Interconnection magnetic attraction coupling device without microlens structure

CN224861787UActive Publication Date: 2026-10-16SHENZHEN HUACHUANGXINGUANG TECH CO LTD
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Patent Information

Application Number
CN202522658390.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-12-16
Publication Date
2026-10-16
Estimated Expiration
2035-12-16

AI Technical Summary

Technical Problem

但大多存在拆卸维护不便、机械应力易集中等问题

Benefits of technology

1、本装置摒弃了复杂的微透镜阵列设计,采用多孔耦合板+底座+PCB板的简洁架构,三者通过成熟的加工工艺制造,磁吸组件与磁吸配合件选用标准化永磁体或铁磁性金属片,相比微透镜的光刻、模压等精密加工工艺,制造成本可降低一个数量级以上,且生产流程简化,良率易于控制,特别适合大规模量产。

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Abstract

The utility model discloses an interconnection magnetic attraction coupling device of exempting from micro lens structure. Including from top to bottom including porous coupling board, base and PCB board in proper order, porous coupling board sets up N X N mounting through -hole for fixed optical fiber, and the magnetic attraction assembly of bottom square frame shape adsorbs with the magnetic attraction cooperation spare in the base precision adsorption, the position, quantity of micro -LED on the test through -hole of base, PCB board and mounting through -hole are matched, and the base is fixed with PCB board through the fixing through -hole of inner hexagonal bolt passing. The device exempts from micro lens design and simplifies the structure, reduces the cost, and the magnetic attraction coupling realizes the quick accurate alignment, and the multiple positioning guarantees the coupling efficiency, and the dismounting is convenient, and provides the efficient solution scheme for the large -scale commercialization of micro -LED optical interconnection.
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Description

Technical Field

[0001] This utility model relates to the technical field of optical interconnection, specifically to an interconnection magnetic coupling device without a microlens structure. Background Technology

[0002] With the rapid development of artificial intelligence, cloud computing, and big data, data center traffic is experiencing explosive growth. Micro-LED array optical interconnect technology has emerged as a new solution. This technology adopts a wide-slow architecture, achieving extremely high total bandwidth through a large number of parallel low-speed optical channels. For example, to achieve a link rate of 800Gbps, 400 Micro-LEDs, each operating at a rate of 2Gbps, can be arranged in a 20×20 array. The core advantage of this approach is that the low rate of each channel eliminates the need for complex DSP modulation and demodulation, significantly reducing power consumption; simultaneously, the high total bandwidth achieved through parallelization meets the demands of future networks.

[0003] Despite the promising future of Micro-LED optical interconnect technology, its commercialization faces a key technological bottleneck: how to efficiently and with low crosstalk couple the light emitted by hundreds or even thousands of Micro-LEDs into their corresponding optical fibers. As a semiconductor light-emitting device, Micro-LEDs exhibit light-emitting characteristics similar to Lambertian light sources, meaning the beam has a large divergence angle. However, optical fibers, whether single-mode or multimode, have very small effective apertures for receiving light. This means that without any intervention, most of the light emitted by Micro-LEDs cannot enter the optical fiber, resulting in extremely low coupling efficiency.

[0004] To address this issue, existing technologies typically employ microlens arrays, particularly total internal reflection microlenses. These microlenses can collimate the diverging beam emitted by the Micro-LED into a smaller cone angle, thereby improving the coupling efficiency of the optical fiber. However, microlens solutions suffer from high design complexity, high manufacturing costs, assembly and alignment difficulties, and low connection reliability.

[0005] Besides microlens array solutions, some studies have attempted to simplify the structure by using traditional mechanically fixed coupling devices. These solutions directly constrain the relative positions of the optical fiber and the Micro-LED through mechanical structures, trying to improve coupling accuracy without using microlenses. However, most of them suffer from problems such as inconvenient disassembly and maintenance, and easy concentration of mechanical stress. Utility Model Content

[0006] To address the shortcomings of existing technologies, this invention provides an interconnected magnetic coupling device without a microlens structure, thus solving the problems mentioned in the background section. Technical solution

[0007] To achieve the above objectives, this utility model provides the following technical solution: an interconnecting magnetic coupling device without a microlens structure, comprising a porous coupling plate, a base, and a PCB board arranged sequentially from top to bottom; characterized in that: The porous coupling plate is square in shape, with N×N vertical mounting holes evenly distributed along a straight line on its top surface. An optical fiber is fixed in each mounting hole by adhesive. A square magnetic suction component is provided on the bottom surface of the porous coupling plate. The base is a square box shape. The lower surface of the base has vertical test through holes that match the position and number of N×N mounting through holes. The lower surface of the base also has a square magnetic attachment component that cooperates with the magnetic attachment assembly. The top surface of the PCB board is provided with Micro-LEDs that match the positions and number of N×N test vias.

