Temperature control system and aging test machine

Abstract

The utility model provides a kind of temperature control system and ageing test machine, it is related to semiconductor test technical field, the utility model provides temperature control system for to chip ageing test temperature control, including liquid distribution component, valve component, test pressure head and collection device;Liquid distribution component includes multiple liquid inlet pipes, valve component is installed on each liquid inlet pipe to independently control the opening and closure of each liquid inlet pipe;Test pressure head is used to abut chip on test seat and with chip carries out heat conduction to carry out crimping test, test pressure head is equipped with measured chip flow channel, measured chip flow channel includes multiple flow channels with multiple liquid inlet pipes one-to-one detachably connected, collection device is connected with each flow channel to receive the medium of heat exchange in each flow channel.The utility model provides temperature control system can control the flow of medium in each flow channel, cope with the different degrees of heat loss existing in each flow channel, improve temperature control precision.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing technology, and in particular to a temperature control system and an aging tester. Background Technology

[0002] Chip aging testers are specialized devices for semiconductor chip reliability testing. By simulating extreme environments such as high temperature, high pressure, and high current, they accelerate the aging process of new products, screening out chips that fail early and ensuring product stability and lifespan before shipment. The principle behind their high-temperature accelerated aging is to increase the temperature and accelerate the chemical reaction rate, thereby shortening the chip lifespan testing time. Therefore, temperature control of the aging board inside the tester, which holds the chip under test, is particularly important, requiring high-precision temperature control to ensure stable chip operation during the aging process.

[0003] Temperature control systems typically consist of heating modules, cooling modules, and control algorithms. Temperature sensors within each module collect the existing temperature, which is then compared to the target temperature using the control algorithm. The algorithm then adjusts and controls the heating and cooling modules, ultimately achieving temperature control through a combination of heating and cooling. However, existing temperature control systems suffer from several drawbacks. The large number of workstations and the long internal piping of the aging test machine lead to heat exchange between deionized water and air as the water flows through these pipes. Furthermore, the inability to individually control the flow rate of the medium in each channel negatively impacts the system's temperature control accuracy. Utility Model Content

[0004] The purpose of this invention is to provide a temperature control system that can control the flow rate of the medium in each flow channel, address the varying degrees of heat loss in each channel, and improve temperature control accuracy. Additionally, an aging test machine incorporating the aforementioned temperature control system is also provided.

[0005] To achieve the above objectives, this utility model provides the following technical solution: In a first aspect, this utility model provides a temperature control system for controlling the temperature of chip aging tests, including a hard contact heat transfer module, wherein the hard contact heat transfer module includes a liquid distribution component, a valve component, a test pressure head, and a collection device; The liquid separation assembly includes multiple liquid inlet pipes, and the valve assembly is installed on each of the liquid inlet pipes to independently control the opening and closing of each liquid inlet pipe. The test head is used to press the chip against the test socket and conduct heat to the chip for a press test. The test head is provided with a chip channel, which includes multiple channels that are detachably connected to the multiple liquid inlet pipes. The collection device is connected to each of the channels to receive the heat exchange medium in each channel.

[0006] In an optional embodiment, the valve assembly includes a plurality of first valves, which are installed one-to-one on the plurality of inlet pipes; And / or, the outlet end of each of the inlet pipes is detachably connected to the inlet end of the corresponding flow channel via a docking plug.

[0007] In an optional embodiment, the multiple flow channels are divided into several flow channel units, each flow channel unit including an equal number of flow channels, and the collection device has multiple drain pipes, which are connected to the multiple flow channel units one by one.

[0008] In an optional embodiment, the temperature control system further includes a liquid return assembly and a main return water pipe. The liquid return assembly includes multiple liquid return pipes, one end of each liquid return pipe is detachably connected to each of the drain pipes, and the other end of each liquid return pipe is connected to the main return water pipe.

