gripping device

Abstract

The application relates to a clamping device and relates to the technical field of semiconductors. The clamping device comprises a wafer carrier assembly, a suction assembly and a plurality of positioning assemblies. The wafer carrier assembly is provided with a bearing area and a relief hole. The bearing area is used for bearing a to-be-clamped piece. The relief hole extends to the bearing area in a radial direction from the side of the wafer carrier assembly. The suction assembly is used for providing a suction force to the bearing area, so that the to-be-clamped piece is adsorbed to the bearing area. The plurality of positioning assemblies are arranged on the wafer carrier assembly and are arranged in a circumferential direction at intervals around the bearing area. The positioning assembly comprises a positioning part and a driving part. The positioning part is movably arranged on the wafer carrier assembly. The driving part is configured to drive the positioning part to move in the radial direction, so as to clamp or release the side of the to-be-clamped piece. The technical scheme disclosed by the application can solve the problems that the existing manual wafer taking is time-consuming and easy to cause the wafer to fall off and be scratched.

Description

Technical Field

[0001] This application relates to the semiconductor field, and more particularly to a clamping device. Background Technology

[0002] Photolithography is a core process in chip manufacturing. Based on the principle of photochemical reaction, it uses photoresist (also known as photoresist) to precisely transfer the circuit pattern of the mask onto the surface of the wafer (substrate). Key processes include coating, exposure, and development. After coating and before and after development, the wafer needs to be baked at high temperatures multiple times on a hot plate to optimize the adhesion of the photoresist and the resolution of the pattern. During normal production, hot-pad wafers are transferred by an automated transfer arm without human intervention. In case of transfer arm failure, manual wafer retrieval is required to prevent production interruptions and wafer retention issues. Current manual wafer retrieval methods mostly involve toolless operation or fixture-assisted operation: toolless wafer retrieval is prone to burns and wafer scratches due to the high temperature of the hot pad and the confined operating space; waiting for the wafers to cool down before retrieval is time-consuming and inefficient, and the remaining wafers may suffer structural abnormalities and reduced yield due to overheating; fixture-assisted wafer retrieval is prone to wafer drops or surface scratches due to unstable human operation. Utility Model Content

[0003] This application provides a clamping device to solve the problems of long time consumption and easy wafer drop and scratching caused by existing manual wafer handling.

[0004] In a first aspect, this application provides a clamping device, comprising: The carrier assembly is provided with a bearing area and a clearance hole. The bearing area is used to bear the workpiece to be clamped, and the clearance hole extends radially from the side of the carrier assembly into the bearing area. An adsorption component is used to provide an adsorption force to the bearing area to adsorb the part to be clamped onto the bearing area; Multiple positioning components are disposed on the carrier assembly and arranged circumferentially around the center of the bearing area. Each positioning component includes a positioning part and a driving part. The positioning part is movably disposed on the carrier assembly, and the driving part is configured to drive the positioning part to move along the radial direction to clamp or release the side of the object to be clamped.

[0005] In some embodiments, the drive unit includes: A fixing seat is disposed on the slide assembly, the fixing seat is provided with a fixing cavity, and the positioning part is slidably inserted into the fixing cavity; An elastic element is housed within the fixed cavity and one end is connected to the positioning part; An electromagnetic drive module is housed within the fixed cavity and connected to the end of the elastic member away from the positioning part. The electromagnetic drive module includes an on-state and a off-state. In the on-state, the electromagnetic drive module generates a magnetic attraction force, driving the positioning part to move along the radial direction away from the center of the bearing area and compressing the elastic element, so that the positioning part releases the clamped part. In the off-state, the compressed elastic element drives the positioning part to move along the radial direction towards the center of the bearing area, so as to clamp the clamped part.

[0006] In some embodiments, the slide assembly includes a base, a slide stage, and a cover plate arranged sequentially in an axial direction; the slide stage has a first bearing groove at one end facing the cover plate; and the cover plate has a second bearing groove that extends through the cover plate in the axial direction. The first bearing groove segment and the second bearing groove segment are aligned and connected in the axial direction to jointly form the bearing area.

[0007] In some embodiments, the base is provided with a first hole segment extending in the radial direction and penetrating the base in the axial direction; the slide stage is provided with a second hole segment extending in the radial direction and penetrating the slide stage in the axial direction, the second hole segment being connected to the first bearing groove segment; the cover plate is provided with a third hole segment extending in the radial direction and penetrating the cover plate in the axial direction, the third hole segment being connected to the second bearing groove segment; The first hole segment, the second hole segment, and the third hole segment are aligned and connected in the axial direction to form the clearance hole.

[0008] In some embodiments, the bottom of the first bearing groove is provided with a plurality of adsorption holes, which are arranged circumferentially around the center of the bearing area; wherein, the base is provided with a vacuum passage channel communicating with the adsorption holes, and the vacuum passage channel is connected to the adsorption component to provide negative pressure to the adsorption holes.

[0009] In some embodiments, the carrier assembly is provided with a plurality of guide grooves extending along the radial direction, the plurality of guide grooves being arranged circumferentially around the center of the bearing area and corresponding one-to-one with a plurality of positioning components; the positioning component is housed in the corresponding guide groove, and the positioning part of the positioning component is slidably disposed in the guide groove.

[0010] In some embodiments, the guide groove includes: The first guide groove section is disposed at the bottom of the first bearing groove section and extends along the radial direction; The second guide groove segment is disposed on the side wall of the first bearing groove segment and extends along the radial direction, and the second guide groove segment is connected to the first guide groove segment in the radial direction; The third guide groove segment is disposed on the side wall of the second bearing groove segment and extends along the radial direction. The third guide groove segment is aligned with and connected to the second guide groove segment in the axial direction.

[0011] In some embodiments, the adsorption assembly includes a vacuum pump connected to the vacuum passageway.

[0012] In some embodiments, the clamping device further includes: A handle is provided on the side of the slide assembly and located in the extending direction of the clearance hole; The power module is located inside the handle; The air extraction control branch is electrically connected to the power module and includes the adsorption component and the air extraction control switch connected in series. The air extraction control switch is located on the handle.

[0013] In some embodiments, the clamping device further includes a clamping control branch connected in parallel with the air extraction control branch to the power module; the clamping control branch includes the electromagnetic drive module and the clamping control module connected in series. The clamping control module is at least partially disposed on the handle and is configured to switch the on / off state of the clamping control branch and adjust the current flowing through the electromagnetic drive module.

[0014] The technical solutions provided in this application have the following advantages compared with the prior art: The clamping device provided in this application embodiment uses an adsorption component to provide adsorption force to the bearing area to initially fix the workpiece to be clamped. Combined with multiple circumferentially spaced positioning components, the driving unit moves the positioning units radially to clamp the side of the workpiece, forming a dual fixing structure of adsorption and circumferential positioning. This effectively solves the problem of workpiece detachment caused by unstable manual operation when using tools to pick up pieces, ensuring the reliability of the transfer process. Simultaneously, the positioning components clamp the side of the workpiece, while the adsorption components fix the non-functional surface of the workpiece through surface contact, without directly contacting the functional surface, and thus providing a secure gripping mechanism. The clamping components provide stable support, preventing friction or collision between the workpiece and machine parts, thus solving the problem of easy scratches on the surface of the workpiece in traditional pick-up methods and ensuring product quality. Therefore, operators can indirectly pick up and place the workpiece through the clamping device without directly touching it with their hands or the high-temperature hot plate, effectively avoiding the risk of burns when picking up workpieces without tools, reducing safety hazards, and completing the pick-up through the adsorption and positioning components without waiting for the hot plate to cool down. This significantly shortens troubleshooting time, avoids rework due to overheating of other workpieces in the machine, ensures production continuity, and improves production yield. In addition, the positioning part can move in the radial direction to accommodate different sizes of clamping parts. The clearance hole of the carrier assembly extends in the radial direction to the bearing area, which can accommodate the arrangement of pin supports (pins) in the machine. When picking up the piece, the clamping device can pass through the vertical pin support to reach the bottom of the clamping part. After slowly lifting, the clamping part is smoothly lifted into the bearing area and separated from the pin support. This not only achieves reliable separation between the clamping part and the pin support, but also facilitates the picking and placing of the clamping part and the movement clearance of the positioning assembly, further improving the practicality and operational flexibility of the structure. Attached Figure Description

[0015] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0018] Figure 1This is a three-dimensional structural diagram of the clamping device provided in the embodiments of this application; Figure 2 An exploded view of the clamping device provided in the embodiments of this application; Figure 3 This is a schematic diagram of the structure of the clamping device provided in the embodiments of this application when clamping a wafer; Figure 4 This is a schematic diagram of the positioning component provided in an embodiment of this application; Figure 5 The circuit diagram provided for the embodiments of this application.

