A power board detection apparatus

Abstract

This utility model provides a power board testing device, which includes a main body. The main body is equipped with a main control board, a power supply board electrically connected to the main control board, a display board electrically connected to the main control board, a display screen electrically connected to the display board, and a power board interface adapter board electrically connected to the main control board. The power board and the power board interface adapter board are plugged into each other. The main control board receives temperature data from the temperature measurement module on the power board and determines whether the temperature measurement function of the power board is normal. It also generates a control signal to control the electric field signal generation module on the power board to generate an electric field. The generated electric field information is transmitted to the host aging test equipment through an external adapter to test whether the electric field signal generation function of the power board is normal. Finally, the test information is transmitted to the display board electrically connected to it and the test results are displayed on the display screen electrically connected to the display board for easy observation by the tester.

Description

Technical Field

[0001] This utility model relates to a power board testing device. Background Technology

[0002] Currently, the main treatments for tumors include surgery, radiotherapy, and chemotherapy, but all have corresponding drawbacks. For example, radiotherapy and chemotherapy can cause side effects and kill normal cells. Using electric fields to treat tumors is also at the forefront of research. Tumor Treating Fields (TTF) is a method that applies a low-intensity, medium-frequency alternating electric field to cancer cells, thereby interfering with the mitotic process of cancer cells, inhibiting mitosis, and inducing apoptosis, thus achieving a therapeutic effect. The electric field therapy equipment used to treat tumors mainly includes a tumor electric field therapy device main unit and electrode patches electrically connected to the main unit. The electrode patches are applied to the skin corresponding to the lesion, thus applying the alternating electric field to the tumor tissue area for electric field tumor therapy.

[0003] Existing tumor electric field therapy devices typically include an electric field signal generation module internally designed to generate the therapeutic electric field. This module is generally integrated onto a power board electrically connected to the main control board. The main control board applies control signals to control the electric field signal generation module on the power board to generate the electric field. However, the electric field signal generation module on the power board generates heat during operation. To prevent electrical components from being damaged by overheating due to heat accumulation, the power board usually also has a temperature sensing module to monitor the temperature around the power board in real time and transmit the temperature data to the main control board. The main control board then adjusts the output power of the power board based on the temperature to control the temperature and prevent it from exceeding a preset value. Therefore, the electric field signal generation and temperature sensing functions of the power board are crucial.

[0004] Therefore, a power board testing device is needed to test the aforementioned functions of the incoming power board before assembling the main unit of the tumor electric field therapy device. Utility Model Content

[0005] This application provides a power board testing device for performing functional testing on power boards.

[0006] Specifically, this application is achieved through the following technical solution: a power board testing device, which includes a main body, on which a main control board, a power board electrically connected to the main control board, a display board electrically connected to the main control board, a display screen electrically connected to the display board, and a power board interface adapter board electrically connected to the main control board are provided, and the power board is electrically connected to the power board interface adapter board.

[0007] According to one embodiment of the present invention, the main control board is provided with a first MCU module and a joint switching module. The first MCU module has a first I / O interface, a second I / O interface, an SPI interface, a first UART1 communication interface and a UART2 communication interface. The joint switching module is provided with an RS485 communication module, a power control module and an electric field switching circuit module.

[0008] According to one embodiment of the present invention, the RS485 communication module is electrically connected to the UART2 communication interface, and the power control module and the electric field switching circuit module are both connected to the second I / O interface.

[0009] According to one embodiment of the present invention, the first UATR1 communication interface of the first MCU module is electrically connected to the power board through the power board interface adapter board, and the electric field switching circuit module of the combined switching module is electrically connected to the power board through the power board interface adapter board.

[0010] According to one embodiment of the present invention, the power board is provided with a temperature measurement module, a second MCU module and an electric field signal generation module connected in series. The second MCU module is provided with an ADC interface, a second UART1 communication interface and a PWM interface connected in series. The ADC interface is electrically connected to the temperature measurement module and the PWM interface is electrically connected to the electric field signal generation module.

[0011] According to one embodiment of the present invention, the second UART1 communication interface is electrically connected to the first UART1 communication interface through the power board interface adapter, and the electric field signal generation module is electrically connected to the electric field switching circuit module through the power board interface adapter.

[0012] According to one embodiment of the present invention, the main control board is electrically connected to an external adapter through the joint switching module, and the adapter is electrically connected to the host aging detection equipment.

