A developer temperature control system

Abstract

The utility model relates to the technical field of semiconductor manufacturing auxiliary equipment discloses a developing solution temperature control system, including storage jar, fan, heater, adjusting unit and with the conveying pipeline of storage jar intercommunication, the outer wall of storage jar is provided with interlayer, is provided with heater and water bath medium in interlayer, is provided with magnetic stirrer in storage jar, the fan sets up in the four -around of storage jar, is provided with the branch road going to the inside of storage jar on the conveying pipeline, is provided with circulating pump on the branch road, the adjusting unit includes temperature setter, temperature display, environmental temperature sensor, water bath medium temperature sensor and developing solution temperature sensor, wherein temperature display is connected with environmental temperature sensor, water bath medium temperature sensor and developing solution temperature sensor electricity respectively, and temperature setter is connected with fan and heater electricity respectively. The utility model solves the problem that the simple mode temperature control effect is poor, simplifies the structure, and reduces the cost.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing auxiliary equipment technology, and in particular to a developer temperature control system. Background Technology

[0002] In photolithography, the temperature stability of the developer solution has a significant impact on the development effect. Temperature fluctuations exceeding the reasonable range can cause a series of problems, such as uneven wafer development and reduced pattern accuracy, seriously affecting product quality and performance.

[0003] To address this issue, high-precision developer temperature control systems have emerged. These systems integrate multi-level sensors, complex algorithm modules, and multiple adjustment units. Through the collaborative work of these components, precise temperature control can be achieved. However, existing high-precision systems have significant drawbacks. Their complex structure results in high initial investment costs and cumbersome and difficult installation and debugging processes. For some small and medium-sized manufacturers or laboratories, the systems suffer from functional redundancy, failing to fully realize their value, resulting in relatively low cost-effectiveness and difficulty in meeting actual needs.

[0004] Existing simple temperature control methods mostly use a single heating rod in conjunction with a mechanical temperature control switch, which can only roughly control the temperature of the storage tank. They cannot cope with the temperature loss during the transfer of the developer, nor can they adapt to the effects of changes in ambient temperature. The temperature control accuracy is poor (usually the deviation exceeds ±1℃), and cannot meet the basic process requirements. Utility Model Content

[0005] To address the existing problems, this utility model provides a developer temperature control system, which aims to solve the problems of high cost and complex structure of existing high-precision systems, and poor temperature control effect of traditional simple methods. Under the premise of ensuring basic temperature control accuracy (±0.5℃), the system simplifies the structure and reduces costs.

[0006] To achieve the above objectives, the present invention provides the following technical solution.

[0007] A developer temperature control system includes a storage tank, a fan, a heater, an adjustment unit, and a delivery pipe connected to the storage tank. The storage tank has an outer wall with a jacket containing a heater and a water bath medium, and a magnetic stirrer is installed inside the storage tank. The fan is positioned around the storage tank. A branch of the delivery pipe leads into the storage tank, and a circulation pump is installed on the branch. The adjustment unit includes a temperature setter, a temperature display, an ambient temperature sensor, a water bath medium temperature sensor, and a developer temperature sensor. The temperature display is electrically connected to the ambient temperature sensor, the water bath medium temperature sensor, and the developer temperature sensor, respectively, and the temperature setter is electrically connected to the fan and the heater, respectively.

[0008] As a further improvement of this utility model, the ambient temperature sensor is disposed on the outer wall of the conveying pipe.

[0009] As a further improvement of this utility model, the ambient temperature sensor is an NTC thermistor, which has an accuracy of 0.1℃ in the range of 0℃-50℃.

[0010] As a further improvement of this utility model, the water bath medium temperature sensor is disposed in the interlayer, and the probe of the water bath medium temperature sensor is immersed in the water bath medium.

[0011] As a further improvement of this utility model, the water bath medium temperature sensor is a thermistor with an accuracy of 0.01℃ in the range of -20℃ to 50℃.

[0012] As a further improvement of this utility model, the developer temperature sensor is installed inside the storage tank, and the probe of the developer temperature sensor is immersed in the developer.

