Display device

Abstract

The application provides a display device. The display device comprises a front frame decoration strip, a liquid crystal panel connected with the front frame decoration strip, a COF comprising a flat cable and a circuit chip connected with the flat cable, and at least one isolation pad between the front frame decoration strip and the COF. The display device provided by the application reduces the damage risk of the circuit chip when electrostatic discharge charge impacts, improves product quality reliability, enhances the strength of the front frame decoration strip, and improves the assembly and subsequent appearance presentation effect of the product.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically to a display device. Background Technology

[0002] With the advancement of technology, liquid crystal display panels have been widely used in various fields. In particular, liquid crystal display panels are used in a variety of electronic products due to their superior characteristics such as thinness, low power consumption and no radiation.

[0003] However, during actual assembly, the COF (Chip on Film), which has been folded at a large angle, can deform and float up, thus sticking tightly to the front frame trim. This assembly situation affects the front appearance of the assembled front frame trim. If an electrostatic discharge (ESD) shock occurs, current coupling can easily occur at the contact point between the COF and the front frame trim, leading to charge accumulation inside the circuit chip and potentially causing it to break down and malfunction. Utility Model Content

[0004] This application proposes a display device to solve the technical problems of COF deformation and floating during actual assembly, and damage to circuit chips during electrostatic discharge (ESD) charge impact.

[0005] To solve the above problems, the technical solution provided in this application is as follows: A display device includes: a front bezel trim strip; a liquid crystal panel connected to the front bezel trim strip; a coreless freewheeling (COF) including a ribbon cable and a circuit chip connected to the ribbon cable; and an isolation pad, at least one of which is located between the front bezel trim strip and the COF. Furthermore, the isolation pad is non-detachably connected to the front frame decorative strip.

[0006] Furthermore, the non-removable connection includes adhesion or welding.

[0007] Furthermore, the shape of the isolation pad can be any one of square, round, triangular, conical, or irregular shapes.

[0008] Furthermore, the contact surface between the isolation pad and the front frame decorative strip is a plane, while the contact surface between the isolation pad and the COF is a curved surface.

[0009] Furthermore, the isolation pads are multiple, and the multiple isolation pads are arranged at intervals.

[0010] Furthermore, adjacent isolation pads are interconnected.

[0011] The beneficial effects of this application are that by adding an isolation pad under the front frame trim strip, the risk of ESD circuit chip damage is reduced, thereby improving product quality reliability; at the same time, the strength of the front frame trim strip is enhanced, improving the product assembly and subsequent appearance. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the structure of the display device provided in the embodiments of this application.

[0014] Figure 2 This is a schematic diagram of the structure of the isolation pad provided in an embodiment of this application.

[0015] Figure 3 This is a schematic diagram of the structure of the isolation pad provided in an embodiment of this application.

[0016] Figure 4 This is a schematic diagram of the spacer pads arranged at intervals according to an embodiment of this application.

[0017] Figure 5 This is a schematic diagram of the connection and arrangement of the isolation pads provided in an embodiment of this application.

[0018] Figure label: 1: LCD panel; 2: Front bezel decorative strip 3: Outer frame 4: COF 5: PCB 6: Back cover 7: Backlit frame 8: Backlit back panel 9: Isolation pad; 10: Circuit chip Detailed Implementation The following descriptions of the embodiments are based on the accompanying illustrations, illustrating specific embodiments in which this application can be implemented. Directional terms used in this application, such as up, down, front, back, left, right, inside, outside, side, etc., are only for reference to the accompanying drawings. Therefore, the directional terms used are for illustration and understanding of this application, and not for limiting this application. In the figures, structurally similar units are denoted by the same reference numerals. In the figures, the thickness of some layers and regions is exaggerated for clarity and ease of description. That is, the dimensions and thicknesses of each component shown in the figures are arbitrarily shown, but this application is not limited thereto.