[0013] According to one embodiment of the present invention, the power board interface adapter board is provided with a plurality of second pins, and the power board is provided with a plurality of second sockets corresponding to the plurality of second pins, and the plurality of second pins and the plurality of second sockets are connected in a one-to-one correspondence.

[0014] According to one embodiment of the present invention, the main body is further provided with a mating plate corresponding to the power board interface adapter plate and the power board, and the mating plate is sandwiched between the power board interface adapter plate and the power board.

[0015] According to one embodiment of the present invention, the mating plate is provided with a plurality of clearance grooves, and the mating plate is provided with a plurality of first through holes corresponding one-to-one with a plurality of second pins, and the second pins are exposed in the corresponding first through holes.

[0016] The power board testing equipment provided in this application includes a first MCU module on its main control board that can receive temperature data read from the power board to be tested to determine whether the temperature measurement function of the power board is normal. The first MCU module on the main control board can also generate control signals to control the power board to generate an electric field, which is then transmitted to the host aging testing equipment via an external adapter to test whether the electric field signal generation function of the power board is normal. The first MCU module finally transmits the test information to a display board electrically connected to it, and displays the test results on a screen electrically connected to the display board, facilitating observation by testing personnel. The power board testing equipment also includes a mating plate sandwiched between the power board interface adapter board and the power board, which is fixed to the power board interface adapter board. This mating plate has multiple first through holes that expose the second pins on the power board interface adapter board that correspond to the second sockets on the power board, facilitating the replacement of the power board by testing personnel after testing and improving the efficiency of the testing process.

[0017] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0018] Figure 1 This is a perspective structural diagram of a power board testing device according to one embodiment of the present invention; Figure 2 for Figure 1 An exploded view of the overall structure of the power board testing equipment shown in the figure; Figure 3 for Figure 1 The diagram shows the three-dimensional structure of the main body of the power board testing equipment after the power board interface adapter plate is installed. Figure 4 for Figure 1 The diagram shows a schematic block diagram of the circuit principle of the power board testing device.

[0019] Explanation of reference numerals in the attached figures: Power board testing device 100, adapter 10, power board 11, adapter interface 110, power switch 111, main control board 12, first MCU module 120, first I / O interface 1200, second I / O interface 1201, SPI interface 1202, first UART1 communication interface 1203, UART2 communication interface 1204, combined switching module 121, RS485 communication module 1210, power control module 1211, electric field switching circuit module 1212, first pin 122, display board 13, key detection circuit 130, key 1300, display screen driving circuit 131, display screen 14, display surface 140, power board interface adapter board 15, first via 150, positioning hole 1500, screw hole 1501, first socket 151 Second pin 152, power board 16, second MCU module 160, ADC interface 1600, second UART1 communication interface 1601, PWM interface 1602, temperature measurement module 161, electric field signal generation module 162, second socket 163, adapter 17, host aging test equipment 18, main body 20, first mounting part 201, second mounting part 202, positioning post 2020, threaded hole post 2021, third mounting part 203, fourth mounting part 204, housing 21, housing cover 22, protrusion 220, adapter assembly 221, button assembly 2200, first partition plate 23, second partition plate 24, mating plate 25, clearance groove 250, first through hole 251, second through hole 252, second through hole 253, limiting part 254, interface cover 26. Detailed Implementation

[0020] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples consistent with some aspects of this application.

[0021] refer to Figures 1 to 4 As shown, the present invention relates to a power board testing device 100 for performing functional testing on a power board 16, which has a main body 20. The main body 20 is provided with a main control board 12, a power supply board 11 electrically connected to the main control board 12, a display board 13 electrically connected to the main control board 12, a display screen 14 electrically connected to the display board 13, a power board interface adapter board 15 electrically connected to the main control board 12, and a power board 16 electrically connected to the main control board 12 through the power board interface adapter board 15.

[0022] Specifically, the power board 11 has an adapter interface 110 for connecting to an external adapter 10 to power the main control board 12.

[0023] The main control board 12 includes a first MCU module 120 and a joint switching module 121. The first MCU module 120 has a first I / O interface 1200, a second I / O interface 1201, an SPI interface 1202, a first UART1 communication interface 1203, and a UART2 communication interface 1204. The joint switching module 121 includes an RS482 communication module 1210, a power control module 1211, and an electric field switching circuit module 1212. The RS482 communication module 1210 is connected to the UART2 communication interface 1204, and the power control module 1211 and the electric field switching circuit module 1212 are connected to the second I / O interface 1201.

