Highly conductive conductive plastic masterbatch

Abstract

The utility model discloses a kind of high-conductivity conductive plastic masterbatch, it is related to conductive plastic masterbatch technical field, its technical key points include bearing framework;Conductive inner shell, the conductive inner shell is adhered and fixed on the circumferential side of bearing framework;Resin shell, the resin shell is adhered and fixed on the outside of conductive inner shell, and the adhered and fixed on the circumferential side of bearing framework;Dust wrapping ring, the dust wrapping ring is adhered and fixed on the circumferential side of resin shell, technical effect is by being provided with resin shell structure, to facilitate heat conduction to carry out efficient fusion, resin shell resin shell body circumferential side is provided with cross positioning ring groove, to play the limiting effect, resin shell body is positioned by cross positioning ring groove and adhered with dust wrapping ring, so that dust wrapping ring can be positioned installation placement, the inside of cross positioning ring groove is located resin shell body and is provided with heat uniform hole, heat uniform hole is convenient for the external heat conduction to resin shell body interior and carries out heating, heating fusion is more efficient.

Description

Technical Field

[0001] This utility model relates to the field of conductive plastic masterbatch technology, specifically a highly conductive conductive plastic masterbatch. Background Technology

[0002] Conductive plastic masterbatch refers to a functional polymer material that is made by mixing resin and conductive materials and then using plastic processing and molding technology to give it conductive properties. This material achieves a leapfrog transformation from insulator to semiconductor and then to conductor by adding conductive additives to the plastic matrix.

[0003] Existing Chinese patent CN215396227U, published on January 4, 2022, discloses a black masterbatch, relating to the technical field of color masterbatch. It includes a carrier column, with multiple carrier support pillars disposed on the peripheral sidewalls of the carrier column. An inner carrier ring and an outer carrier ring are connected between the multiple carrier support pillars, with the inner carrier ring located on the side relatively closer to the carrier column. An inner dispersant layer is disposed between the inner carrier ring and the carrier column, and a pigment layer is disposed between the outer carrier ring and the inner carrier ring. An outer dispersant layer is disposed on the side of the outer carrier ring relatively away from the pigment layer, and an antistatic layer is disposed on the side of the outer dispersant layer relatively away from the outer carrier ring. The antistatic layer protrudes from the ends of the multiple carrier support pillars that are relatively away from the carrier column. Multiple first through holes are formed on the inner carrier ring, through which the inner dispersant layer and the pigment layer abut against each other. Multiple second through holes are formed on the outer carrier ring, through which the pigment layer and the outer dispersant layer abut against each other.

[0004] However, the above-mentioned device cannot efficiently melt during hot-melt processing because it lacks corresponding heat-conducting holes, which prevents the hot gas from being evenly distributed into the carrier, resulting in inefficient hot-melt processing.

[0005] Therefore, we propose a novel highly conductive conductive plastic masterbatch to solve the above-mentioned technical problems. Utility Model Content

[0006] (a) Technical problems to be solved

[0007] To address the shortcomings of existing technologies, this invention provides a highly conductive conductive plastic masterbatch, which solves the problem that the aforementioned devices cannot efficiently melt during hot-melt processing, lack corresponding heat-conducting pores, and thus cannot evenly disperse hot air into the carrier, resulting in inefficient hot-melt processes.

[0008] (II) Technical Solution

[0009] To achieve the above objectives, this utility model provides the following technical solution: a highly conductive conductive plastic masterbatch, comprising:

[0010] Load-bearing frame;

[0011] A conductive inner shell is bonded and fixed to the periphery of the supporting frame;

[0012] A resin outer shell is bonded and fixed to the outer side of the conductive inner shell, and is bonded and fixed to the periphery of the supporting frame.

[0013] A dustproof wrapping ring is adhered and fixed to the periphery of the resin shell.

[0014] Preferably, the supporting frame includes a supporting ball head, and four positioning sleeves are fixedly connected to the circumferential array of the supporting ball head, and a resin shell is adhered and fixedly connected to the circumferential side of the positioning sleeves.

