Conductive busbar and battery pack

Abstract

The utility model provides a kind of electrically conductive busbar and battery pack.Electrically conductive busbar includes first busbar base material and second busbar base material;First busbar base material includes body base material and sampling terminal;Sampling terminal protrudes from the surface or edge of body base material, and sampling terminal exceeds second busbar base material in the protruding direction of itself.After first busbar base material and second busbar base material are stacked, they are used to bear the task of current transmission together.After second busbar base material is stacked on first busbar base material, sampling terminal remains exposed state to ensure that sampling terminal can be connected to corresponding data acquisition structure and ensure normal operation of sampling work.Sampling terminal is integrally formed on first busbar base material, and first busbar does not need to install bolt or stud for sampling, which simplifies the processing procedure of electrically conductive busbar, thereby reducing the production cycle and cost.

Description

Technical Field

[0001] This utility model relates to the field of battery technology, specifically to a conductive busbar and a battery pack. Background Technology

[0002] In high-voltage applications such as lithium-ion battery packs and energy storage systems, the busbar serves as a critical power transmission component, undertaking the important task of connecting multiple battery cells and collecting and transmitting large currents. To monitor the battery pack's operating status (such as voltage and temperature) in real time, sampling points need to be set on the busbar and connected to the battery management system via sampling terminals.

[0003] In related technologies, the installation of sampling terminals on high-voltage busbars mainly adopts a "retrofit" approach. One method involves drilling holes in the busbar and then fixing the ring terminal with bolts; another method involves riveting studs onto the busbar first and then fitting the terminal and tightening the nut. Both methods increase the processing steps of the busbar, raising production costs and timelines. Utility Model Content

[0004] The present invention provides a conductive busbar and a battery pack, wherein the sampling terminal is integrally formed on the conductive busbar, which simplifies the processing steps of the conductive busbar and thus reduces the production cycle and cost.

[0005] According to a first aspect of this application, a conductive busbar is provided, including a first busbar substrate and a second busbar substrate; the first busbar substrate includes a body substrate and a sampling terminal; the sampling terminal and the body substrate are integrally formed, and the sampling terminal protrudes from the surface or edge of the body substrate; the second busbar substrate is stacked on the first busbar substrate; the sampling terminal extends beyond the second busbar substrate in its own protruding direction.

[0006] The above-mentioned technical features have at least the following advantages and beneficial effects: The sampling terminal protrudes from the surface or edge of the main substrate, extending beyond the second busbar substrate in its protruding direction. The first and second busbar substrates, when stacked, work together to carry out current transmission. After the second busbar substrate is stacked on top of the first busbar substrate, the sampling terminal remains exposed to ensure it can connect to the corresponding data acquisition structure and guarantee normal sampling operation.

[0007] The sampling terminal is integrally formed on the first busbar substrate, eliminating the need for bolts or studs for sampling on the first busbar. This simplifies the processing steps of the conductive busbar, thereby reducing the production cycle and cost.

[0008] In one embodiment, the second busbar substrate is stacked on the main body substrate along a first direction; the sampling terminal protrudes from the edge of the main body substrate along a second direction; the first direction is perpendicular to the second direction. This vertical arrangement ensures that the stacking direction of the conductive busbar and the sampling terminal do not interfere with each other spatially.

[0009] In one embodiment, the first busbar substrate is a sheet structure; both the body substrate and the sampling terminal extend within a first plane. Since the body substrate and the sampling terminal are in the same plane, they can be quickly formed by stamping without requiring additional processing steps.

[0010] In one embodiment, the second busbar substrate is a sheet structure, and the plane containing the second busbar substrate is parallel to the first plane. Both the first busbar substrate and the second busbar substrate are parallel to the first plane, and both the first busbar substrate and the second busbar substrate are sheet structures, which are convenient for processing and forming, and easy for stacking and welding.

[0011] In one embodiment, the second busbar substrate does not extend beyond the edge of the main body substrate in the protruding direction of the sampling terminal, ensuring that the second busbar substrate does not interfere with the sampling terminal.

[0012] In one embodiment, the outer contour dimensions of the second busbar substrate are the same as those of the main body substrate. This makes full use of space, allowing the conductive busbar to have a greater current-carrying capacity. The identical dimensions also facilitate alignment, making it easier to connect and fix the first and second busbars.

[0013] In one embodiment, multiple second busbar substrates are provided, and the multiple second busbar substrates are stacked on the same side of the first busbar substrate. The stacking of multiple second busbar substrates ensures the current carrying capacity of the conductive busbar.