[0019] Explanation of reference numerals in the attached figures: 10. Slide carrier assembly; 110. Bearing area; 120. Clearance hole; 130. Base; 1301. First hole section; 1302. Vacuum air passage; 140. Slide carrier stage; 1401. Second hole section; 1402. First bearing groove section; 1403. Adsorption hole; 150. Cover plate; 1501. Second bearing groove section; 1502. Third hole section; 160. Guide groove; 1601. First guide groove section; 1602. Second guide groove section; 1603. Third guide groove section; 20. Adsorption components; 30. Positioning assembly; 310. Positioning part; 3101. Horizontal plate; 3102. Vertical plate; 320. Driving part; 3201. Fixing base; 3202. Fixing cavity; 3203. Elastic element; 3204. Electromagnetic drive module; 40. Handle; 50. Power supply module; 60. Air extraction control branch; 610. Air extraction control switch; 70. Clamping control branch; 710. Clamping control module; 80. Item to be clamped. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] The following disclosure provides numerous different embodiments or examples for implementing various structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0022] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0023] Photolithography is a core process in chip manufacturing. Based on the principle of photochemical reaction, it uses photoresist (also known as photoresist) to precisely transfer the circuit pattern of the mask onto the surface of the wafer (substrate). Key processes include coating, exposure, and development. After coating and before and after development, the wafer needs to be baked at high temperatures multiple times on a hot plate to optimize the adhesion of the photoresist and the resolution of the pattern. During normal production, the wafers in the hot plate are transferred by the machine's built-in automated transfer arm without any manual intervention, ensuring the continuity and stability of the production process. However, when the machine malfunctions and the transfer arm cannot operate normally, in order to avoid production interruptions and process abnormalities caused by wafers remaining in the machine, on-site personnel must manually remove the wafers. In this scenario, manual wafer retrieval typically employs either tool-free direct retrieval or retrieval using clamps. However, both methods have significant technical drawbacks: First, the high temperature of the hot plate during operation and the confined internal operating space not only easily cause burns to operators but also make it highly susceptible to contact and friction between the wafer surface and the inner wall of the hot plate or other machine components, resulting in wafer surface scratches and affecting product quality. Second, if the hot plate heating system is shut down to avoid burn risks, it is necessary to wait for the hot plate to cool down to a safe temperature before operation. This process is time-consuming, severely reducing production efficiency. Furthermore, it can cause other wafers awaiting processing in the machine to exceed the process allowable threshold due to their inability to be transferred according to the preset process path, leading to abnormal internal wafer structures and requiring rework, significantly reducing production yield. Third, when using clamps for wafer retrieval, the instability of manual operation makes wafers prone to falling during transfer, and the wafer surface is also susceptible to contact with machine components, causing wafer scratches and affecting product quality.

[0024] Example 1 like Figure 1 , Figure 2 As shown, this application embodiment provides a clamping device, including a carrier assembly 10, an adsorption assembly 20, and a plurality of positioning assemblies 30. The carrier assembly 10 is provided with a bearing area 110 and a clearance hole 120. The bearing area 110 is used to bear the workpiece 80 to be clamped, and the clearance hole 120 extends radially from the side of the carrier assembly 10 into the bearing area 110. The adsorption assembly 20 is used to provide adsorption force to the bearing area 110 to adsorb the workpiece 80 to be clamped onto the bearing area 110. A plurality of positioning assemblies 30 are disposed on the carrier assembly 10 and arranged circumferentially around the center of the bearing area 110. Each positioning assembly 30 includes a positioning part 310 and a driving part 320. The positioning part 310 is movably disposed on the carrier assembly 10, and the driving part 320 is configured to drive the positioning part 310 to move radially to clamp or release the side of the workpiece 80 to be clamped.

[0025] As can be seen from the above, the adsorption component 20 provides adsorption force to the bearing area 110 to achieve initial fixation of the part to be clamped 80. In conjunction with multiple circumferentially spaced positioning components 30, the driving unit 320 drives the positioning unit 310 to move radially to clamp the side of the part to be clamped 80, forming a dual fixing structure of adsorption and circumferential positioning. This effectively solves the problem of the part to be clamped 80 falling off due to unstable manual operation when using tools to pick up the piece, ensuring the reliability of the transfer process. Simultaneously, the positioning component 30 clamps the side of the part to be clamped 80, and the adsorption component 20 fixes the non-functional surface of the part to be clamped 80 through surface contact, without directly contacting the functional surface of the part to be clamped 80. It can provide stable support for the clamped part 80, avoiding friction or collision between the clamped part 80 and machine parts, solving the problem of easy scratches on the surface of the clamped part 80 in traditional wafer picking methods, and ensuring product quality. Therefore, the operator can indirectly pick up and put down the wafer through the clamping device without directly touching the clamped part 80 or the high-temperature hot plate with their hands, effectively avoiding the risk of burns when picking up the wafer without tools, reducing safety hazards, and completing the wafer picking through the adsorption component 20 and the positioning component 30 without waiting for the hot plate to cool down, greatly shortening the fault handling time, avoiding rework due to the heating timeout caused by the other wafers in the machine, ensuring the continuity of the production process, and improving the production yield. In addition, the positioning part 310 can move in the radial direction to adapt to clamping parts 80 of different sizes. The clearance hole 120 of the carrier assembly 10 extends in the radial direction to the bearing area 110, which can adapt to the arrangement of needle-shaped support members (pins) in the machine tool. When picking up the piece, the clamping device can pass through the upright needle-shaped support member to reach the bottom of the clamping part 80. After slowly lifting, the clamping part 80 is smoothly lifted into the bearing area 110 and separated from the needle-shaped support member. This not only realizes the reliable separation of the clamping part 80 from the needle-shaped support member, but also facilitates the picking and placing of the clamping part 80 and the movement clearance of the positioning assembly 30, further improving the practicality and operational flexibility of the structure.

[0026] It should be noted that the clamping component 80 can be, but is not limited to, a wafer. When the clamping component 80 is a wafer, the wafer includes a functional surface and a non-functional surface. In chip manufacturing, the functional surface of the wafer usually faces upwards to facilitate processing by the manufacturing equipment, while the non-processed surface of the wafer contacts the stage of the manufacturing equipment. For example, in the hot plate scenario of the photolithography process in chip manufacturing, pins are needle-shaped support components set inside the hot plate. Their function is to support the non-processed surface of the wafer to be processed, so that a gap is formed between the wafer and the hot plate, ensuring uniform heat transfer during high-temperature baking, while avoiding direct contact between the functional surface of the wafer and the hot plate, which could cause contamination or damage. In the clamping device of this application, when picking up the wafer, the clearance hole 120 can pass through the pin-shaped support components, allowing the clamping device to smoothly reach under the wafer. Then, by slowly lifting, the wafer is smoothly lifted into the bearing area 110. Therefore, the adsorption component 20 fixes the non-functional surface of the wafer through surface contact.

[0027] It should also be noted that, such as Figure 1 As shown, the axial direction is parallel to the Z direction.

[0028] Example 2 like Figure 1 , Figure 2 As shown, this application embodiment provides a clamping device, including a carrier assembly 10, an adsorption assembly 20, and a plurality of positioning assemblies 30. The carrier assembly 10 is provided with a bearing area 110 and a clearance hole 120. The bearing area 110 is used to bear the workpiece 80 to be clamped, and the clearance hole 120 extends radially from the side of the carrier assembly 10 into the bearing area 110. The adsorption assembly 20 is used to provide adsorption force to the bearing area 110 to adsorb the workpiece 80 to be clamped onto the bearing area 110. A plurality of positioning assemblies 30 are disposed on the carrier assembly 10 and arranged circumferentially around the center of the bearing area 110. Each positioning assembly 30 includes a positioning part 310 and a driving part 320. The positioning part 310 is movably disposed on the carrier assembly 10, and the driving part 320 is configured to drive the positioning part 310 to move radially to clamp or release the side of the workpiece 80 to be clamped.

