Semiconductor high-low temperature test fixture for silicon-based devices

Abstract

The utility model relates to a kind of semiconductor high-low temperature test fixture of silicon-based device, comprising: rotating hinged positioning seat and spinning seat, the bottom surface of positioning seat is equipped with base by screw mounting, the top surface of base is provided with clamping groove, and the inside of clamping groove is provided with chip, probe is inlayed and installed in the inside of base, the outer surface of positioning seat and spinning seat is respectively provided with positioning groove and mounting groove, rotating hook piece is rotatably installed in the inside of mounting groove;The setting of copper mesh cloth, guide bar and guide pillar increases the contact area with the outside world, quickly conducts hot gas or cold gas to fixture, increases the heat conduction or cooling efficiency of fixture, improves the chip heating or cooling speed, improves the test speed when the fixture is used, the length and angle of nut distance positioning seat can be adjusted, so that it can be aligned with different specifications PCB mounting hole, so that it can be installed to different specifications PCB, improve its adaptability.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor testing fixtures, specifically relating to a high and low temperature testing fixture for silicon-based devices. Background Technology

[0002] Silicon-based devices are an important component of the power electronics field. These devices include diodes, transistors, and chips. Chips are common electronic components used in daily life, and various types of chips are packaged on many PCBs. After packaging, chips require various tests to verify their reliability. With the rapid development of automotive-grade chips in recent years, the environmental temperature requirements for chip testing have become increasingly stringent. High and low temperature testing equipment for chips is becoming increasingly common in areas such as reliability testing and aging testing. High-temperature testing of diodes, transistors, and chips requires the use of test chambers and fixtures. During this process, the chip is installed in the fixture, and the fixture is then fixed to the PCB board using screws. When the PCB board is not the same size as the chip, the screw holes on the fixture and the PCB board may misalign, causing the fixture to be incompatible with different PCB sizes. This reduces its adaptability to different PCB sizes. When using test chambers with fixtures for high and low temperature testing, the low thermal conductivity or cooling efficiency of the fixture results in slow chip heating or cooling rates, reducing the testing speed. Utility Model Content

[0003] (1) Technical problems to be solved To address the shortcomings of existing technologies, the purpose of this utility model is to provide a semiconductor high and low temperature testing fixture for silicon-based devices. This device aims to solve the problems that existing fixtures cannot be adapted to PCBs of different specifications, thus reducing their adaptability to different PCB specifications. Furthermore, the low thermal conductivity of the fixtures leads to slow chip heating or cooling speeds, thereby reducing testing speed.

[0004] (2) Technical solution To solve the above-mentioned technical problems, this utility model provides a semiconductor high and low temperature testing fixture for silicon-based devices, including: a positioning seat and a spinning seat that are rotatably hinged. The bottom surface of the positioning seat is fitted with a base by screws. The top surface of the base is provided with a slot, and a chip is placed inside the slot. A probe is embedded through the inside of the base. The outer surfaces of the positioning seat and the spinning seat are respectively provided with a positioning groove and a mounting groove. A rotating hook is rotatably installed inside the mounting groove, and the outer surface of the rotating hook is fixedly connected to the inner wall of the mounting groove by a strong spring.

[0005] Optionally, the outer surface of the rotating hook is provided with anti-slip texture.

[0006] Optionally, a protective plate is provided on the bottom of the base, and the protective plate can be installed with screws to the base.

[0007] Optionally, the inner wall of the card slot is provided with a slanted groove.

[0008] Optionally, a transmission mechanism is installed on the outer surface of the spinning base. The transmission mechanism includes a threaded hole on the outer surface of the spinning base, and a guide post is connected to the internal thread of the threaded hole. A bracket is installed on the outer surface of the guide post away from the spinning base, and a guide strip is rotatably installed inside the bracket. A copper mesh is installed on the outer surface of the guide strip, and a round handle screw is installed on the outer surface of the guide post away from the spinning base.

[0009] Optionally, a positioning mechanism is installed on the outer surface of the positioning seat. The positioning mechanism includes a fixed rod rotatably mounted on the outer surface of the positioning seat, a sliding sleeve slidably mounted on the outside of the fixed rod, and a nut installed at the end of the sliding sleeve away from the positioning seat. The outer surfaces of the fixed rod and the sliding sleeve are respectively provided with a insertion hole and a through hole. A pin is slidably mounted inside the through hole. A tension spring is sleeved on the outside of the pin, and the two ends of the tension spring are fixedly connected to the pin and the positioning seat respectively.

