Optical module heat dissipation module and optical module

Abstract

The utility model provides a kind of optical module heat dissipation module and optical module, it is related to optical module technical field, and optical module heat dissipation module includes the heat-absorbing part, the heat-diffusing part and the heat-absorbing part of integrally formed using the same material;Heat-absorbing part is protruded in the side surface of heat-diffusing part, for contacting chip;Heat-diffusing part inside is equipped with the first cavity of hollow, and first cavity is filled with heat-diffusing medium;Heat-dissipating part is equipped with multiple, and multiple heat-dissipating part is arranged along the side surface of heat-diffusing part away from heat-absorbing part interval. By heat-absorbing part contact chip absorption heat, heat is transferred to the heat-diffusing medium in heat-diffusing part, so that heat-diffusing medium phase change obtains hot steam, and hot steam transfers heat to the outer wall of heat-dissipating part, and air outside heat-dissipating part occurs convection, to carry away heat from the outer wall of heat-dissipating part;Heat-absorbing part, heat-diffusing part and heat-dissipating part are integrally formed using the same material, avoid the thermal resistance between material and bonding surface, improve the efficiency of heat dissipation module on heat transfer path, to greatly improve the heat dissipation capacity of heat dissipation module.

Description

Technical Field

[0001] This utility model relates to the field of optical module technology, and in particular to an optical module heat dissipation module and an optical module. Background Technology

[0002] Optical chips are the core of optical communication modules. Currently, the highest speed and mass-producible chips in the world have a speed of 56G, and the power consumption of a single chip is 3 to 4W. To achieve a transmission speed of 800G or more, 16 to 32 or more chips need to be packaged in an optical device with a diameter of 2 square centimeters. A large amount of heat is concentrated in a small space. If it cannot be dissipated in time, it will cause the internal temperature of the optical module to rise abnormally, which will affect the chip's operating speed and lifespan.

[0003] In the existing technology, the heat dissipation module of an optical module is usually composed of three parts: a heat absorption layer, a heat dissipation layer, and a heat dissipation layer. Due to differences in materials or processes, these functional layers need to be welded or pressed together in pairs. There is thermal resistance between the materials and thermal resistance at the joint surface. These thermal resistances will reduce the efficiency of the heat dissipation module in the heat transfer path, thereby significantly reducing the heat dissipation capacity of the heat dissipation module. Utility Model Content

[0004] In view of this, the present invention proposes an optical module heat dissipation module and an optical module to solve the technical problem mentioned in the background art that the optical module heat dissipation module has both thermal resistance between materials and thermal resistance at the joint surface. These thermal resistances reduce the efficiency of the heat dissipation module in the heat transfer path, thereby significantly reducing the heat dissipation capacity of the heat dissipation module.

[0005] The technical solution of this utility model is implemented as follows: In a first aspect, this utility model provides a heat dissipation module for an optical module, comprising a heat-absorbing part, a heat-spreading part, and a heat-dissipating part integrally formed from the same material, wherein: The heat-absorbing part protrudes from one side of the heat-spreading part and is used to contact the chip; The heat-equalizing section has a hollow first cavity inside, which is filled with a heat-equalizing working fluid. The heat dissipation section is provided in multiple parts, and the multiple heat dissipation sections are arranged at intervals along the side of the heat distribution section away from the heat absorption section.

[0006] In some optional embodiments, preferably, the heat dissipation part has a hollow second cavity inside, and the second cavity is connected to the first cavity.

[0007] In some alternative embodiments, preferably, the heat dissipation portion extends along the length direction of the heat distribution portion, so that a narrow air duct is formed between adjacent heat dissipation portions.

[0008] In some alternative embodiments, preferably, the inner wall of the first cavity is provided with a reflux channel, which is filled with a circulating cooling medium.

[0009] In some alternative implementations, the reflux channel is preferably a capillary structure.

[0010] In some alternative embodiments, preferably, the first cavity is evacuated and then filled with a homogenizing working fluid.

[0011] In some alternative implementations, preferably, the heat-absorbing part is a solid structure.

[0012] Secondly, this utility model provides an optical module, including the optical module heat dissipation module as described in the first aspect.