[0029] As can be seen from the above, the adsorption component 20 provides adsorption force to the bearing area 110 to achieve initial fixation of the part to be clamped 80. In conjunction with multiple circumferentially spaced positioning components 30, the driving unit 320 drives the positioning unit 310 to move radially to clamp the side of the part to be clamped 80, forming a dual fixing structure of adsorption and circumferential positioning. This effectively solves the problem of the part to be clamped 80 falling off due to unstable manual operation when using tools to pick up the piece, ensuring the reliability of the transfer process. Simultaneously, the positioning component 30 clamps the side of the part to be clamped 80, and the adsorption component 20 fixes the non-functional surface of the part to be clamped 80 through surface contact, without directly contacting the functional surface of the part to be clamped 80. It can provide stable support for the clamped part 80, avoiding friction or collision between the clamped part 80 and machine parts, solving the problem of easy scratches on the surface of the clamped part 80 in traditional wafer picking methods, and ensuring product quality. Therefore, the operator can indirectly pick up and put down the wafer through the clamping device without directly touching the clamped part 80 or the high-temperature hot plate with their hands, effectively avoiding the risk of burns when picking up the wafer without tools, reducing safety hazards, and completing the wafer picking through the adsorption component 20 and the positioning component 30 without waiting for the hot plate to cool down, greatly shortening the fault handling time, avoiding rework due to the heating timeout caused by the other wafers in the machine, ensuring the continuity of the production process, and improving the production yield. In addition, the positioning part 310 can move in the radial direction to adapt to clamping parts 80 of different sizes. The clearance hole 120 of the carrier assembly 10 extends in the radial direction to the bearing area 110, which can adapt to the arrangement of needle-shaped support members (pins) in the machine tool. When picking up the piece, the clamping device can pass through the upright needle-shaped support member to reach the bottom of the clamping part 80. After slowly lifting, the clamping part 80 is smoothly lifted into the bearing area 110 and separated from the needle-shaped support member. This not only realizes the reliable separation of the clamping part 80 from the needle-shaped support member, but also facilitates the picking and placing of the clamping part 80 and the movement clearance of the positioning assembly 30, further improving the practicality and operational flexibility of the structure.

[0030] It should be noted that the clamping component 80 can be, but is not limited to, a wafer. When the clamping component 80 is a wafer, the wafer includes a functional surface and a non-functional surface. In chip manufacturing, the functional surface of the wafer usually faces upwards to facilitate processing by the manufacturing equipment, while the non-processed surface of the wafer contacts the stage of the manufacturing equipment. For example, in the hot plate scenario of the photolithography process in chip manufacturing, pins are needle-shaped support components set inside the hot plate. Their function is to support the non-processed surface of the wafer to be processed, so that a gap is formed between the wafer and the hot plate, ensuring uniform heat transfer during high-temperature baking, while avoiding direct contact between the functional surface of the wafer and the hot plate, which could cause contamination or damage. In the clamping device of this application, when picking up the wafer, the clearance hole 120 can pass through the pin-shaped support components, allowing the clamping device to smoothly reach under the wafer. Then, by slowly lifting, the wafer is smoothly lifted into the bearing area 110. Therefore, the adsorption component 20 fixes the non-functional surface of the wafer through surface contact.

[0031] It should also be noted that, such as Figure 1 As shown, the axial direction is parallel to the Z direction.

[0032] like Figure 4 As shown, in some embodiments, the driving unit 320 includes a fixed base 3201, an elastic element 3203, and an electromagnetic driving module 3204; the fixed base 3201 is disposed on the carrier assembly 10, and the fixed base 3201 is provided with a fixed cavity 3202, and the positioning part 310 is slidably disposed in the fixed cavity 3202; the elastic element 3203 is housed in the fixed cavity 3202 and one end is connected to the positioning part 310; the electromagnetic driving module 3204 is housed in the fixed cavity 3202 and is connected to the end of the elastic element 3203 away from the positioning part 310; The electromagnetic drive module 3204 includes an on-state and an off-state. In the on-state, the electromagnetic drive module 3204 generates a magnetic attraction force, driving the positioning part 310 to move radially away from the center of the bearing area 110 and compressing the elastic member 3203, so that the positioning part 310 releases the clamped part 80. In the off-state, the compressed elastic member 3203 drives the positioning part 310 to move radially towards the center of the bearing area 110, so as to clamp the clamped part 80.

[0033] The drive unit 320, through the linkage design of the electromagnetic drive module 3204 and the elastic element 3203, uses the reset force of the elastic element 3203 to drive the positioning unit 310 to automatically clamp the wafer 80 in the power-off state, effectively preventing the wafer from accidentally loosening and falling, and greatly improving safety and transfer reliability. The opening and closing of the positioning unit 310 can be achieved simply by switching the power on and off of the electromagnetic drive module 3204, eliminating the need for complex manual adjustments and mechanical transmission operations, simplifying the workflow. Simultaneously, the electromagnetic drive can drive multiple positioning units 310 to move synchronously and smoothly, avoiding… To address issues such as uneven clamping force or movement lag caused by manual operation, the positioning unit 310 ensures consistent contact with the side of the workpiece to be clamped, reducing the risk of edge damage caused by uneven force on the wafer side. The elastic element 3203 acts as a buffer and absorbs energy during clamping, preventing damage to the side of the workpiece 80 caused by excessive movement or force from the positioning unit 310. Furthermore, the elastic deformation of the elastic element 3203 adapts to minute dimensional deviations on the side of the workpiece 80, ensuring a uniform distribution of clamping force, thus guaranteeing both clamping stability and the edge integrity of the workpiece 80. Additionally, the drive unit 320 integrates the elastic element 3203 and the electromagnetic drive module 3204 through the fixed cavity 3202, resulting in a compact structure suitable for the limited operating space inside the thermopan.

[0034] It should be noted that, as Figure 4As shown, the positioning part 310 includes a vertical plate 3102 and a horizontal plate 3101 that is perpendicularly connected to the vertical plate 3102. One end of the elastic member 3203 is connected to the vertical plate 3102. In addition, the elastic member 3203 may be, but is not limited to, a spring.

[0035] Example 3 like Figure 1 , Figure 2 As shown, this application embodiment provides a clamping device, including a carrier assembly 10, an adsorption assembly 20, and a plurality of positioning assemblies 30. The carrier assembly 10 is provided with a bearing area 110 and a clearance hole 120. The bearing area 110 is used to bear the workpiece 80 to be clamped, and the clearance hole 120 extends radially from the side of the carrier assembly 10 into the bearing area 110. The adsorption assembly 20 is used to provide adsorption force to the bearing area 110 to adsorb the workpiece 80 to be clamped onto the bearing area 110. A plurality of positioning assemblies 30 are disposed on the carrier assembly 10 and arranged circumferentially around the center of the bearing area 110. Each positioning assembly 30 includes a positioning part 310 and a driving part 320. The positioning part 310 is movably disposed on the carrier assembly 10, and the driving part 320 is configured to drive the positioning part 310 to move radially to clamp or release the side of the workpiece 80 to be clamped.

