An auxiliary heat dissipation clamp for a temperature and humidity bias test system

Abstract

The utility model provides a kind of auxiliary heat dissipation fixture for temperature and humidity bias test system.The auxiliary heat dissipation fixture at least includes test fixture, the test fixture includes test fixture body and is used to carry the test board of test fixture body;The test fixture body is used to place the chip to be measured, and its upper surface is equipped with heat dissipation module;The auxiliary heat dissipation fixture further includes air pressure adjusting channel structure supported in test fixture, and the channel structure intake end is large-diameter end, and the air outlet end is small-diameter end;Its air outlet end acts on heat dissipation module to accelerate heat dissipation speed.The auxiliary heat dissipation fixture provided by the utility model is beneficial to improve the heat dissipation capacity of heat dissipation module, further avoids the temperature of test chip in test fixture being too high, and is beneficial to improve the accuracy and reference of temperature and humidity bias test.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor testing technology and relates to an auxiliary heat dissipation fixture for a temperature and humidity bias test system. Background Technology

[0002] With the rapid development of electronic products, industries such as automotive electronics, industrial control, and consumer electronics are placing increasingly higher demands on the quality of chips and other electronic components they use. Among these, the Temperature Humidity Bias Test (THB Test) is a crucial and irreplaceable environmental reliability test in the electronics industry, especially in the reliability verification of semiconductor devices and integrated circuits.

[0003] Temperature, humidity, and bias testing simulates the operating conditions of chips under high temperature (typically 85°C or higher), high humidity (typically 85%RH or higher), and bias (applied operating voltage or reverse bias) conditions. This three-pronged approach aims to accelerate the simulation of the most demanding operating environments that electronic products might encounter in real-world use (such as automotive electronics in hot and humid summer weather, outdoor equipment, and consumer electronics) and storage environments. This allows for the disclosure of packaging defects and failure mechanisms in chips or electronic devices, assessment of their long-term reliability lifespan, and verification of chip quality.

[0004] Existing temperature and humidity bias test systems include an environmental chamber. A test fixture containing the chip under test is placed inside the environmental chamber. By adjusting the temperature and humidity within the environmental chamber in conjunction with an air circulation system, a constant high-temperature and high-humidity test is performed on the chip. Simultaneously, the test fixture is electrically connected to a power supply unit to apply a test bias voltage to the chip under test. Since the chip generates self-heating after electrical connection, the test fixture is typically equipped with a heat dissipation module to further ensure that the chip's own temperature matches the test temperature, avoiding inaccurate test results due to chip self-heating.

[0005] However, the heat dissipation module of the existing test fixture has limited heat dissipation capacity and cannot effectively and timely dissipate heat from the test chip. As a result, the chip's own temperature is often higher than the test temperature (for example, when the chip is tested in the present, its own temperature will be higher than 95°C, and the test requires that the chip temperature not be higher than 10°C above the test temperature). This is significantly higher than the acceptable range of the test temperature, which makes the test results of temperature and humidity bias test inaccurate and loses its reference value.

[0006] Therefore, how to provide a heat dissipation device for temperature and humidity bias testing, so as to facilitate timely heat dissipation of the test chip after electrical connection, further ensure that the chip's own temperature is the same as the test temperature, and improve the accuracy and reference value of the temperature and humidity bias test results, is an urgent problem to be solved by researchers. Utility Model Content

[0007] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide an auxiliary heat dissipation fixture for a temperature and humidity bias test system to solve the problems existing in the prior art.

[0008] To achieve the above and other related objectives, this utility model provides an auxiliary heat dissipation fixture for a temperature and humidity bias test system. The auxiliary heat dissipation fixture includes at least a test fixture, which includes a test fixture body and a test board for supporting the test fixture body. The test fixture body is used to place the chip under test, and its upper surface is provided with a heat dissipation module. The auxiliary heat dissipation fixture also includes an air pressure regulating channel structure supported on the test fixture. The air inlet of the channel structure is a large-diameter end, and the air outlet is a small-diameter end. The air outlet acts on the heat dissipation module to accelerate the heat dissipation speed.

