Modular electronic device and ecosystem
Patent Information
- Application Number
- CN202521491801.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-10-25
- Filing Date
- 2025-07-16
- Publication Date
- 2026-10-16
- Estimated Expiration
- 2035-07-16
AI Technical Summary
该连接有火花和电源浪涌的风险
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Figure CN224861910U_ABST
Abstract
Description
[0001] Cross-reference to related applications This application claims priority and benefit to U.S. Provisional Patent Application No. 63 / 712,152, filed October 25, 2024, and U.S. Provisional Patent Application No. 63 / 672,077, filed July 16, 2024, the entire contents of which are incorporated herein by reference. Technical Field
[0002] This application relates to an ecosystem, and more particularly to an ecosystem and modular electronic device with a CAN bus communication system. Background Technology
[0003] Modular systems are used by construction workers for the efficient storage and transport of construction equipment, such as power tools and accessories. Modular systems include wall panels, baseboards, rolling storage boxes, toolboxes, tool bags, organizers, power tools, and accessories that interconnect using modular installation features. Modular installation features include physical interfaces for physically interconnecting two modular units. These modular installation features can be modified to also include electrical interfaces for electrically connecting two modular electronic devices (e.g., power supplies, chargers, batteries, battery cells, etc.). Portable power supplies, chargers, batteries, and battery cells provide flexibility and convenience for powering electronic devices (e.g., power tools) on construction sites. Modular electronic devices can be customizable and include any number of interchangeable modules for exchanging power and communication. For example, a user might find they need multiple charging modules connected to a power source to adequately charge multiple battery packs. The charging modules need to be able to communicate with each other and with the power source to negotiate power transfer. Modular electronic devices can be connected linearly or in a delinear, tree-like structure. In these cases, it is advantageous to utilize Control Area Network (CAN) buses (e.g., CAN buses with flexible data rate CAN-FD), RS-485, Ethernet 10Base-T1S, or similar protocols to provide communication between various modular electronic devices. Therefore, each modular electronic device in the modular ecosystem should be able to implement a communication bus protocol.
[0004] As modules become more interchangeable within a modular ecosystem, the necessity and feasibility of replacing modules while they are running (e.g., hot-swapping) also increase. Hot-swapping modules can lead to power surges and pre-charge issues. In one example, a running battery pack charger can be paired with battery cells and returned to a public charging location (e.g., a portable power source). A user can then connect the battery pack charger and battery cells to an existing module paired with their own battery cells. This connection carries the risk of sparks and power surges. Utility Model Content
[0005] Using interleaved pin interfaces on inserted or removed modules is advantageous for generating a reliable system interrupt signal that also functions as a fast-acting shutdown circuit to prevent arcing. Interleaved pins also offer the benefit of a low quiescent current automatic disconnect scheme when inserting or removing modules.
[0006] The modular electronic device of this invention includes a communication interface, one or more terminating resistors configured to be selectively enabled, and sensing logic circuitry. The one or more terminating resistors are electrically connected to the communication interface when enabled and electrically disconnected from the communication interface when disabled. The sensing logic circuitry is configured to enable the one or more terminating resistors when it determines that the modular electronic device is a terminal module in a communication bus master stack.
[0007] The ecosystem described in this invention includes a first small-chip module and a second small-chip module. The first small-chip module includes a first downward interface and a first upward interface. The second small-chip module includes a second downward interface, a first transceiver coupled to the second downward interface, a second upward interface, a second transceiver coupled to the second upward interface, and a controller coupled to the first and second transceivers. The controller includes an electronic processor configured to segment a first CAN bus at the second downward interface, create a second CAN bus, and provide the second CAN bus to the first downward interface via the second upward interface. The second CAN bus is transmitted from the first downward interface to the first upward interface.
[0008] The method described in this invention provides enabling an internal modular resistor in a modular electronic device. The method includes receiving input from a first communication interface of the modular electronic device using sensing logic circuitry; determining, using the sensing logic circuitry, that the modular electronic device includes a first characteristic; determining, using the sensing logic circuitry and in response to determining that the modular electronic device includes the first characteristic, that the modular electronic device includes a second characteristic; and enabling an internal modular resistor using the sensing logic circuitry and in response to determining that the modular electronic device includes the second characteristic.
[0009] Before explaining any embodiment in detail, it should be understood that the embodiments are not limited in application to the details of the configuration and arrangement of the components described in the following description or shown in the accompanying drawings. Embodiments can be practiced or implemented in various ways. Furthermore, it should be understood that the wording and terminology used in this invention are for illustrative purposes and should not be considered restrictive. The use of “comprising,” “including,” or “having,” and variations thereof is intended to cover the items listed thereafter and their equivalents and additional items. Unless otherwise specified or limited, the terms “mounted,” “connected,” “supported,” and “coupled,” and variations thereof are used broadly and cover direct and indirect mounting, connection, support, and coupling.
[0010] Furthermore, it should be understood that embodiments may include hardware, software, and electronic components or modules, which, for the purposes of discussion, may be illustrated and described as if most components were implemented solely in hardware. However, those skilled in the art, based on reading this detailed description, will recognize that in at least one embodiment, the electronic aspects may be implemented in software (e.g., stored on a non-transitory computer-readable medium) that can be executed by one or more processing units (such as microprocessors and / or application-specific integrated circuits (“ASICs”). Therefore, it should be noted that embodiments may be implemented using a plurality of hardware and software-based devices and a plurality of different structural components. For example, “server,” “computing device,” “controller,” “processor,” etc., as described in the specification may include one or more processing units, one or more computer-readable medium modules, one or more input / output interfaces, and various connectors (e.g., system buses) for connection components.
[0011] Related terms used in conjunction with quantities or conditions, such as “about,” “approximately,” “generally,” etc., will be understood by a person skilled in the art to include the stated value and have a meaning prescribed by the context (e.g., the term includes at least the degree of error associated with measurement accuracy, tolerances associated with a particular value [e.g., manufacturing, assembly, use, etc.]). Such terms should also be considered to disclose a range defined by the absolute values of two endpoints. For example, an expression such as “about 2 to about 4” also discloses a range of “2 to 4.” Related terms may refer to a percentage added to or subtracted from the indicated value (e.g., 1%, 5%, 10%).
[0012] It should be understood that although some figures show hardware and software located within a particular device, these are for illustrative purposes only. Functions described in this invention as being performed by a single component can be performed by a plurality of components in a distributed manner. Similarly, functions performed by a plurality of components can be combined and performed by a single component. In some embodiments, the components shown can be combined or divided into separate software, firmware, and / or hardware. For example, logic and processing can be distributed among a plurality of electronic processors, rather than being located within a single electronic processor and performed by a single electronic processor. Regardless of how the hardware and software components are combined or divided, the hardware and software components can reside on the same computing device or can be distributed among different computing devices connected via one or more networks or other suitable communication links. Similarly, components described as performing specific functions can also perform additional functions not described in this invention. For example, a device or structure “configured” in a certain way is at least configured in that way, but can also be configured in a way not explicitly listed.
[0013] Other aspects of the embodiments will become apparent from a careful reading of the detailed description and accompanying drawings. Attached Figure Description
[0014] Figure 1 A modular ecosystem is shown according to some embodiments.
[0015] Figure 2A and 2B Modular electronic devices of a modular ecosystem according to some embodiments are shown.
[0016] Figure 3 According to some embodiments Figure 1 A block diagram of a modular electronic device.
[0017] Figure 4A It is a first CAN bus system according to some embodiments, including a linear CAN bus with branches.
[0018] Figure 4B It is a second CAN bus system according to some embodiments, including a linear CAN bus with a plurality of branches.
[0019] Figure 5A A first CAN bus termination scheme according to some embodiments is shown.
[0020] Figure 5B A second CAN bus termination scheme according to some embodiments is shown.
[0021] Figure 6 A communication interface circuit according to some embodiments is shown.
[0022] Figure 7 The following are examples of methods for inserting modules according to some embodiments. Figure 1 A flowchart illustrating methods for controlling internal module resistors within a modular ecosystem.
[0023] Figure 8A The diagram illustrates terminal configurations for a modular ecosystem according to some embodiments.
[0024] Figure 8B The following diagram illustrates the use of [method / mechanism] during insertion according to some embodiments. Figure 8A The timing diagram of the ecosystem interface interruption in the terminal configuration.
[0025] Figure 8C The following are illustrations of methods for use during extraction according to some embodiments. Figure 8A The timing diagram of the ecosystem interface interruption in the terminal configuration.
[0026] Figure 9 A flowchart is shown of a method for interrupting the ecosystem interface during device insertion, according to some embodiments.
[0027] Figure 10 A flowchart of a method for interrupting the ecosystem interface during device withdrawal, according to some embodiments, is shown.
[0028] Figure 11 The diagram illustrates the termination of power shutdown when two operating power systems are added to an ecosystem, according to some embodiments.
[0029] Figure 12A The diagram illustrates terminal configurations for a modular ecosystem according to some embodiments.
[0030] Figure 12B The following diagram illustrates the use of [method / mechanism] during insertion according to some embodiments. Figure 12A The timing diagram of the ecosystem interface interruption in the terminal configuration.
[0031] Figure 13A The diagram illustrates terminal configurations for a modular ecosystem according to some embodiments.
[0032] Figure 13B The following diagram illustrates the use of [method / mechanism] during insertion according to some embodiments. Figure 12A The timing diagram of the ecosystem interface interruption in the terminal configuration.
[0033] Figure 14 A pin diagram of a modular ecosystem according to some embodiments is shown.
[0034] Figure 15A A pinout diagram for a first modular ecosystem is shown according to some embodiments.
[0035] Figure 15B A pinout diagram for a second modular ecosystem is shown according to some embodiments.
[0036] Figure 15C A pinout diagram for a third modular ecosystem is shown according to some embodiments.
[0037] Figure 16A A first bidirectional converter according to some embodiments is shown.
[0038] Figure 16B A first modular ecosystem, including a first bidirectional converter module and a half-width module, is shown according to some embodiments.
[0039] Figure 16C A second modular ecosystem, comprising a first bidirectional converter module, a half-width module, and a core module, is shown according to some embodiments.
[0040] Figure 16DA third modular ecosystem, comprising a first bidirectional converter module, a half-width module, and a DC extension board, is shown according to some embodiments.
[0041] Figure 16E A fourth modular ecosystem, comprising a first bidirectional converter module, a half-width module, a core module, and a DC extension board, is illustrated according to some embodiments.
[0042] Figure 16F A fifth modular ecosystem, comprising a first bidirectional converter, a half-width module, and a core module, is illustrated according to some embodiments.
[0043] Figure 16G A sixth modular ecosystem, comprising a first bidirectional converter module, a half-width module, and a DC extension board, is shown according to some embodiments.
[0044] Figure 16H A seventh modular ecosystem, comprising a first bidirectional converter module, a half-width module, a core module, and a DC extension board, is illustrated according to some embodiments.
[0045] Figure 17A A core module according to some embodiments is shown.
[0046] Figure 17B An eighth modular ecosystem, including core modules and half-width modules, is shown according to some embodiments.
[0047] Figure 17C This illustrates a ninth modular ecosystem, including core modules and half-width modules, according to some embodiments.
[0048] Figure 17D This illustrates a tenth modular ecosystem, including core modules and half-width modules, according to some embodiments.
[0049] Figure 18A A pinout diagram for a fourth portable communications ecosystem is shown according to some embodiments.
[0050] Figure 18B A pinout diagram for a fifth portable communications ecosystem is shown according to some embodiments.
[0051] Figure 18C A pinout diagram for a sixth portable communications ecosystem is shown according to some embodiments.
[0052] Figure 19A A second bidirectional converter module according to some embodiments is shown.