[0009] In an optional implementation, the temperature control system further includes a main water inlet pipe, which is connected to each of the individual liquid inlet pipes.

[0010] In an optional embodiment, the temperature control system further includes a cooling component, which is connected to the liquid distribution component via a main water inlet pipe to discharge cooling medium into each of the liquid inlet pipes. The cooling component is also connected to the collection device via a main water return pipe to receive the heat-exchanged medium in the collection device.

[0011] In an optional embodiment, the cooling assembly includes a first heat exchange pipeline, a second heat exchange pipeline, a first heat exchanger, a pump body, and a storage tank. The first heat exchange pipeline is connected between the main inlet pipe and the main return pipe. The second heat exchange pipeline and the first heat exchange pipeline are thermally connected through the first heat exchanger. The pump body and the storage tank are both installed on the first heat exchange pipeline and located between the main return pipe and the first heat exchanger.

[0012] In an optional embodiment, the inlet of the second heat exchange pipeline is used to connect with the plant cooling water, and the inlet of the second heat exchange pipeline is provided with a second valve.

[0013] In an optional embodiment, the first heat exchange pipeline has an inlet section and an outlet section, the inlet section being located between the main return water pipe and the liquid storage tank, and the outlet section being located between the main inlet water pipe and the first heat exchanger; The cooling assembly further includes a bypass valve connected between the outlet section and the storage tank, and / or the cooling assembly further includes a filter connected between the outlet section and the inlet section.

[0014] In an optional implementation, the temperature control system further includes an airflow temperature control module that works in conjunction with the hard contact heat transfer module to control the temperature.

[0015] Secondly, this utility model provides an aging test machine, including a test stand and a temperature control system as described in any of the foregoing embodiments.

[0016] The temperature control system and aging test machine provided by this utility model can produce the following beneficial effects: In the temperature control system provided by this invention, valve assemblies are configured on each inlet pipe to independently control the opening and closing of each inlet pipe, thereby adjusting the flow rate of the medium entering a single flow channel and improving temperature control accuracy. When a fault occurs in the structure through which each flow channel passes, the inlet pipe can be disconnected from the corresponding flow channel to repair the faulty structure, reducing the impact on the remaining flow channels.

[0017] Compared with the prior art, the temperature control system provided by the first aspect of this utility model can control the flow rate of the medium in each flow channel, cope with the different degrees of heat loss in each flow channel, and improve the temperature control accuracy.

[0018] The aging test machine provided in the second aspect of this utility model has the temperature control system provided in the first aspect of this utility model, and thus has all the beneficial effects of the temperature control system provided in the first aspect of this utility model. Attached Figure Description

[0019] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0020] Figure 1 A schematic diagram of the temperature control system provided in this embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of the test head provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of the airflow temperature control module provided in an embodiment of the present invention.

[0021] Icons: 1-Dispensing assembly; 11-Inlet pipe; 2-Valve assembly; 21-First valve; 3-Test head; 31-Chip under test flow channel; 311-Flow channel; 312-Flow channel unit; 32-Driver; 33-Liquid cooling base plate; 4-Collection device; 41-Drain pipe; 5-Return assembly; 51-Return pipe; 6-Main return water pipe; 7-Main inlet water pipe; 8-Cooling assembly; 81-First heat exchange pipeline; 811-Inlet section; 812-Outlet section; 82-Second heat exchange pipeline; 821-Second valve; 83-First heat exchanger; 84-Pump body; 85-Storage tank; 86-Bypass valve; 87-Filter; 9-Controller; 10-Chip; 011-Thermal compensation device; 012-Airflow temperature control module; 0121-Second heat exchanger; 0122-Fan. Detailed Implementation

[0022] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0023] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0024] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0025] The specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the scope of this utility model.

