Wafer photoresist exposure device

Abstract

The utility model provides a kind of wafer photoresist exposure device, belong to semiconductor processing equipment field, specifically including adsorption device, exposure mechanism, alignment mechanism and drive assembly, adsorption device is used to carry wafer and is adsorbed to wafer positioning;Exposure mechanism can emit light to wafer;Alignment mechanism can be coupled with wafer, so that wafer and adsorption device are in coaxial state;Drive assembly is connected with adsorption device, for rotating adsorption device, drives wafer to rotate around central axis;The beneficial effects of the utility model are: through the setting of alignment mechanism, improve the coaxiality of wafer and adsorption device, so when wafer rotates, reduce the deviation of exposure area formed at wafer edge, especially when wafer and adsorption device are coaxial, after again carrying out edge exposure treatment to wafer, annular exposure area can be coaxial with wafer, to improve exposure accuracy and uniformity.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor processing technology, specifically relating to a wafer photoresist exposure device. Background Technology

[0002] Photoresist is coated on the wafer. During the spin coating process, photoresist inevitably covers the front edge, back edge, and even the beveled edge areas of the wafer. If the photoresist at the edges is not treated in time, this excess photoresist will cause a series of serious problems, such as uneven and fragile photoresist coatings at the edges and back, which are prone to cracking and peeling during subsequent transport and processing, generating particulate contaminants, and even causing contamination in subsequent processes. Currently, photoresist at the edge of a wafer is typically exposed using an exposure device so that the photoresist in the area to be removed can be dissolved in the subsequent development step. However, due to the special shape of the wafer, the exposure area formed is prone to deviation when exposing the edge of the wafer. This requires multiple adjustments and exposures of the wafer, resulting in low processing efficiency. Utility Model Content

[0003] The purpose of this invention is to provide a wafer photoresist exposure device that can improve wafer exposure accuracy and increase exposure processing efficiency.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is a wafer photoresist exposure apparatus, comprising an adsorption device, an exposure mechanism, an alignment mechanism, and a driving assembly. The adsorption device is used to carry the wafer and adsorb and position it. The exposure mechanism is capable of emitting light onto the wafer. The alignment mechanism can couple with the wafer to make the wafer and the adsorption device coaxial; the drive component is connected to the adsorption device to make the adsorption device rotate, thereby driving the wafer to rotate around the central axis.

[0005] Furthermore, the alignment mechanism includes alignment components capable of applying forces to the wafer, causing the wafer to move on a horizontal plane.

[0006] Furthermore, the calibration component includes a push-pull assembly and grippers, the push-pull assembly having two output ends; The gripper is located on the side of the adsorption device and is connected to the output end of the push-pull assembly; the gripper can be moved by the push-pull assembly.

[0007] Furthermore, there are two grippers, and the two grippers move synchronously in opposite directions, so that both grippers can contact the wafer simultaneously.

[0008] Furthermore, the alignment mechanism also includes a detection component for detecting the alignment of the geometric center of the wafer with the rotation axis of the adsorption device.

[0009] Furthermore, the detection component includes a light emitting component and a light receiving sensor. The light emitting component is located above the wafer and can emit light downwards; the light receiving sensor is located below the wafer and can receive the light emitted by the light emitting component; when the wafer is eccentric, it can block the light emitted by the light emitting component.

[0010] Furthermore, the exposure mechanism includes an illumination assembly and an adjustment frame, with the illumination assembly located above the wafer; the upper end of the adjustment frame is connected to the illumination assembly, and the lower end is connected to the drive assembly; light is emitted from the illumination assembly.

[0011] Furthermore, the drive assembly includes a second drive motor connected to a second synchronous belt; the adjustment frame is connected to the second synchronous belt; the second drive motor operates through the second synchronous belt, causing the lighting assembly to perform linear reciprocating motion above the wafer, thereby adjusting the position of the lighting assembly.