[0013] As a further improvement of this utility model, the developer temperature sensor is a thermistor with an accuracy of 0.01℃ in the range of -20℃ to 50℃.

[0014] As a further improvement of this utility model, the interlayer is made of polytetrafluoroethylene material.

[0015] As a further improvement of this utility model, it also includes a heat dissipation loop; the water bath medium in the heat dissipation loop circulates between the interlayer and the outside of the storage tank.

[0016] As a further improvement of this utility model, the effective range of the fan covers the heat dissipation loop.

[0017] This utility model has the following beneficial effects: This invention achieves rapid temperature response and uniformity of the developing solution (within ±0.5℃) through the synergistic action of a heater, water bath medium, fan, and magnetic stirrer, avoiding uneven development or chemical side reactions caused by local overheating. The circulation between the delivery pipeline and storage tank ensures consistent temperature of the developing solution as it flows between external equipment and the storage tank, reducing temperature fluctuations during process transfer. This invention also enables rapid testing, verification, and data collection of materials and methods in the developing process.

[0018] Preferably, the sensor is placed on the outer wall of the delivery pipe to monitor the ambient temperature changes (such as fluctuations in cleanroom air conditioning) as the developer flows in the pipe in real time. The heating / cooling power can be adjusted in advance by the adjustment unit to avoid process deviations caused by temperature lag. Furthermore, the temperature of the outer wall of the delivery pipe can help detect the temperature of the developer in the storage tank and perform preliminary temperature measurement calibration for other sensors.

[0019] Preferably, an accuracy of 0.1℃ within the range of 0-50℃ can capture minute temperature changes (such as air conditioning fluctuations of ±0.3℃), ensuring the system's response speed to environmental interference and making it suitable for temperature-sensitive scenarios such as semiconductor manufacturing (such as processes below 90nm).

[0020] Preferably, the probe is immersed in the interlayer medium to avoid measurement errors caused by the thermal resistance of the interlayer material (such as PTFE), accurately reflect the actual temperature of the water bath, and provide an accurate basis for adjusting the heater power.

[0021] Preferably, a precision of 0.01℃ can be achieved within the sub-Celsius temperature range of -20℃ to 50℃, meeting the requirements of high-end photoresist development (such as EUV photoresist) for temperature fluctuations ≤±0.1℃, and reducing linewidth deviation.

[0022] Preferably, the probe is directly immersed in the developing solution to eliminate the delay in heat conduction from the container wall, ensuring that the measured value is consistent with the actual process temperature and avoiding temperature control failure caused by sensor position deviation.

[0023] Preferably, the 0.01℃ accuracy is matched with the water bath sensor to form a dual closed-loop control (water bath + developer), which can maintain the developer temperature fluctuation ≤±0.2℃ even under external interference, thereby improving product yield.

[0024] Preferably, PTFE does not react with strong alkaline developers such as TMAH, avoiding corrosion of traditional metal interlayers (such as stainless steel) that could lead to solution contamination or leakage; PTFE can also prevent heater leakage from being conducted to the developer through the interlayer, ensuring operator safety; PTFE can also withstand a temperature range of -200℃ to 260℃, adapting to extreme process conditions (such as low-temperature development or high-temperature stripping).

[0025] Preferably, the excess heat inside the storage tank is quickly removed through the circulation of the medium between the interlayer and the outside, avoiding the problem of insufficient heat dissipation efficiency of natural convection relying solely on the fan; the heat dissipation loop can independently control the flow rate, and work with the heater to achieve adjustable heating / cooling rates to adapt to different process rhythms.