[0010] Optionally, a pull ring is rotatably mounted on the top of the pin.

[0011] (3) Beneficial effects Compared with the prior art, the beneficial effects of this utility model are as follows: This invention increases the contact area with the outside environment by using copper mesh, guide strips, and guide posts when the fixture is placed in the test chamber for heating or cooling. This allows for rapid conduction of hot or cold air to the fixture, increasing its heat conduction or cooling efficiency, improving the chip heating or cooling speed, and increasing the testing speed during use. Furthermore, the length and angle of the nut relative to the positioning seat can be adjusted to align with mounting holes on PCBs of different specifications, thus improving its adaptability. Attached Figure Description

[0012] Figure 1 This is a front view of the main structure of this utility model; Figure 2 This is the utility model Figure 1 Enlarged structural diagram at point A in the middle; Figure 3 This is the utility model Figure 1 Enlarged structural diagram at point B; Figure 4 This is a three-dimensional structural view of the guide bar, bracket, and guide post of this utility model; Figure 5 This is a three-dimensional structural diagram of the circular handle screw of this utility model; Figure 6 This is a three-dimensional structural diagram of the positioning seat, base, and spinning seat of this utility model; Figure 7 This is a three-dimensional structural diagram of the base of this utility model; Figure 8This is a cross-sectional structural diagram of the spinning base of this utility model; Figure 9 This is a three-dimensional structural diagram of the spinning base of this utility model.

[0013] The markings in the attached diagram are as follows: 1. Positioning seat; 2. Base; 3. Protective plate; 4. Nut; 5. Sliding sleeve; 6. Copper mesh cloth; 7. Through hole; 8. Pull ring; 9. Insert pin; 10. Fixed rod; 11. Insertion hole; 12. Tension spring; 13. Guide bar; 14. Bracket; 15. Round handle screw; 16. Guide post; 17. Rotating hook; 18. Threaded hole; 19. Mounting groove; 20. Spinning seat; 21. Positioning groove; 22. Chip; 23. Card slot; 24. Probe; 25. Strong spring; 26. Inclined groove. Detailed Implementation

[0014] This specific embodiment is a semiconductor high and low temperature testing fixture for silicon-based devices, and its structural schematic diagram is shown below. Figures 1-9 As shown, it includes: a rotatably hinged positioning seat 1 and a spinning seat 20. The bottom surface of the positioning seat 1 is fitted with a base 2 by screws. The top surface of the base 2 is provided with a slot 23, and a chip 22 is provided inside the slot 23. A probe 24 is embedded through the inside of the base 2. The outer surfaces of the positioning seat 1 and the spinning seat 20 are respectively provided with a positioning groove 21 and a mounting groove 19. A rotating hook 17 is rotatably installed inside the mounting groove 19, and the outer surface of the rotating hook 17 is fixedly connected to the inner wall of the mounting groove 19 by a strong spring 25.

[0015] Specifically, by placing the chip 22 into the slot 23, then squeezing the top of the rotating hook 17 to make it rotate in the mounting slot 19, compressing the strong spring 25, then rotating the spinneret 20 to fit against the positioning seat 1, the spinneret 20 squeezes the chip 22 to install it in the slot 23, releasing the rotating hook 17, and under the action of the strong spring 25, pushing the rotating hook 17 to rotate back to its original position, the bottom end of the rotating hook 17 is inserted into the positioning slot 21 for fixation, fixing the positioning seat 1 and the spinneret 20, making the chip 22 fit against the probe 24, and finally placing the base 2 on the PCB board, making the probe 24 fit against the PCB board, installing the base 2 on the PCB board, and placing it in the test box for testing, so that the chip 22 can be quickly installed and tested.

[0016] Furthermore, the outer surface of the rotating hook 17 is provided with anti-slip texture.

[0017] Specifically, the anti-slip texture on the surface of the rotating hook 17 increases the surface friction of the rotating hook 17 and prevents the user from slipping when squeezing the rotating hook 17.

[0018] Furthermore, a protective plate 3 is provided below the base 2, and the protective plate 3 can be installed with the base 2 using screws.

