or the projected area of ​​the second recess 116 toward the first protrusion 113.

[0112] A large facing area is achieved within the limited space of the circuit board 10 without increasing the overall footprint of the electrode plate, making it suitable for the internal layout of miniaturized electronic devices 1. The staggered structure makes the edge effect of the electrode plate more uniform, reduces the impact of external electromagnetic interference on capacitance detection, and maintains detection stability, especially in complex circuit environments.

[0113] In this embodiment, the interlaced curve structure, compared to the straight line structure, can increase the contact area between the medium layer 12 and the air, thereby improving the humidity detection sensitivity.

[0114] Figure 10 This is another structural diagram of the circuit board provided in the embodiments of this application. Figure 11 Another structural diagram of the circuit board provided in an embodiment of this application. For example... Figure 10 and Figure 11As shown, the first electrode plate 111 and the second electrode plate 112 are located on both sides of the dielectric layer 12 along the first direction; wherein, the first direction is the thickness direction of the dielectric layer 12.

[0115] The dielectric layer 12 has a first surface and a second surface opposite to each other along the first direction. The first electrode plate 111 is disposed on the first surface of the dielectric layer 12, and the second electrode plate 112 is disposed on the second surface of the dielectric layer 12. That is, the two electrode plates are respectively located on both sides of the dielectric layer 12 along the thickness direction.

[0116] The first electrode plate 111 and the second electrode plate 112 have a first overlapping region when projected along the first direction. That is, the first electrode plate 111 is projected onto the dielectric layer 12 along the first direction and the second electrode plate 112 is projected onto the dielectric layer 12 in a partially overlapping manner. This overlapping part forms the first overlapping region.

[0117] For example, if the first electrode plate 111 is a 5mm×3mm rectangle and the second electrode plate 112 is a 4mm×3mm rectangle, after the two are aligned along the length direction, the overlapping area of ​​the orthographic projection is 4mm×3mm, and the non-overlapping area is the 1mm×3mm portion of the first electrode plate 111 that extends beyond it.

[0118] The first electrode plate 111 and the second electrode plate 112 form a capacitor in the vertical direction with the dielectric layer 12 as the dielectric. The first overlapping region is the main region for forming the capacitor, that is, the electric field is concentrated in the first overlapping region.

[0119] For example, taking the waterproof detection module of a smart bracelet as an example, the dielectric layer 12 is made of a 0.15mm thick waterproof polymer material, and the first electrode plate 111 and the second electrode plate 112 are copper foil electrodes with an 80% overlap rate in the orthogonal projection along the thickness direction. When the ambient humidity increases, water vapor penetrates into the dielectric layer 12 and changes its dielectric constant. Since the electric field in the first overlapping area mainly passes through the dielectric layer 12, the capacitance value will change synchronously with the humidity of the dielectric layer 12. The processor 30 can accurately determine whether the bracelet is in a high-humidity environment by detecting this change and trigger the internal waterproof protection mechanism.

[0120] In this embodiment, the first electrode plate 111 and the second electrode plate 112 are respectively disposed on both sides of the dielectric layer 12 along its thickness direction, and the orthogonal projections of the two electrode plates along the first direction have a first overlapping area. A capacitor is formed by using the dielectric layer 12 as the dielectric and the first overlapping area as the main electric field concentration area, which is then used to achieve humidity detection by combining the capacitance value. The vertical stacked structure utilizes the thickness space of the dielectric layer 12, with the two electrode plates located on both sides of the dielectric layer 12, which can adapt to the wiring requirements of the double-layer circuit board 10 without occupying the limited space on the same side, thus improving the flexibility of the circuit board 10 layout.

[0121] Figure 12This is another structural diagram of the circuit board provided in an embodiment of this application. For example... Figure 12 As shown, the orthographic projection of the first surface along the first direction is within the range of the orthographic projection of the second surface along the first direction.

[0122] When the surfaces of the two electrode plates are projected in the first direction, the orthographic projection of the first surface falls completely within the area covered by the orthographic projection of the second surface. That is, the orthographic projection of the second surface can completely enclose the orthographic projection of the first surface in the first direction, and there is no part of the orthographic projection of the first surface that exceeds the orthographic projection of the second surface.

[0123] In some embodiments, the orthographic projection of the first surface along the first direction may completely coincide with the orthographic projection of the second surface along the first direction.