[0019] Reference Figure 1 , Figure 1This is a partial cross-sectional structural diagram of the display device provided in the embodiments of this application. The display device includes a liquid crystal panel 1, a front frame decorative strip 2, an outer frame 3, a COF 4, a PCB 5, a circuit chip 10, a rear cover 6, and an isolation pad 9. The backlight module of the display device includes a backlight frame 7 and a backlight backplate 8.

[0020] Specifically, please refer to Figures 1 to 2 The LCD panel 1 and the front bezel trim 2 together constitute the front appearance of the monitor. The COF4 of the LCD panel 1 is continuously folded using a large-angle folding process, causing the end of the COF4 to extend into the internal area of ​​the monitor. This design significantly reduces the space occupied by the COF4 on the front area, thereby reducing the bezel width of the LCD panel 1 and making the overall appearance more compact.

[0021] Specifically, after the COF4 is folded, the PCB (Printed Circuit Board) 5 of the LCD panel 1 is adjusted to a horizontal layout. The traces and components of the PCB 5 are all located inside the display and form a continuous circuit connection path with the COF4.

[0022] Specifically, a circuit chip 10 is disposed on the surface of COF4 facing PCB5 to realize signal transmission and drive control between the liquid crystal panel 1 and the circuit.

[0023] Specifically, at least one isolation pad is located between the front frame trim strip 2 and the COF4.

[0024] Understandably, the insulating pad 9 separates the COF4 and the front frame trim 2, preventing them from contacting each other and thus reducing the risk of current coupling under ESD impact. It also protects the circuit chip 10 from charge breakdown. Simultaneously, heat from the circuit chip 10 can be conducted to the front frame trim 2 through the insulating pad 9. Since the front frame trim 2 is made of metal, this forms a highly efficient heat-conducting network of circuit chip 10-COF4-insulating pad 9-front frame trim 2-air, thereby preventing the circuit chip 10 from exceeding its cutoff temperature and causing functional failure.

[0025] Because the insulating pad 9 is positioned between the COF4 and the front frame trim 2, forming a physical isolation structure, it effectively blocks direct contact between the two. Furthermore, since the front frame trim 2 is made of metal, it has high conductivity and is highly susceptible to becoming a path for charge accumulation or discharge during electrostatic discharge (ESD) events. If the COF4 and the front frame trim 2 are in direct contact, the transient current under ESD impact may form a low-impedance path through the metal front frame, directly coupling to the circuit chip 10 on the COF4, leading to current overload, or even charge breakdown of the internal structure of the circuit chip, causing device failure. The introduction of the insulating pad 9 significantly reduces the risk of such current coupling through physical isolation, thereby improving the reliability of the circuit chip 10 under ESD impact.

[0026] Specifically, the back cover 6 covers the entire structure from the direction relative to the surface of the LCD panel 1 and the PCB 5, with one end fixedly connected to the back of the outer frame 3. The back cover 6 is typically made of metal or high-strength plastic, providing good structural support and electromagnetic shielding performance. The outer frame 3 is located on both sides of the LCD panel 1, with one end fixedly connected to the front frame decorative strip 2 and the other end joined to the outer edge of the back cover 6, forming a closed structural cavity.

[0027] Specifically, the front bezel decorative strip 2 is made of ultra-thin metal material (such as 0.15~0.3mm SECC, SGCC or SGLC), and its surface is treated with black paint, the color of which is highly consistent with the black border area of ​​the LCD panel 1. The front bezel decorative strip 2 is installed at the front edge of the LCD panel 1, with its leading edge slightly extending beyond the display area of ​​the LCD panel 1, forming a visual "edge-covering" effect. Because the front bezel decorative strip 2 is extremely thin and its color is similar to the black border of the LCD panel, when viewed from the front, the LCD panel 1 and the front bezel decorative strip 2 are almost integrated, presenting a visual effect similar to "four-sided borderless" (4BL).

[0028] Specifically, during assembly, the front bezel decorative strip 2 can be fixed to the front edge of the LCD panel 1 using clips or screws. Its inner edge is tightly fitted with the black border of the LCD panel 1, while its outer edge is aligned with the front edge of the monitor's outer frame 3. The outer frame 3 is typically made of metal or engineering plastic, and its thickness is slightly greater than that of the front bezel decorative strip 2 to provide sufficient structural strength and heat dissipation. The front edge of the outer frame 3 is designed with slots or fixing holes that match the front bezel decorative strip 2, ensuring accurate and stable positioning of both during assembly.

