A low-power processor motherboard

Abstract

The utility model discloses a kind of low-power processor mainboards, processor mainboard technical field, including mainboard board body and heat dissipation component, the mainboard board body is integrated structure, and the rear end of mainboard board body upper surface is equipped with CPU slot, the heat dissipation component is set to the surface of mainboard board body, and heat dissipation component includes radiating fin, heat plate, heat-conducting silicone grease, auxiliary radiating fin, auxiliary fan and dustproof heat dissipation fan, the radiating fin is set to the rear side of mainboard board body upper surface. The low-power processor mainboard, by heat dissipation component, so that the device is through zoning multiple heat dissipation to improve overall heat dissipation efficiency, effectively reduce the temperature of processor mainboard, and then reduce the frequency reduction phenomenon triggered by high temperature, avoid performance loss by maintaining stable working temperature, indirectly optimize power consumption performance, by mounting component, so that the convenient disassembly of processor mainboard is realized, simultaneously, shock-absorbing mechanism can effectively absorb vibration energy, so that mainboard is not easily damaged.

Description

Technical Field

[0001] This utility model relates to the field of processor motherboard technology, specifically a low-power processor motherboard. Background Technology

[0002] The processor motherboard is the core circuit board of a computer, housing key hardware such as the CPU, memory, and graphics card. It provides physical connections and communication channels, acting as the computer's "skeleton and transportation hub." It connects all components via slots, coordinates data exchange between the CPU, memory, and peripherals through the chipset and bus, and provides stable power support to all components. It is widely used in electronic devices, industrial control equipment, servers, and other fields. However, current processor motherboards still have the following shortcomings: For example, patent document CN218728880U discloses a new type of processor motherboard. This new processor motherboard features an integrated structure and is directly equipped with a dedicated heatsink, making it simple and convenient. This motherboard not only has existing USB 2.0 and USB 3.0 interfaces, but also traditional round interfaces and a relatively traditional HDMI interface, improving its overall adaptability. However, it lacks a proper heat dissipation mechanism, resulting in poor overall heat dissipation. This leads to increased chip temperature, triggering a frequency reduction protection mechanism, causing CPU performance to decrease, and indirectly increasing actual power consumption. Utility Model Content

[0003] The purpose of this invention is to provide a low-power processor motherboard to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a low-power processor motherboard, comprising a motherboard body and a heat dissipation assembly. The motherboard body is an integrated structure, and a CPU socket is installed at the rear end of the upper surface of the motherboard body. The heat dissipation assembly is disposed on the surface of the motherboard body and includes heat dissipation fins, a heat spreader, thermal grease, auxiliary heat dissipation fins, an auxiliary fan, and a dustproof cooling fan. The heat dissipation fins are disposed on the rear side of the upper surface of the motherboard body, and a heat spreader is installed on the upper surface of the motherboard body. Thermal grease is disposed on the front right end of the upper surface of the motherboard body, and auxiliary heat dissipation fins are disposed on the upper surface of the thermal grease. A dustproof cooling fan is installed on the upper side of the auxiliary heat dissipation fins. A dustproof cooling fan is disposed on the upper side of the CPU socket.

[0005] Furthermore, memory slots are provided on both sides of the CPU socket, and a power supply interface is provided on the right side of the memory slot.

[0006] Furthermore, a keyboard and mouse interface is installed on the rear left side of the upper surface of the motherboard, and a USB interface is provided in front of the keyboard and mouse interface.

[0007] Furthermore, a PCIe slot is provided at the front end of the upper surface of the motherboard, and an M. interface is installed on the right side of the front end of the upper surface of the motherboard.

[0008] Furthermore, a network card interface is provided on the front left end of the upper surface of the motherboard, and a pin is installed on the front end of the upper surface of the motherboard.

[0009] Furthermore, the motherboard surface is provided with mounting components for auxiliary installation, and the mounting components include highly elastic thermally conductive adhesive, auxiliary mounting frame, mounting bolts and shock-absorbing washers, with the highly elastic thermally conductive adhesive disposed on the side surface of the motherboard.