[0014] In one embodiment, multiple second busbar substrates are provided; the second busbar substrates are respectively provided on opposite sides of the first busbar substrate. Providing second busbar substrates on both sides of the first busbar substrate avoids the problem of excessive structural thickness caused by unilateral stacking, ensuring uniform current transmission between the layers.

[0015] In one embodiment, the sampling terminal has a through sampling hole. The sampling hole allows for quick and easy connection of the external monitoring harness to the sampling terminal via a quick-plugging method. Using the sampling hole to secure the detection harness or connector ensures reliable and stable connection, effectively reducing the risk of system failures caused by poor contact.

[0016] In one embodiment, connecting holes are provided at both ends of the length direction of the main body substrate and at both ends of the length direction of the second busbar substrate; the connecting holes at the same end of the main body substrate and the second busbar substrate are interconnected. The connecting holes can be used to fix the conductive busbar on the electrical structure. The connecting holes can also be used for positioning when the first busbar substrate and the second busbar substrate are welded and fixed.

[0017] In one embodiment, the main substrate and the second busbar substrate are joined together by laser welding or molecular diffusion welding. Laser welding or molecular diffusion welding allows for rapid and secure connection and fixation of the main substrate and the second busbar substrate.

[0018] According to a second aspect of this application, this application provides a battery pack including the aforementioned conductive busbar. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of the first embodiment of the conductive busbar of this application.

[0021] Figure 2 This is a schematic diagram of the structure of the first busbar substrate of this application.

[0022] Figure 3 This is a front view of an embodiment of the first busbar substrate of this application.

[0023] Figure 4 This is a schematic diagram of the structure of the second busbar substrate embodiment of this application.

[0024] Figure 5 This is a schematic diagram of another embodiment of the conductive busbar of this application.

[0025] Figure label: 100, First busbar substrate; 110, Body substrate; 120, Sampling terminal; 121, Sampling hole; 122, Chamfered structure; 200, Second busbar substrate; 300, Connection hole. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of the present utility model and are not intended to limit the present utility model. In the present utility model, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0027] In related technologies, sampling terminals are installed on conductive busbars and connected to the battery management system to monitor the battery pack's operating status (such as voltage and temperature) in real time. The installation of sampling terminals on high-voltage busbars mainly adopts a "retrofit" approach. For example, holes are drilled in the busbar and then bolted to secure the ring terminals, or studs are riveted and then terminals are fitted and nuts are tightened. These methods require additional drilling, riveting, and assembly processes, leading to increased process complexity and production costs, while also posing a risk of loosening or failure of connecting components.

[0028] One technical concept of this application is to propose a conductive busbar in which the sampling terminal is integrally formed on the corresponding structure of the conductive busbar, simplifying the manufacturing process of the conductive busbar and ensuring that the sampling terminal on the conductive busbar is more stable and reliable.

[0029] Figure 1 This is a schematic diagram of the structure of the first embodiment of the conductive busbar of this application. Figure 2 This is a schematic diagram of the structure of the first busbar substrate 100 of this application.

[0030] See Figure 1 and Figure 2 A conductive busbar is a structure used to transmit large currents, such as during the charging of electric vehicles. The conductive busbar includes a first busbar substrate 100 and a second busbar substrate 200. The second busbar substrate 200 is stacked on top of the first busbar substrate 100, increasing the busbar's current-carrying capacity and reducing energy loss during current transmission. The stacked busbar also optimizes stray inductance and suppresses voltage spikes. Furthermore, the stacked busbar has a larger area and better structural strength, thereby enhancing heat dissipation and mechanical strength.

[0031] The second busbar substrate 200 and the first busbar substrate 100 are metal layers with the same or similar conductivity, specifically formed by stamping copper or aluminum alloy sheets. For example, a copper or aluminum alloy sheet with a thickness of 0.5 mm to 2 mm can be used for stamping. Stacking refers to one or more second busbar substrates 200 arranged in a layered manner on the surface of the first busbar substrate 100, for example, by fixing them together through laser welding or molecular diffusion welding.

[0032] In one embodiment, the first busbar substrate 100 and the second busbar substrate 200 are structures made of the same conductive material. For example, both the first busbar substrate 100 and the second busbar substrate 200 are structures made of copper sheets. Alternatively, both the first busbar substrate 100 and the second busbar substrate 200 are structures made of aluminum sheets.

[0033] In another embodiment, the first busbar substrate 100 and the second busbar substrate 200 can be structures made of different conductive materials. For example, the first busbar substrate 100 can be a structure made of copper sheet, and the second busbar substrate 200 can be a structure made of aluminum sheet. Alternatively, the first busbar substrate 100 can be a structure made of aluminum sheet, and the second busbar substrate 200 can be a structure made of copper sheet.