[0124] In some embodiments, the orthographic projection of the second surface along the first direction may be located within the range of the orthographic projection of the first surface along the first direction.

[0125] In this embodiment, by limiting the orthographic projection of the first surface of the first electrode plate along the first direction to be within the orthographic projection range of the second surface of the second electrode plate along the same direction, the two electrode plates can form a complete electric field coupling region, improve the uniformity of electric field distribution, reduce detection interference caused by unstable coupling area, and make moisture diffusion more concentrated in the effective coupling region, thereby improving the stability and accuracy of humidity detection signal and improving the reliability of liquid ingress detection of electronic equipment.

[0126] In this embodiment, the surface of the dielectric layer 12 facing the first electrode plate 111 includes a first region, which is located on the outer surface of the circuit board and surrounds the outer periphery of the first electrode plate 111; and / or the surface of the dielectric layer 12 facing the second electrode plate 112 includes a second region, which is located on the outer surface of the circuit board and surrounds the outer periphery of the second electrode plate 112.

[0127] In some embodiments, the first electrode plate 111 and the dielectric layer 12 have an overlapping region along the first direction when projected onto the ground, and also have a non-overlapping region, that is, in addition to the side of the dielectric layer 12 being in contact with air, the other surfaces of the dielectric layer 12 also have a region in contact with air.

[0128] In some embodiments, along the thickness direction of the dielectric layer 12, the orthographic projection of the first electrode plate 111 and / or the orthographic projection of the second electrode plate 112 partially overlaps with the orthographic projection of the dielectric layer 12, and the overlapping portion constitutes a second overlapping region; and the area of ​​the second overlapping region is smaller than the orthographic projection area of ​​the dielectric layer 12 itself, that is, the orthographic projection of the first electrode plate 111 and / or the orthographic projection of the second electrode plate 112 does not completely cover the dielectric layer 12, and at least a portion of the dielectric layer 12 is exposed outside the projection range of the electrode plates.

[0129] For example, if dielectric layer 12 is a rectangle of 10mm × 8mm, the area is 80mm². 2 The first electrode plate 111 is a rectangle of 6mm × 5mm with an area of ​​30mm². 2 The overlapping area of ​​the two orthographic projections is 5mm × 4mm, with an area of ​​20mm². 2 Then the 20mm 2 The region is the second overlapping region, and its area is significantly smaller than that of the dielectric layer 12. The dielectric layer 12 has exposed edges of varying or equal widths around it.

[0130] The dielectric layer 12 has a first region on its surface facing the first electrode plate 111. This first region also serves as part of the outer surface of the circuit board and is distributed in a surrounding pattern around the outer periphery of the first electrode plate 111. As the outer surface of the circuit board, the first region is directly exposed to the internal cavity environment of the electronic device without any other obstructing structures, which increases the contact area with the internal cavity environment of the dielectric layer. The layout surrounding the outer periphery of the first electrode plate 111 forms a sensing band around the first electrode plate 111. The width of this band can be set according to the size of the electrode plate and the detection requirements, maximizing the contact area while maintaining a preset distance from the edge of the first electrode plate 111.

[0131] Since the first region is distributed around the outer periphery of the first electrode plate 111, the liquid can be captured by the corresponding surrounding region regardless of the direction from which it penetrates the first electrode plate 111, thus avoiding detection blind spots caused by contact in a single direction. At the same time, the annular layout allows the humidity change of the medium layer to act more evenly on the edge of the electrode plate, enhancing the detectability of the electric field change between the first electrode plates 111 and further improving the accuracy of liquid ingress or humidity abnormality judgment.

[0132] In some embodiments, the surface of the dielectric layer 12 facing the second electrode plate 112 may also have a second region. This second region is also the outer surface of the circuit board and surrounds the outer periphery of the second electrode plate 112. The position and effect of the second region are the same as those of the first region, and will not be described again here. The first region and the second region may be provided separately or simultaneously.

[0133] In this embodiment of the application, taking the first electrode plate 111 as an example, by setting the area surrounding the outer periphery of the first electrode plate 111 on the surface of the dielectric layer 12 facing the first electrode plate 111 as the outer surface of the circuit board 10, the contact area between the dielectric layer 12 and the ambient moisture can be increased, so that the dielectric layer 12 can quickly and fully absorb moisture, and at the same time form a sensing band around the first electrode plate 111, thereby improving the sensitivity, timeliness and comprehensiveness of humidity detection, and optimizing the response efficiency and judgment accuracy of the electronic device 1 to humidity anomalies.