[0012] Compared with the prior art, the beneficial effects of this utility model are: by setting the alignment mechanism, the coaxiality between the wafer and the adsorption device is improved. Thus, when the wafer rotates, the deviation of the exposure area formed at the edge of the wafer is reduced. In particular, after the wafer and the adsorption device are coaxial, the edge exposure processing of the wafer is performed, so that the annular exposure area can be coaxial with the wafer, thereby improving the exposure accuracy and uniformity. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the drive component structure of this utility model; Figure 3 This is a schematic diagram of the calibration component structure of this utility model; Figure 4 This is a schematic diagram of the detection component structure of this utility model; Among them, 1-worktable, 2-adsorption device, 3-wafer, 4-base plate, 5-support leg, 6-first drive motor, 7-transmission disk, 8-first synchronous belt, 9-lighting component, 10-second drive motor, 11-second synchronous belt, 12-positioning wheel, 13-drag chain, 14-flat frame, 15-push-pull component, 16-gripper, 17-upper arm, 18-lower arm, 19-light emitting component, 20-light receiving sensor, 21-end block. Detailed Implementation

[0014] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0015] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0016] See Figures 1 to 4 As shown, a wafer photoresist exposure apparatus includes a worktable 1, on which an adsorption device 2 is provided. After a wafer 3 is placed on the adsorption device 2, the adsorption device 2 adsorbs and positions the wafer 3. An exposure mechanism is also provided on the worktable 1, located to the side of the adsorption device 2. After the wafer 3 is placed on the adsorption device 2, the exposure mechanism can emit light upwards at the edge of the wafer 3. Then, the adsorption mechanism is controlled to rotate, which drives the wafer 3 to rotate, thereby achieving exposure of the edge position of the wafer 3.

[0017] In this embodiment, a base plate 4 is provided below the workbench 1. The base plate 4 is connected to the workbench 1 by a support leg 5, so that a vertical gap is formed between the base plate 4 and the workbench 1. A driving component is provided in this vertical gap. The driving component includes a first driving module and a second driving module. The first driving module is connected to the adsorption device 2 and can control the adsorption device 2 to rotate through the first driving module. The first drive module includes a first drive motor 6 and a transmission disk 7. The transmission disk 7 is connected to the lower part of the adsorption device 2. The transmission disk 7 is connected to the output end of the first drive motor 6 through a first synchronous belt 8. When the first drive motor 6 starts working, it can make the output shaft rotate. At this time, the gear at the end of the output shaft starts to rotate. The gear is coupled with the first synchronous belt 8, so that the first synchronous belt 8 starts to work. The transmission disk 7 is also coupled with the first synchronous belt 8, so that the transmission disk 7 can rotate and drive the adsorption device 2 to rotate. It should be noted that in this embodiment, the workbench 1 should be provided with a circular opening. The adsorption device 2 passes through the circular opening. A positioning bearing is installed in the circular opening. The outer ring of the positioning bearing is fixed at the circular opening, while the inner ring is connected to the adsorption device 2. This can increase the stability of the rotation of the adsorption device 2. Moreover, the adsorption device 2 is not linearly connected to other components, so it will not affect the rotation of the adsorption device 2.

[0018] In this embodiment, the adsorption device 2 adopts existing technology products, which typically include an outer shell, a vacuum pump and a battery. The outer shell has a cylindrical structure, and an adsorption plate can be installed at its upper end. When the vacuum pump is working, it can adsorb the wafer 3 through the adsorption plate. The lower end of the outer shell is connected to the transmission disk 7. Specifically, PIAB's iTAG series and Schmalz's FCP series products can be used.