[0053] Figure 19B An eleventh ecosystem, including a second bidirectional converter module and a half-width module, is shown according to some embodiments.
[0054] Figure 19C A twelfth ecosystem, comprising a second bidirectional converter module, a half-width module, and a core module, is shown according to some embodiments.
[0055] Figure 19D The thirteenth ecosystem, according to some embodiments, includes a second bidirectional converter module, a half-width module, and a DC (direct current) expansion board module.
[0056] Figure 19E The fourteenth ecosystem, according to some embodiments, includes a second bidirectional converter module, a half-width module, a core module, and a DC expansion board module.
[0057] Figure 19F The fifteenth ecosystem, comprising a second bidirectional converter module, a half-width module, and a core module, is shown according to some embodiments.
[0058] Figure 19G The sixteenth ecosystem, according to some embodiments, includes a second bidirectional converter module, a half-width module, and a DC expansion board module.
[0059] Figure 19H The seventeenth ecosystem, according to some embodiments, includes a second bidirectional converter module, a half-width module, a core module, and a DC expansion board module.
[0060] Figure 20A A core module according to some embodiments is shown.
[0061] Figure 20B An eighteenth ecosystem, including a core module and a half-width module, is shown according to some embodiments.
[0062] Figure 20C The nineteenth ecosystem, including a core module and a half-width module, is shown according to some embodiments.
[0063] Figure 20D The 20th ecosystem, including core modules and half-width modules, is shown according to some embodiments.
[0064] Figure 21A The twenty-first ecosystem, including core modules, half-width modules, and small core modules, is illustrated according to some embodiments.
[0065] Figure 21B A twenty-second ecosystem, including core modules, half-width modules, and small core modules, is shown according to some embodiments.
[0066] Figure 22A A pinout diagram for the seventh portable communications ecosystem is shown according to some embodiments.
[0067] Figure 22B A pinout diagram for an eighth portable communications ecosystem is shown according to some embodiments.
[0068] Figure 23 A flowchart illustrating an example method for connecting small core modules to a modular ecosystem, according to some embodiments, is shown.
[0069] Figure 24 A flowchart is shown, according to some embodiments, of a method for controlling internal module resistors when a module is inserted into a modular ecosystem. Detailed Implementation
[0070] The embodiments described in this utility model relate to CAN bus or similar communication for modular ecosystems.
[0071] Figure 1 An example of a modular ecosystem 100 is shown. The modular ecosystem 100 includes a plurality of modular electronic devices 110 electrically and physically connected together, for example, using modular mounting features and / or wires 120. The modular ecosystem 100 allows power transfer and communication between the various modular electronic devices 110. Communication can be performed using Controller Area Network (CAN) bus protocols. For example, communication can be performed using the Controller Area Network Flexible Data Rate (CAN-FD) protocol. As another example, communication can be performed using any multipoint communication requiring termination (e.g., RS485, Ethernet 10Base-T1S, etc.). The modular electronic devices 110 include, for example, a portable power supply 110A, a base plate 110B, a full-width module 110C (e.g., a power cell core of a battery cell), a plurality of half-width modules 110D (e.g., small cells of a battery cell), and a plurality of charging modules 110E for charging a battery pack 130. In one example, wires 120 may include cables that allow power transfer and CAN bus communication between the connected modular electronic devices 110. The wire 120 provides an alternative connection scheme (e.g., daisy chain) for connecting the modular electronic device 110.
[0072] Figure 2AAn example embodiment of a modular electronic device 110 (e.g., a portable power supply 110A) is shown. The portable power supply 110A includes a housing 200, for example, made of an impact-resistant polymer plastic material. The housing 200 can be manufactured using injection molding, 3D printing, or the like. The housing 200 includes a modular mounting feature 210 disposed on its top surface. A corresponding interlocking modular mounting feature may be disposed on the bottom surface of the housing 200, interlocking with a modular mounting feature 210 on the top of another modular electronic device 110. The portable power supply 110A also includes a power output unit 220 and a display 230. A power input unit may also be provided, including a plurality of electrical connection interfaces configured to receive power from an external power source. The external power source can be a DC power source or an AC power source. For example, the AC power source can be a conventional wall socket, such as a 120V or 240V socket common in North America.
[0073] The power output unit 220 includes one or more power outlets. In the illustrated embodiment, the power output unit 220 includes a plurality of AC power outlets 220A and DC power outlets 220B. It should be understood that the number of power outlets included in the power output unit 220 is not limited to... Figure 2A The power outlet shown is an example. For instance, the power output unit 220 may include more or fewer power outlets than those included in the illustrated embodiment of the portable power supply 110A.
[0074] The power output unit 220 can be configured to provide power from the internal power supply 240 to one or more peripheral devices (see [link]). Figure 3 The power output unit 220 can be configured to directly supply power from an external power source to one or more peripheral devices. These peripheral devices may be smartphones, tablets, laptops, portable music players, power tools, or power tool battery packs (e.g., battery pack 130 [see...]). Figure 1 (e.g., power tool battery chargers). Peripheral devices can be configured to receive DC and / or AC power from the power output unit 220.
[0075] Display 230 is configured to indicate to a user the status of portable power supply 110A, such as the charging status and / or fault condition of internal power supply 240. In some embodiments, display 230 includes one or more light-emitting diode (“LED”) indicators configured to illuminate and display the current charging status of internal power supply 240. In some embodiments, display 230 is, for example, a liquid crystal display (“LCD”), a light-emitting diode (“LED”) display, an organic LED (“OLED”) display, an electroluminescent display (“ELD”), a surface-conducting electron emitter display (“SED”), a field emission display (“FED”), a thin-film transistor (“TFT”) LCD, an electronic ink display, etc. In other embodiments, portable power supply 110A does not include a display.
[0076] Figure 2B An example embodiment of a modular electronic device 110 (e.g., base plate 110B) is shown. Base plate 110B may be made of stamped sheet metal or other durable materials and includes modular mounting features 210. Portable power supply 110A includes a controller 300 (see...). Figure 3 The active modular electronic device 110. The base plate 110B represents the passive modular electronic device 110, which may not include a controller, but still provides CAN bus communication capability for the modular electronic device 110 coupled to the base plate 110B.
[0077] Figure 3 This is a schematic diagram of a controller 300 for an active modular electronic device 110 (e.g., any one of modular electronic devices 110A, 110C, 110D, 110E). The controller 300 is electrically and / or communicatively connected to various modules or components of the modular electronic device 110. For example, the controller 300 is connected to a power output unit 220, a power supply 240, an edge detection and delay circuit 305, sensing logic 310, and a transceiver 315. The power supply 240 may include, for example, a removable battery pack 130, internal battery cells (e.g., non-removable) comprising stacked battery cells connected in series and / or parallel. The power output unit 220 may include an AC / DC output or charging interface for charging the battery pack 130.
[0078] The controller 300 includes a combination of hardware and software operable to control the operation of the modular electronic device 110. For example, the controller 300 particularly includes a processing unit 320 (e.g., a microprocessor, microcontroller, electronic processor, electronic controller, or other suitable programmable device), a memory 325, an input unit 330, and an output unit 335. The processing unit 320 particularly includes a control unit 340, an arithmetic logic unit (“ALU”) 345, and a plurality of registers 350 (in... Figure 3The processor 320 is shown as a set of registers and is implemented using a known computer architecture (e.g., a modified Harvard architecture, a von Neumann architecture, etc.). The processing unit 320, memory 325, input unit 330, and output unit 335, as well as various modules or circuits connected to the controller 300, are connected via one or more control and / or data buses (e.g., a common bus 355). For illustrative purposes, the processor 320 is shown as a set of registers and is implemented using a known computer architecture (e.g., a modified Harvard architecture, a von Neumann architecture, etc.). Figure 3 The control and / or data bus is roughly shown in the diagram. Although the controller 300 is... Figure 3 While shown as a single controller, controller 300 may also include a plurality of controllers configured to work together to achieve the desired level of control for the modular electronics 110. Therefore, any control functions and processes described in this invention with respect to controller 300 may also be performed by two or more controllers operating in a distributed manner.
[0079] Memory 325 is a non-transitory computer-readable medium, including, for example, a program storage area and a data storage area. The program storage area and data storage area may include combinations of different types of memory, such as ROM, RAM (e.g., DRAM, SDRAM, etc.), EEPROM, flash memory, hard disk, SD card, or other suitable magnetic, optical, physical, or electronic memory devices. Processing unit 320 is connected to memory 325 and configured to execute software instructions that can be stored in RAM of memory 325 (e.g., during execution), ROM of memory 325 (e.g., on a substantially permanent basis), or another non-transitory computer-readable medium (such as another memory or disk). Software included in the implementation of modular electronics 110 and controller 300 may be stored in memory 325 of controller 300. Software includes, for example, firmware, one or more applications, program data, filters, rules, one or more program modules, and other executable instructions. Controller 300 is configured to retrieve from memory 325 and execute instructions related to the control processes and methods described herein. In other embodiments, controller 300 includes additional, fewer, or different components.
[0080] The controller 300 facilitates power transfer and communication between the modular electronic devices 110 of the modular ecosystem 100. Additionally, the controller 300, or alternatively, the sensing logic 310, can determine when to activate a terminating resistor within the modular electronic device 110. In some examples, the sensing logic 310 can be implemented within the controller 300. The sensing logic 310 can be a microcontroller. This determination process will be described in detail below.
[0081] Transceiver 315 can send and receive data from modular electronics 110 to other devices. For example, transceiver 315 can allow controller 300 to communicate with other devices via a network or via a wired connection (e.g., via a CAN bus). Transceiver 315 can be a conventional CAN transceiver, a CAN transceiver with adjustable rise and fall times, or a CAN signal enhancement function (SIC) transceiver.
[0082] Figure 4A This is a first CAN bus system 400 comprising a linear CAN bus 410 and a branch 420. The linear CAN bus 410 and the branch 420 may consist of a pair of twisted pairs forming a characteristic impedance between them. For example, the impedance may be 120Ω. The linear CAN bus 410 may be made of a plurality of segments of the CAN bus, each segment including an internal module resistor 430. The internal module resistor 430 may be enabled (i.e., connected to the CAN bus) to provide a terminating resistor 430 at the end of the CAN bus system 400, and internal module resistors 430 not at the end may be disabled (e.g., disconnected from the CAN bus). Each CAN bus system 400 has at least two terminating resistors 430. In some embodiments, the terminating resistor 430 is enabled in the branch 420. For example, the branch 420 may be configured as part of a CAN bus system 500 in a modular electronic device 110, forming a link separate from the linear CAN bus 410. Reference will be made below. Figure 5A Please describe this example in detail.
[0083] Branch 420 can be a tributary of the linear CAN bus 410, allowing communication with modular electronics 110 that are not part of the linear set of modular electronics 110. Adding branch 420 can cause interference to the impedance of the CAN bus system 400, resulting in interrupt signals. To mitigate any interference, the impedance of branch 420 should be as high as possible. High impedance on branch 420 can be achieved by keeping the internal module resistor 430 of branch 420 open. However, if the length of branch 420 is too long, an open internal module resistor 430 can still cause impedance mismatch on the linear CAN bus 410. In this example, the maximum permissible length (Lmax) of branch 420 is a function of the data rate on the CAN bus system 400, the total length of the CAN bus system 400, the propagation delay of the wires, the transmitter / receiver propagation delay (e.g., that of transceiver 315), and the time quantum setting within controller 300. For example, for 500 kilobits per second (kbps) of data, the maximum permissible length of branch 420 (Lmax) could be 5 meters (m), and for 1 megabit per second (Mbps) of data, the maximum permissible length of branch 420 could be 1.6 m. As another example, the maximum permissible length of branch 420 (Lmax) could be one-third of the critical length of the transmission line (i.e., the length where the downlink and return propagation delays are equal to the signal transition times [the greater of the rise and fall times]).
