Integrated circuit testing apparatus

Abstract

The utility model relates to integrated circuit testing device technical field discloses integrated circuit testing device, include: testing device main part, be provided with test module on testing device main part, the one side of test module is equipped with the inspection platform, is provided with the discharge box on the one side of testing device main part away from the inspection platform, the one side of discharge box is provided with the die inspection department, the one side of die inspection department is equipped with motion component, motion component includes adsorption module, the adsorption module includes C type mechanical arm, the both ends of C type mechanical arm are provided with the plastic plate, the vacuum suction nozzle is fixedly arranged on the plastic plate, through adding the suction nozzle in C type mechanical arm adsorption vacuum position, effectively solved the vacuum leakage problem caused by the uneven Ring ring surface because of DAF adhesive tape sticking, the improved adsorption module can form stable and sufficient vacuum suction, greatly reduced the time loss caused by alarm shutdown and production interruption, and the required artificial intervention frequency, thereby significantly improved the machine utilization and overall production efficiency.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit testing equipment technology, specifically to integrated circuit testing equipment. Background Technology

[0002] In the integrated circuit industry, chip testing is a crucial step in ensuring product quality and performance. This is especially true for specialized products such as DAF film products with adhesive tape and thin-film chips, where the testing process demands extremely high precision, stability, and compatibility from the equipment. Traditional integrated circuit testing equipment exhibits numerous technical limitations when handling these products, making it difficult to meet the demands of high-efficiency production.

[0003] To prevent surface-mount adhesive (DAF) films on wafers from detaching or shifting during handling after dicing, traditional equipment uses adhesive tape along the edge of the metal ring supporting the wafer to secure the DAF film. However, this tape creates localized bulges between the ring and the DAF film, resulting in an uneven lower surface of the ring. Traditional equipment performs adsorption from below the ring; when the adsorption surface is uneven, an effective seal cannot be formed between the vacuum port and the ring surface, leading to air leakage during adsorption, a decrease in vacuum, and frequent machine alarms. This not only reduces equipment utilization but also requires manual intervention, increasing labor costs and the risk of product scratches.

[0004] In terms of automated transfer, the motion components of some equipment lack sufficient linkage precision, and there are delays in the coordinated control of the X, Y, and Z axes. This results in low transfer efficiency of chips between the feeding box, inspection area, and testing module, affecting the overall testing cycle time. At the same time, the positioning structure of the inspection platform for chips is simple, which is prone to poor test contact due to chip placement misalignment, further affecting the accuracy of test results.

[0005] In addition, traditional devices have poor adaptability to chips of different specifications. In particular, for thin products of about 100μm, the existing adsorption structure is difficult to grasp stably, which limits the applicability of the equipment. Special modules need to be customized for specific products, which increases production costs and debugging cycle. Utility Model Content

[0006] The purpose of this invention is to address the shortcomings of existing technologies by proposing an integrated circuit testing device.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: an integrated circuit testing device, comprising: a testing device body, a testing module provided on the testing device body, an inspection platform provided on one side of the testing module, a material feeding box provided on the side of the testing device body away from the inspection platform, a bare die inspection area provided on one side of the material feeding box, and a motion component provided on one side of the bare die inspection area, the motion component including an adsorption module;

[0008] The adsorption module includes a C-shaped robotic arm with plastic plates at both ends and vacuum nozzles fixedly mounted on the plastic plates.

[0009] As a further description of the above technical solution:

[0010] A circular ring is provided above the inspection platform.

[0011] As a further description of the above technical solution:

[0012] An adsorption module is arranged on one side of the bare film inspection area, and a C-shaped robotic arm is arranged on the adsorption module, with plastic plates fixedly arranged at both ends of the C-shaped robotic arm.

[0013] The plastic plate is provided with at least one vacuum nozzle.

[0014] As a further description of the above technical solution:

[0015] The motion component includes:

[0016] The Z-axis is mounted on the main body of the testing device;

[0017] The Y-axis is positioned above the Z-axis;

[0018] The X-axis is positioned above the Y-axis, and the adsorption module is fixedly positioned on the X-axis.

[0019] As a further description of the above technical solution:

[0020] At least one mounting hole is provided on the plastic plate, and the vacuum nozzle is disposed in the mounting hole.

[0021] As a further description of the above technical solution:

[0022] The diameter of the vacuum nozzle is 4 mm to 6 mm.

[0023] As a further description of the above technical solution:

[0024] The number of mounting holes is 1, 2, or 3.

[0025] This utility model has the following beneficial effects:

[0026] 1. By adding a suction nozzle to the vacuum adsorption position of the C-type robotic arm, the problem of vacuum leakage caused by unevenness of the Ring surface due to DAF tape adhesion is effectively solved. The improved adsorption module can form a stable and sufficient vacuum suction, which greatly reduces the time loss caused by alarm shutdown and production interruption, as well as the number of manual interventions required, thereby significantly improving machine utilization and overall production efficiency.

[0027] 2. A similar nozzle optimization scheme is also applicable, effectively broadening the scope of application of the equipment. Combined with the coordinated design of the C-shaped robotic arm and three sets of vacuum nozzles, as well as the motion components composed of X, Y, and Z axes, it realizes precise and efficient operation of chip adsorption and transfer, improving the automation level and overall work efficiency of the integrated circuit testing process. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the overall device of the integrated circuit testing apparatus proposed in this utility model;

[0029] Figure 2 This is a schematic diagram of the C-shaped robotic arm of the integrated circuit testing device proposed in this utility model;

[0030] Figure 3 The integrated circuit testing device proposed in this utility model Figure 2 Enlarged view at point A;

[0031] Figure 4 This is a schematic diagram of the circular ring of the integrated circuit testing device proposed in this utility model;

[0032] Figure 5 This is a schematic diagram of the moving components of the integrated circuit testing device proposed in this utility model.

