An integrated circuit testing apparatus

Abstract

The utility model relates to integrated circuit testing arrangement technical field discloses an integrated circuit testing arrangement, include: air compressor, heat exchanger, be provided with air inlet and air outlet on the heat exchanger, air inlet is passed through transmission pipeline no.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit testing equipment technology, specifically to an integrated circuit testing equipment. Background Technology

[0002] In the testing of integrated circuit chips, especially in the performance verification of high-precision chips, testing is often required at low temperatures to simulate their actual working environment or assess their stability under specific conditions. Traditional low-temperature chip testing equipment has significant limitations in terms of gas supply, temperature control, and system coordination.

[0003] Existing devices often use a single cooling module for their cooling system, which lacks precise temperature regulation and stabilization mechanisms. This results in large temperature fluctuations in the low-temperature gas delivered to the test area, which can easily interfere with the accuracy of chip test results, especially for temperature-sensitive chips.

[0004] Pressure stability is difficult to guarantee during gas transmission. Traditional systems often rely on manual valve adjustment or lack real-time pressure monitoring, which frequently leads to gas transmission interruptions or unstable flow due to sudden increases or decreases in gas pressure. This not only affects cooling efficiency but may also cause potential damage to the chip due to airflow impact.

[0005] Furthermore, in most testing systems, modules such as air supply, cooling, and pressure control lack integrated design and coordinated control. Parameters in each stage are difficult to match, resulting in low system efficiency and complex operation, requiring frequent manual intervention and adjustments, which increases the risk of testing errors and labor costs. Additionally, the internal chip positioning structure of the sorting machine lacks precision, making it susceptible to poor contact that further affects the stability of test signal transmission.

[0006] To address the requirements of stable low-temperature environment, precise pressure control, and efficient system coordination in integrated circuit testing, existing technologies still have significant room for improvement, and there is an urgent need for an integrated and highly stable testing device to overcome these bottlenecks. Utility Model Content

[0007] The purpose of this invention is to address the shortcomings of existing technologies by proposing an integrated circuit testing device.

[0008] To achieve the above objectives, the present invention adopts the following technical solution: an integrated circuit testing device, comprising: an air compressor;

[0009] A heat exchanger having an inlet end and an outlet end, wherein the inlet end is connected to the air compressor via a transmission pipe.

[0010] The sorting machine includes a test chamber, which is connected to the outlet of the heat exchanger via a transmission pipe.

[0011] As a further description of the above technical solution:

[0012] The air compressor is equipped with a transmission port and an airlock.

[0013] As a further description of the above technical solution:

[0014] A pressure gauge and a solenoid valve are installed on the transmission pipeline.

[0015] As a further description of the above technical solution:

[0016] An outlet temperature tester is installed on the second transmission pipeline.

[0017] As a further description of the above technical solution:

[0018] A test socket is provided inside the test chamber.

[0019] As a further description of the above technical solution:

[0020] The heat exchanger includes a refrigeration unit with a vapor compression refrigeration cycle.

[0021] As a further description of the above technical solution:

[0022] The sorting machine also includes an immersion zone and a test head.

[0023] As a further description of the above technical solution:

[0024] The test head is configured to movably close the test cavity.

[0025] As a further description of the above technical solution:

[0026] The test head is equipped with multiple guide rods.

[0027] This utility model has the following beneficial effects:

[0028] 1. By coordinating the air compressor and the heat exchanger of the vapor compression refrigeration cycle, the airflow temperature entering the test chamber of the sorting machine can be precisely controlled; the pressure gauge and solenoid valve of the first transmission pipeline monitor and control the air pressure in real time, and the outlet temperature tester of the second transmission pipeline provides feedback on the airflow temperature, ensuring that the test chamber maintains a stable temperature and pressure environment, providing standard-compliant test conditions for integrated circuits.

[0029] 2. The air compressor, heat exchanger, and sorter form a closed-loop temperature control system through transmission pipelines. The test socket and circuit board inside the test chamber directly connect to the integrated circuit to be tested. The overall structure is compact and the functions are interconnected. The airlock setting facilitates the control of airflow interruption, and the solenoid valve can respond and adjust quickly to meet the rapid switching test requirements of integrated circuits under different temperature and pressure conditions. Attached Figure Description

[0030] Figure 1 This is an overall test flowchart of an integrated circuit testing device proposed in this utility model;

[0031] Figure 2 This is a schematic diagram of the air compressor transmission port of an integrated circuit testing device proposed in this utility model;

[0032] Figure 3 This is a schematic diagram of a heat exchanger for an integrated circuit testing device proposed in this utility model;

[0033] Figure 4 This is a schematic diagram of the immersion temperature zone of the sorting machine in an integrated circuit testing device proposed in this utility model;

[0034] Figure 5 This is a schematic diagram of the sorting test chamber of an integrated circuit testing device proposed in this utility model;

[0035] Figure 6 This is a schematic diagram of the sorting machine test head of an integrated circuit testing device proposed in this utility model.