[0036] As can be seen from the above, the adsorption component 20 provides adsorption force to the bearing area 110 to achieve initial fixation of the part to be clamped 80. In conjunction with multiple circumferentially spaced positioning components 30, the driving unit 320 drives the positioning unit 310 to move radially to clamp the side of the part to be clamped 80, forming a dual fixing structure of adsorption and circumferential positioning. This effectively solves the problem of the part to be clamped 80 falling off due to unstable manual operation when using tools to pick up the piece, ensuring the reliability of the transfer process. Simultaneously, the positioning component 30 clamps the side of the part to be clamped 80, and the adsorption component 20 fixes the non-functional surface of the part to be clamped 80 through surface contact, without directly contacting the functional surface of the part to be clamped 80. It can provide stable support for the clamped part 80, avoiding friction or collision between the clamped part 80 and machine parts, solving the problem of easy scratches on the surface of the clamped part 80 in traditional wafer picking methods, and ensuring product quality. Therefore, the operator can indirectly pick up and put down the wafer through the clamping device without directly touching the clamped part 80 or the high-temperature hot plate with their hands, effectively avoiding the risk of burns when picking up the wafer without tools, reducing safety hazards, and completing the wafer picking through the adsorption component 20 and the positioning component 30 without waiting for the hot plate to cool down, greatly shortening the fault handling time, avoiding rework due to the heating timeout caused by the other wafers in the machine, ensuring the continuity of the production process, and improving the production yield. In addition, the positioning part 310 can move in the radial direction to adapt to clamping parts 80 of different sizes. The clearance hole 120 of the carrier assembly 10 extends in the radial direction to the bearing area 110, which can adapt to the arrangement of needle-shaped support members (pins) in the machine tool. When picking up the piece, the clamping device can pass through the upright needle-shaped support member to reach the bottom of the clamping part 80. After slowly lifting, the clamping part 80 is smoothly lifted into the bearing area 110 and separated from the needle-shaped support member. This not only realizes the reliable separation of the clamping part 80 from the needle-shaped support member, but also facilitates the picking and placing of the clamping part 80 and the movement clearance of the positioning assembly 30, further improving the practicality and operational flexibility of the structure.

[0037] It should be noted that the clamping component 80 can be, but is not limited to, a wafer. When the clamping component 80 is a wafer, the wafer includes a functional surface and a non-functional surface. In chip manufacturing, the functional surface of the wafer usually faces upwards to facilitate processing by the manufacturing equipment, while the non-processed surface of the wafer contacts the stage of the manufacturing equipment. For example, in the hot plate scenario of the photolithography process in chip manufacturing, pins are needle-shaped support components set inside the hot plate. Their function is to support the non-processed surface of the wafer to be processed, so that a gap is formed between the wafer and the hot plate, ensuring uniform heat transfer during high-temperature baking, while avoiding direct contact between the functional surface of the wafer and the hot plate, which could cause contamination or damage. In the clamping device of this application, when picking up the wafer, the clearance hole 120 can pass through the pin-shaped support components, allowing the clamping device to smoothly reach under the wafer. Then, by slowly lifting, the wafer is smoothly lifted into the bearing area 110. Therefore, the adsorption component 20 fixes the non-functional surface of the wafer through surface contact.

[0038] It should also be noted that, such as Figure 1 As shown, the axial direction is parallel to the Z direction.

[0039] like Figure 4 As shown, in some embodiments, the driving unit 320 includes a fixed base 3201, an elastic element 3203, and an electromagnetic driving module 3204; the fixed base 3201 is disposed on the carrier assembly 10, and the fixed base 3201 is provided with a fixed cavity 3202, and the positioning part 310 is slidably disposed in the fixed cavity 3202; the elastic element 3203 is housed in the fixed cavity 3202 and one end is connected to the positioning part 310; the electromagnetic driving module 3204 is housed in the fixed cavity 3202 and is connected to the end of the elastic element 3203 away from the positioning part 310; The electromagnetic drive module 3204 includes an on-state and an off-state. In the on-state, the electromagnetic drive module 3204 generates a magnetic attraction force, driving the positioning part 310 to move radially away from the center of the bearing area 110 and compressing the elastic member 3203, so that the positioning part 310 releases the clamped part 80. In the off-state, the compressed elastic member 3203 drives the positioning part 310 to move radially towards the center of the bearing area 110, so as to clamp the clamped part 80.

[0040] The drive unit 320, through the linkage design of the electromagnetic drive module 3204 and the elastic element 3203, uses the reset force of the elastic element 3203 to drive the positioning unit 310 to automatically clamp the wafer 80 in the power-off state, effectively preventing the wafer from accidentally loosening and falling, and greatly improving safety and transfer reliability. The opening and closing of the positioning unit 310 can be achieved simply by switching the power on and off of the electromagnetic drive module 3204, eliminating the need for complex manual adjustments and mechanical transmission operations, simplifying the workflow. Simultaneously, the electromagnetic drive can drive multiple positioning units 310 to move synchronously and smoothly, avoiding… To address issues such as uneven clamping force or movement lag caused by manual operation, the positioning unit 310 ensures consistent contact with the side of the workpiece to be clamped, reducing the risk of edge damage caused by uneven force on the wafer side. The elastic element 3203 acts as a buffer and absorbs energy during clamping, preventing damage to the side of the workpiece 80 caused by excessive movement or force from the positioning unit 310. Furthermore, the elastic deformation of the elastic element 3203 adapts to minute dimensional deviations on the side of the workpiece 80, ensuring a uniform distribution of clamping force, thus guaranteeing both clamping stability and the edge integrity of the workpiece 80. Additionally, the drive unit 320 integrates the elastic element 3203 and the electromagnetic drive module 3204 through the fixed cavity 3202, resulting in a compact structure suitable for the limited operating space inside the thermopan.

[0041] It should be noted that, as Figure 4As shown, the positioning part 310 includes a vertical plate 3102 and a horizontal plate 3101 that is perpendicularly connected to the vertical plate 3102. One end of the elastic member 3203 is connected to the vertical plate 3102. In addition, the elastic member 3203 may be, but is not limited to, a spring.

[0042] like Figure 1 , Figure 2 As shown, in some embodiments, the substrate assembly 10 includes a base 130, a substrate stage 140, and a cover plate 150 arranged sequentially along the axial direction; the substrate stage 140 is provided with a first bearing groove 1402 at one end facing the cover plate 150; the cover plate 150 is provided with a second bearing groove 1501 that penetrates the cover plate 150 in the axial direction; wherein the first bearing groove 1402 and the second bearing groove 1501 are aligned and connected in the axial direction to jointly form the bearing area 110.

[0043] The bearing area 110, formed by the connection between the first bearing groove 1402 of the stage 140 and the second bearing groove 1501 of the cover plate 150, features a groove-like design that allows the clamped component 80 to be embedded within it. The cover plate 150 and the groove wall form a surrounding protection, effectively preventing protrusions within the hot plate from touching the wafer surface, thus avoiding scratches and preventing damage to the clamped component 80. This design also provides circumferential restraint to the clamped component 80, effectively preventing displacement during transfer and providing stable support for the wafer. Through the axial stacking arrangement of the base 130, stage 140, and cover plate 150, each groove is integrated within the stacked structure, eliminating the need for additional lateral space. This compact structure is suitable for the confined operating environment inside the hot plate.

[0044] It should be noted that, as Figure 2 As shown, the first bearing groove segment 1402 and the second bearing groove segment 1501 are both circular and coaxially arranged, and the diameters of the first bearing groove segment 1402 and the second bearing groove segment 1501 are the same; it can be understood that the center of the bearing area 110 is the center of the circle.

[0045] It should also be noted that, such as Figure 1 , Figure 2 As shown, the outer contours of the base, the stage 140, and the cover plate 150 are the same and aligned. This not only enables the rapid positioning and assembly of the base, the stage 140, and the cover plate 150, improving assembly efficiency, but also ensures that the first hole segment 1301 and the second hole segment 1401, and the first bearing segment and the second bearing segment of each layer are accurately aligned and connected, avoiding the offset of the clearance hole 120 channel or the offset of the bearing area 110 due to assembly deviation.

[0046] like Figure 2As shown, in some embodiments, the base 130 is provided with a first hole segment 1301 extending radially and penetrating the base 130 in the axial direction; the stage 140 is provided with a second hole segment 1401 extending radially and penetrating the stage 140 in the axial direction, the second hole segment 1401 being connected to the first bearing groove segment 1402; the cover plate 150 is provided with a third hole segment 1502 extending radially and penetrating the cover plate 150 in the axial direction, the third hole segment 1502 being connected to the second bearing groove segment 1501; wherein, the first hole segment 1301, the second hole segment 1401 and the third hole segment 1502 are aligned and connected in the axial direction to jointly form the clearance hole 120.