[0015] Preferably, the resin shell includes a resin housing, the periphery of which is provided with a cross-shaped positioning ring groove, the inner side of which is provided with a heat equalization hole on the resin housing, and the resin housing is positioned and bonded with a dustproof wrapping ring through the cross-shaped positioning ring groove.

[0016] Preferably, the dustproof wrapping ring includes a dustproof circular ring, and symmetrical dustproof semicircular rings are fixed to the outer wall of the dustproof circular ring.

[0017] Preferably, the conductive inner shell comprises conductive fibers and conductive metal powder.

[0018] Preferably, both the resin outer shell and the dustproof wrapping ring are made of resin.

[0019] Preferably, the weight of the conductive inner shell is greater than the total weight of the resin outer shell and the dustproof wrapping ring.

[0020] (III) Beneficial Effects

[0021] Compared with the prior art, this utility model provides a highly conductive conductive plastic masterbatch, which has the following beneficial effects:

[0022] 1. This utility model features a resin shell structure, which facilitates efficient fusion through heat conduction. The resin shell has a cross-shaped positioning groove on its periphery, which serves as a limiting element. A dustproof wrapping ring is attached to the resin shell through the cross-shaped positioning groove, allowing the dustproof wrapping ring to be positioned and installed. A heat equalization hole is provided on the inner side of the cross-shaped positioning groove on the resin shell, which facilitates the conduction of external heat to the interior of the resin shell for heating, thus making the fusion process more efficient.

[0023] 2. The supporting frame of this utility model can stably support the placement of the resin shell through its outer shape, and the dustproof wrapping ring can wrap around the periphery of the resin shell to prevent dust from entering the heat equalization holes of the resin shell, thereby playing a role in wrapping and preventing dust. Attached Figure Description

[0024] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0025] Figure 2 This is a schematic diagram of the resin shell structure of this utility model;

[0026] Figure 3 This is a schematic diagram of the dustproof wrapping ring structure of this utility model;

[0027] Figure 4 This is a cross-sectional structural diagram of the present invention;

[0028] Figure 5 This is a schematic diagram of the load-bearing frame structure of this utility model.

[0029] In the picture:

[0030] 1. Resin housing; 11. Cross-shaped positioning ring groove; 2. Positioning sleeve post; 21. Bearing ball head; 3. Heat equalization hole; 4. Dustproof ring; 41. Dustproof semi-circular ring; 5. Conductive inner shell. Detailed Implementation

[0031] In this utility model, unless otherwise stated, the orientations used, such as "up" and "down", usually refer to the direction shown in the accompanying drawings, or to the vertical, perpendicular, or gravitational direction; similarly, for ease of understanding and description, "left" and "right" usually refer to the left and right shown in the accompanying drawings; "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not used to limit this utility model.

[0032] Example 1

[0033] This embodiment provides a technical solution: a highly conductive conductive plastic masterbatch, such as... Figures 1-5 As shown, it includes a supporting frame, a conductive inner shell 5, a resin outer shell, and a dustproof wrapping ring.

[0034] The conductive inner shell 5 is adhered and fixed to the periphery of the supporting frame. The conductive inner shell 5 can be stably supported and placed by the shape of the supporting frame. The resin outer shell is adhered and fixed to the outer side of the conductive inner shell 5. The resin outer shell and the conductive inner shell 5 are connected by hot melt bonding, so that the connection is more firm and tight. The resin outer shell is adhered and fixed to the periphery of the supporting frame. The supporting frame can stably support and place the resin outer shell by its outer shape. The dustproof wrapping ring is adhered and fixed to the periphery of the resin outer shell. The dustproof wrapping ring can wrap and protect the periphery of the resin outer shell to prevent dust from entering the interior of the resin outer shell.

[0035] The conductive inner shell 5 comprises conductive fibers and conductive metal powder, thus possessing excellent conductivity;

[0036] The conductive inner shell 5 has a greater weight than the total weight of the resin outer shell and the dustproof wrapping ring, thus having high conductivity.

[0037] Both the resin outer shell and the dustproof wrapping ring are made of resin, which makes it easy to process into plastic for use.