[0034] The first busbar substrate 100 and the second busbar substrate 200 can be structures made of the same or different conductive materials, which will not be elaborated here.

[0035] Figure 3 This is a front view of an embodiment of the first busbar substrate 100 of this application.

[0036] See Figures 1 to 3 The first busbar substrate 100 includes a body substrate 110 and a sampling terminal 120; the sampling terminal 120 and the body substrate 110 are integrally formed, and the sampling terminal 120 protrudes from the surface or edge of the body substrate 110.

[0037] The substrate 110 serves as the main structure of the first busbar substrate 100 and is used to transmit current. The sampling terminal 120 serves as an electrical or voltage monitoring interface, used to collect current or voltage data of the busbar in real time to determine the working status of the busbar.

[0038] The sampling terminal 120 is integrally formed on the first busbar substrate 100, eliminating the need for subsequent processes such as drilling holes, installing bolts, or riveting studs on the first busbar substrate 100, thereby improving the overall production efficiency of the conductive busbar. Simultaneously, the integral forming of the sampling terminal 120 on the first busbar substrate 100 effectively prevents loosening of the sampling terminal 120, avoids poor connection, ensures the stability and reliability of the sampling terminal 120, and guarantees the reliability of the sampling data.

[0039] The sampling terminal 120 protrudes from the surface or edge of the main substrate 110, extending beyond the second busbar substrate 200 in its protruding direction. After the first busbar substrate 100 and the second busbar substrate 200 are stacked, they jointly undertake the task of current transmission. After the second busbar substrate 200 is stacked on top of the first busbar substrate 100, the sampling terminal 120 remains exposed to ensure that it can be connected to the corresponding data acquisition structure, thus ensuring normal sampling operation.

[0040] In one embodiment, the sampling terminal 120 protrudes from one side edge of the body substrate 110, and the sampling terminal 120 and the body substrate 110 are integrally stamped.

[0041] In another embodiment, the sampling terminal 120 is disposed within the coverage area of ​​the body substrate 110, and the sampling terminal 120 protrudes from the side of the body substrate 110. The sampling terminal 120 is formed by stamping and bending on the surface of the body substrate 110.

[0042] In some embodiments, the sampling terminal 120 has a through sampling hole 121. The sampling hole 121 allows for quick connection of external monitoring harnesses to the sampling terminal 120 via a quick-plugging method. Fixing the detection harness or connector through the sampling hole 121 ensures reliable and stable connection, effectively reducing the risk of system failures caused by poor contact.

[0043] In one example, sampling hole 121 is a round hole to facilitate the connection of a round connector and to facilitate quick connection with the acquisition harness.

[0044] In some embodiments, the sampling hole 121 can be of different shapes, such as an elliptical hole or a square hole.

[0045] In one example, the first busbar substrate 100 is a one-piece stamped structure. The sampling terminal 120 and the sampling hole 121 are also one-piece stamped.

[0046] In some embodiments, the corners of the sampling terminal 120 are further provided with chamfers or rounded corners, which may also be integrally stamped. For example, the sampling terminal 120 has a chamfer structure 122 at the corner of the end facing away from the main body terminal.

[0047] In other examples, the sampling hole 121 and the chamfer can be structures formed by subsequent machining.

[0048] In one embodiment, the second busbar substrate 200 is stacked on the body substrate 110 along a first direction; the sampling terminal 120 protrudes from the edge of the body substrate 110 along a second direction; the first direction is perpendicular to the second direction.

[0049] The first direction refers to the stacking direction of the second busbar substrate 200 and the main body substrate 110. For example, the direction of stacking vertically can be used as the first direction, such as the second busbar substrate 200 being located on the upper or lower surface of the main body substrate 110.

[0050] The second direction refers to the protruding direction of the sampling terminal 120 relative to the edge of the body substrate 110. For example, the first direction is the up-down direction, and the second direction is the left-right direction. The sampling terminal 120 extends outward from the left or right edge of the body substrate 110.

[0051] In some embodiments, the sampling terminal is disposed on the edge of the body substrate along the length direction, the length of the body substrate is L, and the distance between the sampling terminal and any end of the body terminal along the length direction is greater than 1 / 5L, thereby effectively avoiding interference between the sampling terminal and the two ends of the conductive busbar, and ensuring the connection between the two ends of the conductive busbar on the external structure.

