Air cooling mechanism for network server

CN224861896UActive Publication Date: 2026-10-16SHANXI ALUMINIUM FACTORY
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Patent Information

Application Number
CN202522317565.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-31
Publication Date
2026-10-16
Estimated Expiration
2035-10-31

AI Technical Summary

Technical Problem

[0003]传统的服务器内部风冷散热是通过直接向服务器内部发热元件(如CPU、GPU、内存)吹风实现散热,但强制气流携带灰尘沉积在电路板表面,降低绝缘性能并引发短路风险,故本方案提出一种网络服务器的风冷散热机构,通过风冷-液冷复合散热,液冷介质作为热传导中介,将风冷作用于液冷回路而非直接接触电子元件,实现高效、低尘的散热效果

Benefits of technology

相当于传统单一风冷散热,该装置通过风冷-液冷复合散热,以氟化液作为热传导中介,将风冷作用于毛细通道的液冷回路,并通过气流与壁面呈螺旋流动,提高对毛细通道内的氟化液降温效果,同实现高效、低尘的散热效果。

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a kind of air-cooled heat dissipation mechanisms of network server, including server case, server mainboard is installed on the inside side wall of the server case, the outside of the server case is fixedly connected with heat dissipation plate, multiple vertical through-arranged air-cooled channels are set on the heat dissipation plate, the top of the heat dissipation plate and top side wall are respectively provided with liquid outlet cavity and liquid inlet cavity, the liquid outlet cavity and liquid inlet cavity are not communicated with air-cooled channel, multiple capillary channels are set in the heat dissipation plate, the two ends of each capillary channel are communicated with liquid outlet cavity and liquid inlet cavity respectively.The utility model is cooled by air-cooled-liquid cooled composite heat dissipation, fluorinated liquid is used as heat conduction intermediary, air-cooled is applied to the liquid cooling circuit of capillary channel, and through air current and wall surface spiral flow, improve the fluorinated liquid cooling effect in capillary channel, same realization high efficiency, low dust heat dissipation effect.
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Description

Technical Field

[0001] This utility model relates to the field of server heat dissipation technology, and in particular to a wind-cooled heat dissipation mechanism for a network server. Background Technology

[0002] The physical components of a network server generally include a processor, hard drive, memory, system bus, etc. As a node in the network, the server is closely related to our daily life. For example, we often use mobile phones and laptops to obtain information, communicate with the outside world, and enjoy entertainment. All of these require connection and transmission through the server. When the server is working, it will generate a lot of heat. In order to prevent excessive temperature from causing hardware failure or system crash, the server is equipped with a heat dissipation device.

[0003] Traditional server internal air cooling achieves heat dissipation by directly blowing air onto heat-generating components (such as CPU, GPU, and memory). However, forced airflow carries dust that settles on the circuit board surface, reducing insulation performance and posing a short-circuit risk. Therefore, this solution proposes an air cooling mechanism for network servers that uses a combined air-cooling and liquid-cooling system. The liquid cooling medium acts as a heat conduction intermediary, directing air cooling onto the liquid cooling circuit rather than directly contacting electronic components, thus achieving efficient and low-dust heat dissipation. Utility Model Content

[0004] This invention provides a wind-cooling heat dissipation mechanism for a network server to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A network server air-cooling heat dissipation mechanism includes a server chassis, a server motherboard mounted on the inner side wall of the server chassis, a heat sink fixedly connected to the outer side of the server chassis, multiple vertically penetrating air-cooling channels on the heat sink, an outlet cavity and an inlet cavity respectively opened in the top and top side wall of the heat sink, neither of the outlet cavity nor the inlet cavity is connected to the air-cooling channels, multiple capillary channels are opened in the heat sink, each capillary channel is connected to the outlet cavity and the inlet cavity at both ends respectively, the multiple capillary channels surround the multiple air-cooling channels, and an air intake device is provided on the top of the heat sink; A liquid outlet pipe is fixedly connected to the side wall of the liquid outlet chamber, and one end of the liquid outlet pipe extends into the server chassis. A connecting pipe is fixedly connected to the side wall of the liquid inlet chamber. A liquid pump is provided at the bottom of the server chassis. One end of the connecting pipe extends into the server chassis and communicates with the liquid outlet end of the liquid pump. A suction pipe is fixedly connected to the suction end of the liquid pump.