[0024] The display panel 13 is provided with a key detection circuit 130, a key 1300 electrically connected to the key detection circuit 130, and a display screen driving circuit 131. The key detection circuit 130 is connected to the first I / O interface 1200 of the first MCU module 120, and one end of the display screen driving circuit 131 is connected to the SPI interface 1202 of the first MCU module 120, and the other end is electrically connected to the display screen 14.

[0025] The power board 16 comprises a temperature measurement module 161, a second MCU module 160, and an electric field signal generation module 162, all connected in series. The second MCU module 160 includes an ADC interface 1600, a second UART1 communication interface 1601, and a PWM interface 1602, all connected in series. The ADC interface 1600 is electrically connected to the temperature measurement module 161. The second UART1 communication interface 1601 is electrically connected to the first UART1 communication interface 1203 of the first MCU module 120 of the main control board 12 via the power board interface adapter board 15. The electric field signal generation module 162 is electrically connected to the electric field switching circuit module 1212 of the joint switching module 121 of the main control board 12 via the power board interface adapter board 15. The power board 16 is electrically connected to the main control board 12 via the power board interface adapter board 15 to enable the main control board 12 to perform functional testing on it. The specific functional tests performed by the main control board 12 on the power board 16 include electric field signal generation function testing and temperature measurement function testing.

[0026] When testing the electric field signal generation function of the power board 16, the joint switching module 121 of the main control board 12 is also electrically connected to the host aging test equipment 18 via an adapter 17. The host aging test equipment 18 is used to simulate the working environment of the power board 16 under real use conditions, which facilitates the relevant functional testing of the power board 16. Specifically: After the testing personnel insert the adapter 10 into the adapter interface 110 of the power board 11 and turn on the power switch 111 for normal power supply, the testing personnel can press and hold the button 1300 on the display panel 13 for more than three seconds. The first MCU module 120 on the main control board 12 receives the command to open the electric field transmitted by the button detection circuit 130 electrically connected to the button 1300 through its first I / O interface 1200, and transmits the command to the second UART1 communication interface 1601 on the second MCU module 160 of the power board 16 through the first UART1 communication interface 1203. The command is then transmitted to the PWM interface 1602 through the second UART1 communication interface 1601. The PWM interface 1602 then controls the generation of the electric field signal electrically connected to it. Module 162 operates to generate a stable alternating current signal. Then, the electric field signal generation module 162 transmits the alternating current signal to the electric field switching circuit module 1212 of the joint switching module 121 on the main control board 12, and finally transmits it to the host aging test equipment 18 via the adapter 17. At this time, the tester can connect the voltage and current probes of the oscilloscope (not shown) to the corresponding test points on the host aging test equipment 18 and observe the corresponding alternating current signal voltage, current, frequency, and switching frequency parameters on the oscilloscope (not shown). These parameters are compared with their preset specified ranges. If the values ​​of the above parameters displayed by the oscilloscope (not shown) fall within the corresponding preset specified ranges, it indicates that the electric field signal generation function of the power board 16 is normal; otherwise, it is abnormal.

[0027] When testing the temperature measurement function of the power board 16, the tester inserts the adapter 10 into the adapter interface 110 of the power board 11 and turns on the power switch 111 to supply power normally under the preset experimental ambient temperature. At this time, the second MCU module 160 on the power board 16 reads the temperature data of the temperature measurement module 161 through its ADC interface 1600. The second UART1 communication interface 1601 transmits the temperature data to the first UART1 communication interface 1203 of the first MCU module 120 on the main control board 12. After receiving the temperature data, the first MCU module 120 compares it with its preset temperature data range. If the received temperature data falls within the preset temperature data range, it indicates that the temperature measurement function of the temperature measurement module 161 of the power board 16 is normal; otherwise, it is abnormal. Subsequently, the first MCU module 120 will control the display screen 14 to display whether the temperature measurement function of the temperature measurement module 161 of the power board 16 has passed, based on the temperature measurement function status of the temperature measurement module 161. If it passes, the display screen 14 will display "Temperature sensing passed"; if it fails, the display screen 14 will display "Temperature sensing failed". The testing personnel can judge whether the temperature measurement function of the power board 16 is normal by observing the content displayed on the display screen 14.