[0009] In one embodiment, along the airflow direction, the air pressure regulating channel structure includes a concentrator shroud and a guide shroud connected in sequence, which are conformally connected; the guide shroud covers part or all of the heat dissipation module.

[0010] In one embodiment, the wind-gathering shroud has a gradually changing cross-section structure.

[0011] In one embodiment, the air guide shroud has a uniform cross-section structure.

[0012] In one embodiment, the wind-gathering shroud is a trumpet-shaped structure, which includes at least one of a multi-faceted trumpet-shaped structure and a circular arched trumpet-shaped structure.

[0013] In one embodiment, the bottom of the air guide shroud is connected to the flip cover of the test fixture body; the air shroud is mounted on the test plate.

[0014] In one embodiment, the air guide shroud is a polygonal structure with a uniform cross-section or a chamfered cylindrical structure with a uniform cross-section.

[0015] In one embodiment, the auxiliary heat dissipation fixture further includes a first fixing member and a second fixing member. The air concentrator and the air guide are independently configured and detachably connected to the test fixture via the first fixing member and the second fixing member, respectively.

[0016] In one embodiment, the contact end between the wind-gathering shroud and the test plate is further provided with a fixed edge, which is fixedly connected to the test plate by a first fastener.

[0017] In one embodiment, the air guide cover is fixedly connected to the flip cover of the test fixture body by a second fastener to cover the heat dissipation module without affecting the opening and closing of the test fixture body.

[0018] In one embodiment, the first and second fixing members are screws, which are detachably connected to the test fixture through a screw hole structure.

[0019] In one embodiment, the wind-concentrating hood is a high-temperature and high-humidity resistant wind-concentrating hood, including one or more of polyphenylene sulfide wind-concentrating hoods, polyethersulfone wind-concentrating hoods, stainless steel wind-concentrating hoods, or alloy wind-concentrating hoods.

[0020] In one embodiment, the air guide hood is a high-temperature and high-humidity resistant air guide hood, including one or more of polyphenylene sulfide air guide hoods, polyethersulfone air guide hoods, stainless steel air guide hoods, or alloy air guide hoods.

[0021] This utility model provides an auxiliary heat dissipation fixture for a temperature and humidity bias test system. The specific air pressure regulating channel structure in the auxiliary heat dissipation fixture enables the airflow in the temperature and humidity bias test system to enter the channel through the air inlet of the large-diameter wind-gathering hood and finally reach the air guide hood with a smaller diameter and flow out.

[0022] Because the airflow passes from a large-diameter concentrator through a small-diameter guide shroud, the reduced outlet diameter causes a throttling process. According to the Joule-Thomson effect, the airflow cools down as it passes through the throttling orifice. Simultaneously, the reduced outlet diameter increases the air velocity within the guide shroud. As the airflow passes through the heat dissipation module, the faster velocity and lower temperature facilitate rapid heat dissipation from the module, thus improving its heat dissipation capacity. This further prevents the test chip from overheating, enhancing the accuracy and reliability of temperature and humidity bias tests. Furthermore, this auxiliary heat dissipation fixture is simple in structure, small in size, and low in cost, making it highly suitable for large-scale application in the semiconductor industry. Attached Figure Description

[0023] Figure 1 The diagram shows the structure of the air-collecting shroud and air-guiding shroud in the auxiliary heat dissipation fixture of the temperature and humidity bias test system of this utility model.

[0024] Figure 2 This is one of the structural schematic diagrams of the auxiliary heat dissipation fixture for the temperature and humidity bias test system of this utility model.

[0025] Figure 3 The second schematic diagram shows the structure of the auxiliary heat dissipation fixture for the temperature and humidity bias test system of this utility model.