[0006] The air intake device includes an air guide tube with a circular opening at the top and a rectangular opening at the bottom. The bottom of the air guide tube is fixedly connected to the upper side of the heat sink. The top ends of the multiple air-cooling channels are located inside the bottom opening of the air guide tube. A support plate is fixedly connected to the top of the air guide tube, and a motor is fixedly connected to the bottom side of the support plate. The output shaft of the motor is fixedly connected to a fan blade.

[0007] The heat sink is made of stainless steel.

[0008] Each of the aforementioned air-cooling channels has spiral ribs on its inner sidewall.

[0009] The server chassis is filled with a heat-conducting fluid, which is a fluorinated liquid.

[0010] Compared with the prior art, the beneficial effects of this utility model are: Equivalent to traditional single air-cooling heat dissipation, this device uses air-cooling-liquid-cooling composite heat dissipation, with fluorinated liquid as the heat conduction medium. The air cooling is applied to the liquid cooling circuit of the capillary channel, and the airflow flows in a spiral with the wall, which improves the cooling effect of the fluorinated liquid in the capillary channel and achieves efficient and low-dust heat dissipation.

[0011] The above description is merely an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it according to the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. The specific implementation methods of this utility model are given in detail in the following embodiments and their accompanying drawings. Attached Figure Description

[0012] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings: Figure 1 This is a three-dimensional structural diagram of a wind-cooling heat dissipation mechanism for a network server proposed in this utility model. Figure 2 This is a three-dimensional structural diagram showing the internal cross-section of the server chassis in this utility model. Figure 3 This is a side view cross-sectional structural diagram of a network server air-cooling heat dissipation mechanism proposed in this utility model. Figure 4 This is a side sectional three-dimensional structural diagram of the heat sink in this utility model; Figure 5 for Figure 4 A magnified schematic diagram of the structure of part A in the diagram; Figure 6This is a front cross-sectional perspective view of the heat sink in this utility model. Figure 7 This is a schematic diagram of the internal structure of the liquid outlet cavity of the heat sink in this utility model.

[0013] The attached diagram lists the components represented by each number as follows: 1. Heat sink; 2. Air duct; 3. Motor; 4. Support plate; 5. Server chassis; 6. Liquid outlet pipe; 7. Server motherboard; 8. Liquid suction pipe; 9. Liquid pump; 10. Connecting pipe; 11. Liquid inlet chamber; 12. Fan blade; 13. Capillary channel; 14. Spiral rib; 15. Air cooling channel; 16. Liquid outlet chamber. Detailed Implementation

[0014] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are for illustrative purposes only and are not intended to limit the scope of this utility model. The utility model is described in more detail below by way of example with reference to the accompanying drawings. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of this utility model.

[0015] Please see Figures 1 to 7 In this embodiment of the utility model, a network server air-cooling heat dissipation mechanism includes a server chassis 5, a server motherboard 7 installed on the inner side wall of the server chassis 5, and heat-generating components such as CPU, GPU, and memory on the server motherboard 7. The server chassis 5 is filled with a heat-conducting liquid, which is a fluorinated liquid. A heat sink 1 is fixedly connected to the outer side of the server chassis 5. The heat sink 1 is made of high thermal conductivity stainless steel. Multiple vertically penetrating air-cooling channels 15 are opened on the heat sink 1. Spiral protrusions 14 are provided on the inner side wall of each air-cooling channel 15. An outlet cavity 16 and an inlet cavity 11 are respectively opened in the top and top side wall of the heat sink 1. The outlet cavity 16 and the inlet cavity 11 are not connected to the air-cooling channels 15. Multiple capillary channels 13 are opened in the heat sink 1. The two ends of each capillary channel 13 are connected to the outlet cavity 16 and the inlet cavity 11 respectively. The multiple capillary channels 13 surround the multiple air-cooling channels 15. An air intake device is provided on the top of the heat sink 1. A liquid outlet pipe 6 is fixedly connected to the side wall of the liquid outlet chamber 16. One end of the liquid outlet pipe 6 extends into the server chassis 5. A connecting pipe 10 is fixedly connected to the side wall of the liquid inlet chamber 11. A liquid pump 9 is provided at the bottom of the server chassis 5. One end of the connecting pipe 10 extends into the server chassis 5 and communicates with the liquid outlet end of the liquid pump 9. A suction pipe 8 is fixedly connected to the suction end of the liquid pump 9.