[0028] refer to Figure 2 As shown, the main body 20 includes a housing 21 and a cover 22 located on the front side of the housing 21. The housing 21 has a mounting space (unlabeled) for mounting the aforementioned circuit board. This mounting space (unlabeled) is divided into several mounting portions by several vertically arranged partitions. Specifically, a first partition 23 extending in the left-right direction is provided at the middle of the housing 21. The first partition 23 divides the mounting space (unlabeled) into a first mounting portion 201 located on its front side and a second mounting portion 202 located on its rear side for accommodating the power board interface adapter board 15. Furthermore, the housing 21 also has a second partition 24 located within the first mounting portion 201 and extending in the front-back direction. The second partition 24 divides the first mounting portion 201 into a third mounting portion 203 located on its left side for accommodating the power board 11 and a fourth mounting portion 204 located on its right side for accommodating the main control board 12. The housing 21 is also provided with an interface cover 26 corresponding to the adapter interface 110 and the power switch 111 on the power board 11. The interface cover 26 is provided with corresponding openings (unlabeled) that allow the adapter interface 110 and the power switch 111 to be exposed, so that the tester can plug in the adapter 10 and operate the power switch 111 to start or stop the test process of the power board 16 at any time.

[0029] Combination Figure 3As shown, the main control board 12 and the power board 16 are both located above the power board interface adapter board 15 and are electrically connected to the power board interface adapter board 15. The power board 16 is positioned corresponding to the second mounting part 202. Specifically, the back of the main control board 12 has multiple first pins 122, and the front of the power board interface adapter board 15 has multiple first sockets 151 corresponding to the multiple first pins 122. The multiple first pins 122 and the multiple first sockets 151 are connected one-to-one to achieve electrical connection between the main control board 12 and the power board interface adapter board 15. The front of the power board interface adapter board 15 also has multiple second pins 152, and the back of the power board 16 has multiple second sockets 163 corresponding to the multiple second pins 152. The multiple second pins 152 and the multiple second sockets 163 are connected one-to-one to achieve electrical connection between the power board 16 and the power board interface adapter board 15. The main body 20 also includes a mating plate 25 located between the power board interface adapter plate 15 and the power board 16. The mating plate 25 has multiple clearance slots 250 corresponding to electrical components (not shown) located on the back of the power board 16. The mating plate 25 also has multiple first through holes 251 for exposing multiple first sockets 151 of the power board interface adapter plate 15 and multiple second through holes 252 for exposing multiple second pins 152 of the power board interface adapter plate 15. The left and right sides of the power board interface adapter plate 15 are also provided with first through holes 150, each including a positioning hole 1500 and a screw hole 1501. The left and right sides of the mating plate 25 are respectively provided with second through holes 253 corresponding to the first through holes 150. The second mounting part 202 has positioning posts 2020 located on its left and right sides and corresponding to the positioning holes 1500, and threaded hole posts 2021 located on its left and right sides and corresponding to the screw holes 1501, respectively. When the mating plate 25 and the power board interface adapter plate 15 are installed, the positioning posts 2020 located on both sides of the second mounting part 202 pass through the corresponding positioning holes 1500 and are engaged with the power board interface adapter plate 15. Bolts (not shown) pass through the corresponding second through holes 253 and the corresponding screw holes 1501 in sequence and are locked into the corresponding threaded hole posts 2021 located on the left and right sides of the second mounting part 202 to fix the mating plate 25 and the power board interface adapter plate 15 in the second mounting part 202. The mating plate 25 is also provided with a roughly "L"-shaped limiting part 254 extending upward at the two corners on the rear side of the main body 20. When the power board 16 is placed on the mating plate 25 and inserted into the power board interface adapter plate 15, the rear corner of the power board 16 abuts against the limiting part 254 to enhance the insertion stability of the power board 16 and the power board interface adapter plate 15. This setting makes it convenient for the testing personnel to replace the new power board 16 after the testing process is completed, thus improving the testing efficiency.