[0026] The first aspect of this utility model provides a temperature control system for controlling the temperature during chip aging tests, such as... Figure 1 and Figure 2 As shown, it includes a hard contact heat transfer module, which includes a liquid distribution assembly 1, a valve assembly 2, a test pressure head 3, and a collection device 4. The liquid separation assembly 1 includes multiple inlet pipes 11, and the valve assembly 2 is installed on each inlet pipe 11 to independently control the opening and closing of each inlet pipe 11. The test head 3 is used to press the chip 10 against the test socket and conduct heat conduction with the chip 10 to perform a press test. The test head 3 is provided with a chip flow channel 31 under test. The chip flow channel 31 under test includes multiple flow channels 311 that are detachably connected to multiple liquid inlet pipes 11. The collection device 4 is connected to each flow channel 311 to receive the heat exchange medium in each flow channel 311.

[0027] The temperature control system provided in the first aspect of this utility model allows the test head 3 to press the chip 10 against the test socket and conduct heat through the chip 10 for a press-fit test. Valve assemblies 2 are configured on each inlet pipe 11 to independently control the opening and closing of each inlet pipe 11, adjusting the flow rate of the medium entering the flow channel 31 of the chip under test, thus improving temperature control accuracy. When a fault occurs in the structure through which the flow channel 311 passes, the inlet pipe 11 can be disconnected from the corresponding flow channel 311 for repair, minimizing the impact on the remaining flow channels 311. Therefore, when different flow channels 311 in the above-mentioned temperature control system experience varying degrees of heat loss, the flow rate of the medium in each flow channel 311 can be adjusted specifically to improve temperature control accuracy.

[0028] like Figure 2 As shown, the test end at the bottom of the test head 3 is provided with a flow channel 31 of the chip under test, and a thermal compensation device 011 is also provided inside which is thermally connected to the flow channel 31 of the chip under test. The thermal compensation device 011 and the flow channel 31 of the chip under test work together to control the temperature of the chip 10, so as to achieve more precise temperature control accuracy.

[0029] The aforementioned test head 3 also includes a drive unit 32 connected to the test end. The drive unit 32 drives the test end to move in the vertical direction, thereby realizing the pressing and releasing of the chip 10. A liquid cooling base plate 33 is connected above the drive unit 32.

[0030] The thermal compensation device 011 may include structures such as heating elements and heating tubes.

[0031] In alternative implementations, such as Figure 1 As shown, the valve assembly 2 includes a plurality of first valves 21, which are installed one-to-one on a plurality of inlet pipes 11.

[0032] In actual use, the flow rate of the medium in the corresponding liquid inlet pipe 11 can be controlled by controlling the opening and closing of each first valve 21.

[0033] The first valve 21 mentioned above can be an electric proportional valve or a manual valve.

[0034] To facilitate the control of the opening degree of the first valve 21, the first valve 21 may be, but is not limited to, an electric proportional valve.

[0035] Specifically, the temperature control system may include a controller 9 and a temperature sensor. The temperature sensor may be installed in each chip test chamber to detect the temperature of the chip test chamber. The temperature sensor and each first valve 21 are connected to the controller 9. The controller 9 can control the opening degree of the corresponding first valve 21 according to the temperature detected by the temperature sensor in real time, so as to control each chip test chamber at a suitable temperature.

[0036] In an optional embodiment, the outlet end of each inlet pipe 11 is detachably connected to the inlet end of the corresponding flow channel 311 via a docking plug.

[0037] Users can connect the inlet pipe 11 and the flow channel 311 through the docking plug, or disconnect the inlet pipe 11 and the flow channel 311 through the docking plug, so that each flow channel 311 can be removed from the system for maintenance without affecting the use of other flow channels 311.

[0038] The connector can include a male and a female connector, which can be detached through threaded connection or snap-fit ​​connection.

[0039] Of course, the above-mentioned connectors can also be self-locking connectors.

[0040] To facilitate the assembly and disassembly of the inlet pipe 11 and the flow channel 311, the inlet pipe 11 and the flow channel 311 can be made of flexible tubing, such as PU (Polyurethane) tubing.