[0084] Figure 4B This is a second CAN bus system 440 comprising a linear CAN bus 410 having multiple branches 420A, 420B, and 420C. Similar to the first CAN bus system 400, the second CAN bus system 440 includes two terminating resistors 430 located at the ends of the second CAN bus system 440 and an open-circuit internal module resistor 430 located between the two terminating resistors 430. In the current instance with multiple branches 420A, 420B, and 420C, the maximum cumulative branch length (Lcum) needs to be considered to mitigate any interference. The maximum cumulative branch length (Lcum) can be equal to the total length of each branch 420A, 420B, and 420C added together (Lcum = L1 + L2 + L3). An example of the maximum cumulative branch length (Lcum) for 500 kbps data is 25 m, and an example of the maximum cumulative branch length (Lcum) for 1 Mbps data is 8 m.
[0085] In some examples, CAN bus systems 400, 440 may extend beyond terminating resistor 430 for secondary modular electronics 110 without significantly extending the length of CAN bus systems 400, 440. The lengths of these wires can also be considered in signal analysis. For example, the length of the wires used for signal analysis beyond terminating resistor 430 may be half the distance between interfaces (e.g., the first and second connection interfaces of modular electronics 110).
[0086] Figure 5A A first CAN bus termination scheme 500 is illustrated. The first CAN bus termination scheme 500 may include a plurality of modular electronic devices 110 (e.g., power management unit modules 510A and 510B-510D) connected to a base plate 110B. Power management unit module 510A is, for example, a portable power supply 110A. Modules 510B-510D may be full-width modules 110C, half-width modules 110D, charging modules 110E, etc. Each module 510B-510D is stacked on either the power management unit module 510A or the base plate 110B. In the example shown, modules 510B-510D are half-width modules, where the first module 510B is stacked on the power management unit module 510A, and the second module 510C and the third module 510D are stacked on the base plate 110B.
[0087] At least one of modules 510B-510D may enable the terminating resistor 430. In this example, the first module 510B enables its internal module resistor 430 as a terminating resistor 430 because the first module 510B forms the terminating module of the main stack of the CAN bus system. The internal module resistors 430 of the second and third modules 510C, 510D remain open because these modules are connected as branches from the main stack of the CAN bus system.
[0088] Figure 5BA second CAN bus termination scheme 520 is illustrated. The second CAN bus termination scheme 520 may include a baseboard 110B, a power management unit module 510A, and modules 510B-510H. Modules 510B-510H may be a full-width module 110C, a half-width module 110D, a charging module 110E, etc. Each module 510B-510H is stacked on top of the power management unit module 510A, the baseboard 110B, or another module 510B-510H. In this example, the first module 510B is a full-width module, and modules 510C-510H are half-width modules. The first module 510B is stacked on top of the power management unit module 510A, and the second module 510C and the third module 510D are stacked on top of the first module 510B. The fourth module 510E, the fifth module 510F, and the sixth module 510G are stacked on the base plate 110B, and the seventh module 510H is stacked on the fourth module 510E.
[0089] In the example shown, the power management unit module 510A includes a U-shaped CAN bus 530 to form a stack separate from the main CAN bus 540. In this example, the base plate 110B and the power management unit module 510A enable the internal module resistor 430 to terminate the main CAN bus 540. The second module 510C and the third module 510D enable the internal module resistor 430 to terminate the U-shaped CAN bus 530.
[0090] Figure 6 A terminal configuration 600 of a modular electronic device 110 is shown. The terminal configuration 600 includes a first communication interface 610, a second communication interface 620, a CAN bus 630, sensing logic circuitry 310, and internal module resistors 430. The first communication interface 610 includes five pins (or terminals): CAN+ pin, CAN- pin, Configuration Module Input (CMI) pin, Configuration Module Output (CMO) pin, and Configuration Module Stack (CMS) pin. The first interface 610 can be a bottom interface electrically and mechanically connected to another modular electronic device 110 physically located below the modular electronic device 110. The second interface 620 includes five pins (or terminals): CAN+, CAN-, CMO pin, CMI pin, and CMS pin. The second interface 610 can be a top interface electrically and mechanically connected to a modular electronic device 110 physically located above the modular electronic device 110. The pins of the first interface 610 and the second interface 620 can be connected to a controller of the modular electronic device 110 (e.g., controller 300). The CMS pin of the first interface 610 can be directly connected to the CMS pin of the second interface 620.
[0091] Sensing logic circuitry 310 is connected to first interface 610 and second interface 610 to control (i.e., enable / disable) internal module resistor 430. As described above, when module electronics 110 is a terminal device in the CAN bus system, terminating resistor 430 should be enabled, and when module electronics 110 is not part of a terminal device or branch of the CAN bus system, terminating resistor 430 should be disabled. Sensing logic circuitry 310 can be used to detect the location of module electronics 110 in modular ecosystem 100 and control internal module resistor 430 accordingly. In one example, sensing logic circuitry 310 includes an AND gate that enables terminating resistor 430 based on detection in at least one CMI pin, as shown in Table 1 below.
[0092] Table 1 In another example, the sensing logic circuit 310 includes a NAND gate that enables the terminating resistor 430 when one and only one of the two CMI pins is active. When only one CMI pin is active, the modular electronics 110 is a terminating device, and therefore, the internal module resistor 430 should be enabled. The sensing logic circuit 310 may include a NOT gate to disable the internal module resistor 430 when CMS is active. When CMS (i.e., pass-through) is active or both CMI pins are active simultaneously, the modular electronics 110 is not a terminating module, and therefore, the internal module resistor 430 should be disabled. The sensing logic circuit 310 may include additional logic circuitry to control the internal module resistor 430 based on the location of the modular electronics 110 within the modular ecosystem 100.
[0093] Figure 7 A flowchart of a method 700 for enabling the internal module resistor 430 of modular electronics 110 when a new modular electronics device is inserted into modular ecosystem 100 is shown. Although the illustrated method 700 includes specific steps, not all steps need to be performed or need to be performed in the order presented. Method 700 may be performed by modular electronics 110 (e.g., sensor logic circuitry 310 of modular electronics 110).
[0094] Method 700 includes receiving input from communication interfaces 610, 620 using sensing logic circuitry 310 (step 710). As described above, the CMI pin, CMO pin, and CMS pin of communication interfaces 610, 620 are electrically connected to sensing logic circuitry 310. Sensing logic circuitry 310 senses signals (e.g., voltage signals and / or current signals) on the communication pins CMI and CMS of communication interfaces 610, 620. Sensing logic circuitry 310 can also provide input to controller 300.
[0095] Method 700 includes using sensing logic circuitry 310 to determine whether modular electronics 110 is part of the main stack or detached from the main stack (step 720). Sensing logic circuitry 310 may determine whether modular electronics 110 is part of the main stack or detached from the main stack based on input data from the CMI and CMS pins. For example, sensing logic circuitry 310 may determine whether modular electronics 110 is located at the end or middle of the CAN bus stack based on inputs from the CMI and CMS pins. Sensing logic circuitry 310 may receive logic information (high / low inputs) from other modular electronics 110 via the CMI and CMS pins. When sensing logic circuitry 310 determines that modular electronics 110 is part of the main stack (the main stack at determination step 720), method 700 continues to determination step 730. When sensing logic circuitry 310 determines that modular electronics 110 is detached from the main stack (detached from the main stack at determination step 720), method 700 continues to determination step 760.
[0096] Method 700 includes using sensing logic circuitry 310 to determine whether modular electronic device 110 is a terminal module (determination step 730). Sensing logic circuitry 310 can determine whether a module is a terminal module based on input data from a CMI pin. For example, sensing logic circuitry 310 can sense that only one of the CMI pins of communication interfaces 610, 620 is active (i.e., high). When only one CMI pin of communication interfaces 610, 620 is active, sensing logic circuitry 310 can determine that no module exists above modular electronic device 110. As another example, sensing logic circuitry 310 can sense that a CMS pin is currently high. When sensing logic circuitry 310 determines that modular electronic device 110 is a terminal module (yes at determination step 730), method 700 continues to step 740. When sensing logic circuitry 310 determines that modular electronic device 110 is not a terminal module (no at determination step 730), method 700 continues to step 750.
[0097] Method 700 includes enabling the internal module resistor 430 using sensing logic circuitry 310 (step 740). As described above, the internal module resistor 430 is enabled on the CAN bus. The sensing logic circuitry 310 of the modular electronics 110 can enable the terminating resistor 430 by providing a switch between the CAN+ and CAN- pins in the internal module resistor 430. For example, a latching relay, photoMOSFET, microswitch, or reed switch can connect and disconnect the internal module resistor 430 to the CAN bus. The latching relay can allow the internal module resistor 430 to remain connected when the module is in sleep or standby mode by allowing the module with the terminating resistor 430 to maintain a low quiescent current state when other modules are communicating via the CAN bus.
[0098] The internal module resistor 430 can be enabled when the modular electronic device 110 is part of the main stack and there are no other modules above it, or there are modules above it but no modules below it. The internal module resistor 430 will be disabled when the modular electronic device 110 is part of the main stack and there are modules above and below it.
[0099] Method 700 includes disabling the internal module resistor 430 using sensing logic circuitry 310 (step 750). Based on the module's location in the stack, sensing logic circuitry 310 determines that the internal module resistor 430 is disabled and allows the CAN bus to remain disconnected via modular electronics 110. For example, sensing logic circuitry 310 may configure the internal module resistor 430 to be in the off position.
[0100] Method 700 includes using sensing logic circuitry to determine whether module 754 is furthest from the main stack (determination step 760). Sensing logic circuitry 310 can sense whether the modular electronic device is an end device outside the main stack, similar to what is described in step 730. When sensing logic circuitry 310 determines that modular electronic device 110 is an end module (yes at determination step 760), method 700 continues to step 740. When sensing logic circuitry 310 determines that the modular electronic device is not an end module (no at determination step 760), method 700 continues to step 750.
[0101] Method 700 is an example method (e.g., a direct method) for managing internal module resistors 430. See below for reference. Figure 24 Describe another example method (e.g., an indirect method) for managing the internal module resistor 430.
[0102] Each time a modular electronic device 110 is added to or removed from the modular ecosystem 100, the CAN bus may need to be reconfigured. Additionally, if the modular electronic device 110 is being hot-swapped, a reliable method for shutting down the terminal may be required. Figure 8A A terminal configuration 800 for generating a global system interrupt is shown. This terminal configuration 800 is described in terms of the connection between a first modular electronic device 805A (e.g., any one of the modular electronic devices 110) and a second modular electronic device 805B (e.g., any one of the modular electronic devices 110).
[0103] The first modular electronic device 805A includes a low-voltage power supply (LVPS) terminal 810, a global system interrupt (GSI) terminal 815, and an interface edge detection (IED) terminal 820. The LVPS terminal 810 can provide or receive low-voltage power, for example, to power corresponding low-power electronic components of the first modular electronic device 805A (e.g., controller 300, sense logic circuit 310, etc.). The GSI terminal 815 and the IED terminal 820 output logic high signals to their respective pins. The second modular electronic device 805B includes a low-voltage power supply (LVPS) pin 825, a global system interrupt (GSI) pin 830, and an interface edge detection (IED) pin 835. The LVPS pin 825 can provide or receive low-voltage power, for example, to power corresponding low-power electronic components of the second modular electronic device 805B (e.g., controller 300, sense logic circuit 310, etc.). The GSI pin 830 and the IED pin 835 receive signals from the GSI terminal 815 and the IED terminal 820, respectively. Interrupt circuit 840 is connected to GSI pin 830 and IED pin 835. Interrupt circuit 840 includes edge detection circuit 840A, timer circuit 840B, and transistor switch 840C. Edge detection circuit 840A detects an edge signal (e.g., a low-to-high edge) at IED pin 835 and outputs a high signal to transistor switch 840C when an edge is detected. Timer circuit 840B blocks the output signal from edge detection circuit 840A after a predetermined time. When edge detection circuit 840A is turned on, transistor switch 840C connects GSI pin 830 to ground, thereby pulling the GSI pin low.