[0026] Figures 1-3 Component designation description 2 Air guide cover 3 First fastener 4 Second fastener 5 Test fixture 51 Test fixture body 52 Heat dissipation module 53 test board Detailed Implementation

[0027] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0028] Please see Figures 1-3 It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show the components related to this utility model and are not drawn according to the actual number, shape and size of the components. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0029] like Figures 1-2 As shown, this embodiment provides a specific auxiliary heat dissipation fixture for a temperature and humidity bias test system. The auxiliary heat dissipation fixture includes at least a test fixture 5, which includes a test fixture body 51 and a test board 53 for supporting the test fixture body 51. The test fixture body 51 is used to place the chip under test, and its upper surface is provided with a heat dissipation module 52. The auxiliary heat dissipation fixture also includes an air pressure regulating channel structure supported on the test fixture 5. The air inlet of the channel structure is a large-diameter end, and the air outlet is a small-diameter end. Its air outlet acts on the heat dissipation module 52 to accelerate the heat dissipation speed.

[0030] In practical use, the auxiliary heat dissipation fixture with an air pressure regulating channel structure provided by this invention allows airflow in the environmental chamber to enter from the larger diameter end of the channel structure and exit from the smaller diameter end. This creates a throttling process in the airflow. According to the Joule-Thomson effect, the airflow cools down when passing through the small orifice; furthermore, the reduced outlet size increases the airflow velocity within the channel. Consequently, the faster flow velocity and lower temperature of the airflow through the heat dissipation module 52 facilitate rapid heat dissipation, effectively improving the heat dissipation capacity of the heat dissipation module 52.

[0031] like Figures 1-2 As shown, along the airflow direction, the air pressure regulating channel structure includes a concentrator shroud 1 and a guide shroud 2 connected in sequence, with the two conformally joined; the guide shroud 2 covers part or all of the heat dissipation module. In a... Figure 2 In the specific embodiment shown, the air guide shroud 2 partially covers the heat dissipation module 52.

[0032] The conformal docking described in this application means that the contour shape of one end of the wind shield 2 can be completely adapted to the contour shape of the small-diameter end of the wind shroud 1, and the two maintain a seamless or near-seamless docking.

[0033] Specifically, during the temperature and humidity bias test of the chip, the chip under test is placed in the test fixture body 51. The chip is electrically connected to the power supply unit through the test fixture body 51, thereby applying a test bias voltage to the chip under test. Furthermore, the test fixture body 51 is equipped with a heat dissipation module 52 to further ensure that the chip's own temperature meets the test temperature, avoiding self-heating of the chip due to electrical connection, which could lead to excessively high chip temperature and inaccurate test results.

[0034] In practical use, after placing the chip in the test fixture body 51, the operator places the air-concentrating shroud 1 and the air-guiding shroud 2 onto the heat dissipation module 52, ensuring that the air-concentrating shroud 1 and the air-guiding shroud 2 are sequentially arranged and connected along the air intake direction. During operation, the airflow in the temperature and humidity bias test system enters the channel through the air-concentrating shroud 1 and exits through the air-guiding shroud 2. According to the Joule-Thomson effect (throttling effect) principle, the airflow exiting through the air-guiding shroud 2 has a faster flow velocity and a lower temperature. When flowing through the heat dissipation module 52, it facilitates the rapid dissipation of heat, thereby effectively improving the heat dissipation capacity of the heat dissipation module 52.

[0035] This application does not specifically limit the heat dissipation module 52; any structure that can perform heat dissipation in the prior art is acceptable. In this application, the heat dissipation module is an integrated pressure plate heat dissipation structure, specifically including thermally conductive silicone, heat pipes, a heat dissipation pressure plate body, and heat dissipation fins. The heat pipes are embedded in the heat dissipation pressure plate body, and the heat dissipation fins are disposed on the upper surface of the heat dissipation pressure plate body; the thermally conductive silicone is attached to the surface of the chip under test and connected to the heat pipes. During heat dissipation, the chip under test transfers heat through the thermally conductive silicone to the heat pipes, and finally dissipates heat through the heat dissipation fins.

