A power-on test tooling jig

Abstract

The utility model discloses a power on test tooling fixture, its characterized in that, including: power module, its inside is equipped with conducting loop, and has the anode connecting point and the negative pole connecting point for connecting the power supply of outside or self -supporting, and multiple test points with conducting loop electricity is connected, its surface is covered with outer insulating layer, and the window of exposing test point is opened to outer insulating layer, multiple elastic conducting components, each setting in the window of outer insulating layer opening, and with conducting loop electricity is connected, elastic conducting component has the contact portion that protrudes on the outer insulating layer above in natural state, and can be measured circuit board pad underpressure and produce elastic compression deformation. The utility model can realize large quantities power on test, improve efficiency significantly, and when needing to adjust different interval to adapt to different products, only needs to replace corresponding power module.

Description

Technical Field

[0001] This utility model relates to the field of electrical testing technology, and in particular to an electrical testing fixture. Background Technology

[0002] Ion migration refers to the ionization of metals such as copper, silver, and tin on a circuit board under certain conditions, and their migration to another pole through the insulating layer under the action of an electric field, resulting in a decrease in insulation performance. Therefore, testing the ion migration status of a product under energized conditions confirms the product's reliability.

[0003] The common testing method involves soldering each pad of the product to be tested individually using numerous wires, and then connecting all the positive and negative terminals in parallel to form a single positive and negative connection for power supply. This method has the following significant drawbacks: it relies on manual soldering, which is inefficient; it requires various materials such as soldering irons, solder wires, flux, and wires; and the inconsistent quality of each solder joint can easily introduce interference, affecting the accuracy of the test results.

[0004] To address the aforementioned issues, Chinese invention patent application number 202010549507.8 proposes a batch multi-variety circuit board testing fixture. By fabricating a standard test probe combination that corresponds one-to-one with the test points on the circuit board, effective contact between the probes and the test pads is achieved, eliminating the steps of soldering and desoldering test leads. By designing and fabricating a probe combination fixing plate that matches the circuit board under test and the standard probe combination, the positioning and fixing of the test probes and the test pads of the circuit board under test are achieved.

[0005] However, this solution still has certain limitations: once the spacing between test points changes, the original fixing block needs to be disassembled and a new fixing block of a new specification needs to be installed, making the replacement process cumbersome. In addition, the entire assembly process involves the installation of multiple components such as support columns, fixing plates, and probes, which is time-consuming, and the multi-layered stacked tooling structure is prone to poor contact due to accumulated errors. Utility Model Content

[0006] The technical problem to be solved by this utility model is to provide a power-on test fixture that can quickly complete the corresponding configuration when the spacing between test points changes, in light of the above-mentioned technical status.

[0007] The technical solution adopted by this utility model to solve the above-mentioned technical problems is: an electrical testing fixture, characterized in that it includes:

[0008] The power-on module has an internal conductive circuit and positive and negative connection points for connecting to an external or built-in power source, as well as multiple test points electrically connected to the conductive circuit; its surface is covered with an outer insulating layer, and the outer insulating layer has windows that expose the test points.

[0009] Multiple elastic conductive components are each disposed within a window opened in the outer insulating layer and electrically connected to the conductive circuit; each elastic conductive component has a contact portion that protrudes above the outer insulating layer in its natural state and can be elastically compressed and deformed by being pressed down by the pads of the circuit board under test.

[0010] Preferably, the elastic conductive component includes

[0011] A conductive needle, the tip of which forms the contact portion;

[0012] A spring, one end of which is electrically connected to the conductive circuit of the energized module, and the other end of which is connected to the conductive needle, is used to provide elastic support for the conductive needle.

[0013] To ensure consistent contact conditions, the power-on test fixture preferably includes a pressure plate. The circuit board to be tested is placed above the power-on module, and the pressure plate is placed above the circuit board to be tested, applying pressure to the circuit board to be tested so that the pads of the circuit board to be tested and the contact portion of the elastic conductive component make full contact.

[0014] Preferably, the conductive circuit includes a positive busbar and a negative busbar; the positive busbar is electrically connected to the positive connection point and is used to connect multiple positive electrical paths on the test points in parallel; the negative busbar is electrically connected to the negative connection point and is used to connect multiple negative electrical paths on the test points in parallel.

[0015] Furthermore, the power-on test fixture also includes a positive wire and a negative wire; one end of the positive wire is electrically connected to the positive connection point of the power-on module, and the other end is used to connect to the positive terminal of an external or built-in power supply; one end of the negative wire is electrically connected to the negative connection point of the power-on module, and the other end is used to connect to the negative terminal of an external or built-in power supply.