[0041] In alternative implementations, such as Figure 1 As shown, due to the large number of workstations inside the aging test machine and the limited layout space, the multiple flow channels 311 are divided into several flow channel units 312. Each flow channel unit 312 includes an equal number of flow channels 311. The collection device 4 has multiple drain pipes 41, which are connected to multiple flow channel units 312 one by one.

[0042] In other words, in the above embodiment, the medium in each flow channel 311 of each flow channel unit 312 enters the collection device 4 after exchanging heat with the heating device and is discharged from a drain pipe 41 in the collection device 4.

[0043] For example, the inlet pipe 11 is configured with forty-eight pipes, and correspondingly, the flow channel 311 is configured with forty-eight pipes. The forty-eight flow channels 311 are divided into twelve flow channel units 312. Each flow channel unit 312 includes four flow channels 311. The collection device 4 has twelve drain pipes 41, and each drain pipe 41 discharges the medium in one flow channel unit 312 downstream.

[0044] Of course, the number of inlet pipe 11, flow channel 311 and outlet pipe 41 mentioned above is only an example, and the specific number is not limited here and can be adjusted according to the actual situation.

[0045] The collection device 4 may include multiple collectors, which are connected to multiple flow channel units 312 in a one-to-one correspondence, and each collector has a drain pipe 41.

[0046] When a single flow channel unit 312 fails, it can be quickly removed from the whole machine for repair by plugging and unplugging the connector, reducing the impact on the testing of the remaining flow channel units 312.

[0047] In alternative implementations, such as Figure 1 As shown, the temperature control system also includes a return liquid assembly 5 and a main return water pipe 6. The return liquid assembly 5 includes multiple return liquid pipes 51. One end of each return liquid pipe 51 is detachably connected to each drain pipe 41, and the other end of each return liquid pipe 51 is connected to the main return water pipe 6.

[0048] The aforementioned return pipes 51 can collect the medium in each drain pipe 41 into the main return water pipe 6, facilitating subsequent cooling of the medium.

[0049] The return pipe 51 can be made of a flexible tube, such as a PU flexible tube.

[0050] In alternative implementations, such as Figure 1 As shown, the temperature control system also includes a main water inlet pipe 7, which is connected to each liquid inlet pipe 11.

[0051] The main water inlet pipe 7 can separate the cooled medium into liquids, which are then discharged into each inlet pipe 11.

[0052] In alternative implementations, such as Figure 1 As shown, the temperature control system also includes a cooling component 8, which is connected to the liquid distribution component 1 through the main water inlet pipe 7 to discharge cooling medium into each liquid inlet pipe 11. The cooling component 8 is connected to the collection device 4 through the main water return pipe 6 to receive the medium after heat exchange in the collection device 4.

[0053] The purpose of the aforementioned cooling component 8 is to cool down the medium discharged from the main return water pipe 6, and then discharge the cooled medium to the main inlet water pipe 7, so that the medium in the flow channel 311 can continuously exchange heat with the heating device.

[0054] Optionally, the cooling component 8 can be connected to the controller 9 via a computer to achieve systematic control of the cooling component.

[0055] In alternative implementations, such as Figure 1 As shown, the cooling assembly 8 includes a first heat exchange pipe 81, a second heat exchange pipe 82, a first heat exchanger 83, a pump body 84, and a liquid storage tank 85. The first heat exchange pipe 81 is connected between the main water inlet pipe 7 and the main water return pipe 6. The second heat exchange pipe 82 and the first heat exchange pipe 81 are thermally connected through the first heat exchanger 83. The pump body 84 and the liquid storage tank 85 are both installed on the first heat exchange pipe 81 and located between the main water return pipe 6 and the first heat exchanger 83.