[0104] The lengths of LVPS pin 825 and GSI pin 830 can be equal and greater than the length of IED pin 835. The staggered pin lengths generate a reliable global system interrupt signal when they contact the corresponding terminals 815 and 820. (Reference) Figure 8BIn timing diagram 850, when the second modular electronic device 805B is connected to the modular ecosystem 100, LVPS pin 825 and GSI pin 830 are the first pins in contact with the LVPS terminal 810 and GSI terminal 815 of the first modular electronic device 805A. When the LVPS signal 855 is pulled high, a low-voltage power supply from the first modular electronic device 805A to the second modular electronic device 805B is established at t0. Also at t0, the GSI signal 860 is high (i.e., the first edge signal) due to the contact between the GSI pin 830 and the GSI terminal 815. At t1, the IED pin 835 contacts the IED terminal 820, thereby generating an edge signal (low to high) for the IED signal 865. At t1, the interrupt circuit 840 detects the edge signal at the IED pin 835 and momentarily (e.g., from t1 to t2) pulls the GSI signal 860 low (i.e., the second edge signal). At t2, the GSI signal 860 rises again after a predetermined time (i.e., the third edge signal).
[0105] Figure 8C illustrates the timing diagram 870 during the extraction process, where the first modular electronics 805A and the second modular electronics 805b are disconnected. The LVPS signal 855 and the GSI signal 860 remain high until t3. At t3, the IED pin 835 is disconnected from the IED terminal 820, resulting in a high-to-low edge signal at the IED pin 835. An interrupt circuit 840 momentarily (e.g., from t3 to t4) pulls the GSI signal 860 low (i.e., the fourth edge signal). At t4, the GSI signal 860 rises again after a predetermined time (i.e., the fifth edge signal). At t5, the second modular electronics 805B is completely extracted from the first modular electronics 805A, and the LVPS signal 855 and the GSI signal 860 go low (i.e., the sixth edge signal). The edge signal at the GSI pin 830 provides a global interrupt via the CAN bus to indicate the connection or disconnection of a new module. This interrupt signal triggers a reconfiguration of the CAN bus within the ecosystem. By introducing the IED pin, additional functions such as hot-plugging can be enabled in addition to CAN bus reconfiguration.
[0106] Figure 9 A flowchart of an example method 900 for interrupting the ecosystem interface during module insertion is shown. Although the illustrated method 900 includes specific steps, not all steps need to be performed or need to be performed in the order presented. In some embodiments, method 900 is performed by a second modular electronic device 805B.
[0107] Method 900 includes providing a first edge signal to the ecosystem interface in response to a GSI pin 830 of the first module (e.g., the second modular electronic device 805B) contacting a corresponding GSI terminal 815 of the second module (e.g., the first modular electronic device 805A) (step 910). As described above, when the GSI pin contacts the GSI terminal 815, the GSI pin 830 provides a first edge signal indicating connection to the CAN bus system.
[0108] Method 900 includes using interrupt circuit 840 to determine that the IED pin 835 of the first module is contacting the corresponding IED terminal 820 of the second module (step 920). Interrupt circuit 840 is electrically coupled to IED pin 835. Method 900 includes providing a second edge signal to the ecosystem interface (step 930). Interrupt circuit 840 senses the edge signal on IED pin 835 and turns on transistor switch 840C to pull the GSI pin low.
[0109] Method 900 includes providing a third edge signal to the ecosystem interface after a predetermined time (step 940). Interrupt circuit 840 turns off transistor switch 840C after the predetermined time, thereby pulling the GSI pin high.
[0110] Figure 10 A flowchart of a method 1000 for interrupting the ecosystem interface during module extraction is shown. Although the illustrated method 1000 includes specific steps, not all steps need to be performed or need to be performed in the order presented. In some embodiments, method 1000 is performed by a second modular electronic device 805B.
[0111] Method 1000 includes using interrupt circuit 840 to determine that the IED pin 835 of the first module is not in contact with the IED terminal 820 of the second module (step 1010). Interrupt circuit 840 senses an edge signal at the IED pin. Method 1000 includes providing a fourth edge signal to the ecosystem interface in response to step 1010 (step 1020). Interrupt circuit 840 turns on transistor switch 840C to pull the GSI pin 830 low.
[0112] Method 1000 includes providing a fifth edge signal to the ecosystem interface after a predetermined time (step 1030). Interrupt circuit 840 turns off transistor switch 840C after the predetermined time, thereby pulling GSI pin 830 high. Method 1000 also includes providing a sixth edge signal to the ecosystem interface in response to the disconnection of GSI pin 830 of the first module from GSI terminal 815 of the second module.
[0113] Figure 11The diagram illustrates that when two operating power systems are connected (i.e., hot-swapped or hot-swapped) to the modular ecosystem 100, the terminal power is turned off. Ecosystem 100 includes a first battery cell 1100A coupled to a second battery cell 1100B. An electric arc may occur between the devices when a user wishes to connect the first battery cell 1100A to the second battery cell 1100B while both are running.
[0114] Figure 12A A terminal configuration 1200 for shutting down the terminal during hot-plugging is shown. The terminal configuration 1200 is described in connection with a first modular electronic device 1205A (e.g., any one of the modular electronic devices 110) and a second modular electronic device 1205B (e.g., any one of the modular electronic devices 110).
[0115] The first modular electronic device 1205A includes a ground terminal 1210, a positive power supply terminal 1215, an LVPS terminal 810, a GSI terminal 815, and an IED terminal 820. The ground terminal 1210 and the positive power supply terminal 1215 receive power from a first battery cell (V1) 1220, which can be activated and deactivated using a first logic circuit 1225.
[0116] The second modular electronic device 1205B includes a ground pin 1230, a positive power supply pin (B+) 1235, an LVPS pin 825, a GSI pin 830, and an IED pin 835. The ground pin 1230 and the positive power supply pin 1235 receive power from a second battery cell (V2) 1240, which can be activated and deactivated using a second logic circuit 1245. The GND pin 1230 may be longer than the other pins, and the B+ pin 1235 may be shorter than the other pins. The LVPS pin 825 and the GSI pin 830 may be of equal length, shorter than the GND pin 1230, and longer than the B+ pin 1235 and the IED pin 835. The GND pin 1230 may be the longest, making it the first pin contacted when coupling the second modular electronic device 1205B to the first modular electronic device 1205A, to mitigate electrostatic discharge. The GSI pin 830 and the IED pin 835 generate global system interrupts, as described above. Figures 8A-8C As stated above.
[0117] Ecosystem 100 can perform a quick-action shutdown to prevent arching issues between power terminals during insertion and withdrawal between the first modular electronic device 1205A and the second modular electronic device 1205B. (Reference) Figure 12BIn the timing diagram 1250, the V2 battery signal 1255, LVPS signal 855, and GSI signal 860 begin at a high level. The GND signal 1260 remains low. At t0, the GND pin 1230 contacts the ground terminal 1210. The LVPS signal 855 and GSI signal 860 remain high on the second modular electronics 1205B because the second modular electronics 1205B is operating modules (e.g., they are charging / discharging). At t3, the second logic circuit 1245 detects the subsequent edge signal of the GSI signal 860. At t4, the second logic circuit 1245 turns off the FET associated with the second battery cell 1240 in the second modular electronics 1205B, and the V2 battery signal 1255 goes low. In some embodiments, at t4, the first logic circuit 1225 may also turn off the first battery cell 1220. Once the voltage from the second modular electronic device 1205B is disconnected (i.e., the V2 battery signal 1255 is low), the second modular electronic device 1205B can be connected to the first module 1102 without any abnormalities at t5.
[0118] In addition to power-off interruption to prevent arcing issues between power terminals and ecosystem reconfiguration, global system interrupts can also be used for fault notification. Fault notification can be an edge-triggered signal (e.g., detected by interrupt circuit 840), which is the fastest way to notify the module controller (e.g., controller 300) that a fault event has occurred and may require action. For example, a GSI pin (e.g., GSI pin 830) can be paired with an accelerometer reading (e.g., integrated into modular electronics 110) to indicate that a trailer or vehicle accident has occurred. As another example, when the battery is short-circuited due to an external power cable being cut, the GSI signal (e.g., GSI signal 860) can remain low for a longer duration than when ecosystem reconfiguration is present. Using GSI pin 830 and GSI signal 860 to notify of a fault is operationally faster than relying on CAN bus communication because the priority of fault notification is not delayed by other data transmitted on the CAN bus.
[0119] Figure 13A This illustrates a combination of terminal configuration 600 ( Figure 6 (as shown) and terminal configuration 1200 ( Figure 12A The complete terminal configuration 1300 of the modular ecosystem 100 (shown in the diagram) is described in terms of the connection between a first modular electronic device 1305A (e.g., any one of the modular electronic devices 110) and a second modular electronic device 1305B (e.g., any one of the modular electronic devices 110).
[0120] Figure 13BTiming diagram 1305 illustrates the reconfiguration of the CAN bus based on terminal configuration 1300. At t3, the reconfiguration of the CAN bus system is triggered based on the rising edge signal detected at GSI signal 860. Sensing logic circuitry 310 can detect the rising edge at GSI signal 860 and trigger the reconfiguration of the CAN bus system.
[0121] The above example provides protection against arcing when two power components (e.g., battery cells, bidirectional converters, etc.) are connected together. In other examples, arcing can be prevented by detecting the type of device being connected and providing terminals that implement specific connections for certain types of modular electronics 110. In one example, a bidirectional converter might need to be connected only as the top of the stack or only as the bottom of the stack. Figure 14 A pinout 1400 for implementing connectivity in the modular ecosystem 100 is shown. The pins include a half-width module presence pin 1410, a half-width module detection pin 1420, a bidirectional converter or power chip presence pin 1430, a bidirectional converter or power chip detection pin 1440, a backplane / wallplate presence pin 1450, and a backplane / wallplate detection pin 1460.
[0122] The pin can be at least one of a single electrical connector, a magnetic rod, a reed switch, a mechanical plunger, a micro switch, a ferromagnetic rod, and a magnetically biased reed switch. When the first module has a magnetic rod, the second module can have one of a normally open read switch and a normally closed reed switch. When the first module has a mechanical plunger, the second module can have one of a normally open micro switch and a normally closed micro switch. When the first module has a ferromagnetic rod, the second module can have a magnetically biased normally open reed switch.
[0123] The pins can be connected to the inputs of the controller (e.g., controller 300) on the monitoring pins. Presence pins (e.g., half-width module presence pin 1410, bidirectional converter or power supply presence pin 1430, backplane / wallplate presence pin 1450) can be grounded. In other words, the pins are unidirectional, and two modules require two pins to detect each other.
[0124] Figure 15A A pinout diagram for a first modular ecosystem 1500 is shown. The first modular ecosystem 1500 includes two half-width modules 1505 (e.g., small cores), a first core module 1510A, and a second core module 1510B. The half-width modules 1510 and the core module 1510 are, for example, modular electronic devices 110. The modules are stacked on top of each other and include pins from a first pinout diagram 1400. Each module may include one or two terminating resistors (e.g., terminating resistor 430).