[0026] Optionally, the fan acts directly on the heat dissipation loop (such as the heat sink fins) to accelerate the heat exchange of the medium. Under high-temperature conditions (such as summer ambient temperature ≥35℃), it can still maintain the system's temperature control capability and avoid temperature overshoot caused by insufficient heat dissipation. Attached Figure Description

[0027] The accompanying drawings described herein are for illustrative purposes only and do not limit the scope of this invention in any way. Furthermore, the shapes and proportions of the components in the drawings are merely schematic to aid in understanding the invention and do not specifically limit the shapes and proportions of the components. In the drawings: Figure 1 This is an overall diagram of a developer temperature control system as described in Example 1; Figure 2 This is an overall diagram of a developer temperature control system as described in Example 2; The components include: 1. Temperature display; 2. Temperature setting device; 3. Adjustment unit; 4. Delivery pipe; 5. Ambient temperature sensor; 6. Developer temperature sensor; 7. Fan; 8. Heater; 9. Storage tank; 10. Stirrer; 11. Filter; 12. Branch circuit; 13. Circulation pump; 14. Jacket; 15. Heat dissipation loop; and 16. Water bath medium temperature sensor. Detailed Implementation

[0028] To enable those skilled in the art to better understand the technical solutions of this utility model, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0029] It should be noted that when an element is referred to as being "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0030] Unless otherwise defined below, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0031] Example 1 like Figure 1As shown, a developer temperature control system includes a storage tank 9, a fan 7, a heater 8, an adjustment unit 3, a delivery pipe 4 connected to the storage tank 9, a filter 11, and a heat dissipation loop 15. The outer wall of the storage tank 9 is provided with a jacket 14, in which the heater 8 and a water bath medium are disposed. A magnetic stirrer 10 and a filter 11 are disposed inside the storage tank 9. The fan 7 is disposed around the storage tank 9. A branch 12 leading to the storage tank 9 is provided on the delivery pipe 4, and a circulation pump 13 is disposed on the branch 12. The adjustment unit 3 includes a temperature setter 2, a temperature display 1, an ambient temperature sensor 5, a water bath medium temperature sensor 16, and a developer temperature sensor 6. The temperature display 1 is electrically connected to the ambient temperature sensor 5, the water bath medium temperature sensor 16, and the developer temperature sensor 6, respectively. The temperature setter 2 is electrically connected to the fan 7 and the heater 8, respectively. The water bath medium in the heat dissipation loop circulates between the jacket 14 and the outside of the storage tank 9. The effective range of the fan 7 covers the heat dissipation loop 15.

[0032] The ambient temperature sensor 5 is disposed on the outer wall of the conveying pipe 4; the ambient temperature sensor 5 is an NTC thermistor with an accuracy of 0.1℃ in the range of 0℃-50℃.

[0033] The water bath medium temperature sensor 16 is disposed in the interlayer 14, and the probe of the water bath medium temperature sensor 16 is immersed in the water bath medium; the water bath medium temperature sensor 16 is a thermistor, and its accuracy is 0.01℃ in the range of -20℃ to 50℃.

[0034] The developer temperature sensor 6 is installed inside the storage tank 9, and the probe of the developer temperature sensor 6 is immersed in the developer solution; the developer temperature sensor 6 is a thermistor, and its accuracy is 0.01℃ in the range of -20℃ to 50℃.

[0035] The interlayer 14 is made of polytetrafluoroethylene.

[0036] The temperature setting device 2 is a knob-type temperature setting device. The knob is used for manual input of the target temperature, and the display screen displays the current developer temperature and ambient temperature in real time, which is convenient for operators to observe intuitively and manually correct deviations.

[0037] Example 2 like Figure 2As shown, this embodiment discloses a developer temperature control system, which is simpler than that of Embodiment 1. It is suitable for simple developing process tests or experiments on storage tanks with a volume of 15cm x 15cm x 50cm or smaller. It includes a storage tank 9, a fan 7, a heater 8, an adjustment unit 3, and a delivery pipe 4 connected to the storage tank 9. The heater 8 is provided on the outer wall of the storage tank 9. The fan 7 is arranged around the storage tank 9. The adjustment unit 3 includes a temperature setting device 2, a temperature display 1, an ambient temperature sensor 5, and a developer temperature sensor 6. The temperature display 1 is electrically connected to the ambient temperature sensor 5 and the developer temperature sensor 6, respectively. The temperature setting device 2 is electrically connected to the fan 7 and the heater 8, respectively.