[0036] This application does not specify the exact structure of the test fixture body 51; any existing test fixture suitable for temperature and humidity bias testing systems is acceptable. In this application, the test fixture body is a test box with a flip-top structure and a built-in circuit layer. The test fixture body enables the connection and fixation of the chip under test with an external bias power supply.

[0037] like Figures 1-2 As shown, the wind-gathering cover 1 has a gradually changing cross-section structure.

[0038] More specifically, in a situation like Figures 1-2 In the specific embodiment shown, the wind-gathering cover 1 is a trumpet-shaped structure, and the trumpet-shaped structure includes at least one of a multi-faceted trumpet-shaped structure and a circular arched trumpet-shaped structure.

[0039] This application does not specifically limit the exact shape and outline of the trumpet-shaped structure of the wind-gathering shroud 1, as long as the wind-gathering shroud 1 meets the requirements of a gradually changing cross-section structure and openings at both ends. As an example, in one specific embodiment, the trumpet-shaped wind-gathering shroud 1 can be a multi-faceted frustum shape, such as a quadrilateral trumpet-shaped structure, a pentagonal trumpet-shaped structure, a hexagonal trumpet-shaped structure, etc.; in another specific embodiment, the trumpet-shaped wind-gathering shroud 1 can be a circular arched trumpet-shaped structure. In this application, such as... Figures 1-3 As shown, the wind-gathering cover 1 with the horn-shaped structure is a quadrilateral horn-shaped structure.

[0040] like Figures 1-2 As shown, in a specific embodiment, the air guide shroud 2 has a uniform cross-section structure.

[0041] This application does not limit the specific shape and outline of the constant cross-section structure air guide shroud 2, as long as the air guide shroud 2 meets the requirements of having a constant cross-section structure, openings at both ends, and being able to match the small-diameter outline of the wind concentrator shroud 1 to achieve conformal docking. As an example, in one specific embodiment, the air guide shroud 2 is a polygonal constant cross-section structure, such as a rectangular constant cross-section structure, a pentagonal constant cross-section structure, a hexagonal constant cross-section structure, etc.; in another specific embodiment, the air guide shroud 2 is a chamfered cylindrical constant cross-section structure.

[0042] In this application, as Figures 1-2 As shown, the air guide shroud 2 has a rectangular cross-section structure.

[0043] like Figures 1-2 As shown, in a specific embodiment, the bottom of the air guide shroud 2 is connected to the flip cover of the test fixture body 51; the air concentrator shroud 1 is mounted on the test plate 53.

[0044] Specifically, the auxiliary heat dissipation fixture further includes a first fixing member 3 and a second fixing member 4. The air concentrator shroud 1 and the air guide shroud 2 are independently configured and detachably connected to the test fixture 5 via the first fixing member 3 and the second fixing member 4, respectively. More specifically, the first fixing member 3 and the second fixing member 4 are screws, which are detachably connected to the test fixture 5 via screw hole structures.

[0045] In this application, the air-concentrating shroud 1 and the air-guiding shroud 2 are two independent, interlocking components, rather than being integrally molded. The air-concentrating shroud 1 is fixed to the test board 53, and the air-guiding shroud 2 is fixed to the flip cover of the test fixture body 51. This technique of separately setting and fixing the air-concentrating shroud 1 and the air-guiding shroud 2 ensures that the air-guiding shroud 2 on the test fixture body 51 does not interfere with the flip-opening and closing of the test fixture body 51 for placing or replacing the test chip. Furthermore, when the chip is placed and the test fixture body 51 is closed, the air-guiding shroud 2 can still cover the heat dissipation module 52 on the test fixture body 51, avoiding multiple disassemblies that waste time and reduce experimental efficiency.

[0046] In one specific embodiment, the contact end between the wind-gathering cover 1 and the test plate 53 is further provided with a fixed edge, which is fixedly connected to the test plate 53.