[0016] To ensure that the pads of the circuit board under test are aligned with the test points when the board is placed above the power-on test fixture, preferably, the upper surface of the outer insulating layer is provided with a positioning structure for determining the placement position of the circuit board under test.

[0017] Furthermore, the positioning structure is a positioning protrusion formed on the upper surface of the outer insulating layer.

[0018] Preferably, the power-conducting module is a printed circuit board, and the circuit pattern on its surface constitutes the conductive circuit.

[0019] Specifically, the test points are arranged on the power-on module in a one-to-one correspondence with the pad positions on the circuit board under test.

[0020] Preferably, the outer insulating layer is an ink layer printed on the power-conducting module.

[0021] Compared with existing technologies, the advantages of this invention are that by setting up a power-conducting module and an elastic conductive component, manual soldering of wires is eliminated, enabling large-scale testing and significantly improving efficiency. When different spacing needs to be adjusted to suit different products, only the corresponding power-conducting module needs to be replaced. The elastic conductive component can be directly mounted on the test point surface of the power-conducting module using SMT technology, which is more efficient and faster than the previous installation method involving multiple components such as support columns, fixing plates, and probes. Attached Figure Description

[0022] Figure 1 This is a top view of the power-on module according to an embodiment of the present utility model, wherein the left half is a normal view and the right half is a perspective view of the conductive circuit;

[0023] Figure 2 This is a side sectional view of an embodiment of the present utility model;

[0024] Figure 3 for Figure 2 Enlarged diagram of point A in the middle. Detailed Implementation

[0025] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0026] like Figures 1-3 The image shows a preferred embodiment of the electrical testing fixture of this utility model.

[0027] This embodiment includes a power-conducting module 1, multiple elastic conductive components 2, and a pressure plate 3. A circuit board under test (PCB), such as an FPC, is placed upside down above the power-conducting module 1. The elastic conductive components 2 electrically connect each pad of the PCB 4 to the power-conducting module 1. The power-conducting module 1 connects the positive and negative terminals in parallel to form a positive and negative pair, which is then connected to a power source for power-on testing. The pressure plate 3 is placed above the PCB 4, applying pressure to ensure full contact between the pads of the PCB 4 and the elastic conductive components 2. The power source can be the power supply built into the power-on testing fixture of this embodiment, or it can be an external power source.

[0028] The power-conducting module 1 has an internal conductive circuit 11, and has a positive connection point 12 and a negative connection point 13 for connecting to an external or internal power source, as well as multiple test points 14 electrically connected to the conductive circuit 11. The surface of the power-conducting module 1 is covered with an outer insulating layer 15, and the outer insulating layer 15 has windows 16 for exposing the test points 14.

[0029] Multiple elastic conductive components 2 are each disposed within a window 16 opened in the outer insulating layer 15 and electrically connected to the conductive circuit 11. The elastic conductive component 2 has a contact portion that protrudes above the outer insulating layer 15 in its natural state, and can be elastically compressed and deformed by being pressed down by the pads of the circuit board under test 4, so as to maintain a sufficient and stable electrical connection with the pads.

[0030] The elastic conductive component 2 includes a conductive pin 21 and a spring 22. The tip of the conductive pin 21 forms a contact portion. One end of the spring 22 is electrically connected to the conductive circuit 11 of the power-conducting module 1, and the other end is connected to the conductive pin 21 to provide elastic support for the conductive pin 21. The conductive pin 21 and the spring 22 can be an integrated structure, which can be directly mounted on the surface of the test point 14 of the power-conducting module 1 using SMT technology.

[0031] In this embodiment, the power-conducting module 1 is a printed circuit board, and the circuit pattern on its surface forms a conductive circuit 11. The outer insulating layer 15 is an ink layer printed on the power-conducting module 1, and the arrangement of the test points 14 on the power-conducting module 1 corresponds one-to-one with the position of the solder pads on the circuit board under test 4.

[0032] The conductive circuit 11 includes a positive busbar and a negative busbar 112. The positive busbar is electrically connected to the positive connection point 12 and is used to connect the positive electrical paths on multiple test points 14 in parallel; the negative busbar 112 is electrically connected to the negative connection point 13 and is used to connect the negative electrical paths 111 on multiple test points 14 in parallel.