[0010] Furthermore, an auxiliary mounting frame is provided on the outer surface of the high-elasticity thermally conductive adhesive, and mounting bolts are threaded to both ends of the auxiliary mounting frame. A shock-absorbing washer is provided on the upper end of the mounting bolt.

[0011] Furthermore, the mounting assembly also includes a shock-absorbing pad and a graphene thermally conductive pad, and the lower surface of the auxiliary mounting frame is provided with a shock-absorbing pad, while the lower surface of the motherboard is provided with a graphene thermally conductive pad.

[0012] This utility model provides a low-power processor motherboard, which has the following advantages: 1. This utility model incorporates a heat dissipation component, including heat sink fins, a vapor chamber, thermal grease, auxiliary heat sink fins, an auxiliary fan, and a dustproof cooling fan. During use, the heat sink fins directly contact the motherboard surface, increasing the surface area to accelerate heat dissipation and improve heat dissipation efficiency. Thermal grease fills the tiny gaps between the auxiliary heat sink fins and the motherboard, reducing contact thermal resistance. The auxiliary heat sink fins provide auxiliary heat dissipation, while the auxiliary fan expels heat from the fins via airflow. The dustproof cooling fan provides continuous direct cooling to the CPU. The vapor chamber achieves uniform heat dissipation through its internal capillary structure. This multi-zone heat dissipation system improves overall heat dissipation efficiency, effectively reducing the processor motherboard temperature and thus reducing throttling caused by high temperatures. By maintaining a stable operating temperature, performance loss is avoided, indirectly optimizing power consumption.

[0013] 2. This utility model incorporates an installation component, including a high-elasticity thermally conductive adhesive, an auxiliary mounting frame, mounting bolts, and shock-absorbing washers. The component also includes shock-absorbing pads and graphene thermally conductive pads. During use, the high-elasticity thermally conductive adhesive is used as an adhesive to fix the auxiliary mounting frame to the motherboard, ensuring a stable connection between the motherboard and the auxiliary mounting frame while enhancing its heat dissipation performance. The mounting bolts secure the auxiliary mounting frame to the installation position. The shock-absorbing washers provide cushioning during use, preventing the mounting bolts from loosening due to vibration. The shock-absorbing pads directly dampen the auxiliary mounting frame. The graphene thermally conductive pads combine thermal conductivity and cushioning properties, exhibiting good compression resilience and enhancing shock absorption while maintaining heat dissipation. This facilitates convenient installation and removal of the processor motherboard. Furthermore, the shock-absorbing mechanism effectively absorbs vibration energy, preventing damage to the motherboard. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of a low-power processor motherboard according to the present invention. Figure 2 This is a three-dimensional structural diagram of a heat dissipation component for a low-power processor motherboard according to the present invention. Figure 3 This is a three-dimensional structural diagram of the motherboard body of a low-power processor motherboard according to the present invention. Figure 4 This is a three-dimensional structural diagram of the mounting components for a low-power processor motherboard according to the present invention.

[0015] In the diagram: 1. Motherboard; 2. CPU socket; 3. Heatsink assembly; 301. Heatsink fins; 302. Heatsink plate; 303. Thermal grease; 304. Auxiliary heatsink fins; 305. Auxiliary fan; 306. Dustproof cooling fan; 4. Memory slots; 5. Power connector; 6. Keyboard and mouse connectors; 7. USB connector; 8. PCIe slot; 9. M.2 interface; 10. Network interface; 11. Pin headers; 12. Mounting components; 1201. High-elasticity thermal adhesive; 1202. Auxiliary mounting frame; 1203. Mounting bolts; 1204. Vibration damping washers; 1205. Vibration damping pads; 1206. Graphene thermal pads. Detailed Implementation

