A server housing structure and a server

Abstract

The application relates to a server shell structure and a server. The server shell structure comprises a shell main body which is detachably fixedly connected by multiple modular components; a heat dissipation channel is arranged in the shell main body, the output end of the heat dissipation channel corresponds to a heat dissipation fin arranged on the shell main body, the heat dissipation fin is detachably mounted on the shell main body; the shell main body further comprises multiple hollow heat dissipation windows, the positions of the heat dissipation windows correspond to heat dissipation fans arranged in the shell main body; a support pad made of high-elastic rubber material is arranged in the shell main body and corresponds to the bottom of a PCB. The technical scheme of the application effectively solves the technical problems of insufficient heat dissipation performance of a traditional server shell, inconvenient installation and maintenance and the like.

Description

Technical Field

[0001] This utility model relates to the field of server equipment technology, and in particular to a server shell structure. Background Technology

[0002] With the rapid development of data centers, cloud computing technologies, and large-scale models, and the continuous expansion of server clusters, servers, as core devices for data processing and storage, face increasingly higher requirements for performance and stability. Servers typically contain a large number of sophisticated electronic components, such as motherboards, hard drives, and memory. The server casing provides physical protection for these components, preventing them from being affected by impacts, vibrations, dust, moisture, and other external factors. Simultaneously, the server casing also serves functions such as heat dissipation management and facilitating installation and maintenance.

[0003] In related technologies, existing server enclosure structures often suffer from problems such as insufficient heat dissipation and inconvenient installation and maintenance. Furthermore, most existing servers do not consider shock resistance, which is detrimental to large-scale server clusters. Utility Model Content

[0004] This application provides a server enclosure structure and a server to solve the problems of poor heat dissipation efficiency, poor shock resistance, and inconvenient installation and maintenance of traditional server enclosure structures.

[0005] Therefore, in a first aspect, embodiments of this application provide a server housing structure, including a housing body, characterized in that the housing body is detachably and fixedly connected from multiple modular components;

[0006] The outer casing has a heat dissipation channel inside, and the output end of the heat dissipation channel corresponds to the heat sink provided on the outer casing. The heat sink is detachably installed on the outer casing.

[0007] The outer casing also includes multiple perforated heat dissipation windows, the positions of which correspond to the cooling fans located inside the outer casing.

[0008] The interior of the outer casing is provided with a support pad made of highly elastic rubber material at the position corresponding to the bottom of the PCB board.

[0009] In one possible implementation, the outer shell body is made of high-strength aluminum alloy material.

[0010] In one possible implementation, LED lights are provided on the outer surface of the outer casing to indicate the server's operating status.

[0011] In one possible implementation, the exterior of the housing body is further provided with a handle, an EMI spring, and a locking device.

[0012] Secondly, embodiments of this application also provide a server, including the server shell structure as described in any one of the embodiments of the first aspect 1 to 4.

[0013] According to the server enclosure structure and server provided in this application, the server enclosure structure includes an enclosure body, which is composed of multiple modular components that are detachably and fixedly connected. The enclosure body has internal heat dissipation channels, the output ends of which correspond to heat sinks on the enclosure body, which are detachably mounted on the enclosure body. The enclosure body also has multiple perforated heat dissipation windows, the positions of which correspond to cooling fans 2 located inside the enclosure body. A support pad made of highly elastic rubber material is provided inside the enclosure body corresponding to the bottom of the PCB board. Because this application uses detachable modular components, it facilitates disassembly and maintenance. By providing heat dissipation channels, cooling fans, heat sinks, and multiple perforated heat dissipation windows on the enclosure body, heat dissipation efficiency and ease of disassembly and maintenance are greatly improved. Furthermore, the support pad at the bottom of the PCB board provides shock absorption. Therefore, the technical solution of this application effectively solves the technical problems of insufficient heat dissipation performance, inconvenient installation and maintenance, and poor shock absorption in traditional server enclosures. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, those skilled in the art can obtain other drawings based on these drawings without creative effort. In addition, in the drawings, the same parts use the same reference numerals, and the drawings are not drawn to scale.

[0015] Figure 1 A three-dimensional structural diagram of a server casing structure provided in one embodiment of the application;

[0016] Figure 2 A schematic diagram of a heat dissipation module for a server casing structure provided in an embodiment of this application;

[0017] Figure 3 A schematic diagram of the heat sink structure of a server casing provided in one embodiment of this application;

[0018] Figure 4 A schematic diagram of a modular design for a server casing structure provided in one embodiment of the application;

[0019] The attached diagram is labeled as follows: 1. Handle; 2. Fan; 3. EMI spring; 4. LED light; 5. LATCH; 6. Rubber sleeve; 7. Heat dissipation window; 8. Heat sink; 9. Light guide column; 10. LED board; 11. Screw. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] See Figure 1 , Figure 2 and Figure 4 The embodiment shown in this application provides a server shell structure, including a shell body. The shell body is composed of multiple modular components that are detachably and fixedly connected. The connection method can use clips or screws, which facilitates disassembly and assembly.