[0019] Specifically, the protective plate 3 is installed onto the base 2 using screws to cover the probe 24 to prevent slippage and damage to the probe 24 during transport of the fixture.

[0020] Furthermore, the inner wall of the slot 23 is provided with an inclined groove 26.

[0021] Specifically, the slanted groove 26 increases the opening area of ​​the card slot 23, making it easier for the chip 22 to be placed into the card slot 23 for installation.

[0022] Furthermore, the transmission mechanism includes a threaded hole 18 on the outer surface of the spinning base 20, and a guide post 16 is threadedly connected inside the threaded hole 18. A bracket 14 is installed on the outer surface of the guide post 16 away from the spinning base 20, and a guide bar 13 is rotatably installed inside the bracket 14. A copper mesh cloth 6 is installed on the outer surface of the guide bar 13, and a round handle screw 15 is installed on the outer surface of the guide post 16 away from the spinning base 20.

[0023] Specifically, during use, grasp the guide strip 13 and rotate the copper mesh cloth 6 to open it. The ends of the multiple guide strips 13 that are close together abut against the top of the guide post 16. Then, grasp the round handle screw 15 and install it on the guide post 16. The round handle screw 15 presses down on the guide strip 13 to fix it. Then, rotate the guide post 16 into the wire hole 18. When the fixture is placed in the test chamber for heating or cooling, the arrangement of the copper mesh cloth 6, guide strips 13 and guide post 16 increases the contact area with the outside world, quickly conducts hot or cold air to the fixture, increases the heat conduction or cooling efficiency of the fixture, improves the chip heating or cooling speed, and improves the testing speed when using the fixture.

[0024] Furthermore, a positioning mechanism is installed on the outer surface of the positioning seat 1. The positioning mechanism includes a fixed rod 10 rotatably mounted on the outer surface of the positioning seat 1, a sliding sleeve 5 slidably mounted on the outside of the fixed rod 10, and a nut 4 installed at the end of the sliding sleeve 5 away from the positioning seat 1. The outer surfaces of the fixed rod 10 and the sliding sleeve 5 are respectively provided with an insertion hole 11 and a through hole 7. A pin 9 is slidably mounted inside the through hole 7. A tension spring 12 is sleeved on the outside of the pin 9, and the two ends of the tension spring 12 are fixedly connected to the pin 9 and the positioning seat 1, respectively.

[0025] Specifically, during installation, the fixture is pulled upwards by the pin 9 and pulled out of the insertion hole 11. Then, the base 2 is pulled along the fixed rod 10 with the nut 4. The distance between the nut 4 and the positioning seat 1 is adjusted. The pin 9 is then released, and under the tension of the tension spring 12, the pin 9 is pulled down into the insertion hole 11, fixing the sliding sleeve 5 and the fixed rod 10. With the rotation of the fixed rod 10, the length and angle of the nut 4 from the positioning seat 1 can be adjusted, allowing it to be aligned with the mounting holes of different PCB boards and installed on PCB boards of different specifications, thus improving its adaptability.

[0026] Furthermore, a pull ring 8 is rotatably mounted on the top of the pin 9.

[0027] Specifically, the pull ring 8 allows staff to easily lift the pin 9 as it rises.

[0028] This utility model discloses a semiconductor high and low temperature testing fixture for silicon-based devices. The process involves placing a chip 22 into a slot 23, then pressing the top of a rotating hook 17 to rotate it within a mounting slot 19, compressing a powerful spring 25. Next, a spinneret 20 is rotated to fit against a positioning seat 1, pressing the chip 22 into the slot 23. Releasing the rotating hook 17 allows it to rotate back to its original position under the force of the powerful spring 25. The bottom of the rotating hook 17 is then inserted into a positioning slot 21 for fixation, securing the positioning seat 1 and the spinneret 20. This allows the chip 22 to fit against a probe 24. Finally, a base 2 is placed on a PCB board, allowing the probe 24 to fit against the PCB board. The base 2 is then installed on the PCB board and placed in a test chamber for testing, enabling rapid chip 22 installation and testing.