[0013] The optical module heat dissipation module of this invention has the following advantages over the prior art: (1) The heat is absorbed by the chip through the heat absorption part, and the heat is transferred to the heat homogenizing medium in the heat homogenizing part, causing the heat homogenizing medium to undergo a phase change to hot vapor. The hot vapor transfers the heat to the outer wall of the heat dissipation part, and the air outside the heat dissipation part undergoes convection, thereby carrying away the heat from the outer wall of the heat dissipation part. The heat absorption part, heat homogenizing part and heat dissipation part are integrally formed from the same material, avoiding the formation of thermal resistance between materials and the joint surface, improving the efficiency of the heat dissipation module in the heat transfer path, thereby greatly improving the heat dissipation capacity of the heat dissipation module. (2) The heat dissipation part has a hollow second cavity inside, which is connected to the first cavity. The heat dissipation medium is in contact with the entire outer wall of the heat dissipation part, so that heat can be quickly transferred to the outer wall of the heat dissipation part through the heat dissipation medium, and the heat transfer efficiency is faster. (3) By extending the heat dissipation part along the length of the heat equalization part, a narrow air duct is formed between adjacent heat dissipation parts, which can increase the wind speed. The air convects in the narrow air duct, thereby quickly removing heat from the outer wall of the heat dissipation part. (4) A reflux channel is provided in the inner wall of the first cavity. The reflux channel is filled with circulating cooling medium. Under the action of the reflux channel, the cooling medium flows back to the heat absorption part in the inner wall of the entire first cavity, thus circulating heat dissipation and further improving the heat dissipation efficiency of the chip. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a perspective view of the optical module heat dissipation module in an embodiment of this utility model; Figure 2 This is a top view of the optical module heat dissipation module in an embodiment of this utility model; Figure 3 This utility model Figure 2 AA section view in the image.

[0016] Explanation of reference numerals in the attached diagram: 1-Heat absorption section, 2-Heat dissipation section, 3-Heat dissipation section, 4-Air duct; 21-First cavity, 22-Recirculation channel; 31-Second cavity. Detailed Implementation

[0017] The technical solutions of this utility model will be clearly and completely described below with reference to the embodiments of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.

[0018] Reference Figures 1-3 As shown, in a first aspect embodiment of the present invention, a heat dissipation module for an optical module is proposed, comprising a heat-absorbing part 1, a heat-spreading part 2, and a heat-dissipating part 3 integrally formed from the same material, wherein: The heat-absorbing part 1 protrudes from one side of the heat-spreading part 2 and is used to contact the chip; the heat-absorbing part 1 has a convex shape and absorbs heat by contacting the chip. The heat-equalizing section 2 has a hollow first cavity 21 inside, and the first cavity 21 is filled with a heat-equalizing working fluid. Multiple heat dissipation sections 3 are provided, and these sections are arranged at intervals along the side of the heat-spreading section 2 away from the heat-absorbing section 1. The heat dissipation sections 3 are finned to increase the heat dissipation area. No welding or assembly processes are performed between the heat-absorbing section 1, the heat-spreading section 2, and the heat dissipation sections 3, ensuring that no interfacial thermal resistance is generated on the functional layer.

[0019] The optical module heat dissipation module proposed in this embodiment absorbs heat through the contact of the heat-absorbing part 1 with the chip. The heat is transferred to the heat-spreading medium in the heat-spreading part 2, causing the heat-spreading medium to undergo a phase change and become hot vapor. The hot vapor transfers heat to the outer wall of the heat dissipation part 3, and the air outside the heat dissipation part 3 undergoes convection, thereby carrying away the heat from the outer wall of the heat dissipation part 3. The heat-absorbing part 1, the heat-spreading part 2, and the heat dissipation part 3 are integrally formed from the same material, avoiding the formation of thermal resistance between materials and at the joint surfaces, improving the efficiency of the heat dissipation module in the heat transfer path, and thus greatly improving the heat dissipation capacity of the heat dissipation module.

[0020] In some embodiments, the heat dissipation part 3 has a hollow second cavity 31 inside, which is connected to the first cavity 21. Through the connection between the second cavity 31 and the first cavity 21, the heat dissipation medium is in contact with the entire outer wall of the heat dissipation part 3, thereby quickly transferring heat to the outer wall of the heat dissipation part 3 through the heat dissipation medium, resulting in faster heat transfer efficiency.