[0033] Legend: 1. Main body of the testing device; 101. X-axis; 102. Y-axis; 103. Z-axis; 2. Testing module; 3. Inspection platform; 31. Ring; 4. Bare film inspection area; 5. Feed box; 6. Adsorption module; 61. C-shaped robotic arm; 62. Plastic plate; 63. Vacuum nozzle. Detailed Implementation

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0035] like Figures 1 to 5As shown, the integrated circuit testing device provided in this application embodiment includes: a testing device body 1, on which a testing module 2, an inspection platform 3, a material feeding box 5, a bare die inspection area 4, and a motion component are integrated, the motion component including an adsorption module 6.

[0036] In actual operation, the adsorption module 6 picks up the wafer from the feeding box 5. The wafer is fixed around the material by DAF film or other film and ring. The adsorption module 6 moves to place the wafer on the inspection platform 3, and the testing module 2 tests the wafer.

[0037] In some embodiments, the inspection platform 3 has a ring 31 on top of it. The inner diameter of the ring is adapted to the wafer and the Ring that carries the wafer. The ring is used to place the wafer to be inspected, to fix the product, to prevent it from shifting during testing, and to ensure the stability of the inspection.

[0038] The material box 5 is used to store wafer material boxes; the bare die inspection area 4 uses optical recognition technology to detect defects in the bare dies on the wafer.

[0039] The adsorption module 6 includes a C-shaped robotic arm 61, with plastic plates 62 at both ends of the C-shaped robotic arm 61. The specific installation method includes, but is not limited to, fixing the plastic plates 62 to the top of the robotic arm 61 by adhesive or screws. A vacuum nozzle 63 is fixedly installed on the plastic plate 62. Depending on the adsorption requirements, one, two, or three mounting holes can be opened on the plastic plate 62 for installing the vacuum nozzle 63.

[0040] In some embodiments, the motion component further includes an X-axis, a Y-axis, and a Z-axis, enabling three-dimensional motion via X-axis 101, Y-axis 102, and Z-axis 103. Z-axis 103 is fixed to the main body 1 of the testing device, Y-axis 102 is positioned above Z-axis 103, X-axis 101 is positioned above Y-axis 102, and adsorption module 6 is fixed to X-axis 101, thereby enabling wafer transfer between the material feeding box 5, the inspection platform 3, and the bare wafer inspection area 4.

[0041] It should be noted that the optimal number of mounting holes is three. The single-hole design is suitable for large-size wafers, while the dual-hole / triple-hole design is suitable for small-size or thin wafers. Multi-point adsorption improves stability, and the adsorption method can be flexibly selected according to the wafer specifications to avoid wafer deformation or detachment and improve handling reliability.

[0042] It should be noted that the vacuum nozzle 63 is connected to the vacuum pump via a vacuum hose. By generating negative pressure, it adsorbs the wafer, ensuring that the vacuum nozzle is securely installed, guaranteeing stable adsorption force, and facilitating nozzle replacement and maintenance.

[0043] In some embodiments, the number of vacuum holes is at least one, and the diameter of the vacuum nozzle 63 is 4 mm to 6 mm. Different diameter nozzles are selected according to the wafer size. With such a design, the vacuum nozzle 63 can form an effective adsorption with the surface of the ring carrying the wafer. The appropriate contact area ensures stable adsorption without damaging the die, adapting to integrated circuit wafers of different sizes, improving equipment versatility, and ensuring the safety of die handling.

[0044] Understandable Figure 1 The subject matter is shown only schematically, and the actual shape, size, location, and construction of these components are not subject to change. Figure 1 The limitations mean that the topics can also include those that are more... Figure 1 More or fewer parts.

[0045] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An integrated circuit testing apparatus, characterized in that: include: The main body of the testing device (1) is provided with a testing module (2), and an inspection platform (3) is provided on one side of the testing module (2). A feeding box (5) is provided on the side of the main body of the testing device (1) away from the inspection platform (3). A bare wafer inspection area (4) is provided on one side of the feeding box (5). A motion component is provided on one side of the bare wafer inspection area (4). The motion component includes an adsorption module (6). The adsorption module (6) includes a C-shaped robotic arm (61), with plastic plates (62) at both ends of the C-shaped robotic arm (61), and vacuum nozzles (63) fixedly mounted on the plastic plates (62).

2. The integrated circuit testing apparatus according to claim 1, characterized in that: A ring (31) is provided above the inspection platform (3).

3. The integrated circuit testing apparatus according to claim 1, characterized in that: An adsorption module (6) is arranged on one side of the bare film inspection area (4), and a C-shaped robotic arm (61) is arranged on the adsorption module (6), with plastic plates (62) fixedly arranged at both ends of the C-shaped robotic arm (61). The plastic plate (62) is provided with at least one vacuum nozzle (63).

4. The integrated circuit testing apparatus according to claim 1, characterized in that: The motion component includes: The Z-axis (103) is set on the main body (1) of the testing device; The Y-axis (102) is positioned above the Z-axis (103); The X-axis (101) is positioned above the Y-axis (102), and the adsorption module (6) is fixedly positioned on the X-axis (101).

5. The integrated circuit testing apparatus according to claim 1, characterized in that: At least one mounting hole is provided on the plastic plate (62), and the vacuum nozzle (63) is disposed in the mounting hole.

6. The integrated circuit testing apparatus according to claim 1, characterized in that: The diameter of the vacuum nozzle (63) is 4 mm to 6 mm.

7. The integrated circuit testing apparatus according to claim 5, characterized in that: The number of mounting holes provided on the plastic plate (62) is 1, 2 or 3.

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