[0036] Legend: 1. Air compressor; 11. Transmission port; 12. Airlock; 2. Transmission pipe one; 21. Transmission pipe two; 3. Pressure gauge; 4. Solenoid valve; 5. Heat exchanger; 51. Inlet; 52. Outlet; 6. Outlet temperature tester; 7. Sorter; 71. Test chamber; 72. Test socket; 73. Immersion zone; 8. Test head; 9. Guide rod. Detailed Implementation

[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0038] like Figures 1 to 6 As shown in the embodiment of this application, an integrated circuit testing device includes: an air compressor 1, a heat exchanger 5, and a sorting machine 7.

[0039] Understandable Figure 1 The subject matter is shown only schematically, and the actual shape, size, location, and construction of these components are not subject to change. Figure 1 The limitations mean that the topics can also include those that are more... Figure 1 More or fewer parts.

[0040] In some embodiments, the air compressor 1 provides compressed gas at room temperature. The air compressor 1 is provided with a transmission port 11 and an airlock 12. The airlock 12 controls the opening and closing of the transmission port 11, so as to achieve precise control of the air delivery volume of the air compressor 1 and ensure stable compression efficiency.

[0041] In some embodiments, the heat exchanger 5 is provided with an inlet end and an outlet end. The heat exchanger 5 includes a refrigeration unit with a vapor compression refrigeration cycle. The refrigeration unit achieves heat exchange through a vapor compression cycle, processes the gas output from the air compressor 1 to the target temperature, provides a wide range of temperature regulation, and meets the testing requirements of integrated circuits under different temperature environments.

[0042] In some embodiments, the air compressor 1 is connected to the air inlet of the heat exchanger 5 via a transmission pipe 2. A pressure gauge 3 and a solenoid valve 4 are installed on the transmission pipe 2. The pressure gauge 3 monitors the pressure inside the transmission pipe 2 in real time, and the solenoid valve 4 controls the opening and closing of the pipe. It automatically closes when the pressure is abnormal, thereby realizing pipe pressure monitoring and safety control to prevent overpressure operation.

[0043] In some embodiments, the sorting machine 7 includes a test chamber 71, an immersion zone 73, and a test head 8, which together complete the low-temperature pretreatment, transfer, and testing process of the chips. The immersion zone 73 has a first track inside for receiving and temporarily storing the chip products to be tested; the first track is not shown in the accompanying drawings. Before low-temperature testing, low-temperature compressed air provided by the heat exchanger 5 is guided to the immersion zone 73 to pre-cool the area, allowing the chips located on the first track to reach a low-temperature state close to the target test temperature in advance. This helps reduce temperature fluctuations in the subsequent test chamber and improves testing efficiency and temperature stability. The test head 8, as a key moving component connecting the immersion zone 73 and the test chamber 71, integrates a second track and multiple guide rods 9; the second track is not shown in the accompanying drawings. During the test preparation stage, the test head 8 moves to a closed position, so that its front end is tightly fitted with the opening of the test chamber 71, forming a sealed test space. In this closed state, the second track inside the test head 8 precisely aligns with the first track of the immersion zone 73, forming a continuous product transport path from the immersion zone 73 directly to the inside of the test chamber 71. A test socket 72 is installed inside the test chamber 71, fixedly mounted above the test circuit board. During testing, the pre-cooled chip is released from the first track of the immersion zone 73 and enters the aligned second track of the test head 8. Subsequently, the guide rod 9 on the test head 8 guides the chip to move smoothly along the track, ultimately being precisely pushed and placed onto the test socket 72 inside the test chamber 71. The test socket 72 establishes an electrical connection with the testing machine through the connected test circuit board. The testing machine provides test signals and power to the product through the test circuit board and the test socket 72, thereby completing the product's electrical performance test. In some embodiments, the sorting machine 7 is connected to the outlet of the heat exchanger 5 via a second transmission pipe 21. An outlet temperature tester 6 is installed on the second transmission pipe 21, which monitors the temperature of the gas entering the test chamber 71 in real time. The data is transmitted to the control system, providing a basis for temperature adjustment.

[0044] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An integrated circuit testing device, characterized in that: include: Air compressor (1); The heat exchanger (5) is provided with an air inlet (51) and an air outlet (52). The air inlet is connected to the air compressor (1) through a transmission pipe (2). The sorting machine (7) includes a test chamber (71), which is connected to the outlet of the heat exchanger (5) via a transmission pipe (21).

2. The integrated circuit testing device according to claim 1, characterized in that: The air compressor (1) is provided with a transmission port (11) and an airlock (12).

3. The integrated circuit testing device according to claim 1, characterized in that: A pressure gauge (3) and a solenoid valve (4) are installed on the transmission pipeline (2).

4. The integrated circuit testing device according to claim 1, characterized in that: An outlet temperature tester (6) is installed on the second transmission pipeline (21).

5. An integrated circuit testing device according to claim 1, characterized in that: A test socket (72) is provided inside the test cavity (71).

6. The integrated circuit testing apparatus according to claim 1, characterized in that: The heat exchanger (5) includes a refrigeration unit with a vapor compression refrigeration cycle.

7. The integrated circuit testing apparatus according to claim 1, characterized in that: The sorting machine (7) also includes an immersion zone (73) and a test head (8).

8. An integrated circuit testing apparatus according to claim 7, characterized in that: The test head (8) is configured to movably close the test cavity (71).

9. An integrated circuit testing apparatus according to claim 7, characterized in that: The test head (8) is provided with multiple guide rods (9).

Images