[0021] In some embodiments, the heat dissipation section 3 extends along the length of the heat dissipation section 2, so that a narrow air duct 4 is formed between adjacent heat dissipation sections 3. The narrow air duct 4 can increase the air velocity, and the air convection in the narrow air duct 4 can quickly remove heat from the outer wall of the heat dissipation section 3.

[0022] In some embodiments, a reflux channel 22 is provided in the inner wall of the first cavity 21, and the reflux channel 22 is filled with circulating cooling medium. Under the action of the reflux channel 22, the cooling medium flows back to the heat absorption part 1 throughout the inner wall of the first cavity 21, thereby circulating heat dissipation and further improving the heat dissipation efficiency of the chip.

[0023] In some embodiments, the return channel 22 is a capillary structure. The capillary structure design ensures the return of the cooling medium, guaranteeing reliability while improving heat dissipation capacity.

[0024] In some embodiments, the first cavity 21 is evacuated and then filled with a heat-spreading medium. By evacuating the cavity before filling it with the heat-spreading medium, air is prevented from occupying space in the first cavity 21, allowing the heat-spreading medium to fill the first cavity 21 completely, increasing the volume of the heat-spreading medium, thereby improving the heat-spreading capacity and further enhancing the heat dissipation capacity of the device.

[0025] In some embodiments, the heat-absorbing part 1 is a solid structure. The solid design of the heat-absorbing part 1 allows heat to be transferred upwards from the entire heat-absorbing part 1 to the heat-spreading part 2, improving heat transfer efficiency and thus improving heat dissipation efficiency.

[0026] The working principle of the optical module heat dissipation module in this embodiment is as follows: the heat-absorbing part 1 absorbs heat in contact with the chip, and the heat is transferred to the heat-spreading medium in the heat-spreading part 2, causing the heat-spreading medium to undergo a phase change to become hot vapor. The hot vapor transfers heat to the outer wall of the heat dissipation part 3, and the air outside the heat dissipation part 3 undergoes convection, thereby carrying away the heat from the outer wall of the heat dissipation part 3. The heat-absorbing part 1, the heat-spreading part 2, and the heat dissipation part 3 are integrally formed from the same material, avoiding thermal resistance between materials and at the joint surfaces, improving the efficiency of the heat dissipation module in the heat transfer path, and thus greatly improving the heat dissipation capacity of the heat dissipation module; in addition, the integrated optical module heat dissipation module simplifies the assembly process of the heat dissipation module and saves assembly time and cost.

[0027] Based on the same concept, a second aspect of this utility model provides an optical module, including the optical module heat dissipation module as described in the first aspect embodiment.

[0028] The optical module proposed in this embodiment has faster heat dissipation, better heat dissipation effect, and effectively improved stability and reliability.

[0029] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat dissipation module for an optical module, characterized in that, This includes a heat-absorbing section, a heat-spreading section, and a heat-dissipating section, all integrally molded from the same material, wherein: The heat-absorbing part protrudes from one side of the heat-spreading part and is used to contact the chip; The heat-equalizing section has a hollow first cavity inside, which is filled with a heat-equalizing working fluid. The heat dissipation section is provided in multiple parts, and the multiple heat dissipation sections are arranged at intervals along the side of the heat distribution section away from the heat absorption section.

2. The optical module heat dissipation module as described in claim 1, characterized in that, The heat dissipation section has a hollow second cavity inside, which is connected to the first cavity.

3. The optical module heat dissipation module as described in claim 2, characterized in that, The heat dissipation section extends along the length of the heat equalization section, so that a narrow air duct is formed between adjacent heat dissipation sections.

4. The optical module heat dissipation module as described in claim 1, characterized in that, The inner wall of the first cavity is provided with a reflux channel, which is filled with a circulating cooling medium.

5. The optical module heat dissipation module as described in claim 4, characterized in that, The reflux channel has a capillary structure.

6. The optical module heat dissipation module as described in claim 1, characterized in that, The first cavity is evacuated and then filled with a homogenizing working fluid.

7. The optical module heat dissipation module as described in claim 1, characterized in that, The heat-absorbing part is a solid structure.

8. An optical module, characterized in that, Includes the optical module heat dissipation module as described in any one of claims 1-7.

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