[0008] Preferably, the base has four vertical threaded holes symmetrically arranged at the four corners of its bottom surface; the PCB board has four fixing through holes symmetrically arranged to match the four threaded holes of the base.

[0009] Preferably, the threaded hole and the fixing through hole of the base are connected together by an internal hex bolt.

[0010] Preferably, the N×N mounting through holes are located inside the magnetic attraction assembly; the N×N test through holes are located inside the magnetic attraction mating component.

[0011] Preferably, after the base is installed with the PCB board, the coaxial center of the Micro-LED is located within the corresponding test through hole.

[0012] Preferably, the bottom end of the optical fiber extends out of the mounting through hole and downwards into the test through hole.

[0013] This invention provides an interconnecting magnetic coupling device without a microlens structure, which has the following advantages: 1. This device abandons the complex microlens array design and adopts a simple architecture of multi-hole coupling plate + base + PCB board. The three are manufactured through mature processing technology. The magnetic components and magnetic mating parts use standardized permanent magnets or ferromagnetic metal sheets. Compared with the precision processing technology of microlenses such as photolithography and molding, the manufacturing cost can be reduced by more than an order of magnitude. Moreover, the production process is simplified and the yield is easy to control, making it particularly suitable for large-scale mass production.

[0014] 2. Based on the principle of magnetic coupling, the multi-hole coupling plate and the base can achieve automatic and precise alignment without the need for complex optical alignment equipment and mechanical fixing tools. A single person can quickly complete the assembly, which shortens the assembly time compared to traditional solutions. At the same time, the constraint positioning of the mounting through hole, the precise adsorption of the magnetic structure, and the rigid fixing of the bolt form a triple positioning guarantee, ensuring the alignment accuracy of the optical fiber and the Micro-LED and effectively improving the coupling stability.

[0015] 3. Through mature processing technology, high-precision position control of installation and testing through holes is achieved. Combined with the automatic alignment of the magnetic structure, extremely high typical coupling efficiency can be achieved even without the use of microlenses. With optimized design, it can be further improved, fully meeting the performance requirements of most application scenarios such as data center optical interconnection and high-speed communication, while avoiding the crosstalk risk brought by microlenses.

[0016] 4. The magnetic fixing method ensures uniform adsorption force distribution, effectively avoiding localized stress concentration and component deformation problems associated with traditional bolt fixing. The permanent magnet's adsorption force remains stable over the long term, exhibiting strong resistance to vibration and environmental temperature changes. This solves the problems of easy detachment with traditional adhesive fixing and easy drift with mechanical fixing, ensuring long-term stable operation of the device. Disassembly requires only the application of a moderate reverse external force to separate the porous coupling plate from the base, and unscrewing the hexagonal bolts allows for the separation of the base from the PCB board. The operation requires no special tools and will not damage the components, facilitating subsequent maintenance operations such as fiber optic replacement, Micro-LED repair, and component cleaning, significantly reducing later use and maintenance costs. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 for Figure 1 Top view; Figure 3 for Figure 2 Sectional view of AA; Figure 4 for Figure 2 BB section view; Figure 5 This is a schematic diagram of the 3D structure of the PCB board; Figure 6 This is a schematic diagram of the three-dimensional structure of the porous coupling plate; Figure 7 This is a schematic diagram of the three-dimensional structure of the base; In the diagram: 1. Multi-hole coupling plate; 101. Mounting through hole; 102. Magnetic suction assembly; 2. Base; 201. Test through hole; 202. Magnetic suction mating part; 3. PCB board; 301. Fixing through hole; 4. Fiber optic cable; 5. Micro-LED; 6. Hex socket head cap screw. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0019] In this application, the terms "upper," "lower," "inner," "middle," "outer," "front," and "rear," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0020] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0021] Example 1: Please refer to Figures 1 to 7 A microlens-free interconnect magnetic coupling device includes a porous coupling plate (1), a base (2) and a PCB board (3) arranged sequentially from top to bottom. The porous coupling plate (1) is square plate-shaped, and its top surface is uniformly provided with N×N vertical mounting through holes (101) along the straight direction. An optical fiber (4) is fixed in each mounting through hole (101) by adhesive. The bottom surface of the porous coupling plate (1) is provided with a square frame-shaped magnetic suction component (102). The base (2) is a square box shape, and its internal contour matches the outer contour of the porous coupling plate (1). The lower inner surface of the base (2) is provided with vertical test through holes (201) that match the position and number of N×N mounting through holes (101). The lower inner surface of the base (2) is also provided with a square magnetic accommodating part (202) that cooperates with the magnetic accommodating component (102). The PCB board (3) has Micro-LEDs (5) on its top surface that match the position and number of N×N test through holes (201).