[0022] The main body of the outer casing has a heat dissipation channel inside. The output end of the heat dissipation channel corresponds to the heat dissipation window set on the main body of the outer casing. The heat sink can be detachably installed on the main body of the outer casing, and the installation method is either snap-on or screw-on.

[0023] Reference Figure 2 In the embodiment shown, the outer shell body has multiple hollowed-out heat dissipation windows 7. The overall position of the multiple heat dissipation windows 7 corresponds to the heat dissipation fan 2 located inside the outer shell body, thereby improving the heat dissipation efficiency. The number and arrangement of the heat dissipation windows 7 can be set according to the actual situation.

[0024] In a preferred embodiment, the heat dissipation windows are arranged in a matrix.

[0025] The main body of the casing contains a PCB board. On the inner side of the main body of the casing, corresponding to the bottom of the PCB board, there is a support pad made of highly elastic rubber material. This support pad has a shock absorption effect, further reducing the impact of vibration on the internal components of the server.

[0026] In a preferred embodiment, in addition to the bottom of the PCB board, at least some support pads are also provided inside the main body of the outer casing at other locations.

[0027] In one embodiment of this application, the outer shell body described above is made of high-strength aluminum alloy material, which has the characteristics of being lightweight and having high strength.

[0028] In one embodiment of this application, an LED light is provided on the outer surface of the aforementioned outer casing body to indicate the working status of the server.

[0029] The exterior of the aforementioned main casing is also equipped with a handle 1, an EMI spring 3, a rubber sleeve 6, and a locking device LATCH 5. The handle is located at the top of the server, and the locking device is used to lock the upper part of the main casing to the side part of the main casing, thereby ensuring the safety of the internal components of the server.

[0030] In summary, the server casing structure provided in this application has the following advantages:

[0031] 1. Heat dissipation module

[0032] The main body of the casing has a heat dissipation channel inside, and the output end casing has a perforated heat dissipation window. The heat dissipation window works in conjunction with the internal cooling fan to form a high-efficiency heat dissipation system.

[0033] 2. Outer shell body

[0034] Made of high-strength aluminum alloy, it features lightweight and high strength.

[0035] 3. Equipped with earthquake-resistant structure

[0036] A support pad is placed at the bottom of the PCB. The support pad is made of highly elastic rubber material, which effectively absorbs external vibrations and supports the PCB board, further reducing the impact of vibrations on the internal components of the server.

[0037] 4. Modular component design

[0038] The main body of the shell adopts a modular component design, and the modules are fixed together by clips or screws, which facilitates installation and maintenance.

[0039] Furthermore, in this application, the LED light 4 breaks away from the traditional wired approach and is fixed to the housing with screws and nuts, facilitating installation and disassembly; for example, the structured modular components can be connected using screws 11. In addition, an LED board 10 is also provided on the housing, and a light guide post 9 is provided next to the LED board.

[0040] Secondly, this application also provides a server, which includes the server shell structure described in any of the above embodiments. The server shell structure refers to the above embodiments. Since this server adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, and will not be elaborated further here.

[0041] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0042] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A server casing structure, comprising a casing body, characterized in that, The outer shell is composed of multiple modular components that can be detachably and fixedly connected. The outer casing has a heat dissipation channel inside, and the output end of the heat dissipation channel corresponds to the heat sink provided on the outer casing. The heat sink is detachably installed on the outer casing. The outer casing also includes multiple perforated heat dissipation windows, the positions of which correspond to the cooling fans located inside the outer casing. The interior of the outer shell body is provided with a support pad made of highly elastic rubber material at the position corresponding to the bottom of the PCB board; The outer shell is made of high-strength aluminum alloy. The outer surface of the main body of the outer casing is provided with LED lights to indicate the working status of the server. The LED lights are fixed to the main body of the outer casing by screws and nuts. The exterior of the housing body is also equipped with a handle, EMI spring, and locking device.

2. The server casing structure according to claim 1, characterized in that, The multiple perforated heat dissipation windows are arranged in a matrix.

3. The server casing structure according to claim 1, characterized in that, The outer casing is also provided with an LED panel and a light guide column, with the light guide column located next to the LED panel.

4. The server casing structure according to claim 1, characterized in that, The inner side of the main body of the outer casing, except for the bottom of the PCB board, is also provided with at least some of the aforementioned support pads.

5. A server, characterized in that, Includes the server enclosure structure as described in any one of claims 1 to 4.

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