[0038] The developer temperature sensor 6 is installed at the outlet end of the developer delivery pipeline (near the spray nozzle) to directly measure the temperature of the developer solution that will be applied to the wafer. The developer temperature sensor 6 is a thermistor; its resistance changes with temperature, enabling high-precision measurement within a certain range (-20℃ to 50℃), with an accuracy of up to 0.01℃, and at a low cost. The ambient temperature sensor 5 is fixed to the equipment housing and is used to collect ambient temperature data to help determine the cause of temperature fluctuations. The ambient temperature sensor 5 is a clamp-on probe, a thermistor type, specifically an NTC thermistor, which is highly sensitive to temperature changes and can still measure temperature even with long measurement lines, achieving an accuracy of 0.1℃ within the 0℃-50℃ range.

[0039] Heater 8 and fan 7 are connected in parallel and both are located near the outer wall of the developer storage tank 9. Heater 8 heats the developer in tank 9, while fan 7 assists in cooling the developer when the temperature is too high. By forcing airflow, it accelerates heat dissipation within the developer unit, expelling hot air and drawing in cool air to remove heat generated by developer agitation and component friction, preventing the unit from overheating. Excessive developer temperature leads to performance degradation, affecting development results. Furthermore, excessively high temperatures accelerate the aging of electronic and mechanical components, and may even damage circuit boards and other components, reducing their lifespan. Heater 8 and fan 7 maintain a stable temperature within the developing unit range of 0℃-50℃, reducing damage to components from high temperatures, extending equipment lifespan, and preventing uneven development due to changes in developer properties. This ensures consistency and stability in the development process, resulting in clearer and more accurate imaging. Simple on / off control achieves temperature regulation.

[0040] This embodiment also includes a control unit, which uses a low-cost microcontroller as its core and is electrically connected to the adjustment unit 3. The control unit has a built-in basic PID control program, receives real-time temperature data from the ambient temperature sensor 5 and the developer temperature sensor 6, compares it with the preset target temperature, and outputs a control signal to drive the heater 8 or the fan 7 to work; at the same time, it refers to the data from the ambient temperature sensor 5 and automatically fine-tunes the control parameters when the ambient temperature changes suddenly.

[0041] This embodiment provides a developer temperature control method based on the above system, including the following steps: 1. Parameter setting: Set the target temperature T of the developer solution (generally 23°C) using the knob on the temperature setting device 2. The control unit records this parameter and displays it on the screen.

[0042] 2. Real-time monitoring: The developer temperature sensor 6 collects the developer temperature T at the outlet of the pipeline in real time. 实 Ambient temperature sensor 5 collects ambient temperature T. 环 All data is transmitted to the control unit.

[0043] 3. Deviation Judgment: The control unit calculates the temperature deviation ΔT=T 实 -T: When ΔT < -0.5℃ (developer temperature is too low), the control unit activates the heating element until T... 实 Stop when T-0.2℃ is reached; When ΔT > 0.5℃ (developer temperature is too high), the control unit starts fan 7 until T... 实 Stop when the temperature drops to T+0.2℃; When -0.5℃≤ΔT≤0.5℃, maintain the current state.

[0044] 4. Environmental adaptability: If the ambient temperature T 环 If the temperature deviates from the historical average ambient temperature by more than 5°C, the control unit will automatically adjust the above start-stop threshold by ±0.1°C (if the ambient temperature is too low, the heating stop threshold will be increased to T-0.1°C) to reduce the impact on the environment.

[0045] Taking small-batch wafer development in the laboratory as an example, the working process of the system is explained as follows: The operator sets the target temperature to 23°C using the knob on the temperature setting device 2, and the display screen shows the target value simultaneously.

[0046] After the developer begins to be transferred, the developer temperature sensor 6 monitors the temperature at the outlet of the pipeline in real time, and the ambient temperature sensor 5 monitors the laboratory temperature (assuming the current temperature is T). 环 =25℃, historical average T 环 =24℃).

[0047] When T实 When the temperature reaches 22.3℃, ΔT = 22.3 - 23 = -0.7℃ (below -0.5℃), the control unit drives the heating element to work, and the temperature of the developer gradually rises.