[0019] In this embodiment, the exposure mechanism also adopts existing products, which generally include two core parts: a light source system and an illumination component 9. The light source system generates light, such as an ArF laser (producing deep ultraviolet light with a wavelength of 193nm) and a KrF laser (producing a wavelength of 248nm), and then the illumination component 9 projects the light. The lighting component 9 is connected to an adjustment frame, which is used to adjust the horizontal height of the lighting component 9. A straight opening is provided on the workbench 1, and the lower end of the adjustment frame passes through the straight opening. Then, the lower end of the adjustment frame is connected to the second drive module. Through the operation of the second drive module, the adjustment frame drives the lighting component 9 to perform linear reciprocating motion. The adjustment frame includes a bottom clamp for connecting to the second drive module. A vertically mounted support rod is provided on the bottom clamp, and a connecting plate is installed on the support rod. The connecting plate has holes so that the connecting plate fits onto the support rod. An external thread can be provided on the support rod, and an upper screw nut and a lower screw nut are connected through the external thread. The upper screw nut is located below the connecting plate, and the lower screw nut is located above the connecting plate. When the two nuts rotate in opposite directions, they can finally clamp the connecting plate to achieve vertical positioning of the lighting component 9. Then, through the operation of the second drive module, the horizontal position of the lighting component 9 is adjusted so that the lighting component 9 is located above the wafer 3. The aforementioned adjustment frame is only one type of support structure, which can support the lighting component 9 and adjust the horizontal height of the lighting component 9. It can also be other structures, such as: the adjustment frame includes a bottom clamp and a longitudinal electric push rod, the lighting component 9 is installed at the output end of the longitudinal electric push rod, and the position of the lighting component 9 can be adjusted by extending or shortening the longitudinal electric push rod; The second drive module in this embodiment includes a second drive motor 10 and a second synchronous belt 11. A positioning wheel 12 is provided on the lower surface of the workbench 1. The positioning wheel 12 is connected to the second drive motor 10 through the second synchronous belt 11. The bottom clamping block is docked with the second synchronous belt 11. According to the output direction of the second drive motor 10, the second synchronous belt 11 can be adjusted to rotate forward or backward, thereby moving the bottom clamping block and driving the lighting component 9 to move, realizing the position adjustment of the lighting component 9. A drag chain 13 passes through the straight opening. One end of the drag chain 13 is connected to the bottom clamping block, and the other end is connected to the workbench 1. A lead wire passes through the drag chain 13. One end of the lead wire is connected to the lighting component 9, and the other end is connected to the light source system.

[0020] Based on the above embodiments, this embodiment also provides an alignment mechanism on the worktable 1. The alignment mechanism is used to adjust the position of the wafer 3 so that the wafer 3 is aligned with the adsorption disk in the adsorption device 2, that is, the adsorption disk and the wafer 3 are in a coaxial state, so that the distance between each position of the exposure area and the edge diameter of the wafer 3 is equal, that is, the final annular exposure area is in a coaxial state with the wafer 3.

[0021] The alignment mechanism described above mainly consists of two parts: the first part is the calibration component, and the second part is the detection component. Through the operation of the calibration component, the position of the wafer 3 can be coarsely adjusted. Then, through the detection component in conjunction with the rotation of the adsorption device 2, it is detected whether the wafer 3 is coaxial with the adsorption disk and how much the deviation is. If the wafer 3 is in an eccentric state at this time, it is necessary to finely adjust the wafer 3 to finally make the wafer 3 and the adsorption disk coaxial.

[0022] See 1 and Figure 3 As shown, the calibration assembly includes a push-pull assembly 15, which has two output ends. The push-pull assembly 15 is connected to grippers 16 through the output ends. The adsorption device 2 is located between the two grippers 16. When the push-pull assembly 15 is working, it enables the two grippers 16 to move synchronously toward each other or away from each other. When the two grippers 16 are close to each other, the wafer 3 is initially positioned. Each gripper 16 includes an end block 21 and an arm. The end block 21 is connected to the output end of the push-pull assembly 15. The arm is arc-shaped, and the inner end of the arm is connected to the end block. When the gripper 16 moves toward the adsorption device 2, the arc center of the arm can be located on the central axis of the adsorption device 2. Thus, by moving the gripper 16, a pushing force can be applied to the wafer 3, causing the wafer 3 to move.