[0029] In one specific embodiment, the isolation pad 9 is non-detachably connected to the front frame decorative strip 2; One specific implementation is that the non-removable connection includes adhesion or welding.

[0030] Understandably, using non-removable connections (such as adhesion or welding) to fix the isolation pad 9 to the front frame decorative strip 2 can effectively improve structural stability, prevent component displacement or detachment due to vibration or impact, and ensure that the relative positions of the two are accurate and fixed for a long time. At the same time, it simplifies the assembly process, reduces assembly errors and the use of connectors, helps to achieve lightweighting and space optimization, and enhances overall sealing to prevent dust and moisture intrusion, thereby improving the reliability, environmental adaptability and service life of the display device, and meeting the needs of consumer electronics products for high integration and stability.

[0031] One specific embodiment is that the shape of the isolation pad 9 can be any one of square, circular, triangular, conical, irregular shapes, or a combination thereof.

[0032] Understandably, this design freedom in terms of shape not only allows for adaptation to display modules of different sizes and structures, but also enables optimal layout within limited space, thereby improving overall assembly efficiency and reliability. For example, in space-constrained areas, conical or triangular isolation pads can be used to reduce the occupied area; while in locations requiring enhanced structural stability, square or circular isolation pads can be selected to provide more uniform support. Furthermore, by combining isolation pads of different shapes, local stress distribution can be further optimized, avoiding assembly deformation or material fatigue caused by shape mismatch.

[0033] One specific embodiment is that the contact surface between the isolation pad 9 and the front frame decorative strip 2 is a plane, and the contact surface between the isolation pad 9 and the COF4 is a curved surface, such as... Figure 2 and Figure 3 As shown.

[0034] Reference Figure 2 Understandably, the planar contact surface ensures stable and uniform contact between the isolation pad 9 and the metal front frame trim 2, and between the isolation pad 9 and COF4, thereby reducing thermal resistance and improving heat dissipation efficiency along the heat conduction path. The planar structure also effectively avoids localized stress concentration caused by uneven contact, reducing the risk of deformation of the front frame trim 2 under stress.

[0035] Reference Figure 3 Another superior implementation involves a curved design on the contact surface between the insulating pad 9 and the COF4. This design primarily aims to better accommodate the deformation characteristics of COF4 during assembly. During bonding, COF4 may undergo slight deformation due to thermal expansion, mechanical bending, or material springback. If the contact surface of the insulating pad 9 were a rigid plane, it could lead to poor local contact, affecting the insulation effect or heat dissipation performance. The curved design, however, can actively adapt to the deformation trend of the COF4 through flexible bonding, ensuring that the two maintain close contact in a dynamically changing assembly environment, thereby maintaining stable electrical isolation and thermal conductivity. Furthermore, the curved structure can also disperse contact stress to a certain extent, reducing material damage or failure caused by excessive local pressure.

[0036] One specific embodiment is that there are multiple isolation pads 9, and the multiple isolation pads 9 are arranged at intervals, such as... Figure 4 As shown.

[0037] One specific implementation involves connecting adjacent isolation pads 9 to each other, such as... Figure 5 As shown.

[0038] Understandably, this interconnected design not only enhances the overall structural stability of the isolation pads but also significantly improves their mechanical performance and functional characteristics within the display module by forming a continuous support network. Specifically, when multiple isolation pads 9 are fixed together by connecting structures (such as integrally molded bridging sections or flexible connecting strips), they collectively form a mechanical support system similar to a "reinforcing rib." This system effectively reduces the risk of localized deformation or overall warping of the front frame decorative strip 2 under mechanical impact, temperature changes, or long-term load by dispersing external loads and internal stresses. For example, when the display module is subjected to external pressure or vibration, the connected isolation pad network can evenly transmit stress, preventing stress concentration in an isolated isolation pad area, thereby preventing the front frame decorative strip from undergoing plastic deformation or breakage due to excessive localized stress.