[0125] The bottom interface of the half-width module 1505 may include a half-width module presence pin 1410 located at the downward interface. The top interface of the core module 1510 may include a bidirectional converter or power supply core presence pin 1430, a half-width module detection pin 1420, and a bidirectional converter or power supply core detection pin 1440 on the upper left interface, and a half-width module detection pin 1420 on the upper right interface. The bottom interface of the core module 1510 may include a bidirectional converter or power supply core detection pin 1440 and a bidirectional converter or power supply core presence pin 1430 on the lower left interface.
[0126] Half-width module detection pin 1420 allows the bidirectional converter and power chip (i.e., chip module 1510) to determine whether one or two half-width modules 1505 are provided on the bidirectional converter and / or power chip (i.e., chip module 1510). Bidirectional converter or power chip presence pin 1430 and bidirectional converter or power chip detection pin 1440 allow the bidirectional converter and power chip (i.e., chip module 1510) to determine their position within the full-width stack. For example, bidirectional converter or power chip presence pin 1430 and bidirectional converter or power chip detection pin 1440 provide inputs to controller 300, which uses these inputs to determine the position of chip module 1510 within the full-width stack.
[0127] Figure 15B A pinout diagram for a second modular ecosystem 1515 is shown. The second modular ecosystem 1515 includes two half-width modules 1505, a bidirectional converter module 1520, and a core module 1510. The bidirectional converter module 1520 can be a portable power supply 110A. In one example, the bidirectional converter module 1520 includes a bidirectional power converter that includes any combination of AC to DC, DC to DC, and DC to AC. The modules are stacked on top of each other and include pins from the first pinout diagram 1400.
[0128] The top interface of the bidirectional converter module 1520 may include a half-width module detection pin 1420 located at the upper left interface and a half-width module detection pin 1420 located at the upper right interface. The bottom interface of the bidirectional converter module 1520 may include a bidirectional converter or power chip detection pin 1440 and a bidirectional converter or power chip presence pin 1430 located at the lower left interface. The side interface of the bidirectional converter module 1520 may include a bottom plate / wall plate detection pin 1460 located at the board interface. The bottom plate / wall plate detection pin 1460 may be monitored by the controller 300 of the bidirectional converter module 1520.
[0129] Figure 15CA pinout diagram of the third modular ecosystem 1525 is shown. The third modular ecosystem 1525 includes a bidirectional converter module 1520 and two DC expansion board modules 1530. The DC expansion board modules 1530 can be a base plate 110B or a wall plate. The modules can be arranged adjacent to each other and include pins from the first pinout diagram 1400. For example, when the DC expansion board modules 1530 are base plates, the modules are arranged adjacent to each other on the ground. When the DC expansion modules 1530 are wall plates, the bidirectional converter module 1520 can be arranged adjacent to a wall, and the wall plate can be mounted to a wall.
[0130] The first-side interface of the DC expansion board module 1530 may include a baseboard / wallboard detection pin 1460 on a daisy-chain interface. The second-side interface of the DC expansion board module 1530 may include a baseboard / wallboard presence pin 1450 on a stack interface. The baseboard / wallboard detection pin 1460 may act as a switch to disconnect the terminating resistor of the DC expansion board module 1530 when the baseboard / wallboard presence pin 1450 is inserted into the baseboard / wallboard detection pin 1460.
[0131] Figure 16A A first bidirectional converter module 1600 is shown. The first bidirectional converter module 1600 may be a top stacked module, above which only half-width modules are allowed to be stacked. The first bidirectional converter module 1600 may include two terminating resistors that are disconnected when no module is connected and then connected when the first bidirectional converter module 1600 is coupled to another module. Similar to the bidirectional converter module 1520 of Figure 15B, the first bidirectional converter module 1600 includes a top interface with upper left and upper right interfaces, a bottom interface with lower left interface, and a side interface with a board interface.
[0132] Figure 16B A first ecosystem 1605 is shown, comprising a first bidirectional converter module 1600 and a half-width module 1610. As described above, the first bidirectional converter module 1600 includes two enabled terminating resistors 1615 because the first bidirectional converter module 1600 is connected to the half-width module 1610. The half-width modules 1610 are stacked on top of the first bidirectional converter module 1600, such that the top interface of the first bidirectional converter module 1600 is electrically connected to the bottom interfaces of the two half-width modules 1610. Similar to... Figure 15AThe half-width modules 1505 and 1610 include a downward interface. The CAN bus extends from the first half-width module 1610 via its downward interface, through the upper left interface of the first bidirectional converter module 1600, and then via the downward interface and the upper right interface of the first bidirectional converter module 1600 to the second half-width module 1610. Because the length of the CAN bus within the half-width module 1610 is reduced, only the terminating resistor 1615 of the first bidirectional converter module 1600 is enabled.
[0133] Figure 16C A second ecosystem 1625 is shown, comprising a first bidirectional converter module 1600, a half-width module 1610, and a core module 1620. The first bidirectional converter module 1600 connects to the core module 1620 at a bottom interface, except that it connects to the half-width module 1610 at a top interface. Similar to... Figure 15A The core module 1510 and core module 1620 include a top interface and a bottom interface. The top interface includes an upward left interface and an upward right interface, and the bottom interface includes a downward left interface.
[0134] The CAN bus extends from the first half-width module 1610 via its downward interface and the upward left interface of the first bidirectional converter module 1600, then extends to the second half-width module 1610 via its downward interface and the upward right interface of the first bidirectional converter module 1600. The CAN bus also extends from the first bidirectional converter module 1600 to the core module 1620 via the downward left interface of the first bidirectional converter module 1600 and the upward left interface of the core module 1620.
[0135] The first bidirectional converter module 1600 and the core module 1620 each enable a terminating resistor 1615. For example, when the first bidirectional converter module 1600 and the single core module 1620 are connected together without a DC expansion board and with zero to two half-width modules 1610, the first bidirectional converter module 1600 and the core module 1620 each enable a terminating resistor 1615.
[0136] Figure 16D A third modular ecosystem 1630 is shown, comprising a first bidirectional converter module 1600, a half-width module 1610, and a DC expansion board module 1635. The first bidirectional converter module 1600 connects to the half-width module 1610 at a top interface and to the DC expansion board module 1635 at a side interface. Similar to... Figure 15CDC expansion board module 1530 and DC expansion board module 1635 have a first side interface including a daisy-chain interface and a second side interface including a stacking interface.
[0137] The CAN bus extends from the first half-width module 1610 via its downward interface and the upward left interface of the first bidirectional converter module 1600, then extends to the second half-width module 1610 via its downward interface and the upward right interface of the first bidirectional converter module 1600. The CAN bus also extends from the first bidirectional converter module 1600 to the DC expansion board module 1635 via the board interface of the first bidirectional converter module 1600 and the stacking interface of the DC expansion board module 1635.
[0138] The first bidirectional converter module 1600 and the DC expansion board module 1635 each enable a terminating resistor 1615. For example, when the first bidirectional converter module 1600 and the single DC expansion board module 1635 are connected together without utilizing the core module 1620 and using zero to two half-width modules 1610, the first bidirectional converter module 1600 and the DC expansion board module 1635 each enable a terminating resistor 1615.
[0139] Figure 16E A fourth modular ecosystem 1640 is shown, comprising a first bidirectional converter module 1600, a half-width module 1610, a core module 1620, and a DC expansion board module 1635.
[0140] The CAN bus extends from the first half-width module 1610 via its downward interface and the upward left interface of the first bidirectional converter module 1600, then extends to the second half-width module 1610 via its downward interface and the upward right interface of the first bidirectional converter module 1600. The CAN bus also extends from the first bidirectional converter module 1600 to the DC expansion board module 1635 via its board interface and the stacking interface of the DC expansion board module 1635, and extends to the core module 1620 via its upward left interface.
[0141] The core module 1620 and the DC expansion board module 1635 each enable a terminating resistor 1615. For example, when both the core module 1620 and the DC expansion board module 1635 are connected to the first bidirectional converter module 1600 using zero to two half-width modules, the core module 1620 and the DC expansion board module 1635 each enable a terminating resistor 1615.
[0142] Figure 16FThe fifth modular ecosystem 1645 is shown, which includes a first bidirectional converter module 1600, a half-width module 1610, and a core module 1620.
[0143] The CAN bus extends from the first half-width module 1610 via its downward interface and the upward left interface of the first bidirectional converter module 1600, then extends to the second half-width module 1610 via its downward interface and the upward right interface of the first bidirectional converter module 1600. The CAN bus also extends from the first bidirectional converter module 1600 to the core module 1620 via the downward left interface of the first bidirectional converter module 1600 and the upward left interface of the core module 1620. The CAN bus further extends from the first core module 1620 to the second core module 1620 via the downward left interface of the first core module 1620 and the upward left interface of the second core module 1620.
[0144] The first bidirectional converter module 1600 and the second core module 1620 each enable a terminating resistor 1615. For example, when the first bidirectional converter module 1600 and two or more core modules 1620 are connected together using zero to two half-width modules instead of a DC expansion board module, the first bidirectional converter module 1600 and the bottommost core module 1620 each enable a terminating resistor 1615.
[0145] Figure 16G The sixth modular ecosystem 1360 is shown, which includes a first bidirectional converter module 1600, a half-width module 1610, and a DC expansion board module 1635.
[0146] The CAN bus extends from the first half-width module 1610 via its downward interface and the upward left interface of the first bidirectional converter module 1600, then extends to the second half-width module 1610 via its downward interface and the upward right interface of the first bidirectional converter module 1600. The CAN bus also extends from the first bidirectional converter module 1600 to the first DC expansion board module 1635 via its board interface and the stacking interface of the first DC expansion board module 1635. The CAN bus further extends from the first DC expansion board module 1635 to the second DC expansion board module 1635 via the daisy-chain interface of the first DC expansion board module 1635 and the stacking interface of the second DC expansion board module 1635.
[0147] The first bidirectional converter module 1600 and the second DC expansion board module 1635 each enable a terminating resistor. For example, when the first bidirectional converter module 1600 and two or more DC expansion board modules 1635 are connected together using zero to two half-width modules, the first bidirectional converter module 1600 and the DC expansion board module 1635 furthest from the first bidirectional converter module 1600 each enable a terminating resistor.
[0148] Figure 16H The seventh modular ecosystem 1670 is shown, which includes a first bidirectional converter module 1600, a half-width module 1610, a core module 1620, and a DC expansion board module 1635.
[0149] The CAN bus extends from the first half-width module 1610 via its downward interface and the upward left interface of the first bidirectional converter module 1600, then extends to the second half-width module 1610 via its downward interface and the upward right interface of the first bidirectional converter module 1600. The CAN bus also extends from the first bidirectional converter module 1600 to the first core module 1620 via its downward left interface and the upward left interface of the first core module 1620, then extends to the second core module 1620 via its downward left interface and the upward left interface of the second core module 1620. The CAN bus further extends from the first bidirectional converter module 1600 to the first DC expansion board module 1635 via its board interface and the stacking interface of the first DC expansion board module 1635. Furthermore, the CAN bus extends from the first DC expansion board module 1635 to the second DC expansion board module 1635 via the daisy-chain interface of the first DC expansion board module 1635 and the stacking interface of the second DC expansion board module 1635.
[0150] The second core module 1620 and the second DC expansion board module 1635 each enable a terminating resistor. For example, when the first bidirectional converter module 1600, two or more core modules 1620, and two or more DC expansion board modules 1635 are connected together using zero to two half-width modules, only the bottommost core module 1620 and the DC expansion board module 1635 furthest from the first bidirectional converter module 1600 each enable a terminating resistor.