[0047] The clearance hole 120, formed by connecting the first hole segment 1301 of the base 130, the second hole segment 1401 of the tray stage 140, and the third hole segment 1502 of the cover plate 150, extends radially to accommodate the arrangement of pin-shaped supports. Its axially continuous and stacked structure ensures smooth and unobstructed movement, allowing the clamping device to smoothly pass through the pin-shaped supports to reach the underside of the workpiece 80 to be clamped, avoiding interference during removal. Furthermore, the clearance hole 120 is formed by two layers of components, resulting in higher structural strength. By integrating each hole segment into the stacked structure formed by the base 130, tray stage 140, and cover plate 150, no additional lateral space is required, resulting in a compact structure suitable for the confined operating environment inside the hot plate.

[0048] It should be noted that the first hole section 1301 and the second hole section 1401 have the same shape and size; understandably, in order to increase the bearing area of ​​the workpiece 80 to be clamped, a support plate can be provided on the inner wall of the second hole section 1401 of the plate stage 140.

[0049] like Figure 2 As shown, in some embodiments, the bottom of the first bearing groove 1402 is provided with a plurality of adsorption holes 1403, which are arranged circumferentially around the center of the bearing area 110; wherein, the base 130 is provided with a vacuum passage 1302 that communicates with the adsorption holes 1403, and the vacuum passage 1302 is connected to the adsorption component 20 to provide negative pressure to the adsorption holes 1403.

[0050] Multiple adsorption holes 1403 are arranged circumferentially around the center of the support area 110. Combined with the negative pressure provided by the vacuum air passage 1302 on the base 130, an adsorption force is formed on the back of the component 80 to be clamped. This ensures a tight fit and balanced force between the component 80 and the support area 110, effectively preventing wafer movement and detachment during transfer. Furthermore, the adsorption force and the circumferential clamping of the positioning component 30 form a dual fixation of adsorption and positioning, adapting to the circular structure of the wafer and further ensuring the stability of the wafer picking and transfer process. The adsorption effect of the adsorption holes 1403 acts on the non-functional surface of the wafer, preventing damage to the front-side circuitry and ensuring product yield. Simultaneously, the vacuum air passage 1302 is located on the base 130, eliminating the need for external piping and avoiding occupying the limited operating space of the hot plate.

[0051] It should be noted that, as Figure 2 As shown, the vacuum air passage 1302 is disposed on the end face of the base 130 facing the stage 140. The vacuum air passage 1302 is arranged around the clearance hole 120, and the vacuum air passage 1302 passes through the adsorption hole 1403, thereby connecting the vacuum air passage 1302 with the adsorption hole 1403.

[0052] It should also be noted that multiple adsorption pores 1403 are arranged at equal intervals around the center of the bearing area 110, so that the adsorption force can be evenly distributed.

[0053] like Figure 1 , Figure 2 As shown, in some embodiments, the carrier assembly 10 is provided with a plurality of guide grooves 160 extending in the radial direction. The plurality of guide grooves 160 are arranged circumferentially around the center of the bearing area 110 and correspond one-to-one with a plurality of positioning components 30. The positioning components 30 are housed in the corresponding guide grooves 160, and the positioning part 310 of the positioning component 30 is slidably disposed in the guide groove 160.

[0054] Multiple guide grooves 160 extending radially on the carrier assembly 10 and corresponding one-to-one with the positioning assembly 30 are arranged circumferentially around the center of the bearing area 110. This arrangement provides an accurate sliding guide trajectory for the positioning part 310, ensuring that the positioning part 310 moves smoothly only in the radial direction and avoiding deviation or jamming. At the same time, the guide grooves 160 provide installation space for the positioning assembly 30. In addition, the one-to-one arrangement of the guide grooves 160 enables the rapid assembly of the positioning assembly 30, reducing assembly difficulty. Furthermore, the guide grooves 160 are directly integrated into the carrier assembly 10, eliminating the need for additional independent guide components, saving space, and making the layout of the clamping device more compact.

[0055] It should be noted that, as Figure 1 , Figure 2As shown, the carrier assembly 10 is provided with four guide grooves 160, which are arranged circumferentially around the center of the bearing area 110; the number of positioning components 30 is also four, and the four guide grooves 160 correspond one-to-one with the four positioning components 30.

[0056] like Figure 2 As shown, in some embodiments, the guide groove 160 includes a first guide groove segment 1601, a second guide groove segment 1602, and a third guide groove segment 1603; the first guide groove segment 1601 is disposed at the bottom of the first bearing groove segment 1402 and extends radially; the second guide groove segment 1602 is disposed on the side wall of the first bearing groove segment 1402 and extends radially, and the second guide groove segment 1602 is connected to the first guide groove segment 1601 in the radial direction; the third guide groove segment 1603 is disposed on the side wall of the second bearing groove segment 1501 and extends radially, and the third guide groove segment 1603 is aligned with and connected to the second guide groove segment 1602 in the axial direction.

[0057] The three-section layout of the first guide groove 1601, the second guide groove 1602, and the third guide groove 1603 not only provides space for the positioning component 30 to be installed in the guide groove 160, thus avoiding the positioning component 30 occupying external space, but also constrains the movement trajectory of the positioning part 310 in multiple directions, ensuring that the positioning part 310 slides smoothly in the radial direction. At the same time, the first guide groove 1601, the second guide groove 1602, and the third guide groove 1603 are adapted to the stacked layout of the base 130 and the stage 140, so as to achieve guidance without occupying extra space or interfering with the support and limiting protection of the bearing area 110.

[0058] It should be noted that the first guide groove segment 1601, the second guide groove segment 1602 and the third guide groove segment 1603 are all located on the same straight line extending in the radial direction; and the first guide groove segment 1601 matches the shape of the horizontal plate 3101 of the positioning part 310, thereby playing a guiding role and ensuring that the positioning part 310 moves reliably.

[0059] In some embodiments, the adsorption component 20 includes a vacuum pump connected to the vacuum passage 1302.

[0060] By connecting the vacuum pump to the vacuum path channel 1302, it can not only continuously provide a stable and adjustable negative pressure to the adsorption orifice 1403, ensuring that a uniform and sufficient adsorption force is formed in the bearing area 110, avoiding wafer movement and detachment due to insufficient or fluctuating negative pressure, but also flexibly adjust the negative pressure according to the wafer size and thickness to adapt to different working conditions and improve adsorption adaptability.

[0061] Example 4 like Figure 1 , Figure 2 As shown, this application embodiment provides a clamping device, including a carrier assembly 10, an adsorption assembly 20, and a plurality of positioning assemblies 30. The carrier assembly 10 is provided with a bearing area 110 and a clearance hole 120. The bearing area 110 is used to bear the workpiece 80 to be clamped, and the clearance hole 120 extends radially from the side of the carrier assembly 10 into the bearing area 110. The adsorption assembly 20 is used to provide adsorption force to the bearing area 110 to adsorb the workpiece 80 to be clamped onto the bearing area 110. A plurality of positioning assemblies 30 are disposed on the carrier assembly 10 and arranged circumferentially around the center of the bearing area 110. Each positioning assembly 30 includes a positioning part 310 and a driving part 320. The positioning part 310 is movably disposed on the carrier assembly 10, and the driving part 320 is configured to drive the positioning part 310 to move radially to clamp or release the side of the workpiece 80 to be clamped.

[0062] As can be seen from the above, the adsorption component 20 provides adsorption force to the bearing area 110 to achieve initial fixation of the part to be clamped 80. In conjunction with multiple circumferentially spaced positioning components 30, the driving unit 320 drives the positioning unit 310 to move radially to clamp the side of the part to be clamped 80, forming a dual fixing structure of adsorption and circumferential positioning. This effectively solves the problem of the part to be clamped 80 falling off due to unstable manual operation when using tools to pick up the piece, ensuring the reliability of the transfer process. Simultaneously, the positioning component 30 clamps the side of the part to be clamped 80, and the adsorption component 20 fixes the non-functional surface of the part to be clamped 80 through surface contact, without directly contacting the functional surface of the part to be clamped 80. It can provide stable support for the clamped part 80, avoiding friction or collision between the clamped part 80 and machine parts, solving the problem of easy scratches on the surface of the clamped part 80 in traditional wafer picking methods, and ensuring product quality. Therefore, the operator can indirectly pick up and put down the wafer through the clamping device without directly touching the clamped part 80 or the high-temperature hot plate with their hands, effectively avoiding the risk of burns when picking up the wafer without tools, reducing safety hazards, and completing the wafer picking through the adsorption component 20 and the positioning component 30 without waiting for the hot plate to cool down, greatly shortening the fault handling time, avoiding rework due to the heating timeout caused by the other wafers in the machine, ensuring the continuity of the production process, and improving the production yield. In addition, the positioning part 310 can move in the radial direction to adapt to clamping parts 80 of different sizes. The clearance hole 120 of the carrier assembly 10 extends in the radial direction to the bearing area 110, which can adapt to the arrangement of needle-shaped support members (pins) in the machine tool. When picking up the piece, the clamping device can pass through the upright needle-shaped support member to reach the bottom of the clamping part 80. After slowly lifting, the clamping part 80 is smoothly lifted into the bearing area 110 and separated from the needle-shaped support member. This not only realizes the reliable separation of the clamping part 80 from the needle-shaped support member, but also facilitates the picking and placing of the clamping part 80 and the movement clearance of the positioning assembly 30, further improving the practicality and operational flexibility of the structure.