[0134] In some embodiments, when orthographically projected along the thickness direction of the dielectric layer 12, the orthographic projection outline of the first electrode plate 111, the orthographic projection outline of the second electrode plate 112, or both, is completely within the orthographic projection outline of the dielectric layer 12. That is, the orthographic projection of the electrode plate does not exceed the orthographic projection boundary of the dielectric layer 12, and the dielectric layer 12 can completely cover the first electrode plate 111 and / or the second electrode plate 112 from the orthographic projection viewpoint.

[0135] For example, if the dielectric layer 12 is a square with a side length of 10 mm, that is, a projected area of ​​100 mm². 2 The first electrode plate 111 is a rectangle with a length of 8mm and a width of 6mm, i.e., a projected area of ​​48mm². 2 Then, there is a gap of at least 1 mm between the four edges of the orthographic projection of the first electrode plate 111 and the edge of the orthographic projection of the dielectric layer 12, and the whole is within the range of the orthographic projection of the dielectric layer 12.

[0136] In some embodiments, the orthographic projection shapes of the electrode plate and the dielectric layer 12 may be the same, such as both being rectangular or circular; or they may be different, such as the electrode plate being circular and the dielectric layer 12 being rectangular. However, regardless of whether the shapes are the same, the outermost edge of the projection of the electrode plate never exceeds the outermost edge of the projection of the dielectric layer 12.

[0137] The electrode plate is completely within the projection range of the dielectric layer 12, indicating that the physical edge of the electrode plate does not exceed the physical edge of the dielectric layer 12. This ensures that the electric field between the electrodes is located within the dielectric layer 12 and its surrounding limited area, reducing electric field distortion caused by electrode exposure and improving the stability of capacitance detection.

[0138] For example, taking the flexible circuit board of a smartwatch as an example, the dielectric layer 12 is a 15mm × 10mm polyimide film. The first electrode plate 111 and the second electrode plate 112 are both etched from copper foil and are located on the upper and lower sides of the dielectric layer 12, respectively. The upper first electrode plate 111 has a projected size of 13mm × 8mm, and the lower second electrode plate 112 has a projected size of 12mm × 7mm. Both projections are completely within the projection of the dielectric layer 12. When the watch is bent, the redundant portion at the edge of the dielectric layer 12 can absorb deformation stress, preventing the electrode plates from breaking due to excessive stretching. At the same time, the design of the electrode plates being completely covered by the dielectric layer 12 requires sweat and moisture to penetrate the dielectric layer 12 before affecting the capacitance between the electrodes, slowing down the rate at which contaminants directly corrode the electrodes and improving the durability of the detection structure.

[0139] In this embodiment, by ensuring that the orthographic projections of the first electrode plate 111 and / or the second electrode plate 112 along the thickness direction of the dielectric layer 12 are entirely within the orthographic projection range of the dielectric layer 12, the electric field between the electrodes can be confined to the dielectric layer 12 and its surrounding area, reducing electric field distortion and improving the stability of capacitance detection. Furthermore, the edge region of the dielectric layer 12 can be completely exposed to the air, increasing the contact area between the dielectric layer 12 and the air, improving the response efficiency of the dielectric layer 12 to changes in ambient humidity, and thus enhancing the sensitivity and accuracy of humidity detection based on this structure.

[0140] Figure 13 This is another structural diagram of the circuit board provided in an embodiment of this application. For example... Figure 13 As shown, the first electrode plate 111 includes a first through hole 117 and is located on the outermost layer of the circuit board; and / or the second electrode plate 112 includes a second through hole and is located on the outermost layer of the circuit board.

[0141] In some embodiments, the first through hole 117 connects the space between the dielectric layer 12 and the first electrode plate 111 on the side away from the dielectric layer 12 and / or the second through hole connects the space between the dielectric layer 12 and the second electrode plate 112 on the side away from the dielectric layer 12.

[0142] In some embodiments, the first electrode plate 111 of the circuit board 10 includes a first through hole 117, the first through hole 117 connecting the dielectric layer 12 and the space of the first electrode plate 111 away from the dielectric layer 12, and the second electrode plate 112 does not include a through hole; or the second electrode plate 112 of the circuit board 10 includes a first through hole 117, the second through hole connecting the dielectric layer 12 and the space of the second electrode plate 112 away from the dielectric layer 12, and the first electrode plate 111 does not include a through hole; or both the first electrode plate 111 and the second electrode plate 112 include through holes, wherein the through holes include the first through hole 117 and the second through hole.