[0056] The pump body 84 is used to overcome pressure drop and provide power for the flow of the medium within the temperature control system; the storage tank 85 is used to store the medium. In use, the medium discharged from the main return water pipe 6 enters the first heat exchange pipeline 81, where it can be stored in the storage tank 85. It is then pumped into the first heat exchanger 83 by the pump body 84, where it exchanges heat with the second heat exchange pipeline 82 to cool down, and then discharged into the main inlet water pipe 7.

[0057] The first heat exchanger 83 may be, but is not limited to, a plate heat exchanger; the medium may be, but is not limited to, deionized water.

[0058] Deionized water has a higher specific heat capacity, resulting in better heat exchange capabilities. Its low ion content effectively prevents pipe and equipment blockages, while also offering better heat exchange performance at a lower cost.

[0059] In addition, along the flow direction of the medium in the first heat exchange pipeline 81, the pump body 84 is located downstream of the liquid storage tank 85. The pump body 84 can extract the medium in the liquid storage tank 85 and pump it into the main water inlet pipe 7.

[0060] In an optional embodiment, the inlet of the second heat exchange pipeline 82 is used to connect with the plant cooling water, and the inlet of the second heat exchange pipeline 82 is provided with a second valve 821.

[0061] During use, the plant cooling water and deionized water exchange heat in the first heat exchanger 83, and the flow rate of the plant cooling water is controlled by the opening of the second valve 821, so that the deionized water is stabilized at the set temperature.

[0062] The above-described implementation method uses plant cooling water for heat exchange to control temperature. Compared with compressor refrigeration and liquid nitrogen refrigeration, the structure is simpler and can effectively reduce costs and floor space while reducing component failure rate.

[0063] In an optional embodiment, the first heat exchange pipeline 81 has an inlet section 811 and an outlet section 812. The inlet section 811 is located between the main return water pipe 6 and the liquid storage tank 85, and the outlet section 812 is located between the main inlet water pipe 7 and the first heat exchanger 83. The cooling assembly 8 also includes a bypass valve 86, which is connected between the outlet section 812 and the liquid storage tank 85.

[0064] During use, the supply pressure of deionized water and the flow rate into the main water inlet pipe 7 can be adjusted by controlling the opening of the bypass valve 86.

[0065] The bypass valve 86 may be, but is not limited to, a bypass proportional valve.

[0066] In alternative implementations, such as Figure 1 As shown, the cooling assembly 8 also includes a filter 87, which is connected between the water outlet section 812 and the water inlet section 811.

[0067] The filter 87 is equipped with a resin filter, which monitors the conductivity of the deionized water to remove impurities.

[0068] In alternative implementations, such as Figure 3 As shown, the temperature control system also includes an airflow temperature control module 012 that works in conjunction with the hard contact heat transfer module to control the temperature.

[0069] In the above embodiments, the collaborative temperature control mechanism of the airflow temperature control module 012 and the hard contact heat transfer module not only improves the temperature control response speed and stability of the system, but also enhances the temperature control accuracy of the system under different temperature measurement requirements, and has good application prospects.

[0070] Specifically, such as Figure 3 As shown, the airflow temperature control module 012 includes a second heat exchanger 0121 and a fan 0122. The fan 0122 sends air to the aging test board, and the test head 3 presses the chip 10 onto the test socket of the aging test board. After the airflow exchanges heat with the chip 10 through the aging test board, it flows to the second heat exchanger 0121. After exchanging heat with the second heat exchanger 0121, it flows back to the chip 10. This cycle is repeated to achieve airflow temperature control for the chip 10.

[0071] Depending on the distribution of the aging test board, the airflow temperature control module 012 can be configured as two, three, or more, thereby improving temperature control efficiency and accuracy.

[0072] The second aspect of this utility model provides an aging test machine, which includes a test stand and the aforementioned temperature control system.

[0073] The aging test machine provided in the second aspect of this utility model has the temperature control system provided in the first aspect of this utility model, and thus has all the beneficial effects of the temperature control system provided in the first aspect of this utility model.