[0151] Table 2 below summarizes the information used for Figures 16A-16HThe CAN bus terminating resistor rules for the modules. In particular, the first bidirectional converter module 1600 is the top module in the stack, and the CAN bus terminating resistor rules in Table 2 only apply when the first bidirectional converter module 1600 is on top of the module stack other than the half-width module 1610.
[0152] Table 2 Figure 17A Core module 1700 is shown. Core module 1700 may include two terminating resistors that are disconnected when nothing is connected and then connected once core module 1700 is coupled to another module. Similar to... Figure 15A The core module 1510 and core module 1700 include a top interface with an upward left interface and an upward right interface, and a bottom interface with a downward left interface.
[0153] Figure 17B An eighth modular ecosystem 1710 is shown, comprising a core module 1700 and a half-width module 1720. As described above, the core module 1700 includes two enabled terminating resistors 1715 because the core module 1700 is connected to the half-width module 1720. The half-width modules 1720 are stacked on top of the core module 1700, which allows the top interface of the core module 1700 to be electrically connected to the bottom interfaces of the two half-width modules 1720. Similar to... Figure 15A The half-width module 1505 and half-width module 1720 include a downward interface. The CAN bus extends from the first half-width module 1720 through the downward interface of the first half-width module 1720 and through the upward left interface of the core module 1700 to the second half-width module 1720, and then through the downward interface of the second half-width module 1720 and the upward right interface of the core module 1700 to the second half-width module 1720.
[0154] Figure 17C A ninth modular ecosystem 1730 is shown, comprising a core module 1700 and a half-width module 1720. In particular, the ninth modular ecosystem 1730 includes two core modules 1700. In addition to being connected to the half-width module 1720 at a top interface, the first core module 1700 is connected to the second core module 1700 at a bottom interface.
[0155] The CAN bus extends from the first half-width module 1720 via its downward interface and the upward left interface of the first core module 1700, then extends to the second half-width module 1720 via its downward interface and the upward right interface of the first core module 1700. The CAN bus also extends from the first core module 1700 to the second core module 1700 via the downward left interface of the first core module 1700 and the upward left interface of the second core module 1700.
[0156] The first core module 1700 and the second core module 1700 each enable a terminating resistor 1715. For example, when the two core modules do not utilize a DC expansion board and are connected together using zero to two half-width modules, each core module 1700 enables a terminating resistor 1715.
[0157] Figure 17D A tenth modular ecosystem 1750 is shown, comprising a core module 1700 and a half-width module 1720. Specifically, the tenth modular ecosystem 1750 includes three core modules 1700. In addition to connecting to the half-width module 1720 at a top interface, the first core module 1700 connects to the second core module 1700 at a bottom interface. The second core module 1700 connects to the third core module 1700 at a bottom interface.
[0158] The CAN bus extends from the first half-width module 1720 via its downward interface and the upward left interface of the first core module 1700, then extends to the second half-width module 1720 via its downward interface and the upward right interface of the first core module 1700. The CAN bus also extends from the first core module 1700 to the second core module 1700 via its downward left interface and the upward left interface of the second core module 1700. Furthermore, the CAN bus extends from the second core module 1700 to the third core module 1700 via its downward left interface and the upward left interface of the third core module 1700.
[0159] The first core module 1700 and the third core module 1700 each enable a terminating resistor 1715. For example, when three or more core modules are connected together without utilizing a DC expansion board and using zero to two half-width modules, the topmost core module 1700 and the bottommost core module 1700 each enable a terminating resistor 1715.
[0160] Figure 18AA pinout diagram for the fourth modular ecosystem 1800 is shown. The fourth modular ecosystem 1800 includes two half-width modules 1805, a first core module 1810A, and a second core module 1810B. The modules are stacked on top of each other and include pins from the first pinout diagram 1400. Each module may include one or two terminating resistors (e.g., terminating resistor 430).
[0161] The bottom interface of the half-width module 1805 may include a half-width module presence pin 1410 at the downward interface. The top interface of the core module 1810 may include a bidirectional converter or power supply core presence pin 1430, a half-width module detection pin 1420, and a bidirectional converter or power supply core detection pin 1440 at the upward left interface, and a half-width module detection pin 1420 at the upward right interface. The bottom interface of the core module 1810 may include a bidirectional converter or power supply core detection pin 1440 and a bidirectional converter or power supply core presence pin 1430 at the downward left interface.
[0162] Half-width module detection pin 1420 allows the bidirectional converter and power supply (i.e., core module 1810) to determine whether one or two half-width modules 1805 are present on the bidirectional converter and / or power supply core (i.e., core module 1810). Bidirectional converter or power supply core presence pin 1430 and bidirectional converter or power supply core detection pin 1440 allow the bidirectional converter and power supply core (i.e., core module 1524) to determine their position within the full-width stack. For example, bidirectional converter or power supply core presence pin 1430 and bidirectional converter or power supply core detection pin 1440 provide inputs to controller 300, which uses these inputs to determine the position of modular electronics 110 within the full-width stack.
[0163] Figure 18B A pinout diagram of the fifth modular ecosystem 1815 is shown. The fifth modular ecosystem 1815 includes two half-width modules 1805, a core module 1810, and a bidirectional converter module 1820. The modules are stacked on top of each other and include pins from the first pinout diagram 1400.
[0164] The top interface of the bidirectional converter module 1820 may include a bidirectional converter or power presence pin 1430, a half-width module detection pin 1420, and a bidirectional converter or power core detection pin 1440 at the upward left interface, and a half-width module detection pin 1420 at the upward right interface. The side interface of the bidirectional converter module 1820 may include a bottom plate / wallplate detection pin 1460 at the board interface. The bottom plate / wallplate detection pin 1460 can be monitored by the controller 300 of the bidirectional converter module 1820. The bidirectional converter module 1820 may not have a bottom interface, as it is located at the bottom of the stack in the fifth modular ecosystem 1815.
[0165] Figure 18C A pinout diagram for the sixth modular ecosystem 1825 is shown. The sixth modular ecosystem 1825 includes a bidirectional converter module 1820 and two DC expansion board modules 1830. The DC expansion board module 1830 can be a base plate 110B or a wall plate. The modules can be arranged adjacent to each other and include pins from the first pinout diagram 1400. For example, when the DC expansion board module 1830 is a base plate, the modules are arranged adjacent to each other on the ground. When the DC expansion module 1830 is a wall plate, the bidirectional converter module 1820 can be arranged adjacent to a wall surface, and the wall plate can be mounted to a wall.
[0166] The first-side interface of the DC expansion board module 1830 may include a baseboard / wallboard detection pin 1460 on a daisy-chain connector. The second-side interface of the DC expansion board module 1830 may include a baseboard / wallboard presence pin 1450 on a stacking connector. The baseboard / wallboard detection pin 1460 may be a switch that disconnects the terminating resistor of the DC expansion board module 1830 when the baseboard / wallboard presence pin 1450 is inserted into the baseboard / wallboard detection pin 1460.
[0167] Figure 19A A second bidirectional converter module 1900 is shown. The second bidirectional converter module 1900 can be a bottom module in a stack, which is intolerant of modules below it in the stack. The second bidirectional converter module 1900 may include two terminating resistors that are disconnected when nothing is connected and then connected once the second bidirectional converter module 1900 is coupled to another module. Similar to... Figure 18B The bidirectional converter module 1820 and the second bidirectional converter module 1900 include a top interface with an upward left interface and an upward right interface, a bottom interface with a downward left interface, and a side interface with a board interface.
[0168] Figure 19B An eleventh modular ecosystem 1920 is shown, comprising a second bidirectional converter module 1900 and a half-width module 1905. As described above, the second bidirectional converter module 1900 includes two enabled terminating resistors 1925 because the second bidirectional converter module 1900 is connected to the half-width module 1905. The half-width modules 1905 are stacked on top of the second bidirectional converter module 1900, which allows the top interface of the second bidirectional converter module 1900 to be electrically connected to the bottom interfaces of the two half-width modules 1905. Similar to... Figure 18AThe first half-width module 1805 and the second half-width module 1905 include a downward interface. The CAN bus extends from the first half-width module 1905 via the downward interface of the first half-width module 1905 and via the upward left interface of the second bidirectional converter module 1900 to the second bidirectional converter module 1900, and then extends to the second half-width module 1905 via the downward interface of the second half-width module 1905 and the upward right interface of the second bidirectional converter module 1900.
[0169] Figure 19C A twelfth modular ecosystem 1930 is shown, comprising a second bidirectional converter module 1900, a half-width module 1905, and a core module 1910. In the twelfth modular ecosystem 1930, the half-width module 1905 is connected to the core module 1910 and stacked directly on top of the core module 1910, and then the core module 1910 is connected to the second bidirectional converter module 1900 and stacked directly on top of it. Similar to... Figure 18A The core module 1810 and core module 1910 include a top interface and a bottom interface. The top interface includes an upward left interface and an upward right interface, and the bottom interface includes a downward left interface.
[0170] The CAN bus extends from the first half-width module 1905 via its downward interface and the upward left interface of the core module 1910 to the second half-width module 1905, and then via the downward interface of the second half-width module 1905 and the upward right interface of the core module 1910 to the second half-width module 1905. The CAN bus also extends from the core module 1910 to the second bidirectional converter module 1900 via the downward left interface of the core module 1910 and the upward left interface of the second bidirectional converter module 1900.
[0171] The second bidirectional converter module 1900 and the core module 1910 each enable a terminating resistor 1925. For example, when the second bidirectional converter module 1900 and the single core module 1910 are connected together without utilizing a DC expansion board and using zero to two half-width modules, the second bidirectional converter module 1900 and the core module 1910 each enable a terminating resistor 1925.
[0172] Figure 19D A thirteenth modular ecosystem 1935 is shown, comprising a second bidirectional converter module 1900, a half-width module 1905, and a DC expansion board module 1915. The second bidirectional converter module 1900 connects to the DC expansion board module 1915 at a side interface, except that it connects to the half-width module 1905 at a top interface. Similar to... Figure 18C DC expansion board module 1830 and DC expansion board module 1915 have a first side interface including a daisy-chain interface and a second side interface including a stacking interface.
[0173] The CAN bus extends from the first half-width module 1905 via its downward interface and then via the upward left interface of the second bidirectional converter module 1900 to the second half-width module 1900. It then extends again via the downward interface of the second half-width module 1905 and the upward right interface of the second bidirectional converter module 1900 to the second half-width module 1905. The CAN bus also extends from the second bidirectional converter module 1900 to the DC expansion board module 1915 via the board interface of the second bidirectional converter module 1900 and the stacking interface of the DC expansion board module 1915.
[0174] The second bidirectional converter module 1900 and the DC expansion board module 1915 each enable a terminating resistor 1925. For example, when the second bidirectional converter module 1900 and the single DC expansion board module 1915 are not using a core module and are connected together using zero to two half-width modules, the second bidirectional converter module 1900 and the DC expansion board module 1915 each enable a terminating resistor 1925.
[0175] Figure 19E The fourteenth modular ecosystem 9140 is shown, including a second bidirectional converter module 1900, a half-width module 1905, a core module 1910, and a DC expansion board module 1915.
[0176] The CAN bus extends from the first half-width module 1905 via its downward interface and the upward left interface of the core module 1910, then extends to the second half-width module 1905 via its downward interface and the upward right interface of the core module 1910. The CAN bus also extends from the core module 1910 to the second bidirectional converter module 1900 via the downward left interface of the core module 1910 and the upward left interface of the second bidirectional converter module 1900. The CAN bus further extends from the second bidirectional converter module 1900 to the DC expansion board module 1915 via the board interface of the second bidirectional converter module 1900 and the stacking interface of the DC expansion board module 1915.