[0016] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0017] like Figures 1 to 4As shown, a low-power processor motherboard includes a motherboard body 1 and a heat dissipation component 3. The motherboard body 1 is an integrated structure, and a CPU socket 2 is installed at the rear end of the upper surface of the motherboard body 1. The heat dissipation component 3 is disposed on the surface of the motherboard body 1, and the heat dissipation component 3 includes heat dissipation fins 301, a heat spreader 302, thermal grease 303, auxiliary heat dissipation fins 304, an auxiliary fan 305, and a dustproof cooling fan 306. The heat dissipation fins 301 are disposed on the rear side of the upper surface of the motherboard body 1, and a heat spreader 302 is installed on the upper surface of the motherboard body 1. Thermal grease 303 is disposed on the front right end of the upper surface of the motherboard body 1, and an auxiliary heat dissipation fin 304 is disposed on the upper surface of the thermal grease 303. A dustproof cooling fan 306 is installed on the upper side of the auxiliary heat dissipation fin 304, and a dustproof cooling fan 306 is disposed on the upper side of the CPU socket 2.

[0018] The specific operation is as follows: During use, the heat sink 301 directly contacts the surface of the motherboard 1, thereby increasing the surface area to accelerate heat dissipation and improve heat dissipation efficiency. Thermal grease 303 is used to fill the tiny gaps between the auxiliary heat sink 304 and the motherboard 1 to reduce contact thermal resistance. The auxiliary heat sink 304 provides auxiliary heat dissipation, while the auxiliary fan 305 exhausts the heat from the fins through airflow. The dustproof cooling fan 306 can directly and continuously dissipate heat from the CPU. The heat spreader 302 achieves uniform heat dissipation through its internal capillary structure.

[0019] Please refer to Figures 3 to 4 The CPU socket 2 has memory slots 4 on both sides, and a power connector 5 is located on the right side of the memory slots 4. A keyboard and mouse port 6 is installed on the rear left side of the upper surface of the motherboard 1, and a USB port 7 is located in front of the keyboard and mouse port 6. A PCIe slot 8 is located on the front front of the upper surface of the motherboard 1, and an M.2 interface 9 is installed on the right front front of the upper surface of the motherboard 1. A network card interface 10 is located on the front left side of the upper surface of the motherboard 1, and a header 11 is installed on the front front of the upper surface of the motherboard 1. The surface of the motherboard 1 has an installation component 12 for auxiliary installation, which includes high-elasticity thermal conductive adhesive 1201 and auxiliary... The mounting frame 1202, mounting bolts 1203, and shock-absorbing washers 1204 are installed. High-elasticity thermally conductive adhesive 1201 is provided on the side surface of the main board 1. An auxiliary mounting frame 1202 is provided on the outer surface of the high-elasticity thermally conductive adhesive 1201. The two ends of the auxiliary mounting frame 1202 are threaded with mounting bolts 1203. The upper end of the mounting bolts 1203 is provided with shock-absorbing washers 1204. The mounting assembly 12 also includes shock-absorbing pads 1205 and graphene thermally conductive pads 1206. The lower surface of the auxiliary mounting frame 1202 is provided with shock-absorbing pads 1205, and the lower surface of the main board 1 is provided with graphene thermally conductive pads 1206. The specific operation is as follows: During use, the motherboard body 1 uses high-elasticity thermally conductive adhesive 1201 as an adhesive to fix the auxiliary mounting frame 1202, which can maintain a stable connection between the motherboard body 1 and the auxiliary mounting frame 1202 and enhance its heat dissipation performance. The auxiliary mounting frame 1202 is fixed in the installation position by mounting bolts 1203. The shock-absorbing washer 1204 can play a buffering role during use to prevent the mounting bolts 1203 from loosening due to vibration. The shock-absorbing pad 1205 can directly play a shock-absorbing role on the auxiliary mounting frame 1202. The graphene thermally conductive pad 1206 has both thermal conductivity and buffering performance, good compression resilience, and enhances the shock absorption function while maintaining the heat dissipation effect.