[0038] The resin shell includes a resin shell 1. A cross-shaped positioning groove 11 is provided on the periphery of the resin shell 1 to limit its position. A dustproof wrapping ring is positioned and bonded to the resin shell 1 through the cross-shaped positioning groove 11, so that the dustproof wrapping ring can be positioned and installed. A heat equalization hole 3 is provided on the inner side of the cross-shaped positioning groove 11 on the resin shell 1. The heat equalization hole 3 facilitates the conduction of external heat to the interior of the resin shell 1 for heating, which makes the heating and fusion process more efficient.

[0039] The dustproof wrapping ring includes a dustproof circular ring 4, and symmetrical dustproof semi-circular rings 41 are fixed to the outer wall of the dustproof circular ring 4. The shapes of the dustproof circular ring 4 and the dustproof semi-circular rings 41 facilitate the wrapping. The thickness of the dustproof circular ring 4 and the dustproof semi-circular rings 41 is less than the thickness of the resin shell 1, so that the dustproof circular ring 4 and the dustproof semi-circular rings 41 can expose the heat equalization holes 3 of the resin shell 1 when they are heated and melted.

[0040] like Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, the supporting frame includes a supporting ball head 21. Four positioning sleeves 2 are fixedly connected to the circumferential array of the supporting ball head 21. The supporting ball head 21 can form a cross-shaped frame through the four positioning sleeves 2, which facilitates stable support. A resin shell is adhered and fixed to the circumferential side of the positioning sleeves 2. The resin shell can be positioned and placed for support through the positioning sleeves 2.

[0041] In use, the conductive inner shell 5 can be stably supported by the shape of the support frame. The resin outer shell and the conductive inner shell 5 are connected by hot melt bonding, which makes the connection more firm and tight. It is bonded to the periphery of the support frame. The support frame can stably support the resin outer shell by its outer shape. The dustproof wrapping ring can wrap around the periphery of the resin outer shell to prevent dust from entering the heat equalization hole 3 of the resin outer shell, thus playing a role in dust protection.

[0042] The above are merely specific embodiments of this utility model, but the technical features of this utility model are not limited thereto. Any simple changes, equivalent substitutions, or modifications made based on this utility model to solve essentially the same technical problems and achieve essentially the same technical effects are all covered within the protection scope of this utility model.

Claims

1. A highly conductive conductive plastic masterbatch, characterized in that, include: Load-bearing frame; Conductive inner shell (5), the conductive inner shell (5) is bonded and fixed to the periphery of the supporting frame; A resin shell is bonded to the outside of the conductive inner shell (5) and bonded to the periphery of the supporting frame. A dustproof wrapping ring is adhered and fixed to the periphery of the resin shell.

2. The highly conductive conductive plastic masterbatch according to claim 1, characterized in that: The supporting frame includes a supporting ball head (21), and four positioning sleeves (2) are fixedly connected to the circumferential array of the supporting ball head (21). A resin shell is adhered and fixed to the circumferential side of the positioning sleeves (2).

3. A highly conductive conductive plastic masterbatch according to claim 1 or 2, characterized in that: The resin shell includes a resin shell (1), and a cross-shaped positioning ring groove (11) is provided on the periphery of the resin shell (1). A heat equalization hole (3) is provided on the inner side of the cross-shaped positioning ring groove (11) on the resin shell (1). A dustproof wrapping ring is positioned and bonded to the resin shell (1) through the cross-shaped positioning ring groove (11).

4. The highly conductive conductive plastic masterbatch according to claim 3, characterized in that: The dustproof wrapping ring includes a dustproof circular ring (4), and a symmetrical dustproof semi-circular ring (41) is fixed to the outer wall of the dustproof circular ring (4).

5. The highly conductive conductive plastic masterbatch according to claim 4, characterized in that: The conductive inner shell (5) comprises conductive fibers and conductive metal powder.

6. The highly conductive conductive plastic masterbatch according to claim 1, characterized in that: Both the resin outer shell and the dustproof wrapping ring are made of resin.

7. A highly conductive conductive plastic masterbatch according to claim 1 or 5, characterized in that: The conductive inner shell (5) has a greater weight than the total weight of the resin outer shell and the dustproof wrapping ring.

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