[0029] When in use, grasp the guide strip 13 and rotate the copper mesh cloth 6 to open it. The ends of the multiple guide strips 13 that are close together abut against the top of the guide post 16. Then, grasp the round handle screw 15 and install it on the guide post 16. The round handle screw 15 presses down on the guide strip 13 to fix it. Then, rotate the guide post 16 into the wire hole 18. When the fixture is placed in the test chamber for heating or cooling, the arrangement of the copper mesh cloth 6, guide strips 13 and guide post 16 increases the contact area with the outside world, quickly conducts hot or cold air to the fixture, increases the heat conduction or cooling efficiency of the fixture, improves the chip heating or cooling speed, and improves the testing speed when using the fixture.

[0030] During installation, the fixture is pulled upwards by the pin 9 and pulled out of the insertion hole 11. Then, the base 2 is pulled along the fixed rod 10 with the nut 4. The distance between the nut 4 and the positioning seat 1 is adjusted. The pin 9 is then released and pulled down into the insertion hole 11 by the tension of the tension spring 12, so that the sliding sleeve 5 and the fixed rod 10 are fixed. With the rotation of the fixed rod 10, the length and angle of the nut 4 from the positioning seat 1 can be adjusted, so that it can be aligned with the mounting holes of different PCB boards and can be installed on PCB boards of different specifications, thus improving its adaptability.

[0031] All technical features in this embodiment can be freely combined according to actual needs.

[0032] The above embodiments are preferred implementations of this utility model. In addition, this utility model can also be implemented in other ways. Any obvious substitutions without departing from the concept of this technical solution are within the protection scope of this utility model.

Claims

1. A semiconductor high and low temperature testing fixture for silicon-based devices, characterized in that, include: The positioning seat (1) and the spinning seat (20) are hinged. The bottom surface of the positioning seat (1) is fitted with a base (2) by screws. The top surface of the base (2) is provided with a slot (23) and a chip (22) is provided inside the slot (23). A probe (24) is embedded through the inside of the base (2). The outer surfaces of the positioning seat (1) and the spinning seat (20) are respectively provided with a positioning groove (21) and a mounting groove (19). A rotating hook (17) is rotatably installed inside the mounting groove (19), and the outer surface of the rotating hook (17) is fixedly connected to the inner wall of the mounting groove (19) by a strong spring (25).

2. The semiconductor high and low temperature testing fixture for silicon-based devices according to claim 1, characterized in that, The outer surface of the rotating hook (17) is provided with anti-slip texture.

3. A semiconductor high and low temperature testing fixture for silicon-based devices according to claim 2, characterized in that, A protective plate (3) is provided below the base (2), and the protective plate (3) can be installed with the base (2) using screws.

4. A semiconductor high and low temperature testing fixture for silicon-based devices according to claim 3, characterized in that, The inner wall of the slot (23) is provided with a slanted groove (26).

5. A semiconductor high and low temperature testing fixture for silicon-based devices according to claim 4, characterized in that, The outer surface of the spinning base (20) is equipped with a transmission mechanism, which includes a wire hole (18) provided on the outer surface of the spinning base (20), and a guide post (16) is threadedly connected inside the wire hole (18). A bracket (14) is installed on the outer surface of the guide post (16) away from the spinning base (20), and a guide strip (13) is rotatably installed inside the bracket (14). A copper mesh cloth (6) is installed on the outer surface of the guide strip (13), and a round handle screw (15) is installed on the outer surface of the guide post (16) away from the spinning base (20).

6. A semiconductor high and low temperature testing fixture for silicon-based devices according to claim 5, characterized in that, The positioning mechanism is installed on the outer surface of the positioning seat (1). The positioning mechanism includes a fixed rod (10) rotatably installed on the outer surface of the positioning seat (1). A sliding sleeve (5) is slidably installed on the outside of the fixed rod (10), and a nut (4) is installed on the end of the sliding sleeve (5) away from the positioning seat (1). The outer surfaces of the fixed rod (10) and the sliding sleeve (5) are respectively provided with a insertion hole (11) and a through hole (7). A pin (9) is slidably installed inside the through hole (7). A tension spring (12) is sleeved on the outside of the pin (9), and the two ends of the tension spring (12) are fixedly connected to the pin (9) and the positioning seat (1) respectively.

7. A semiconductor high and low temperature testing fixture for silicon-based devices according to claim 6, characterized in that, A pull ring (8) is rotatably mounted on the top of the pin (9).

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