[0020] In summary, as Figures 1 to 4 As shown, in use, the low-power processor motherboard firstly, the heat sink 301 directly contacts the surface of the motherboard body 1, increasing the surface area to accelerate heat dissipation and improve heat dissipation efficiency. Thermal grease 303 fills the tiny gaps between the auxiliary heat sink 304 and the motherboard body 1, reducing contact thermal resistance. The auxiliary heat sink 304 provides auxiliary heat dissipation, while the auxiliary fan 305 exhausts heat from the fins through airflow. The dustproof cooling fan 306 directly and continuously dissipates heat from the CPU. The vapor chamber 302 achieves uniform heat dissipation through its internal capillary structure. High-elasticity thermally conductive adhesive 1201 is used as an adhesive on the motherboard body 1. The auxiliary mounting frame 1202 is fixed with an adhesive, which can maintain a stable connection between the motherboard 1 and the auxiliary mounting frame 1202 and enhance its heat dissipation performance. The auxiliary mounting frame 1202 is fixed in the installation position by the mounting bolts 1203. The shock-absorbing washer 1204 can play a buffering role during use to prevent the mounting bolts 1203 from loosening due to vibration. The shock-absorbing pad 1205 can directly play a shock-absorbing role on the auxiliary mounting frame 1202. The graphene thermal conductive pad 1206 has both thermal conductivity and buffering performance, good compression resilience, and enhances the shock absorption function while maintaining the heat dissipation effect.

[0021] The embodiments of this utility model are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the utility model to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical applications of this utility model, and to enable those skilled in the art to understand this utility model and design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A low-power processor motherboard, comprising a motherboard body (1) and a heat dissipation assembly (3), characterized in that: The motherboard body (1) is an integrated structure, and a CPU socket (2) is installed at the rear end of the upper surface of the motherboard body (1). The heat dissipation component (3) is disposed on the surface of the motherboard body (1), and the heat dissipation component (3) includes heat dissipation fins (301), a heat spreader (302), thermal grease (303), auxiliary heat dissipation fins (304), an auxiliary fan (305), and a dustproof cooling fan (306). The heat dissipation fins (301) are disposed on the rear side of the upper surface of the motherboard body (1), and a heat spreader (302) is installed on the upper surface of the motherboard body (1). Thermal grease (303) is disposed on the right side of the front side of the upper surface of the motherboard body (1), and an auxiliary heat dissipation fin (304) is disposed on the upper surface of the thermal grease (303). A dustproof cooling fan (306) is installed on the upper side of the auxiliary heat dissipation fins (304). A dustproof cooling fan (306) is disposed on the upper side of the CPU socket (2). The surface of the board (1) is provided with an installation component (12) for auxiliary installation, and the installation component (12) includes a high elastic thermal conductive adhesive (1201), an auxiliary installation frame (1202), an installation bolt (1203) and a shock-absorbing washer (1204). The high elastic thermal conductive adhesive (1201) is provided on the side surface of the main board (1). The outer surface of the high elastic thermal conductive adhesive (1201) is provided with an auxiliary installation frame (1202), and the two ends of the surface of the auxiliary installation frame (1202) are threaded with installation bolts (1203). The upper end of the installation bolt (1203) is provided with a shock-absorbing washer (1204). The installation component (12) also includes a shock-absorbing pad (1205) and a graphene thermal conductive pad (1206). The lower surface of the auxiliary installation frame (1202) is provided with a shock-absorbing pad (1205), and the lower surface of the main board (1) is provided with a graphene thermal conductive pad (1206).

2. A low-power processor motherboard according to claim 1, characterized in that, The CPU socket (2) has memory slots (4) on both sides, and a power supply interface (5) is provided on the right side of the memory slots (4).

3. A low-power processor motherboard according to claim 1, characterized in that, The motherboard body (1) has a keyboard and mouse interface (6) installed on the left rear side of the upper surface, and a USB interface (7) is provided in front of the keyboard and mouse interface (6).

4. A low-power processor motherboard according to claim 1, characterized in that, The motherboard board (1) has a PCIe slot (8) at the front end of its upper surface, and an M.2 interface (9) is installed on the right side of the front end of its upper surface.

5. A low-power processor motherboard according to claim 1, characterized in that, The motherboard board (1) has a network card interface (10) on the left side of the upper surface, and a pin (11) is installed on the front end of the upper surface of the motherboard board (1).

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