[0022] The base (2) has four vertical threaded holes symmetrically arranged at the four corners of its bottom surface; the PCB board (3) has four fixing through holes (301) symmetrically arranged to match the four threaded holes of the base (2).

[0023] The threaded hole of the base (2) and the fixed through hole (301) are connected together by an internal hex bolt (6).

[0024] The N×N mounting through holes (101) are located inside the magnetic suction assembly (102); the N×N test through holes (201) are located inside the magnetic suction mating part (202).

[0025] After the base (2) and PCB board (3) are installed, the Micro-LED (5) is coaxially located in the corresponding test through hole (201).

[0026] The bottom end of the optical fiber (4) extends out of the mounting through hole (101) and downward into the test through hole (201).

[0027] The magnetic attraction component (102) is preferably a neodymium iron boron permanent magnet; the magnetic attraction mating part (202) is preferably a ferromagnetic metal sheet or a permanent magnet that is opposite to the magnetic attraction component (102); the porous coupling plate (1) and the base (2) are preferably made of engineering plastic.

[0028] The porous coupling plate (1) is made of engineering plastic and features lightweight structure, moderate mechanical strength, and low processing difficulty. Its top surface has N×N vertical mounting holes (101) evenly distributed along a straight line (64 holes in total, 8×8 in this embodiment). The hole diameter precisely matches the outer diameter (including the coating layer) of the optical fiber (4), allowing for stable fixation of the optical fiber (4) via adhesive bonding. Simultaneously, the positional constraints of the mounting holes (101) achieve preliminary positioning of the optical fiber (4) and the Micro-LED (5). The bottom surface is equipped with a square-shaped magnetic suction component (102), preferably a neodymium iron boron permanent magnet, which has strong magnetism and stable adsorption force. Its outline precisely matches the magnetic suction fitting (202) inside the base (2), enabling automatic and precise alignment and stable adsorption with the base, replacing the traditional mechanical positioning structure. The overall structural design takes into account multiple requirements for optical fiber fixation, positioning, and rapid assembly.

[0029] The base (2) is made of engineering plastic parts, and its internal contour is completely matched with the outer contour of the multi-hole coupling plate (1) to ensure the fit of the two after assembly. The lower inner surface is provided with vertical test through holes (201) that correspond to the position and number of the mounting through holes (101) to provide a physical channel for the coupling of the optical fiber (4) and the Micro-LED (5). The lower inner surface is also provided with a square frame-shaped magnetic attraction component (202), preferably a ferromagnetic metal sheet or a permanent magnet that is opposite to the magnetic attraction component (102), which can generate a stable attraction force with the magnetic attraction component to ensure alignment accuracy. The bottom lower surface is symmetrically provided with four vertical threaded holes at the four corners for matching with the fixing through holes (301) of the PCB board (3). The base and the PCB board are stably connected by hexagonal bolts (6). The whole plays a key role in connecting the upper and lower parts and is the core component to ensure coupling accuracy and structural stability.

[0030] The PCB board (3) serves as the substrate for carrying the Micro-LED (5). The top surface of the PCB board is provided with Micro-LEDs (5) that match the position and number of the test through holes (201), ensuring that each Micro-LED (5) can accurately correspond to a test through hole (201) and provide a stable light source for light signal emission. The board body is symmetrically provided with four fixed through holes (301), which are precisely aligned with the threaded holes of the base (2). The connection of the internal hex bolts (6) achieves rigid fixation with the base (2), ensuring that the Micro-LED (5) is coaxially positioned in the test through holes (201) and avoiding the impact of relative displacement on coupling efficiency.