[0063] It should be noted that the clamping component 80 can be, but is not limited to, a wafer. When the clamping component 80 is a wafer, the wafer includes a functional surface and a non-functional surface. In chip manufacturing, the functional surface of the wafer usually faces upwards to facilitate processing by the manufacturing equipment, while the non-processed surface of the wafer contacts the stage of the manufacturing equipment. For example, in the hot plate scenario of the photolithography process in chip manufacturing, pins are needle-shaped support components set inside the hot plate. Their function is to support the non-processed surface of the wafer to be processed, so that a gap is formed between the wafer and the hot plate, ensuring uniform heat transfer during high-temperature baking, while avoiding direct contact between the functional surface of the wafer and the hot plate, which could cause contamination or damage. In the clamping device of this application, when picking up the wafer, the clearance hole 120 can pass through the pin-shaped support components, allowing the clamping device to smoothly reach under the wafer. Then, by slowly lifting, the wafer is smoothly lifted into the bearing area 110. Therefore, the adsorption component 20 fixes the non-functional surface of the wafer through surface contact.

[0064] It should also be noted that, such as Figure 1 As shown, the axial direction is parallel to the Z direction.

[0065] like Figure 4 As shown, in some embodiments, the driving unit 320 includes a fixed base 3201, an elastic element 3203, and an electromagnetic driving module 3204; the fixed base 3201 is disposed on the carrier assembly 10, and the fixed base 3201 is provided with a fixed cavity 3202, and the positioning part 310 is slidably disposed in the fixed cavity 3202; the elastic element 3203 is housed in the fixed cavity 3202 and one end is connected to the positioning part 310; the electromagnetic driving module 3204 is housed in the fixed cavity 3202 and is connected to the end of the elastic element 3203 away from the positioning part 310; The electromagnetic drive module 3204 includes an on-state and an off-state. In the on-state, the electromagnetic drive module 3204 generates a magnetic attraction force, driving the positioning part 310 to move radially away from the center of the bearing area 110 and compressing the elastic member 3203, so that the positioning part 310 releases the clamped part 80. In the off-state, the compressed elastic member 3203 drives the positioning part 310 to move radially towards the center of the bearing area 110, so as to clamp the clamped part 80.

[0066] The drive unit 320, through the linkage design of the electromagnetic drive module 3204 and the elastic element 3203, uses the reset force of the elastic element 3203 to drive the positioning unit 310 to automatically clamp the wafer 80 in the power-off state, effectively preventing the wafer from accidentally loosening and falling, and greatly improving safety and transfer reliability. The opening and closing of the positioning unit 310 can be achieved simply by switching the power on and off of the electromagnetic drive module 3204, eliminating the need for complex manual adjustments and mechanical transmission operations, simplifying the workflow. Simultaneously, the electromagnetic drive can drive multiple positioning units 310 to move synchronously and smoothly, avoiding… To address issues such as uneven clamping force or movement lag caused by manual operation, the positioning unit 310 ensures consistent contact with the side of the workpiece to be clamped, reducing the risk of edge damage caused by uneven force on the wafer side. The elastic element 3203 acts as a buffer and absorbs energy during clamping, preventing damage to the side of the workpiece 80 caused by excessive movement or force from the positioning unit 310. Furthermore, the elastic deformation of the elastic element 3203 adapts to minute dimensional deviations on the side of the workpiece 80, ensuring a uniform distribution of clamping force, thus guaranteeing both clamping stability and the edge integrity of the workpiece 80. Additionally, the drive unit 320 integrates the elastic element 3203 and the electromagnetic drive module 3204 through the fixed cavity 3202, resulting in a compact structure suitable for the limited operating space inside the thermopan.

[0067] It should be noted that, as Figure 4 As shown, the positioning part 310 includes a vertical plate 3102 and a horizontal plate 3101 that is perpendicularly connected to the vertical plate 3102. One end of the elastic member 3203 is connected to the vertical plate 3102. In addition, the elastic member 3203 may be, but is not limited to, a spring.

[0068] like Figure 1 , Figure 2 As shown, in some embodiments, the substrate assembly 10 includes a base 130, a substrate stage 140, and a cover plate 150 arranged sequentially along the axial direction; the substrate stage 140 is provided with a first bearing groove 1402 at one end facing the cover plate 150; the cover plate 150 is provided with a second bearing groove 1501 that penetrates the cover plate 150 in the axial direction; wherein the first bearing groove 1402 and the second bearing groove 1501 are aligned and connected in the axial direction to jointly form the bearing area 110.

[0069] The bearing area 110, formed by the connection between the first bearing groove 1402 of the stage 140 and the second bearing groove 1501 of the cover plate 150, features a groove-like design that allows the clamped component 80 to be embedded within it. The cover plate 150 and the groove wall form a surrounding protection, effectively preventing protrusions within the hot plate from touching the wafer surface, thus avoiding scratches and preventing damage to the clamped component 80. This design also provides circumferential restraint to the clamped component 80, effectively preventing displacement during transfer and providing stable support for the wafer. Through the axial stacking arrangement of the base 130, stage 140, and cover plate 150, each groove is integrated within the stacked structure, eliminating the need for additional lateral space. This compact structure is suitable for the confined operating environment inside the hot plate.

[0070] It should be noted that, as Figure 2 As shown, the first bearing groove segment 1402 and the second bearing groove segment 1501 are both circular and coaxially arranged, and the diameters of the first bearing groove segment 1402 and the second bearing groove segment 1501 are the same; it can be understood that the center of the bearing area 110 is the center of the circle.

[0071] It should also be noted that, such as Figure 1 , Figure 2 As shown, the outer contours of the base, the stage 140, and the cover plate 150 are the same and aligned. This not only enables the rapid positioning and assembly of the base, the stage 140, and the cover plate 150, improving assembly efficiency, but also ensures that the first hole segment 1301 and the second hole segment 1401, and the first bearing segment and the second bearing segment of each layer are accurately aligned and connected, avoiding the offset of the clearance hole 120 channel or the offset of the bearing area 110 due to assembly deviation.

[0072] like Figure 2 As shown, in some embodiments, the base 130 is provided with a first hole segment 1301 extending radially and penetrating the base 130 in the axial direction; the stage 140 is provided with a second hole segment 1401 extending radially and penetrating the stage 140 in the axial direction, the second hole segment 1401 being connected to the first bearing groove segment 1402; the cover plate 150 is provided with a third hole segment 1502 extending radially and penetrating the cover plate 150 in the axial direction, the third hole segment 1502 being connected to the second bearing groove segment 1501; wherein, the first hole segment 1301, the second hole segment 1401 and the third hole segment 1502 are aligned and connected in the axial direction to jointly form the clearance hole 120.

[0073] The clearance hole 120, formed by connecting the first hole segment 1301 of the base 130, the second hole segment 1401 of the tray stage 140, and the third hole segment 1502 of the cover plate 150, extends radially to accommodate the arrangement of pin-shaped supports. Its axially continuous and stacked structure ensures smooth and unobstructed movement, allowing the clamping device to smoothly pass through the pin-shaped supports to reach the underside of the workpiece 80 to be clamped, avoiding interference during removal. Furthermore, the clearance hole 120 is formed by two layers of components, resulting in higher structural strength. By integrating each hole segment into the stacked structure formed by the base 130, tray stage 140, and cover plate 150, no additional lateral space is required, resulting in a compact structure suitable for the confined operating environment inside the hot plate.