[0177] The core module 1910 and the DC expansion board module 915 each enable a terminating resistor 1925. For example, when both the core module 1910 and the DC expansion board module 1915 are connected to the second bidirectional converter module 1900 using zero to two half-width modules, the core module 1910 and the DC expansion board module 1915 each enable a terminating resistor 1925.
[0178] Figure 19F The fifteenth modular ecosystem 1945 is shown, which includes a second bidirectional converter module 1900, a half-width module 1905, and a core module 1910.
[0179] The CAN bus extends from the first half-width module 1905 via its downward interface and the upward left interface of the first core module 1910 to the second half-width module 1905, and then via the downward interface of the second half-width module 1905 and the upward right interface of the first core module 1910 to the second half-width module 1905. The CAN bus also extends from the first core module 1910 to the second core module 1910 via the downward left interface of the first core module 1910 and the upward left interface of the second core module 1910. The CAN bus further extends from the second core module 1910 to the second bidirectional converter module 1900 via the downward left interface of the second core module 1910 and the upward left interface of the second bidirectional converter module 1900.
[0180] The second bidirectional converter module 1900 and the first core module 1910 each enable a terminating resistor 1925. For example, when the second bidirectional converter module 1900 is at the bottom and the second bidirectional converter module 1900 and two or more core modules 1910 are not using the DC expansion board module and are connected together using zero to two half-width modules, the second bidirectional converter module 1900 and the topmost core module 1910 each enable a terminating resistor 1925.
[0181] Figure 19G The sixteenth modular ecosystem 1950 is shown, which includes a second bidirectional converter module 1900, a half-width module 1905, and a DC expansion board module 1915.
[0182] The CAN bus extends from the first half-width module 1905 via its downward interface and then via the upward left interface of the second bidirectional converter module 1900, and then extends to the second half-width module 1905 via its downward interface and the upward right interface of the second bidirectional converter module 1900. The CAN bus also extends from the second bidirectional converter module 1900 to the first DC expansion board module 1915 via the board interface of the second bidirectional converter module 1900 and the stacking interface of the first DC expansion board module 1915. The CAN bus further extends from the first DC expansion board module 1915 to the second DC expansion board module 1915 via the daisy-chain interface of the first DC expansion board module 1915 and the stacking interface of the second DC expansion board module 1915.
[0183] The second bidirectional converter module 1900 and the second DC expansion board module 1915 each enable a terminating resistor 1925. For example, when the second bidirectional converter module 1900 and two or more DC expansion board modules 1915 are connected together using zero to two half-width modules, the second bidirectional converter module 1900 and the DC expansion board module 1915 furthest from the second bidirectional converter module 1900 each enable a terminating resistor 1925.
[0184] Figure 19H The seventeenth modular ecosystem 1955 is shown, including a second bidirectional converter module 1900, a half-width module 1905, a core module 1910, and a DC expansion board module 1915.
[0185] The CAN bus extends from the first half-width module 1905 via its downward interface and the upward left interface of the first core module 1910, then extends to the second half-width module 1905 via its downward interface and the upward right interface of the first core module 1910. The CAN bus also extends from the first core module 1910 to the second core module 1910 via the downward left interface of the first core module 1910 and the upward left interface of the second core module 1910. The CAN bus further extends from the second core module 1910 to the second bidirectional converter module 1900 via the downward left interface of the first core module 1910 and the upward left interface of the second bidirectional converter module 1900. The CAN bus further extends from the second bidirectional converter module 1900 to the first DC expansion board module 1915 via the board interface of the second bidirectional converter module 1900 and the stacking interface of the first DC expansion board module 1915. Furthermore, the CAN bus extends from the first DC expansion board module 1915 to the second DC expansion board module 1915 via the daisy-chain interface of the first DC expansion board module 1915 and the stacking interface of the second DC expansion board module 1915.
[0186] Both the first core module 1910 and the second DC expansion board module 1915 enable a terminating resistor 1925. For example, when the second bidirectional converter module 1900, two or more core modules 1910, and two or more DC expansion board modules 1915 are connected together using the second bidirectional converter module 1900 located at the bottom of the stack and zero to two half-width modules, only the topmost core module 1910 and the DC expansion board module 1915 furthest from the second bidirectional converter module 1900 each enable the terminating resistor 1925.
[0187] Table 2 below summarizes the information used for Figures 19A-19HThe CAN bus terminating resistor rules for the modules. In particular, the second bidirectional converter module 1900 is the bottom module of the stack, and the CAN bus terminating resistor rules in Table 3 only apply when the second bidirectional converter module 1900 is at the bottom of the module stack.
[0188] Table 3 Figure 20A A core module 2000 is shown. The core module 2000 may include two terminating resistors 2025, which are open when nothing is connected, and then connected once the core module 2000 is coupled to another module. Similar to... Figure 18A The core module 1810 and core module 2000 include a top interface with an upward left interface and an upward right interface, and a bottom interface with a downward left interface.
[0189] Figure 20B The eighteenth modular ecosystem 2010, comprising a core module 2000 and a half-width module 2005, is illustrated. As described above, the core module 2000 includes two enabled terminating resistors 2025 because the core module 2000 is connected to the half-width module 2005. The half-width modules 2005 are stacked on top of the core module 2000, which allows the top interface of the core module 2000 to be electrically connected to the bottom interfaces of the two half-width modules 2005. Similar to... Figure 18A The first half-width module 1805 and the second half-width module 2005 include a downward interface. The CAN bus extends from the first half-width module 2005 through the downward interface of the first half-width module 2005 and through the upward left interface of the core module 2000 to the core module 2000, and then extends to the second half-width module 2005 through the downward interface of the second half-width module 2005 and the upward right interface of the core module 2000.
[0190] Figure 20C The nineteenth modular ecosystem 2015 is shown, comprising a core module 2000 and a half-width module 2005. In particular, the nineteenth modular ecosystem 2015 includes two core modules 2000. In addition to connecting to the half-width module 2005 at a top interface, the first core module 2000 connects to the second core module 2000 at a bottom interface.
[0191] The CAN bus extends from the first half-width module 2005 via its downward interface and the upward left interface of the first core module 2000 to the second half-width module 2005, and then extends to the second half-width module 2005 via its downward interface and the upward right interface of the first core module 2000. The CAN bus also extends from the first core module 2000 to the second core module 2000 via the downward left interface of the first core module 2000 and the upward left interface of the second core module 2000.
[0192] The first core module 2000 and the second core module 2000 each enable a terminating resistor 2025. For example, when the two core modules are connected together without utilizing a DC expansion board and using zero to two half-width modules, each core module 2000 enables a terminating resistor 2025.
[0193] Figure 20D A twentieth modular ecosystem 2020 is shown, comprising a core module 2000 and a half-width module 2005. Specifically, the twentieth modular ecosystem 2020 includes three core modules 2000. In addition to connecting to the half-width module 2005 at a top interface, the first core module 2000 connects to the second core module 2000 at a bottom interface. The second core module 2000 connects to the third core module 170 at a bottom interface.
[0194] The CAN bus extends from the first half-width module 2005 via its downward interface and the upward left interface of the first core module 2000 to the second half-width module 2005, and then via the downward interface of the second half-width module 2005 and the upward right interface of the first core module 2000 to the third half-width module 2005. The CAN bus also extends from the first core module 2000 to the second core module 2000 via the downward left interface of the first core module 2000 and the upward left interface of the second core module 2000. Furthermore, the CAN bus extends from the second core module 2000 to the third core module 2000 via the downward left interface of the second core module 2000 and the upward left interface of the third core module 2000.
[0195] Both the first core module 2000 and the third core module 2000 each enable a terminating resistor 2025. For example, when three or more core modules are connected together without utilizing a DC expansion board and using zero to two half-width modules, the topmost core module 2000 and the bottommost core module 2000 each enable a terminating resistor 2025.
[0196] Figure 21A A twenty-first modular ecosystem 2100 is illustrated, comprising a core module 2105, a small core module 2110, and a half-width module 2115. The core module 2105 may be similar to the core modules described above (e.g., Figure 18A The core module 1810 can have a top interface with an upward left interface and an upward right interface, and a bottom interface with a downward left interface. The half-width module 2115 can be similar to the aforementioned half-width module (e.g., Figure 18B The half-width module 1805 can be used, and may include a downward interface. The small-chip module 2110 can be electrically connected to a similar half-width module and stacked, but creates a new "upward" communication bus. The new communication bus can be another CAN bus. The small-chip module 2110 includes both an upward interface and a downward interface.
[0197] The small core modules 2110 can be stacked on top of each other (e.g., ...). Figure 21A (as shown), so that high module stacks can be created anywhere in the ecosystem where half-width modules can be connected. To prevent the CAN bus stub length from becoming too long, the small chip module 2110 internally segments the CAN bus. For example, the small chip module 2110 includes two CAN transceivers 2125: one at the upward interface and one at the downward interface. The CAN transceiver 2125 at the downward interface connects to the rest of the stack like the half-width module 2115, while the transceiver 2125 at the upward interface creates a new CAN bus (e.g., utilizing optional pass-through of the CAN bus). In addition to the two transceivers, the small chip module 2110 also includes a controller (similar to controller 300 […]). Figure 3 ]).
[0198] In the 21st modular ecosystem 2100, a first CAN bus 2130A extends from a first half-width module 2115 via its downward interface and through its upward interface to a first small core module 2110. A second CAN bus 2130B extends from the downward interface of the first small core module 2110 to its upward interface. A third CAN bus 2130B (e.g., the original CAN bus in the system compared to the first and second CAN buses) extends from the downward interface of the second small core module 2110 to the upward left interface of the core module 2105. The third CAN bus 2130A extends from the upward left interface through the core module 2105 to the upward right interface. The small core module 2110 can split the CAN bus and either daisy-chain the CAN buses upward (e.g., as shown in the image). Figure 21A As shown, each small chip divides the CAN bus once, or a new CAN bus is created upwards (e.g., as shown). Figure 21B(As shown). The half-width module 2115 will not have a terminating resistor at its downward interface because the stub of the CAN bus (e.g., the third CAN bus 2130B) is short enough that termination is not required for communication purposes. When the small core module 2110 is connected to the core module 2105, which is also connected to the full-width module and the DC board, the CAN bus from the core module 2105 to the full-width module and the DC board is a main CAN bus that terminates only at the end of the segment.
[0199] Each of the small core modules 2110 may have two 120-ohm (Ω) or one 60-ohm terminating resistors (e.g., terminating resistor 2140) permanently enabled at its upward interface. Alternatively, terminating resistor 2140 in core module 2105 may be enabled.
[0200] Figure 21B A twenty-second modular ecosystem 2145 is shown, comprising a core module 2150, a small core module 2155, and a half-width module 2160. A first CAN bus 2165A extends from the first half-width module 2160 via its downward interface and via its upward interface to the first small core module 2155. The first CAN bus 2165A extends from the downward interface of the first small core module 2155 to the upward interface of the second small core module 2155. The first CAN bus 2165A extends from the downward interface of the second small core module 2155 to the upward interface of the third small core module 2155. The first CAN bus 2165A extends from the half-width module 2160 to the upward interface of the third small core module 2155. A second CAN bus 2165B (e.g., the original CAN bus in the system compared to the first CAN bus) extends from the downward interface of the third small core module 2155 to the upward left interface of the core module 2150. The second CAN bus 2165B extends from the upper left interface through the core module 2150 to the upper right interface. The third small core module 2155 divides the original CAN bus to create the first CAN bus 2165A. The small core module 2155 located above the bottommost small core module 2155 is connected to only one CAN transceiver 2170 and does not transmit messages through their controllers. The first small core module 2155 enables one terminating resistor 2175, the third small core module 2155 enables one terminating resistor 2175, and the core module 2150 enables two terminating resistors 2175.