[0143] The first through-hole 117 is a hole-like structure that penetrates the thickness direction of the first electrode plate 111. When the first electrode plate 111 is located on one side of the dielectric layer 12, one end of the first through-hole 117 contacts the surface of the dielectric layer 12, and the other end opens into the space on the side of the first electrode plate 111 away from the dielectric layer 12, such as the internal cavity of the electronic device 1, forming an airflow / moisture channel from the dielectric layer 12 directly to the outside. Similarly, the second through-hole is a hole-like structure that penetrates the thickness direction of the second electrode plate 112. When the second electrode plate 112 is located on the other side of the dielectric layer 12, the second through-hole connects the dielectric layer 12 and the space on the side of the second electrode plate 112 away from the dielectric layer 12.

[0144] In some embodiments, the specific shape of the vias can be designed according to requirements. They can be circular, rectangular, or multiple micropores distributed in an array. The distribution area of ​​the vias on the electrode plate can correspond to the sensitive area of ​​the dielectric layer 12, thereby improving the sensitivity of humidity detection.

[0145] In some embodiments, the number of through holes can be designed according to requirements. This application does not limit the number of through holes while ensuring the capacitance conditions of the electrode plate assembly 11 are met.

[0146] In some embodiments, the through-hole breaks the closed coverage of the electrode plate on the dielectric layer 12, allowing external moisture to directly contact the dielectric layer 12 through the through-hole without having to diffuse around the edge of the electrode plate. This improves the response speed of humidity detection, enhances the timeliness and accuracy of detecting changes in capacitance value with humidity, and optimizes the humidity monitoring effect.

[0147] For example, taking a fitness tracker as an example, the first electrode plate 111 has four first through holes 117 with a diameter of 0.3 mm, which are distributed in a circular pattern in the capacitance detection area. When the user sweats during exercise, the sweat vapor can directly contact the dielectric layer 12 through the through holes, causing the dielectric constant of the dielectric layer 12 to change rapidly. The capacitance detection circuit 20 can capture the humidity rise signal within 1 second, and the processor 30 adjusts the anti-fog mode of the tracker accordingly. When the environment is dry, the moisture absorbed by the dielectric layer 12 evaporates quickly through the through holes, ensuring that the detection value reflects the ambient humidity in real time.

[0148] In this embodiment, the design of the first through hole 117 and / or the second through hole optimizes the interaction efficiency between the dielectric layer 12 and the environment through physical connection without affecting the conductivity of the electrode plate, thus significantly improving the timeliness and reliability of humidity detection.

[0149] In some embodiments, the circuit board 10 may include multiple battery packs.

[0150] In some embodiments, to further optimize the humidity detection performance of the circuit board 10, such as expanding the detection range and improving detection redundancy, the circuit board 10 may integrate multiple electrode groups 11, and achieve more accurate and comprehensive humidity monitoring through the coordinated work of multiple groups of capacitors.

[0151] In some embodiments, multiple electrode plate groups 11 may be distributed or arranged in an array at equal intervals along the extension direction of the circuit board 10, such as the length direction or width direction of the dielectric layer 12. Each electrode plate group 11 includes a first electrode plate 111 and a second electrode plate 112 that are spaced apart. Each electrode plate group 11 shares the same dielectric layer 12, or each electrode plate group 11 corresponds to an independent sub-dielectric layer. The sub-dielectric layers are spliced ​​or stacked to form the overall dielectric layer 12 of the circuit board 10.

[0152] From the perspective of electrical connection and functional logic, multiple electrode plate groups 11 can cooperate with the capacitance detection circuit 20 and the processor 30 in two ways: independent detection mode and collaborative detection mode.

[0153] Specifically, each group of electrode plates 11 is individually electrically connected to a detection channel of the capacitance detection circuit 20. The capacitance detection circuit 20 can obtain the capacitance value of each group of electrode plates 11 forming a capacitor. The processor 30 independently analyzes multiple groups of capacitance values.