[0047] like Figure 3 As shown, in one specific embodiment, the air guide shroud 2 is fixedly connected to the flip cover of the test fixture body 51 to cover the heat dissipation module 52, while not affecting the opening and closing of the test fixture body 51.

[0048] As an example, in one specific embodiment, the air-concentrating shroud 1 is fixed to the test plate 53 by a first fixing member 3; the air-guiding shroud 2 is fixed to the flip cover of the test fixture body 51 by a second fixing member 4. In another specific embodiment, the air-concentrating shroud 1 is fixed to the test plate 53 by a second fixing member 4; the air-guiding shroud 2 is fixed to the flip cover of the test fixture body 51 by a first fixing member 3.

[0049] In actual use, after placing the chip under test in the test fixture body 51, the operator fixes the air shroud 1 to the test board 53 through the first fixing member 3 and the fixing edge. On the basis of ensuring that the air guide shroud 2 and the small diameter end of the air shroud 1 can be conformally connected, the air guide shroud 2 is fixed to the flip cover of the test fixture body 51 through the second fixing member 4, so that the air guide shroud 2 partially covers the heat dissipation module 52 of the test fixture body 51.

[0050] During operation, the auxiliary heat dissipation fixture containing the chip under test is placed in the environmental chamber of the temperature and humidity bias test system. Airflow from the environmental chamber enters the air pressure regulation channel of the auxiliary heat dissipation fixture through the large-diameter end of the air shroud 1. As it flows out through the air guide shroud 2, the airflow is throttled because the diameter of the air shroud 1 is greater than or equal to the diameter of the air guide shroud 2. According to the Joule-Thomson effect, the airflow cools down when throttled through the small orifice. Furthermore, the reduced outlet size increases the air velocity within the air guide shroud 2. The faster flow velocity and lower temperature of the airflow through the heat dissipation module 52 facilitate rapid heat dissipation, effectively improving the heat dissipation capacity of the heat dissipation module 52 and preventing the chip from overheating and affecting the experimental results. When replacing the chip, simply open the flip cover of the test fixture body 51. The air guide shroud 2 fixed to the flip cover of the test fixture body 51 and the air shroud 1 fixed to the test board 53 do not affect the opening and closing of the test fixture body 51.

[0051] If the actual test is conducted using the method provided by this utility model, specifically as follows: Figure 2 The auxiliary heat dissipation fixture with an air pressure regulating channel structure shown was used to test the TI HDC3120-Q1 chip. Specific test conditions were: test temperature 85°C; test humidity 85%RH; airflow: top centrifugal fan, top-supply, bottom-return, no-load wind speed 0.8 m / s, measured surface wind speed ≤0.6 m / s, air exchange rate 8 times / h; pressure working voltage 3.3 V DC; time: 1000 hours. The chip status was recorded at 168 h, 500 h, and 1000 h of testing, and it was found that the chip's own temperature did not exceed 92°C (compared to existing heat dissipation fixtures, this significantly reduces the chip's own temperature and keeps it within an acceptable temperature error range), further ensuring the accuracy and reference value of the temperature and humidity bias test results.

[0052] This application does not specify the material requirements for the wind concentrator shroud 1 and the wind guide shroud 2, as long as the material can operate for a long time in an environment with a temperature of 85~150℃ and a relative humidity of 85%~100%.

[0053] As an example, the wind-concentrating hood 1 is a high-temperature and high-humidity resistant wind-concentrating hood, including one or more of polyphenylene sulfide wind-concentrating hoods, polyethersulfone wind-concentrating hoods, stainless steel wind-concentrating hoods, or alloy wind-concentrating hoods.

[0054] As an example, the air guide hood 2 is a high temperature and high humidity resistant air guide hood, including one or more of polyphenylene sulfide air guide hoods, polyethersulfone air guide hoods, stainless steel air guide hoods, or alloy air guide hoods.

[0055] like Figures 1-3As shown, in a specific embodiment, the wind-concentrating hood 1 is a polyphenylene sulfide wind-concentrating hood, and the air-guiding hood 2 is a polyphenylene sulfide air-guiding hood.