[0201] Figure 22A A pinout diagram of the seventh modular ecosystem 2200 is shown. The seventh modular ecosystem 2200 includes a core module 2205, a small core 2210, and a half-width module 2215. The modules are stacked on top of each other and include pins from the first pinout diagram 1400. Each module may include one or two terminating resistors (e.g., terminating resistor 430).
[0202] The bottom interface of half-width module 2215 may include a half-width module presence pin 1410 at the downward interface. The top interface of small chip 2210 may include a half-width module detection pin 1420 at the upward interface, and the bottom interface of small chip 2210 may include its own half-width module presence pin 1410 at the downward interface. The top interface of chip module 2205 may include a bidirectional converter or power supply chip presence pin 1430, a half-width module detection pin 1420, and a bidirectional converter or power supply chip detection pin 1440 on the upward left interface, and a half-width module detection pin 1420 on the upward right interface. The bottom interface of chip module 2205 may include a bidirectional converter or power supply chip detection pin 1440 and a bidirectional converter or power supply chip presence pin 1430 on the downward left interface.
[0203] Chip 2210 does not need to monitor the half-width module detection pin 1410 on its upward interface for the purpose of enabling the terminating resistor, but it can do so in other ways. For example, Chip 2210 can monitor the half-width module detection pin 1410 on its upward interface to determine whether to turn off the upward CAN transceiver when no half-width module 2215 is stacked on the upward surface of the chip.
[0204] Figure 22B A pinout diagram for the eighth modular ecosystem 2220 is shown. The eighth modular ecosystem 2220 includes a core module 2225, a small core module 2230, and a half-width module 2235. The modules are stacked on top of each other and include pins from the first pinout diagram 1400 as well as additional pins. Each module may include one or two terminating resistors (e.g., terminating resistor 430).
[0205] The bottom interface of the half-width module 2235 may include a half-width module presence pin 1410 at the downward interface. The top interface of the small-chip module 2230 may include a half-width module detection pin 1420 and a small-chip detection pin 2245 at the upward interface, and the bottom interface of the small-chip module 2230 may include its own half-width module presence pin 1410 and a small-chip presence pin 2240 at the downward interface. The top interface of the chip module 2225 may include a bidirectional converter or power supply chip presence pin 1430, a half-width module detection pin 1420, a small-chip detection pin 2245, and a bidirectional converter or power supply chip detection pin 1440 at the upward left interface, and a half-width module detection pin 1420 at the upward right interface. The bottom interface of the chip module 2225 may include a bidirectional converter or power supply chip detection pin 1440 and a bidirectional converter or power supply chip presence pin 1430 at the downward left interface.
[0206] Figure 23A flowchart of an exemplary method 2300 for connecting the chip module 2110 to an ecosystem is shown. Although the illustrated method 2300 includes specific steps, not all steps need to be performed or need to be performed in the presented order. In some embodiments, method 2300 is performed by the chip module 2110, and particularly by the controller 300 of the chip module 2110. Figure 21A , 21B Method 2300 is described in sections 23 and 23.
[0207] Method 2300 includes receiving input data from a first CAN bus interface at a first CAN bus transceiver 2125 (step 2310). The first CAN bus transceiver 2125 may be located at the bottom interface of the chip module 2110. The chip module 2110 may be stacked on top of another modular electronic device 110. The input data may include voltage signals, current signals, data packets, etc. The input data can be transmitted from the CAN bus coupled to the first CAN bus transceiver 2125 to the chip module.
[0208] Method 2300 includes using controller 300 to split the first CAN bus at the first CAN bus transceiver 2125 (step 2320). The controller 300 of the chip module 2110 splits the first CAN bus to prevent the chip module 2110 from generating excessively long CAN bus stubs (e.g., CAN bus stub 420). Figure 5A Specifically, the controller 300 may terminate a first CAN bus (e.g., first CAN bus 2130A) at a first CAN bus transceiver 2125 and terminate a second CAN bus (e.g., second CAN bus 2130B) at a second CAN bus transceiver 2125.
[0209] Method 2300 includes providing data from a second CAN bus transceiver to a second CAN bus (step 2330). The second CAN bus is provided from the second CAN bus transceiver 2125 to a module positioned above the small-diameter module 2110. For example, the second CAN bus can be provided to the second small-diameter module 2110, which then splits the second CAN bus and provides a third CAN bus to the module above it (e.g., a half-width module 2115). The second small-diameter module 2110 may include the CAN bus transceiver 2125 at both the bottom and top interfaces. As another example, the second CAN bus can be provided to two small-diameter modules 2110 stacked around the first small-diameter module 2110. In other words, the second CAN bus can be split again or provided via additional small-diameter modules 2110.
[0210] Method 2300 includes enabling terminating resistor 2140 using controller 300. Controller 300 of the chip module 2110 can enable one or two terminating resistors 2140. For example, the controller can enable two 120-ohm (Ω) terminating resistors or one 60-ohm terminating resistor. Additionally, controller 300 can facilitate communication between a first CAN bus 2130A and a second CAN bus 2130B to enable the entire modular ecosystem to function as a single system.
[0211] Figure 24 A flowchart of an exemplary method 2400 for temporarily enabling the internal module resistor 430 of modular electronics 110 when inserting a new modular electronic device into modular ecosystem 100 is shown. Although the illustrated method 2400 includes specific steps, not all steps need to be performed or need to be performed in the order presented. Method 2400 may be performed by modular electronics 110 (e.g., sensor logic circuitry 310 of modular electronics 110).
[0212] Method 2400 includes receiving input using sensing logic circuitry 310 (or another microcontroller of modular electronics 110) (step 2410). As described above, the CMI, CMO, and CMS pins of communication interfaces 610, 620 are electrically connected to sensing logic circuitry 310. Sensing logic circuitry 310 senses signals (e.g., voltage and / or current signals) on the communication pins CMI and CMS of communication interfaces 610, 620. Sensing logic circuitry 310 may also provide input to controller 300. In another example, communication interfaces 610, 620 may have different configurations. In different configurations, each communication interface may have two pins: a detection pin and an output pin. The output pin is connected to the DC (or ground) terminal of modular electronics 110 via a resistor. The detection pin is connected to sensing logic circuitry 310 or controller 300. The detection pin of the first interface is positioned to connect to the output pin of the second module. The detection pin and output pin may be provided on each of the up and down interfaces. Therefore, the sensing logic circuit 310 or controller 300 uses a detection pin pulled to ground by the output pin of the connected device to detect the presence of another device. Specifically, a pull-up resistor and an ADC can be connected between the detection pin and the sensing logic circuit 310 or controller 300 to detect a low voltage (i.e., ground / DC potential) at the detection pin when another modular device is connected.
[0213] Method 2400 includes using sensing logic circuitry 310 to determine that modular electronics 110 is connected to another module (step 2420). For example, sensing logic circuitry 310 may determine that a detection pin is at a low voltage or a DC potential. In another example, pull-up resistors and digital inputs may determine that at least two pins of the connected module are shorted. As another example, pull-up resistors and an analog-to-digital converter (ADC) may detect that a single pin on the connected module is shorted to DC-. When another module is connected, sensing logic circuitry 310 determines that the voltage output of the ADC is a threshold. When no module is connected to modular electronics 110, the voltage output of the ADC is greater than the threshold.
[0214] Method 2400 includes enabling the internal module resistor 430 using sensing logic circuitry 310 (step 2430). As described above, the internal module resistor 430 is enabled on the CAN bus. The sensing logic circuitry 310 of the modular electronics 110 can enable the terminating resistor 430 by providing a switch between the CAN+ and CAN- pins in the internal module resistor 430. For example, a latching relay, photoMOSFET, microswitch, or reed switch can connect and disconnect the internal module resistor 430 from the CAN bus. The latching relay can allow the internal module resistor 430 to remain connected when the module is in sleep or standby mode by allowing the module with the terminating resistor 430 to maintain a low quiescent current state when other modules are communicating via the CAN bus.
[0215] The internal module resistor 430 can be enabled when the modular electronic device 110 is part of the main stack and there are no other modules above it, or there are modules above it but no modules below it. The internal module resistor 430 will be disabled when the modular electronic device 110 is part of the main stack and there are modules above and below it.
[0216] Therefore, the embodiments described in this utility model particularly provide systems and methods for CAN bus communication systems for modular ecosystems.
Claims
1. A modular electronic device, characterized in that, include: Communication interface; One or more terminating resistors are configured to be selectively enabled, wherein the one or more terminating resistors are electrically connected to the communication interface when enabled and electrically disconnected from the communication interface when disabled. and Sensing logic circuit, the sensing logic circuit being configured as follows: In response to determining that the modular electronic device is a terminal module in the main stack of the communication bus, one or more terminal resistors are enabled.
2. The modular electronic device as claimed in claim 1, characterized in that, The modular electronic device is one of a portable power supply, a baseboard supporting a communication bus, a full-width module, a half-width module, and a small chip.
3. The modular electronic device as claimed in claim 1, characterized in that, The communication interface includes a first communication pin, and the sensing logic determines that the modular electronic device is a terminal module in the main stack of the communication bus in response to detecting a voltage signal at the first communication pin.
4. The modular electronic device as claimed in claim 1, characterized in that, The sensing logic circuit is further configured as follows: The one or more terminating resistors are disabled in response to the determination that the modular electronic device is not a terminating module in the main stack.
5. The modular electronic device as claimed in claim 4, characterized in that, The communication interface includes a first communication pin, and the sensing logic determines that the modular electronic device is not a terminal module in the main stack of the communication bus in response to the absence of a current signal detected at the first communication pin.
6. The modular electronic device as claimed in claim 1, characterized in that, The sensing logic circuit is further configured as follows: The one or more terminating resistors are disabled in response to the determination that the modular electronic device is not part of the main stack.
7. The modular electronic device as claimed in claim 1, characterized in that, The sensing logic circuit is electrically connected to the communication interface and includes logic gates configured to enable the one or more terminating resistors.
8. The modular electronic device as claimed in claim 1, characterized in that, The sensing logic enables the one or more terminating resistors by connecting them to the communication bus using one of a latching relay, an optoMOSFET, a microswitch, and a reed switch.
9. The modular electronic device as claimed in claim 1, characterized in that, The sensing logic circuit is further configured as follows: In response to determining that the modular electronic device is the module furthest from the main stack, one or more terminating resistors are enabled.
10. An ecosystem characterized by, include: The first small-chip module includes: First downward interface, and First upward interface; and The second small core module includes: Second downward interface, A first transceiver, coupled to the second downlink interface. The second upward interface, A second transceiver, the second transceiver being coupled to the second up-interface, and A controller, coupled to the first transceiver and the second transceiver, includes an electronic processor configured to: The first CAN bus is split at the second downward interface. Create a second CAN bus, and The second CAN bus is provided to the first downward interface via the second upward interface. The second CAN bus is transmitted from the first downward interface to the first upward interface.
11. The ecosystem as described in claim 10, characterized in that, The controller is further configured to enable at least one terminating resistor connected to the second CAN bus interface.
12. The ecosystem as described in claim 11, characterized in that, The controller enables two 120Ω terminating resistors.
13. The ecosystem as described in claim 11, characterized in that, The controller enables a 60Ω terminating resistor.
14. The ecosystem as described in claim 10, characterized in that, Communication occurs between the first CAN bus and the second CAN bus via the first transceiver and the second transceiver.
15. The ecosystem as described in claim 10, characterized in that, The ecosystem further includes: The core module includes a third upward interface, and The first CAN bus is transmitted from the third upward interface to the second downward interface.
16. The ecosystem as described in claim 15, characterized in that, The controller is further configured to enable a first terminating resistor connected to the first CAN bus in the core module.