[0154] Specifically, the first electrode plates 111 of the multiple electrode plate groups 11 are electrically connected to each other, and the second electrode plates 112 are electrically connected to each other to form a parallel overall capacitor structure. The capacitance detection circuit 20 obtains the total capacitance value of the overall capacitor, and the processor 30 determines the ambient humidity based on the capacitance value.

[0155] In this embodiment, compared to a single set of electrode plates 11 which can only cover a local area, multiple sets can be distributed to achieve full-area or multi-area humidity monitoring of the circuit board 10, avoiding equipment failure caused by localized dampness not being detected.

[0156] In some embodiments, if one set of electrode plates 11 fails due to damage, the remaining electrode plates 11 can still work normally, forming a redundant detection mechanism to ensure that the humidity monitoring function is not interrupted, which is especially suitable for scenarios with high reliability requirements.

[0157] In some embodiments, the electrode plate assembly 11 may be located inside the waterproof cavity of the electronic device 1.

[0158] Inside the waterproof cavity of electronic device 1, such as the sealed waterproof cavity of some precision instruments, the electrode plate assembly 11 can be integrated onto the circuit board 10 on the inner wall of the cavity. The first electrode plate 111 and the second electrode plate 112 form a capacitor with the dielectric layer 12 inside the waterproof cavity as the dielectric. Since the waterproof cavity itself contains almost no water vapor, this setup is mainly used to monitor the sealing performance of the waterproof cavity.

[0159] Specifically, when the cavity seal fails and air leakage occurs, external moisture will enter the waterproof cavity and be absorbed by the dielectric layer 12, causing a significant change in the capacitance value. The processor 30 can detect this change and provide timely warning of sealing failure, thus avoiding the impact of vacuum environment damage on the core components of the equipment.

[0160] In some embodiments, the electrode plate assembly 11 may be located at the functional aperture of the electronic device 1.

[0161] At functional openings of electronic device 1, such as headphone jacks, charging ports, microphone pickup holes, and heat dissipation holes, the electrode plate group 11 can be placed on the circuit board 10 inside the opening, close to the opening but not affecting the normal function of the opening.

[0162] Electrode plate assembly 11 is set at these functional holes, which can directly sense the water vapor entering the equipment through the holes.

[0163] Specifically, when humid air or liquid from the outside enters through the hole, it first comes into contact with the dielectric layer 12 at the hole, causing the capacitance value of the electrode plate group 11 to change rapidly. The processor 30 can then determine the moisture-proof status of the hole and promptly activate protective measures, such as shutting down the internal circuit or triggering a waterproof warning.

[0164] For example, in a waterproof smartphone, the electrode plate assembly 11 inside the charging port can immediately detect changes in humidity when liquid enters, and the processor 30 will then cut off the power supply to the port and display a water ingress warning on the screen to avoid short circuit damage.

[0165] In some embodiments, the electrode plate assembly 11 may be located inside the battery compartment of the electronic device 1.

[0166] Inside the battery compartment of the electronic device 1, i.e. the cavity that houses the battery, which is usually a relatively enclosed space, the electrode plate assembly 11 can be integrated onto the circuit board 10 or the battery bracket on the inner wall of the battery compartment, maintaining a safe distance from the battery and not affecting the battery installation.

[0167] The battery pack is located inside the battery compartment and can be used to monitor the humidity level inside the battery compartment, as batteries are prone to leakage, bulging, and other risks in high humidity environments. When water enters the battery compartment due to poor sealing or ambient moisture seeps in, the capacitance value of the electrode pack 11 will change as the dielectric layer 12 absorbs moisture. The processor 30 can detect this change to provide an early warning of the risk of battery moisture damage.

[0168] For example, if the electrode plate assembly 11 detects excessive humidity in the battery compartment of a smartwatch, it can prompt the user to dry the battery compartment in time to prevent battery damage that could cause the device to malfunction.

[0169] In some embodiments, the electrode plate assembly 11 may be located at the sealed portion of the electronic device 1.

[0170] Specifically, the sealing point can be a location inside the electronic device 1 where a waterproof sealing design is required, such as the seam of the electronic device's housing, the assembly gap between the interface module and the housing, or the edge where the display screen and the mid-frame fit together.

[0171] When the electrode plate assembly 11 is placed at the aforementioned sealing location, it can be arranged in conjunction with sealing structures such as sealing rings and sealing adhesive layers. When liquid enters the sealing location of the electronic device, the liquid will preferentially contact the electrode plate assembly 11 located at that position, causing a rapid change in the humidity of the environment surrounding the electrode plate assembly 11. This allows the humidity detection module to detect liquid ingress more sensitively and promptly, improving the electronic device's early warning response speed to sealing failure and liquid ingress risks.