[0056] In summary, this invention provides an auxiliary heat dissipation fixture for a temperature and humidity bias test system. This fixture effectively enhances the heat dissipation capacity of the heat dissipation module, preventing excessively high temperatures in the test chip within the fixture, thus improving the accuracy and reliability of the temperature and humidity bias test. Furthermore, the auxiliary heat dissipation fixture is simple in structure, small in size, and low in cost, making it highly suitable for large-scale application in the semiconductor field. Therefore, this invention effectively overcomes the various shortcomings of existing technologies and possesses high industrial applicability.

[0057] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. An auxiliary heat dissipation fixture for a temperature and humidity bias test system, characterized in that, The auxiliary heat dissipation fixture includes at least a test fixture (5), which includes a test fixture body (51) and a test plate (53) for supporting the test fixture body (51). The test fixture body (51) is used to place the chip under test, and its upper surface is provided with a heat dissipation module (52); The auxiliary heat dissipation fixture also includes an air pressure regulating channel structure supported on the test fixture (5). The air inlet of the channel structure is a large-diameter end and the air outlet is a small-diameter end. Its air outlet acts on the heat dissipation module (52) to accelerate the heat dissipation speed.

2. The auxiliary heat dissipation clamp according to claim 1, characterized in that, Along the airflow direction, the air pressure regulating channel structure includes a wind-gathering shroud (1) and a wind-guiding shroud (2) connected in sequence, which are conformally connected; the wind-guiding shroud (2) covers part or all of the heat dissipation module.

3. The auxiliary heat dissipation clamp according to claim 2, characterized in that, The wind-gathering cover (1) has a gradually changing cross-section structure; And / or, the air guide shroud (2) has a uniform cross-section structure.

4. The auxiliary heat dissipation clamp according to claim 3, characterized in that, The wind-gathering cover (1) is a trumpet-shaped structure; the trumpet-shaped structure includes at least one of a multi-faceted trumpet-shaped structure and a circular arched trumpet-shaped structure.

5. The auxiliary heat dissipation clamp according to claim 3, characterized in that, The bottom of the air guide shroud (2) is connected to the flip cover of the test fixture body (51); the air gathering shroud (1) is mounted on the test plate (53).

6. The auxiliary heat dissipation clamp according to claim 3, characterized in that, The air guide cover (2) is a polygonal equal cross-section structure or a beveled cylindrical equal cross-section structure.

7. The auxiliary heat dissipation clamp according to claim 5, characterized in that, The auxiliary heat dissipation fixture also includes a first fixing member (3) and a second fixing member (4). The wind concentrator (1) and the wind guide (2) are independently set and are detachably connected to the test fixture (5) through the first fixing member (3) and the second fixing member (4), respectively.

8. The auxiliary heat dissipation clamp according to claim 7, characterized in that, The contact end between the wind-gathering hood (1) and the test plate (53) is also provided with a fixed edge, which is fixedly connected to the test plate (53) by the first fixing member (3); And / or, the air guide cover (2) is fixedly connected to the flip cover of the test fixture body (51) by the second fastener (4) to cover the heat dissipation module (52) without affecting the opening and closing of the test fixture body (51).

9. The auxiliary heat dissipation clamp according to claim 8, characterized in that, The first fixing member (3) and the second fixing member (4) are screws, which are detachably connected to the test fixture (5) through the screw hole structure.

10. The auxiliary heat dissipation clamp according to claim 2, characterized in that, The air-concentrating hood (1) is a high-temperature and high-humidity resistant air-concentrating hood, including one or more of polyphenylene sulfide air-concentrating hoods, polyethersulfone air-concentrating hoods, stainless steel air-concentrating hoods, or alloy air-concentrating hoods; and / or, the air guide hood (2) is a high-temperature and high-humidity resistant air guide hood, including one or more of polyphenylene sulfide air guide hoods, polyethersulfone air guide hoods, stainless steel air guide hoods, or alloy air guide hoods.

Images