[0023] Finally, see Figure 1 and Figure 4 As shown, the detection assembly in this embodiment includes a horizontal frame 14, which is hinged to the worktable 1. A locking bolt is provided on the horizontal frame 14. The horizontal frame 14 includes two horizontally arranged arms, namely an upper arm 17 and a lower arm 18, with a gap between them. When detecting the coaxiality of the wafer 3, the free end of the upper arm 17 is located above the wafer 3, and the free end of the lower arm 18 is located below the wafer 3. A light source is installed on the free end of the upper arm 17. The horizontal distance between the light emitting component 19 and the central axis of the adsorption device 2 is equal to the radius of the wafer 3. A light receiving sensor 20 is connected to the free end of the lower arm 18. The light emitted by the light emitting component 19 can illuminate the light receiving sensor 20. When the wafer 3 is still eccentric under the calibration of the calibration component, the wafer 3 will block the light at a certain moment when it rotates to a certain position. This indicates that the wafer 3 is eccentric. At this time, the light receiving sensor 20 cannot receive the light and will issue an alarm signal.

[0024] Finally, the push-pull assembly 15 in this technical solution adopts the existing single-motor dual-output shaft push rod, and the light emitting assembly 19, light receiving sensor 20, etc. also adopt existing technology products. It is only an application of their basic functions, and no structural improvement has been made. Therefore, their composition structure will not be described in detail.

[0025] In this technical solution, a concave-convex fit structure is provided between the first synchronous belt 8 and the transmission disc 7, and between the second synchronous belt 11 and the positioning wheel 12, that is, the transmission is not achieved solely through friction.

[0026] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0027] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A wafer photoresist exposure apparatus, characterized in that, include: Adsorption device (2) is used to carry wafer (3) and adsorb and position wafer (3); The exposure mechanism is capable of emitting light onto the wafer (3); The alignment mechanism can be coupled with the wafer (3) so that the wafer (3) and the adsorption device (2) are in a coaxial state; The driving component is connected to the adsorption device (2) and is used to make the adsorption device (2) rotate, thereby driving the wafer (3) to rotate around the central axis.

2. The wafer photoresist exposure apparatus according to claim 1, characterized in that, The alignment mechanism includes: The calibration component can apply force to the wafer (3) to move the wafer (3) on a horizontal plane.

3. The wafer photoresist exposure apparatus according to claim 2, characterized in that, The proofreading components include: The push-pull assembly (15) has two output terminals; The gripper (16) is located on the side of the adsorption device (2) and is connected to the output end of the push-pull assembly (15); The gripper (16) can be moved by the push-pull assembly (15).

4. The wafer photoresist exposure apparatus according to claim 3, characterized in that, There are two grippers (16), and the two grippers (16) move synchronously. The two grippers (16) move in opposite directions and can contact the wafer (3) at the same time.

5. The wafer photoresist exposure apparatus according to claim 2, characterized in that, The alignment mechanism further includes: The detection component is used to detect the alignment between the geometric center of the wafer (3) and the rotation axis of the adsorption device (2).

6. The wafer photoresist exposure apparatus according to claim 5, characterized in that, The detection component includes: A light emitting component (19) is located above the wafer (3) and is capable of emitting light downwards; A light receiving sensor (20), located below the wafer (3), is capable of receiving light emitted by the light emitting component (19); When the wafer (3) is eccentric, it can block the light emitted by the light emitting component (19).

7. The wafer photoresist exposure apparatus according to claim 1, characterized in that, The exposure organizations include: The lighting assembly (9) is located above the wafer (3); The adjustment bracket is connected to the lighting assembly (9) at the top and to the drive assembly at the bottom; The light is emitted from the lighting component (9).

8. The wafer photoresist exposure apparatus according to claim 7, characterized in that, The driving component includes: The second drive motor (10) is connected to the second synchronous belt (11); The adjustment frame is connected to the second synchronous belt (11); the second drive motor (10) works through the second synchronous belt (11) to make the lighting component (9) reciprocate in a straight line above the wafer (3) to adjust the position of the lighting component (9).

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