[0172] In this embodiment, the different locations are set to match the humidity detection function with the structural characteristics and protection requirements of the device. This not only allows for targeted monitoring of the humidity status of a specific space, but also leverages the location advantage to improve the timeliness and effectiveness of the detection, providing multi-dimensional protection for the safe operation of electronic device 1.

[0173] Figure 14 A graph showing the relationship between humidity value and time provided in an embodiment of this application. Figure 14 As shown, the capacitance detected by the capacitance detection circuit 20, i.e., the absolute humidity output by the processor 30, changes over time under different liquid inlet volumes in the electronic device 1. Curves a and b in the figure correspond to different liquid inlet volumes, for example, curves a and b represent liquid inlet volumes of 10 μL and 2 μL, respectively.

[0174] The larger the liquid inflow, the greater the humidity change, the faster the humidity rises, and the higher the final humidity value; while the smaller the liquid inflow, the smaller the humidity change range and the lower the value.

[0175] The humidity value of electronic device 1 changes differently depending on the environment it is in. Specifically, the humidity value in curve a shows a trend of first increasing and then stabilizing over time. For example, if electronic device 1 is placed indoors during the rainy season in southern China for a long time, or placed in a sealed high-humidity storage box, the internal humidity of electronic device 1 will gradually increase as the high humidity of the external environment penetrates. Once the internal humidity of electronic device 1 and the external humidity reach an equilibrium, the humidity value will no longer change.

[0176] Curve b shows a trend of first increasing and then decreasing humidity over time. This means that electronic device 1 is initially in a high-humidity environment and then transferred to a low-humidity, dry environment. For example, electronic device 1 is taken out of a high-humidity bathroom environment and transferred to an indoor space with the air conditioner dehumidifying function turned on, or it is moved from the rainy outdoors to a dry indoor space. In this scenario, when electronic device 1 is in a high-humidity environment, the internal humidity increases as the outside permeates. However, when the device is transferred to a low-humidity environment, the moisture accumulated inside will gradually diffuse to the outside, causing the humidity value to decrease.

[0177] This application embodiment also provides a circuit board 10, including a dielectric layer 12 and an electrode plate group 11. The electrode plate group 11 includes a first electrode plate 111 and a second electrode plate 112 disposed at intervals. The first electrode plate 111 and the second electrode plate 112 are located on at least one side of the dielectric layer 12. The first electrode plate 111 includes a first surface, and the second electrode plate 112 includes a second surface. The first surface and the second surface are disposed opposite to each other. The material of the dielectric layer 12 is a water-absorbing material.

[0178] In some embodiments, the first electrode plate 111 and the second electrode plate 112 are respectively located on both sides of the dielectric layer 12 along a first direction; wherein, the first direction is the thickness direction of the dielectric layer 12.

[0179] In some embodiments, the orthographic projection of the first surface along the first direction is within the range of the orthographic projection of the second surface along the first direction.

[0180] In some embodiments, the surface of the dielectric layer 12 facing the first electrode plate 111 includes a first region, the first region being located on the outer surface of the circuit board and surrounding the outer periphery of the first electrode plate 111; and / or the surface of the dielectric layer 12 facing the second electrode plate 112 includes a second region, the second region being located on the outer surface of the circuit board and surrounding the outer periphery of the second electrode plate 112.

[0181] In some embodiments, the first electrode plate 111 includes a first through hole 117, and the first electrode plate 111 is the outer layer structure of the circuit board 10; and / or the second electrode plate 112 includes a second through hole, and the second electrode plate 112 is the outer layer structure of the circuit board 10.

[0182] In some embodiments, the first electrode plate 111 and the second electrode plate 112 are located on the same side of the dielectric layer 12.

[0183] In some embodiments, the minimum distance between the first surface and the second surface is a first distance d, and the range of the first distance d is: 5μm≤d≤100μm.

[0184] In some embodiments, the dimension h of the first surface and the second surface along the first direction is in the range of 5μm≤h≤200μm; wherein, the first direction is the thickness direction of the first electrode plate 111.