[0074] It should be noted that the first hole section 1301 and the second hole section 1401 have the same shape and size; understandably, in order to increase the bearing area of ​​the workpiece 80 to be clamped, a support plate can be provided on the inner wall of the second hole section 1401 of the plate stage 140.

[0075] like Figure 2 As shown, in some embodiments, the bottom of the first bearing groove 1402 is provided with a plurality of adsorption holes 1403, which are arranged circumferentially around the center of the bearing area 110; wherein, the base 130 is provided with a vacuum passage 1302 that communicates with the adsorption holes 1403, and the vacuum passage 1302 is connected to the adsorption component 20 to provide negative pressure to the adsorption holes 1403.

[0076] Multiple adsorption holes 1403 are arranged circumferentially around the center of the support area 110. Combined with the negative pressure provided by the vacuum air passage 1302 on the base 130, an adsorption force is formed on the back of the component 80 to be clamped. This ensures a tight fit and balanced force between the component 80 and the support area 110, effectively preventing wafer movement and detachment during transfer. Furthermore, the adsorption force and the circumferential clamping of the positioning component 30 form a dual fixation of adsorption and positioning, adapting to the circular structure of the wafer and further ensuring the stability of the wafer picking and transfer process. The adsorption effect of the adsorption holes 1403 acts on the non-functional surface of the wafer, preventing damage to the front-side circuitry and ensuring product yield. Simultaneously, the vacuum air passage 1302 is located on the base 130, eliminating the need for external piping and avoiding occupying the limited operating space of the hot plate.

[0077] It should be noted that, as Figure 2 As shown, the vacuum air passage 1302 is disposed on the end face of the base 130 facing the stage 140. The vacuum air passage 1302 is arranged around the clearance hole 120, and the vacuum air passage 1302 passes through the adsorption hole 1403, thereby connecting the vacuum air passage 1302 with the adsorption hole 1403.

[0078] It should also be noted that multiple adsorption pores 1403 are arranged at equal intervals around the center of the bearing area 110, so that the adsorption force can be evenly distributed.

[0079] like Figure 1 , Figure 2 As shown, in some embodiments, the carrier assembly 10 is provided with a plurality of guide grooves 160 extending in the radial direction. The plurality of guide grooves 160 are arranged circumferentially around the center of the bearing area 110 and correspond one-to-one with a plurality of positioning components 30. The positioning components 30 are housed in the corresponding guide grooves 160, and the positioning part 310 of the positioning component 30 is slidably disposed in the guide groove 160.

[0080] Multiple guide grooves 160 extending radially on the carrier assembly 10 and corresponding one-to-one with the positioning assembly 30 are arranged circumferentially around the center of the bearing area 110. This arrangement provides an accurate sliding guide trajectory for the positioning part 310, ensuring that the positioning part 310 moves smoothly only in the radial direction and avoiding deviation or jamming. At the same time, the guide grooves 160 provide installation space for the positioning assembly 30. In addition, the one-to-one arrangement of the guide grooves 160 enables the rapid assembly of the positioning assembly 30, reducing assembly difficulty. Furthermore, the guide grooves 160 are directly integrated into the carrier assembly 10, eliminating the need for additional independent guide components, saving space, and making the layout of the clamping device more compact.

[0081] It should be noted that, as Figure 1 , Figure 2 As shown, the carrier assembly 10 is provided with four guide grooves 160, which are arranged circumferentially around the center of the bearing area 110; the number of positioning components 30 is also four, and the four guide grooves 160 correspond one-to-one with the four positioning components 30.

[0082] like Figure 2 As shown, in some embodiments, the guide groove 160 includes a first guide groove segment 1601, a second guide groove segment 1602, and a third guide groove segment 1603; the first guide groove segment 1601 is disposed at the bottom of the first bearing groove segment 1402 and extends radially; the second guide groove segment 1602 is disposed on the side wall of the first bearing groove segment 1402 and extends radially, and the second guide groove segment 1602 is connected to the first guide groove segment 1601 in the radial direction; the third guide groove segment 1603 is disposed on the side wall of the second bearing groove segment 1501 and extends radially, and the third guide groove segment 1603 is aligned with and connected to the second guide groove segment 1602 in the axial direction.

[0083] The three-section layout of the first guide groove 1601, the second guide groove 1602, and the third guide groove 1603 not only provides space for the positioning component 30 to be installed in the guide groove 160, thus avoiding the positioning component 30 occupying external space, but also constrains the movement trajectory of the positioning part 310 in multiple directions, ensuring that the positioning part 310 slides smoothly in the radial direction. At the same time, the first guide groove 1601, the second guide groove 1602, and the third guide groove 1603 are adapted to the stacked layout of the base 130 and the stage 140, so as to achieve guidance without occupying extra space or interfering with the support and limiting protection of the bearing area 110.

[0084] It should be noted that the first guide groove segment 1601, the second guide groove segment 1602 and the third guide groove segment 1603 are all located on the same straight line extending in the radial direction; and the first guide groove segment 1601 matches the shape of the horizontal plate 3101 of the positioning part 310, thereby playing a guiding role and ensuring that the positioning part 310 moves reliably.

[0085] In some embodiments, the adsorption component 20 includes a vacuum pump connected to the vacuum passage 1302.

[0086] By connecting the vacuum pump to the vacuum path channel 1302, it can not only continuously provide a stable and adjustable negative pressure to the adsorption orifice 1403, ensuring that a uniform and sufficient adsorption force is formed in the bearing area 110, avoiding wafer movement and detachment due to insufficient or fluctuating negative pressure, but also flexibly adjust the negative pressure according to the wafer size and thickness to adapt to different working conditions and improve adsorption adaptability.

[0087] like Figure 1 , Figure 5 As shown, in some embodiments, the clamping device further includes a handle 40, a power module 50, and a vacuum control branch 60; the handle 40 is disposed on the side of the carrier assembly 10 and located in the extending direction of the clearance hole 120; the power module 50 is disposed inside the handle 40; the vacuum control branch 60 is electrically connected to the power module 50 and includes an adsorption assembly 20 and a vacuum control switch 610 connected in series; wherein, the vacuum control switch 610 is disposed on the handle 40.

[0088] By positioning the handle 40 on the side of the carrier assembly 10 and aligning it with the extension direction of the clearance hole 120, the handle can accurately guide the clearance hole 120 into the needle-shaped support when gripped, avoiding interference with the internal structure of the hot plate during operation. This makes it suitable for operation in confined spaces. Furthermore, the suction control switch 610 is integrated into the handle 40 for convenient user operation and allows for timely control of the suction start and stop. By embedding the power module 50 inside the handle 40, no external power supply is required, making the clamping device an independent and complete working unit, thus making the clamping device more flexible and free from the constraints of external equipment. By directly connecting the suction control branch 60 to the power module 50, and through the series design of the suction assembly 20 and the suction control switch 610, precise start and stop control of the suction function is achieved.

[0089] like Figure 5 As shown, in some embodiments, the clamping device further includes a clamping control branch 70, which is connected in parallel with the air extraction control branch 60 to the power module 50; the clamping control branch 70 includes an electromagnetic drive module 3204 and a clamping control module 710 connected in series; wherein, the clamping control module 710 is at least partially disposed on the handle 40 and is configured to switch the on / off state of the clamping control branch 70 and adjust the current flowing through the electromagnetic drive module 3204.