[0016] Specifically, the air intake device includes an air duct 2, which has a circular opening at the top and a rectangular opening at the bottom. The bottom of the air duct 2 is fixedly connected to the upper side of the heat sink 1. The tops of multiple air-cooling channels 15 are located inside the bottom opening of the air duct 2. A support plate 4 is fixedly connected to the top of the air duct 2, and a motor 3 is fixedly connected to the bottom side of the support plate 4. A fan blade 12 is fixedly connected to the output shaft of the motor 3. The airflow generated by the motor 3 driving the fan blade 12 will enter the multiple air-cooling channels 15 through the air duct 2. The airflow can cool the fluorinated liquid in the capillary channel 13 through heat exchange in the air-cooling channel 15.

[0017] The working principle of this utility model is as follows: When in use, first start the motor 3 and the liquid pump 9. The liquid pump 9 drives the fluorinated liquid that absorbs heat in the server chassis 5 through the suction pipe 8 and the connecting pipe 10 into the liquid inlet chamber 11. Then, after being cooled by multiple capillary channels 13, it enters the liquid outlet chamber 16 and finally flows back into the server chassis 5 through the liquid outlet pipe 6, so as to achieve continuous heat dissipation inside 5. When the fluorinated liquid passes through the capillary channel 13, the airflow generated by the motor 3 driving the fan blade 12 will enter the multiple air-cooling channels 15. The airflow cools the fluorinated liquid in the capillary channel 13 through heat exchange. At the same time, when the airflow passes through the spiral protrusions 14 on the side wall of the air-cooling channel 15, the spiral protrusions 14 make the airflow spiral when it comes into contact with the wall. The spiral flow can accelerate the heat exchange between the airflow and the wall, and improve the cooling effect of the fluorinated liquid in the capillary channel 13.

[0018] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any way. Those skilled in the art can readily implement this utility model based on the accompanying drawings and the above description. However, any modifications, alterations, or variations made by those skilled in the art without departing from the scope of the utility model's technical solution, utilizing the disclosed technical content, are equivalent embodiments of this utility model. Furthermore, any equivalent changes, alterations, or variations made to the above embodiments based on the essential technology of this utility model are still within the protection scope of this utility model's technical solution.

Claims

1. A wind-cooled heat dissipation mechanism for a network server, comprising a server chassis (5), characterized in that, A server motherboard (7) is installed on the inner side wall of the server chassis (5). A heat sink (1) is fixedly connected to the outer side of the server chassis (5). Multiple vertically penetrating air-cooling channels (15) are opened on the heat sink (1). An outlet cavity (16) and an inlet cavity (11) are opened in the top and top side wall of the heat sink (1), respectively. The outlet cavity (16) and the inlet cavity (11) are not connected to the air-cooling channels (15). Multiple capillary channels (13) are opened in the heat sink (1). The two ends of each capillary channel (13) are connected to the outlet cavity (16) and the inlet cavity (11), respectively. Multiple capillary channels (13) surround multiple air-cooling channels (15). An air intake device is provided on the top of the heat sink (1). A liquid outlet pipe (6) is fixedly connected to the side wall of the liquid outlet chamber (16). One end of the liquid outlet pipe (6) extends into the server chassis (5). A connecting pipe (10) is fixedly connected to the side wall of the liquid inlet chamber (11). A liquid pump (9) is provided at the bottom of the server chassis (5). One end of the connecting pipe (10) extends into the server chassis (5) and communicates with the liquid outlet end of the liquid pump (9). A suction pipe (8) is fixedly connected to the suction end of the liquid pump (9).

2. The air-cooled heat dissipation mechanism for a network server according to claim 1, characterized in that, The air intake device includes an air guide tube (2), the top of which has a circular opening and the bottom of which has a rectangular opening. The bottom of the air guide tube (2) is fixedly connected to the upper side of the heat sink (1). The tops of the multiple air-cooling channels (15) are located inside the bottom opening of the air guide tube (2). A support plate (4) is fixedly connected to the top of the air guide tube (2). A motor (3) is fixedly connected to the bottom side of the support plate (4). A fan blade (12) is fixedly connected to the output shaft of the motor (3).

3. The air-cooled heat dissipation mechanism for a network server according to claim 1, characterized in that, The heat sink (1) is made of stainless steel.

4. The air-cooled heat dissipation mechanism for a network server according to claim 1, characterized in that, Each of the air-cooled channels (15) has a spiral protrusion (14) on its inner sidewall.

5. The air-cooled heat dissipation mechanism for a network server according to claim 1, characterized in that, The server chassis (5) is filled with a heat-conducting fluid, which is a fluorinated liquid.