[0033] The power-on module 1 also includes a positive wire 17 and a negative wire 18. One end of the positive wire 17 is electrically connected to the positive connection point 12 of the power-on module 1, and the other end is used to connect to the positive terminal of an external or internal power supply. One end of the negative wire 18 is electrically connected to the negative connection point 13 of the power-on module 1, and the other end is used to connect to the negative terminal of an external or internal power supply. Adhesive is applied to the positive connection point 12 and the negative connection point 13 to protect the solder joints, preventing oxidation from exposure to air and avoiding moisture affecting the accuracy of the test.

[0034] In addition, in order to ensure that the pads of the circuit board under test 4 can be aligned with the test point 14 when it is placed above the power-on test fixture, the upper surface of the outer insulating layer 15 is provided with a positioning structure for determining the placement position of the circuit board under test 4. In this embodiment, the positioning structure is a positioning protrusion 151 formed on the upper surface of the outer insulating layer 15.

[0035] In the specification and claims of this utility model, terms indicating direction, such as "front," "rear," "upper," "lower," "left," "right," "side," "top," and "bottom," are used to describe various exemplary structural parts and elements of this utility model. However, the use of these terms is merely for the purpose of explanation and is based on the exemplary orientations shown in the accompanying drawings. Since the embodiments disclosed in this utility model can be arranged in different orientations, these terms indicating direction are for illustrative purposes only and should not be regarded as limitations. For example, "upper" and "lower" are not necessarily limited to directions opposite to or consistent with the direction of gravity.

Claims

1. A fixture for energizing tests, characterized in that, include: The power-on module (1) has an internal conductive circuit (11) and a positive connection point (12) and a negative connection point (13) for connecting to an external or self-contained power source, as well as multiple test points (14) electrically connected to the conductive circuit (11); its surface is covered with an outer insulating layer (15), and the outer insulating layer (15) has windows (16) that expose the test points (14); Multiple elastic conductive components (2) are each disposed in a window (16) opened in the outer insulating layer (15) and electrically connected to the conductive circuit (11); the elastic conductive component (2) has a contact portion that protrudes above the outer insulating layer (15) in its natural state and can be elastically compressed and deformed by being pressed down by the pads of the circuit board under test (4).

2. The electrical testing fixture according to claim 1, characterized in that, The elastic conductive component (2) includes A conductive needle (21) has its tip forming the contact portion; A spring (22) is provided, one end of which is electrically connected to the conductive circuit (11) of the energized module (1), and the other end is connected to the conductive needle (21) to provide elastic support for the conductive needle (21).

3. The electrical testing fixture according to claim 1, characterized in that, It also includes a pressure plate (3); the circuit board under test (4) is placed above the power-on module (1), and the pressure plate (3) is placed above the circuit board under test (4) to apply pressure to the circuit board under test (4) so ​​that the pads of the circuit board under test (4) and the contact part of the elastic conductive component (2) are in full contact.

4. The electrical testing fixture according to claim 3, characterized in that, The conductive circuit (11) includes a positive busbar and a negative busbar (112); the positive busbar is electrically connected to the positive connection point (12) and is used to connect multiple positive electrical paths on the test points (14) in parallel; the negative busbar (112) is electrically connected to the negative connection point (13) and is used to connect multiple negative electrical paths (111) on the test points (14) in parallel.

5. The electrical testing fixture according to claim 4, characterized in that, It also includes a positive wire (17) and a negative wire (18); one end of the positive wire (17) is electrically connected to the positive connection point (12) of the power-on module (1), and the other end is used to connect to the positive terminal of an external or built-in power supply; one end of the negative wire (18) is electrically connected to the negative connection point (13) of the power-on module (1), and the other end is used to connect to the negative terminal of an external or built-in power supply.

6. The electrical testing fixture according to claim 1, characterized in that, The upper surface of the outer insulation layer (15) is provided with a positioning structure for determining the placement position of the circuit board (4) under test.

7. The electrical testing fixture according to claim 6, characterized in that, The positioning structure is a positioning protrusion (151) formed on the upper surface of the outer insulating layer (15).

8. The electrical testing fixture according to claim 1, characterized in that, The power-conducting module (1) is a printed circuit board, and the circuit pattern on its surface constitutes the conductive circuit (11).

9. The electrical testing fixture according to claim 1, characterized in that, The test points (14) are arranged on the power-on module (1) and correspond one-to-one with the pads on the circuit board (4) under test.

10. The electrical testing fixture according to claim 1, characterized in that, The outer insulating layer (15) is an ink layer printed on the power-conducting module (1).

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