[0074] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A temperature control system for controlling the temperature during chip aging tests, characterized in that, It includes a hard contact heat transfer module, which includes a liquid distribution assembly (1), a valve assembly (2), a test pressure head (3), and a collection device (4). The liquid distribution assembly (1) includes multiple liquid inlet pipes (11), and the valve assembly (2) is installed on each of the liquid inlet pipes (11) to independently control the opening and closing of each of the liquid inlet pipes (11); The test head (3) is used to press the chip (10) against the test socket and conduct heat to the chip (10) for a press test. The test head (3) is provided with a chip flow channel (31) under test. The chip flow channel (31) under test includes multiple flow channels (311) that are detachably connected to the multiple liquid inlet pipes (11). The collection device (4) is connected to each of the flow channels (311) to receive the heat exchange medium in each of the flow channels (311).

2. The temperature control system according to claim 1, characterized in that, The valve assembly (2) includes a plurality of first valves (21), which are installed one-to-one on the plurality of inlet pipes (11). And / or, the outlet end of each of the inlet pipes (11) is detachably connected to the inlet end of the corresponding flow channel (311) via a docking plug.

3. The temperature control system according to claim 1, characterized in that, The multiple channels (311) are divided into several channels (312), each channel unit (312) includes an equal number of channels (311), and the collection device (4) has multiple drain pipes (41), which are connected to the multiple channels (312) one by one.

4. The temperature control system according to claim 3, characterized in that, The temperature control system also includes a return liquid assembly (5) and a main return water pipe (6). The return liquid assembly (5) includes multiple return liquid pipes (51). One end of each return liquid pipe (51) is detachably connected to each drain pipe (41) in a one-to-one correspondence. The other end of each return liquid pipe (51) is connected to the main return water pipe (6).

5. The temperature control system according to claim 1, characterized in that, The temperature control system also includes a main water inlet pipe (7), which is connected to each of the liquid inlet pipes (11).

6. The temperature control system according to claim 1, characterized in that, The temperature control system also includes a cooling component (8), which is connected to the liquid distribution component (1) through a main water inlet pipe (7) to discharge cooling medium into each of the liquid inlet pipes (11). The cooling component (8) is connected to the collection device (4) through a main water return pipe (6) to receive the medium after heat exchange in the collection device (4).

7. The temperature control system according to claim 6, characterized in that, The cooling assembly (8) includes a first heat exchange pipe (81), a second heat exchange pipe (82), a first heat exchanger (83), a pump body (84), and a storage tank (85). The first heat exchange pipe (81) is connected between the main water inlet pipe (7) and the main water return pipe (6). The second heat exchange pipe (82) and the first heat exchange pipe (81) are thermally connected through the first heat exchanger (83). The pump body (84) and the storage tank (85) are both installed on the first heat exchange pipe (81) and located between the main water return pipe (6) and the first heat exchanger (83).

8. The temperature control system according to claim 7, characterized in that, The inlet of the second heat exchange pipeline (82) is used to connect with the plant cooling water, and the inlet of the second heat exchange pipeline (82) is equipped with a second valve (821).

9. The temperature control system according to claim 7, characterized in that, The first heat exchange pipeline (81) has an inlet section (811) and an outlet section (812). The inlet section (811) is located between the main return water pipe (6) and the liquid storage tank (85), and the outlet section (812) is located between the main inlet water pipe (7) and the first heat exchanger (83). The cooling assembly (8) further includes a bypass valve (86) connected between the outlet section (812) and the storage tank (85), and / or the cooling assembly (8) further includes a filter (87) connected between the outlet section (812) and the inlet section (811).

10. The temperature control system according to claim 7, characterized in that, The temperature control system also includes an airflow temperature control module that works in conjunction with the hard contact heat transfer module to control the temperature.

11. An aging test machine, characterized in that, Includes a test stand and a temperature control system as described in any one of claims 1-10.

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