[0185] In some embodiments, the first electrode plate 111 includes a plurality of staggered first recesses 114 and a plurality of first protrusions 113, wherein the first recesses 114 are recessed from the first electrode plate 111 in a direction away from the second electrode plate 112, and the first protrusions 113 are protruded from the first electrode plate 111 in a direction closer to the second electrode plate 112; the second electrode plate 112 includes a plurality of staggered second protrusions 115 and a plurality of second recesses 116, wherein the second protrusions 115 are protruded from the second electrode plate 112 in a direction closer to the first electrode plate 111, and the second recesses 116 are recessed from the second electrode plate 112 in a direction away from the first electrode plate 111; wherein the plurality of first recesses 114 and the plurality of second protrusions 115 are mutually engaged, and the plurality of first protrusions 113 and the plurality of second recesses 116 are mutually engaged.

[0186] It should be understood that the circuit board 10 is similar in structure to the circuit board 10 of the electronic device 1 in the above embodiment, and will not be described again here.

[0187] In some embodiments, taking the first electrode plate 111 and the second electrode plate 112 located on opposite sides of the dielectric layer 12 as an example, the processing technology of the circuit board 10 involves first cutting the substrate to obtain a flexible substrate of the required size; then drilling holes to prepare channels for subsequent circuit interconnection; and then performing hole metallization and copper plating processes to ensure that a conductive layer is formed inside the hole and on the surface of the substrate. In the lamination / exposure stage, the electrode structure and the conventional circuit mask processing are carried out together, and simultaneously developed and exposed. The top and bottom etching areas are distinguished by the mask design, so that after exposure and development, the copper layer on the top surface is etched to form the first electrode pattern, and the copper layer on the bottom surface is then etched to form the second electrode pattern. Since the first electrode plate 111 and the second electrode plate 112 are separated by the dielectric layer 12, the first electrode plate 111 and the second electrode plate 112 remain in an open circuit state.

[0188] After development, etching, and film removal are completed, the cover film lamination process begins. Laser cutting controls the formation of openings in the corresponding areas of the sealing layer, exposing the polyimide layer to contact moisture in the air. These openings can be aligned with the openings in the metal electrode plates, ultimately completing the processing of the entire circuit board 10.

[0189] The entire process, based on traditional double-sided FPC processing, only requires electrode pattern mask design and sealing layer opening mask adjustment to achieve a structure with humidity detection function, without adding any complex process steps.

[0190] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, characterized in that, include: The circuit board includes an electrode plate group (11) and a dielectric layer (12). The electrode plate group (11) includes a first electrode plate (111) and a second electrode plate (112) spaced apart. The first electrode plate (111) and the second electrode plate (112) are located on at least one side of the dielectric layer (12). The first electrode plate (111) includes a first surface, and the second electrode plate (112) includes a second surface. The first surface and the second surface are disposed opposite to each other. The material of the dielectric layer (12) is a water-absorbing material. A capacitance detection circuit (20) is electrically connected to the first electrode plate (111) and the second electrode plate (112). The capacitance detection circuit (20) is used to detect the capacitance value between the first electrode plate (111) and the second electrode plate (112). A processor (30) electrically connected to the capacitance detection circuit (20) is used to determine the humidity of the electronic device based on the capacitance value.

2. The electronic device according to claim 1, characterized in that, The first electrode plate (111) and the second electrode plate (112) are respectively located on both sides of the dielectric layer (12) along the first direction; Wherein, the first direction is the thickness direction of the dielectric layer (12).

3. The electronic device according to claim 2, characterized in that, The orthographic projection of the first surface along the first direction is within the range of the orthographic projection of the second surface along the first direction.

4. The electronic device according to claim 2, characterized in that, The surface of the dielectric layer (12) facing the first electrode plate (111) includes a first region, the first region being located on the outer surface of the circuit board and surrounding the outer periphery of the first electrode plate (111); and / or The surface of the dielectric layer (12) facing the second electrode plate (112) includes a second region, which is located on the outer surface of the circuit board and surrounds the outer periphery of the second electrode plate (112).

5. The electronic device according to claim 2, characterized in that, The first electrode plate (111) includes a first through hole (117), and the first electrode plate (111) is located on the outermost layer of the circuit board; and / or The second electrode plate (112) includes a second through hole and is located on the outermost layer of the circuit board.

6. The electronic device according to claim 1, characterized in that, The first electrode plate (111) and the second electrode plate (112) are located on the same side of the dielectric layer (12).