[0052] In one example, the second busbar substrate 200 is stacked vertically with the main substrate 110, with the second busbar substrate 200 covering the upper surface of the main substrate 110. The sampling terminal 120 extends horizontally outward from the side of the main substrate 110. Because the stacking direction is perpendicular to the protrusion direction, the second busbar substrate 200 does not cover the extension path of the sampling terminal 120 during stacking. The side of the second busbar substrate 200 does not spatially overlap with the horizontal extension of the sampling terminal 120. This ensures that the overall structure of the conductive busbar is rationally distributed in three-dimensional space, avoiding structural interference.

[0053] The vertical layout ensures that the stacking direction of the conductive busbars does not interfere with the sampling terminals 120 in space. For example, the second busbar substrate 200 only covers the upper surface area of ​​the main substrate 110, while the sampling terminals 120 extend horizontally from the side to the uncovered area, facilitating the connection of wire harnesses or connectors to the sampling terminals 120.

[0054] The stacking direction of the conductive busbar is different from the extension direction of the sampling terminal 120, avoiding physical compression or obstruction of the terminal during the stacking process. The stacking operation of the second busbar substrate 200 does not affect the structural integrity of the sampling terminal 120. At the same time, the vertical layout makes the overall structure of the conductive busbar more compact. For example, the stacked part and the sampling terminal 120 form a compact combination in the orthogonal direction, reducing space redundancy and facilitating integration in limited installation space.

[0055] In one example, the first busbar substrate 100 is a sheet-like structure; the main substrate 110 and the sampling terminal 120 both extend within a first plane. A sheet-like structure refers to a plate-like form with uniform thickness and a flat surface, which can be achieved by cutting and forming metal sheets using a stamping process. This structure simplifies the processing flow and reduces material waste. The sheet-like first busbar substrate 100 can be formed through a single stamping process, eliminating the need for other processing steps, thus facilitating rapid processing of the first busbar substrate 100.

[0056] The substrate 110 and the sampling terminal 120 are coplanar and can be formed by stamping. No additional processing steps are required.

[0057] The first busbar substrate 100 is formed into a sheet structure through a stamping process. The main body substrate 110 and the sampling terminal 120 are integrally formed and remain coplanar during the stamping process. The second busbar substrate 200 covers the area of ​​the main body substrate 110 in a parallel stacking manner, so that the sampling terminal 120 extends outward from the edge of the second busbar substrate 200. Since the main body and the terminal are on the same plane, the connector of the monitoring harness can be directly attached to the surface of the sampling terminal 120 for fixation without adjusting the connection angle.

[0058] In some embodiments, the extension direction of the body substrate 110 may be on a different plane from that of the sampling terminal 120. In one example, the body terminal has a continuously bent structure, and the sampling terminal 120 protrudes from a portion of the edge of the body terminal. In another example, the body terminal has an arc-shaped or other structure, and the sampling terminal 120 protrudes from a portion of the edge of the body terminal.

[0059] Figure 4 This is a schematic diagram of the structure of the second busbar substrate 200 embodiment of this application.

[0060] See Figures 1 to 4 The first busbar substrate 100 has a sheet-like structure; the main body substrate 110 and the second busbar substrate 200 also have sheet-like structures, and the plane containing the second busbar substrate 200 is parallel to the first plane. This planar fit facilitates the welding of the first busbar substrate 100 and the second busbar substrate 200.

[0061] The sheet-like structure of the second busbar substrate 200 allows it to form a parallel laminated relationship with the equally sheet-like first busbar substrate 100. During the lamination process, the planes of the second busbar substrate 200 and the first busbar substrate 100 remain parallel, and current conduction is achieved through surface contact. Since there is no tilting or misalignment when the planes are laminated, the contact area between the busbars is maximized, and welding energy can be uniformly applied to the laminated interface, thereby forming a continuous metallurgical bonding layer.

[0062] In one embodiment, the second busbar substrate 200 does not extend beyond the edge of the main substrate 110 in the protruding direction of the sampling terminal 120, ensuring that the second busbar substrate 200 will not interfere with the sampling terminal 120.

[0063] In one example, the outer contour dimensions of the second busbar substrate 200 are the same as those of the main body substrate 110. Same outer contour dimensions mean that the second busbar substrate 200 and the main body substrate 110 of the first busbar substrate 100 are completely identical in length, width, and edge shape. This can be achieved through one-time forming with a stamping die or through step-by-step processing, ensuring edge alignment during stacking. The purpose of identical outer contour dimensions is to eliminate edge misalignment of the stacked busbars and avoid installation interference problems caused by dimensional differences.