[0030] Back Figure 2As shown, the display screen 14 is located on the front side of the display panel 13. Both the display panel 13 and the display screen 14 are housed within the housing 22. The front sidewall of the housing 22 has a protrusion 220 corresponding to the display panel 13, and the display surface 140 of the display screen 14 abuts against the inner sidewall of the protrusion 220. Specifically, the protrusion 220 is made of a light-transmitting material, allowing the display surface 140 of the display screen 14 to display through the protrusion 220. The front sidewall of the housing 22 also has a button assembly 2200 corresponding to the button 1300 on the display panel 13, which can cooperate with the button 1300. The inspector can operate the button 1300 by pressing the button assembly 2200. The front side wall of the cover 22 is also provided with an adapter assembly 221. The adapter assembly 221 is electrically connected to the main control board 12 via a wire (not shown). With this configuration, when performing the aforementioned electric field signal generation function test of the power board 16, the host aging test equipment 18 can be electrically connected to the main control board 12 of the power board test equipment 100 by plugging the adapter 17 into the adapter assembly 221.

[0031] The power board testing device 100 provided by this utility model receives temperature data read by the power board 16 to be tested through the first MCU module 120 on its main control board 12 to determine whether the temperature measurement function of the power board 16 is normal. The first MCU module 120 on the main control board 12 can also generate control signals to control the electric field signal generation module 162 on the power board 16 to generate an electric field and transmit it to the joint switching module 121, and then transmit it to the host aging test device 18 through the external adapter 17 to test whether the electric field signal generation function of the power board 16 is normal. The first MCU module 120 transmits the test information to the display board 13 electrically connected to it and displays the test results on the display screen 14 electrically connected to the display board 13, which is convenient for the test personnel to observe. The power board testing equipment 100 provided in this application also achieves pluggable connection between the power board 16 to be tested and the power board testing equipment 100 by clamping a mating plate 25 fixed to the power board interface adapter plate 15 and the power board 16 between the power board interface adapter plate 15 and the power board 16. This facilitates the replacement of the power board 16 with a new one after the test is completed, thereby improving the efficiency of the testing process.

[0032] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A power board testing device for performing functional testing on power boards, characterized in that: The power board testing device includes a main body, on which a main control board, a power supply board electrically connected to the main control board, a display board electrically connected to the main control board, a display screen electrically connected to the display board, and a power board interface adapter board electrically connected to the main control board are provided. The power board is electrically connected to the power board interface adapter board.

2. The power board testing equipment according to claim 1, characterized in that: The main control board has a first MCU module and a joint switching module. The first MCU module is provided with a first I / O interface, a second I / O interface, an SPI interface, a first UART1 communication interface and a UART2 communication interface. The joint switching module is provided with an RS485 communication module, a power control module and an electric field switching circuit module.

3. The power board testing equipment according to claim 2, characterized in that: The RS485 communication module is electrically connected to the UART2 communication interface, and the power control module and the electric field switching circuit module are both connected to the second I / O interface.

4. The power board testing equipment according to claim 2, characterized in that: The first UATR1 communication interface of the first MCU module is electrically connected to the power board through the power board interface adapter board, and the electric field switching circuit module of the combined switching module is electrically connected to the power board through the power board interface adapter board.

5. The power board testing equipment according to claim 4, characterized in that: The power board is provided with a temperature measurement module, a second MCU module and an electric field signal generation module connected in series. The second MCU module is provided with an ADC interface, a second UART1 communication interface and a PWM interface connected in series. The ADC interface is electrically connected to the temperature measurement module and the PWM interface is electrically connected to the electric field signal generation module.

6. The power board testing equipment according to claim 5, characterized in that: The second UART1 communication interface is electrically connected to the first UART1 communication interface through the power board interface adapter board, and the electric field signal generation module is electrically connected to the electric field switching circuit module through the power board interface adapter board.

7. The power board testing equipment according to claim 2, characterized in that: The main control board is electrically connected to an external adapter via the joint switching module, and the adapter is electrically connected to the host aging detection equipment.

8. The power board testing equipment according to claim 1, characterized in that: The power board interface adapter board is provided with a plurality of second pins, and the power board is provided with a plurality of second sockets corresponding to the plurality of second pins, and the plurality of second pins and the plurality of second sockets are connected in a one-to-one correspondence.

9. The power board testing equipment according to claim 8, characterized in that: The main body is further provided with a mating plate corresponding to the power board interface adapter board and the power board, and the mating plate is sandwiched between the power board interface adapter board and the power board.

10. The power board testing equipment according to claim 9, characterized in that: The mating plate is provided with multiple clearance grooves and multiple first through holes that correspond one-to-one with multiple second pins, with the second pins exposed in the corresponding first through holes.

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