[0048] When T 实 When the temperature rises to 22.8℃ (reaching T-0.2℃=22.8℃), the heating element stops working. At this point, ΔT=-0.2℃, which is within the normal range.

[0049] If the laboratory air conditioning is suddenly turned off, the ambient temperature T 环 The temperature rises to 30°C (6°C deviation from the historical average), and the developer temperature rises to 23.6°C with the ambient temperature, ΔT = 0.6°C (above 0.5°C). The control unit starts fan 7 until T... 实 Stop when the temperature drops to 23.2℃ (T+0.2℃=23.2℃) and maintain a stable temperature.

[0050] Advantages of this utility model: 1. Simple structure and low cost: The hardware structure is simplified by adjusting unit 3, and the overall cost is only 1 / 3 to 1 / 5 of that of traditional high-precision systems, making it suitable for small and medium-sized scenarios.

[0051] 2. Temperature control meets standards: While ensuring basic temperature control accuracy (±0.5℃), the system adapts to ambient temperature, solving the problem that traditional simple methods cannot cope with transmission loss and environmental changes, and meeting the requirements of non-high-precision processes.

[0052] 3. Easy Operation: The temperature setting device 2 is easy to set and observe intuitively, requiring no complex adjustments and reducing the technical requirements for operators. The above embodiments are merely one of the implementation methods for achieving the technical solution of this utility model. The scope of protection claimed by this utility model is not limited to this embodiment, but also includes any variations, substitutions, and other implementations readily conceived by those skilled in the art within the scope of the technology disclosed in this utility model. Although embodiments of this utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of this utility model. The scope of this utility model is defined by the appended claims and their equivalents.

Claims

1. A developer temperature control system, characterized in that, The system includes a storage tank (9), a fan (7), a heater (8), an adjustment unit (3), and a delivery pipe (4) connected to the storage tank (9). The outer wall of the storage tank (9) is provided with a jacket (14), in which the heater (8) and water bath medium are provided, and a magnetic stirrer (10) is provided inside the storage tank (9). The fan (7) is located around the storage tank (9). A branch (12) leading to the storage tank (9) is provided on the delivery pipe (4), and a circulation pump (13) is provided on the branch (12). The adjustment unit (3) includes a temperature setter (2), a temperature display (1), an ambient temperature sensor (5), a water bath medium temperature sensor, and a developer temperature sensor (6). The temperature display (1) is electrically connected to the ambient temperature sensor (5), the water bath medium temperature sensor, and the developer temperature sensor (6), respectively. The temperature setter (2) is electrically connected to the fan (7) and the heater (8), respectively.

2. The developer temperature control system according to claim 1, characterized in that, The ambient temperature sensor (5) is installed on the outer wall of the conveying pipe (4).

3. The developer temperature control system according to claim 2, characterized in that, The ambient temperature sensor (5) is an NTC thermistor with an accuracy of 0.1℃ in the range of 0℃-50℃.

4. The developer temperature control system according to claim 1, characterized in that, The water bath medium temperature sensor is disposed in the interlayer (14), and the probe of the water bath medium temperature sensor is immersed in the water bath medium.

5. A developer temperature control system according to claim 4, characterized in that, The water bath medium temperature sensor is a thermistor, with an accuracy of 0.01℃ in the range of -20℃ to 50℃.

6. A developer temperature control system according to claim 1, characterized in that, The developer temperature sensor (6) is installed inside the storage tank (9), and the probe of the developer temperature sensor (6) is immersed in the developer.

7. A developer temperature control system according to claim 6, characterized in that, The developer temperature sensor (6) is a thermistor with an accuracy of 0.01℃ in the range of -20℃ to 50℃.

8. A developer temperature control system according to claim 1, characterized in that, The interlayer (14) is made of polytetrafluoroethylene.

9. A developer temperature control system according to claim 8, characterized in that, It also includes a heat dissipation loop; the water bath medium in the heat dissipation loop circulates outside the interlayer (14) and the storage tank (9).

10. A developer temperature control system according to claim 9, characterized in that, The effective range of the fan (7) covers the heat dissipation loop (15).

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