7. The electronic device according to claim 6, characterized in that, The minimum distance between the first surface and the second surface is the first distance d, and the range of the first distance d is: 5μm≤d≤100μm.

8. The electronic device according to claim 6, characterized in that, The dimensions h of the first surface and the second surface along the first direction are in the range of: 5μm≤h≤200μm; Wherein, the first direction is the thickness direction of the first electrode plate (111).

9. The electronic device according to claim 6, characterized in that, The first electrode plate (111) includes a plurality of staggered first recesses (114) and a plurality of first protrusions (113). The first recesses (114) are recessed from the first electrode plate (111) in a direction away from the second electrode plate (112), and the first protrusions (113) are protruded from the first electrode plate (111) in a direction closer to the second electrode plate (112). The second electrode plate (112) includes a plurality of staggered second protrusions (115) and a plurality of second recesses (116). The second protrusions (115) are protruded from the second electrode plate (112) in a direction closer to the first electrode plate (111), and the second recesses (116) are recessed from the second electrode plate (112) in a direction away from the first electrode plate (111). The plurality of first recesses (114) are fitted together with the plurality of second protrusions (115), and the plurality of first protrusions (113) are fitted together with the plurality of second recesses (116).

10. The electronic device according to any one of claims 1 to 9, characterized in that, The electrode plate assembly (11) is located at the sealed part of the electronic device or at the functional hole of the electronic device.

11. A circuit board, characterized in that, include: Dielectric layer (12); An electrode plate assembly (11) is provided, comprising a first electrode plate (111) and a second electrode plate (112) spaced apart. The first electrode plate (111) and the second electrode plate (112) are located on at least one side of the dielectric layer (12). The first electrode plate (111) includes a first surface, and the second electrode plate (112) includes a second surface. The first surface and the second surface are disposed opposite to each other. The material of the dielectric layer (12) is an absorbent material.

12. The circuit board according to claim 11, characterized in that, The first electrode plate (111) and the second electrode plate (112) are respectively located on both sides of the dielectric layer (12) along the first direction; Wherein, the first direction is the thickness direction of the dielectric layer (12).

13. The circuit board according to claim 12, characterized in that, The orthographic projection of the first surface along the first direction is within the range of the orthographic projection of the second surface along the first direction.

14. The circuit board according to claim 12, characterized in that, The surface of the dielectric layer (12) facing the first electrode plate (111) includes a first region, the first region being located on the outer surface of the circuit board and surrounding the outer periphery of the first electrode plate (111); and / or The surface of the dielectric layer (12) facing the second electrode plate (112) includes a second region, which is located on the outer surface of the circuit board and surrounds the outer periphery of the second electrode plate (112).

15. The circuit board according to any one of claims 12 to 13, characterized in that, The first electrode plate (111) includes a first through hole (117), and the first electrode plate (111) is the outer layer structure of the circuit board; and / or The second electrode plate (112) includes a second through hole, and the second electrode plate (112) is the outer layer structure of the circuit board.

16. The circuit board according to claim 11, characterized in that, The first electrode plate (111) and the second electrode plate (112) are located on the same side of the dielectric layer (12).

17. The circuit board according to claim 16, characterized in that, The minimum distance between the first surface and the second surface is the first distance d, and the range of the first distance d is: 5μm≤d≤100μm.

18. The circuit board according to claim 16, characterized in that, The dimensions h of the first surface and the second surface along the first direction are in the range of: 5μm≤h≤200μm; Wherein, the first direction is the thickness direction of the first electrode plate (111).

19. The circuit board according to any one of claims 16 to 18, characterized in that, The first electrode plate (111) includes a plurality of staggered first recesses (114) and a plurality of first protrusions (113), wherein the first recesses (114) are recessed from the first electrode plate (111) in a direction away from the second electrode plate (112), and the first protrusions (113) are protruded from the first electrode plate (111) in a direction closer to the second electrode plate (112); the second electrode plate (112) includes a plurality of staggered second protrusions (115) and a plurality of second recesses (116), wherein the second protrusions (115) are protruded from the second electrode plate (112) in a direction closer to the first electrode plate (111), and the second recesses (116) are recessed from the second electrode plate (112) in a direction away from the first electrode plate (111); The plurality of first recesses (114) are fitted together with the plurality of second protrusions (115), and the plurality of first protrusions (113) are fitted together with the plurality of second recesses (116).

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