[0039] Furthermore, the interconnected design of the isolation pads 9 also has a positive impact on heat dissipation. Since the front frame trim 2 is typically made of metal, its coefficient of thermal expansion differs from that of surrounding non-metallic materials (such as plastic or glass), making it prone to thermal stress during temperature changes. The interconnected network of isolation pads can rigidly restrict the free expansion of the front frame trim, reducing structural deformation caused by thermal stress and maintaining the stability of the heat dissipation path, ensuring efficient heat transfer to the external environment. Simultaneously, the interconnected structure prevents the isolation pads from shifting or detaching due to material fatigue during long-term thermal cycling, further guaranteeing the reliability of the heat dissipation system. The interconnected design of adjacent isolation pads 9, by constructing a mechanical support network, significantly improves the front frame trim's resistance to deformation and exerts multiple synergistic effects in heat transfer and structural stability. This design not only enhances the overall reliability of the display module but also achieves a balance between performance and cost by optimizing resource utilization and process compatibility.

[0040] One specific embodiment is that the isolation pad 9 is made of a non-conductive material.

[0041] Furthermore, the circuit chip 10 generates heat during operation. If this heat cannot be dissipated in time, the temperature of the circuit chip may exceed its critical temperature threshold, leading to performance degradation or even functional failure. The insulating pad 9 is not simply an insulating material but is designed as a medium with certain thermal conductivity, capable of efficiently conducting the heat generated by the circuit chip 10 to the front frame trim 2. Since the front frame trim 2 is made of metal, its high thermal conductivity allows heat to be rapidly diffused from the contact point to the entire structure, forming a highly efficient heat-conducting network of "circuit chip 10-COF4-insulating pad 9-front frame trim 2-air". This network, through multi-stage heat conduction paths, significantly improves heat dissipation efficiency, ensuring that the circuit chip 10 remains within a safe temperature range even under prolonged high-load operation, avoiding thermal stress damage or functional abnormalities caused by overheating.

[0042] One specific embodiment is that the non-conductive material is any one or a combination of Al2O3 (aluminum oxide), AlN (aluminum nitride), BN (boron nitride), Si3N4 (silicon nitride), ceramic-filled polymer, and glass fiber reinforced plastic.

[0043] Understandably, the material selection for the insulating pad 9 needs to balance insulation and thermal conductivity. Composite materials, such as polymers doped with thermally conductive fillers (e.g., aluminum nitride, alumina, or graphene), can be used to achieve thermal conduction while ensuring electrical isolation. Its thickness and contact area design also need optimization to balance thermal resistance and mechanical stability. Furthermore, the structural design of the front frame trim strip 2 (such as surface treatment and contact area expansion) will also affect the overall heat dissipation effect; for example, increasing heat dissipation fins or optimizing airflow paths can further improve heat dissipation capacity.

[0044] In the embodiments of this application, the display device can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, or laptop computer.

[0045] The embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A display device, characterized in that, include: Front frame trim strip; A liquid crystal panel, wherein the liquid crystal panel is connected to the front frame decorative strip; COF includes a ribbon cable and a circuit chip connected to the ribbon cable; An isolation pad, at least one of the isolation pads being located between the front frame trim strip and the COF.

2. The display device according to claim 1, characterized in that, The isolation pad is non-detachably connected to the front frame decorative strip.

3. The display device according to claim 2, characterized in that, The non-removable connection includes adhesion or welding.

4. The display device according to claim 1, characterized in that, The isolation pad can be any of the following shapes: square, round, triangular, conical, or irregular.

5. The display device according to claim 4, characterized in that, The contact surface between the isolation pad and the front frame decorative strip is a plane, while the contact surface between the isolation pad and the COF is a curved surface.

6. The display device according to claim 1, characterized in that, The isolation pads are multiple, and the multiple isolation pads are arranged at intervals.

7. The display device according to claim 6, characterized in that, The adjacent isolation pads are interconnected.

Images