[0031] Working process: First, the magnetic suction component (102) is fixed to the bottom lower surface of the porous coupling plate (1) by adhesive, ensuring that the square outline of the magnetic suction component (102) is concentric with the outer outline of the porous coupling plate (1); at the same time, the magnetic suction mating part (202) is fixed to the inner lower surface of the base (2) by adhesive, ensuring that the magnetic suction mating part (202) is concentric with the array of test through holes (201) inside the base (2).

[0032] Take the hex bolt (6) and pass it through the four fixing through holes (301) on the PCB board (3) one by one. Then screw it into the threaded holes at the four corners of the bottom surface of the base (2) to ensure that the base (2) and the PCB board (3) fit tightly together and that each Micro-LED (5) on the PCB board (3) is coaxially located in the corresponding test through hole (201) of the base (2).

[0033] Insert the optical fibers (4) to be coupled one by one into the mounting through holes (101) of the multi-hole coupling plate (1), ensuring that the optical fibers (4) fit tightly against the inner wall of the mounting through holes (101). Hold the multi-hole coupling plate (1) with the assembled optical fibers (4) and slowly bring it close to the top of the base (2), so that the magnetic suction component (102) at the bottom of the multi-hole coupling plate (1) is aligned with the magnetic suction mating component (202) in the base (2). With the help of the attraction between the two, the multi-hole coupling plate (1) will automatically attract and accurately align to the base (2), realizing the one-to-one correspondence between the mounting through holes (101) and the test through holes (201).

[0034] Gently adjust the extension length of the optical fiber (4) so ​​that the bottom end of the optical fiber (4) extends out of the mounting through hole (101) of the multi-hole coupling plate (1) and extends downward into the test through hole (201) of the base (2). Ensure that the distance between the bottom end face of the optical fiber (4) and the light-emitting surface of the Micro-LED (5) is controlled at 0.1mm-0.5mm. At this time, the center of the end face of the optical fiber (4) is precisely aligned with the light-emitting center of the corresponding Micro-LED (5). Then, fix the optical fiber (4) in the mounting through hole (101) by adhesive to complete the entire coupling assembly process. The light signal emitted by the Micro-LED (5) can be directly coupled into the optical fiber (4) for transmission.

[0035] When maintenance or replacement of parts is required, apply a moderate external force opposite to the magnetic attraction direction to the multi-hole coupling plate (1) to separate the multi-hole coupling plate (1) from the base (2); then, unscrew the hex bolts (6) to separate the base (2) from the PCB board (3) and then perform operations such as fiber optic (4) replacement, Micro-LED (5) repair or component cleaning. After maintenance is completed, reassemble according to the above steps to restore use.

[0036] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A microlens-free interconnect magnetic coupling device, comprising a porous coupling plate (1), a base (2), and a PCB board (3) arranged sequentially from top to bottom; characterized in that: The porous coupling plate (1) is square plate-shaped, and its top surface is uniformly provided with N×N vertical mounting through holes (101) along the straight direction. An optical fiber (4) is fixed in each mounting through hole (101) by adhesive. The bottom surface of the porous coupling plate (1) is provided with a square frame-shaped magnetic suction component (102). The base (2) is a square box shape. The lower surface inside the base (2) is provided with vertical test through holes (201) that match the position and number of N×N mounting through holes (101). The lower surface inside the base (2) is also provided with a square magnetic mate (202) that cooperates with the magnetic mate (102). The PCB board (3) has Micro-LEDs (5) on its top surface that match the position and number of N×N test through holes (201).

2. The interconnecting magnetic coupling device without microlens structure according to claim 1, characterized in that: The base (2) has four vertical threaded holes symmetrically arranged at the four corners of its bottom surface; the PCB board (3) has four fixing through holes (301) symmetrically arranged to match the four threaded holes of the base (2).

3. The interconnecting magnetic coupling device without a microlens structure according to claim 2, characterized in that: The threaded hole of the base (2) and the fixed through hole (301) are connected together by an internal hex bolt (6).

4. The interconnecting magnetic coupling device without microlens structure according to claim 1, characterized in that: The N×N mounting through holes (101) are located inside the magnetic suction assembly (102); the N×N test through holes (201) are located inside the magnetic suction mating part (202).

5. The interconnecting magnetic coupling device without microlens structure according to claim 1, characterized in that: After the base (2) and PCB board (3) are installed, the Micro-LED (5) is coaxially located in the corresponding test through hole (201).

6. The interconnecting magnetic coupling device without a microlens structure according to claim 5, characterized in that: The bottom end of the optical fiber (4) extends out of the mounting through hole (101) and downward into the test through hole (201).