[0090] By connecting the clamping control branch 70 and the suction control branch 60 in parallel, independent power supply and control are achieved for the adsorption component 20 and the electromagnetic drive module 3204. The adsorption and clamping actions do not interfere with each other, allowing users to operate flexibly according to the work process. Furthermore, if one power supply branch fails, the other power supply branch can still operate normally, preventing overall structural failure and improving operational safety. The clamping control module 710 has both on / off switching and current adjustment functions, which can not only adjust the current flowing through the electromagnetic drive module 3204, but also flexibly adjust the strength of the magnetic attraction, so that the release range and movement speed of the positioning part 310 can be adapted as needed. To avoid the positioning part 310 rapidly impacting the side of the wafer due to excessive magnetic attraction, it can also overcome the force of the elastic element 3203, avoiding the problem of the elastic element 3203 getting stuck and the positioning part 310 being unable to move due to insufficient magnetic attraction, thereby preventing interference between the positioning part 310 and the wafer during the wafer removal process; at the same time, the clamping control module 710 is at least partially integrated into the surface of the handle 40. Combined with the ergonomic layout of the handle 40 along the extension direction of the avoidance hole 120, the operator can complete the clamping start and stop and force adjustment with one hand when holding it, without the need for additional posture adjustment or the use of tools, simplifying the operation process and reducing the risk of human error in confined spaces.

[0091] It should be noted that the clamping control module 710 can be a push-type linear potentiometer, which is a component that integrates a linear sliding potentiometer and a push-button switch. When the push rod of the push-type linear potentiometer is pressed briefly, the state of its internal switch contacts is changed, controlling the on / off state of the clamping control branch 70. When the push rod of the push-type linear potentiometer is pressed and continued to be pushed, it directly drives the slider of the internal linear sliding potentiometer, changing the resistance value, thereby adjusting the magnitude of the magnetic force of the electromagnetic drive module 3204. In addition, the push-button switch is located on the handle 40 at this time. It is understandable that a spinning potentiometer can also be used as the clamping control module 710, which can also realize the functions of controlling the on / off state of the clamping control branch 70 and adjusting the magnitude of the magnetic attraction force of the electromagnetic drive module 3204. The specific working principle and structure are existing technologies and will not be described in detail in this application.

[0092] It should also be noted that the clamping control module 710 includes a clamping control switch and a sliding rheostat. The clamping control switch and the sliding rheostat are connected in series in the clamping control branch 70, and the operating part of the clamping control switch is mechanically coupled to the slider of the sliding rheostat. In the first operation, the clamping control switch can be switched on and off, and in the second operation, the slider of the sliding rheostat can be driven to move. The first and second operations can be either a short press or a long press of the clamping control switch, or a short-stroke or long-stroke movement of the clamping control switch. Furthermore, the clamping control switch is located on the handle 40 at this time. Understandably, the mechanical coupling method can be, but is not limited to, rack and pinion linkage, cam linkage, etc. The specific structure and working principle of these methods are existing technologies and will not be elaborated upon in this application.

[0093] It should be noted that in the hot plate scenario of the photolithography process in chip manufacturing, the pins of the machine are in the raised state, holding the wafer in the center of the hot plate cavity. The specific wafer retrieval method is as follows: Step 1: The clamping control module 710 powers on the electromagnetic drive module 3204 and adjusts the current flowing through the electromagnetic drive module 3204. The increase in current increases the magnetic attraction of the electromagnetic force. When the magnetic attraction is greater than the elastic force of the elastic element 3203, the positioning part 310 will move towards the electromagnetic drive module 3204 due to the magnetic attraction, thus completing the preparation state for picking up the piece. Step 2: Pass the clearance hole 120 of the clamping device through the upright pin to the bottom of the wafer, and then slowly lift the clamping device to lift the wafer into the bearing area 110, so that the wafer is separated from the pin. Step 3: The electromagnetic drive module 3204 is de-energized by the clamping control module 710. The electromagnetic drive module 3204 loses its magnetic attraction. The positioning part 310 moves to the side of the wafer under the elastic force of the elastic element 3203, clamps the wafer, and fixes the wafer at the center of the bearing area 110. Step 4: By connecting the air extraction control branch 60 through the air extraction control switch 610, the adsorption component 20 extracts the air from the vacuum air passage 1302, making the adsorption hole 1403 a negative pressure state, and adsorbing the wafer onto the support area 110. Step 5: Slowly pull the clamping device out of the hot plate to complete the entire wafer removal process.

[0094] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0095] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0096] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A clamping device, characterized in that, include: The carrier assembly is provided with a bearing area and a clearance hole. The bearing area is used to bear the workpiece to be clamped, and the clearance hole extends radially from the side of the carrier assembly into the bearing area. An adsorption component is used to provide an adsorption force to the bearing area to adsorb the part to be clamped onto the bearing area; Multiple positioning components are disposed on the carrier assembly and arranged circumferentially around the center of the bearing area. Each positioning component includes a positioning part and a driving part. The positioning part is movably disposed on the carrier assembly, and the driving part is configured to drive the positioning part to move along the radial direction to clamp or release the side of the object to be clamped.

2. The clamping device according to claim 1, characterized in that, The drive unit includes: A fixing seat is disposed on the slide assembly, the fixing seat is provided with a fixing cavity, and the positioning part is slidably disposed in the fixing cavity; An elastic element is housed within the fixed cavity and one end is connected to the positioning part; An electromagnetic drive module is housed within the fixed cavity and connected to the end of the elastic element away from the positioning part. The electromagnetic drive module includes an on-state and a off-state. In the on-state, the electromagnetic drive module generates a magnetic attraction force, driving the positioning part to move along the radial direction away from the center of the bearing area and compressing the elastic element, so that the positioning part releases the clamped part. In the off-state, the compressed elastic element drives the positioning part to move along the radial direction towards the center of the bearing area, so as to clamp the clamped part.

3. The clamping device according to claim 2, characterized in that, The slide assembly includes a base, a slide stage, and a cover plate arranged sequentially along the axial direction; the slide stage has a first bearing groove section at one end facing the cover plate; the cover plate has a second bearing groove section that penetrates the cover plate in the axial direction. The first bearing groove segment and the second bearing groove segment are aligned and connected in the axial direction to jointly form the bearing area.

4. The clamping device according to claim 3, characterized in that, The base is provided with a first hole segment extending in the radial direction and penetrating the base in the axial direction; the slide stage is provided with a second hole segment extending in the radial direction and penetrating the slide stage in the axial direction, the second hole segment being connected to the first bearing groove segment; the cover plate is provided with a third hole segment extending in the radial direction and penetrating the cover plate in the axial direction, the third hole segment being connected to the second bearing groove segment; The first hole segment, the second hole segment, and the third hole segment are aligned and connected in the axial direction to form the clearance hole.

5. The clamping device according to claim 3, characterized in that, The bottom of the first bearing tank section is provided with multiple adsorption holes, which are arranged circumferentially around the center of the bearing area. The base is provided with a vacuum passage that communicates with the adsorption holes, and the vacuum passage is connected to the adsorption component to provide negative pressure to the adsorption holes.

6. The clamping device according to claim 3, characterized in that, The carrier assembly is provided with a plurality of guide grooves extending along the radial direction. The plurality of guide grooves are arranged circumferentially around the center of the bearing area and correspond one-to-one with a plurality of positioning components. The positioning components are housed in the corresponding guide grooves, and the positioning part of the positioning component is slidably disposed in the guide groove.

7. The clamping device according to claim 6, characterized in that, The guide groove includes: The first guide groove section is disposed at the bottom of the first bearing groove section and extends along the radial direction; The second guide groove segment is disposed on the side wall of the first bearing groove segment and extends along the radial direction, and the second guide groove segment is connected to the first guide groove segment in the radial direction; The third guide groove segment is disposed on the side wall of the second bearing groove segment and extends along the radial direction. The third guide groove segment is aligned with and connected to the second guide groove segment in the axial direction.

8. The clamping device according to claim 5, characterized in that, The adsorption component includes a vacuum pump, which is connected to the vacuum air passage.

9. The clamping device according to any one of claims 2-7, characterized in that, The clamping device further includes: A handle is provided on the side of the slide assembly and located in the extending direction of the clearance hole; The power module is located inside the handle; The air extraction control branch is electrically connected to the power module and includes the adsorption component and the air extraction control switch connected in series. The air extraction control switch is located on the handle.

10. The clamping device according to claim 9, characterized in that, The clamping device further includes a clamping control branch, which is connected in parallel with the air extraction control branch to the power module; the clamping control branch includes the electromagnetic drive module and the clamping control module connected in series. The clamping control module is at least partially disposed on the handle and is configured to switch the on / off state of the clamping control branch and adjust the current flowing through the electromagnetic drive module.

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