[0064] The second busbar substrate 200 and the main substrate 110 are stacked with the same external dimensions, so that their edges completely overlap after stacking. During the internal assembly of the battery pack, the overall shape of the stacked busbar remains regular and can be directly fixed by a uniform positioning fixture without additional position adjustment. For example, in laser welding processes, the edge-aligned structure can simplify welding path planning, improve processing efficiency, and reduce the risk of welding defects caused by misalignment.

[0065] The second busbar substrate 200 has the same shape as the main body substrate 110, making the structure more compact. This not only facilitates quick positioning when the two are assembled, eliminating the need for secondary adjustments during installation, but also significantly improves assembly efficiency.

[0066] In some embodiments, the second busbar substrate 200 and the body substrate 110 have different external dimensions. For example, the second busbar substrate 200 is smaller than the body substrate 110, and the second busbar substrate 200 is located within the coverage area of ​​the first busbar substrate 100.

[0067] See Figures 1 to 4 Multiple second busbar substrates 200 are provided, and multiple second busbar substrates 200 are stacked on the same side of the first busbar substrate 100.

[0068] The first busbar substrate 100 serves as the basic conductive layer, and multiple second busbar substrates 200 are sequentially stacked on the same side surface to form a composite conductive structure. The planar dimensions of each second busbar substrate 200 can be consistent with the body portion of the first busbar substrate 100, and interlayer electrical connections are achieved through a welding process. During current transmission, the multiple stacked second busbar substrates 200 jointly undertake the current-carrying task, and their total cross-sectional area increases with the number of layers, thereby improving the overall conductivity.

[0069] Figure 5 This is a schematic diagram of another embodiment of the conductive busbar of this application.

[0070] See Figure 5 and combined Figures 1 to 4 In this embodiment, the conductive busbar includes a first busbar substrate 100 and a second busbar substrate 200. The first busbar substrate 100 and the second busbar substrate 200 refer to the structure described above, except that: multiple second busbar substrates 200 are provided; and second busbar substrates 200 are respectively provided on opposite sides of the first busbar substrate 100.

[0071] During the manufacturing process of the conductive busbar, multiple second busbar substrates 200 are respectively arranged on opposite sides of the first busbar substrate 100. For example, one second busbar substrate 200 is stacked on each of the upper and lower surfaces of the first busbar substrate 100. Through this symmetrical stacking design, the overall thickness of the busbar is distributed to both sides, avoiding the problem of excessive structural thickness caused by stacking on one side. At the same time, the multiple second busbar substrates 200 are connected to the first busbar substrate 100 through a welding process to form an integrated conductive structure, ensuring uniform current transmission between the layers.

[0072] See Figures 1 to 5 Both ends of the main body substrate 110 and both ends of the second busbar substrate 200 in the length direction are provided with connecting holes 300; the connecting holes 300 at the same end of the main body substrate 110 and the second busbar substrate 200 are connected.

[0073] In some embodiments, when the busbar is installed to the battery module, bolts can pass sequentially through the connection holes 300 at the same end of the main body substrate 110 and the second busbar substrate 200, and be locked with the threaded holes of the battery terminals. This design fixes the overall connection position of the stacked busbars, avoiding installation difficulties caused by misalignment between layers.

[0074] Meanwhile, when the first busbar substrate 100 and the second busbar substrate 200 are welded and aligned, the positioning post passes through the connecting hole 300 at the same end of the first busbar substrate 100 and the second busbar substrate 200 to facilitate rapid alignment of the first busbar substrate 100 and the second busbar substrate 200.

[0075] The number of connection holes 300 can be set to two, three, or four, etc.

[0076] The first busbar substrate 100 and the second busbar substrate 200 are stacked and connected as one unit by molecular diffusion welding or laser welding; both the first busbar substrate 100 and the second busbar substrate 200 are stamped structures.

[0077] Molecular diffusion welding refers to a welding method that uses high temperature and pressure to induce atomic diffusion at the contact surfaces of base materials, forming a metallurgical bond. Specifically, it can be achieved using vacuum diffusion welding equipment under inert gas protection, forming a high-strength bond without the need for additional solder. Laser welding, on the other hand, uses a high-energy laser beam to melt the surface of the base material. Specifically, it can be achieved using a fiber laser to continuously scan and weld the edges of stacked base material layers, resulting in a small heat-affected zone and high welding speed. After the first busbar substrate 100 and the second busbar substrate 200 are stamped to form a sheet structure, they are stacked and aligned along the lamination direction, and a metallurgical bond is formed at the contact surface or edge through molecular diffusion welding or laser welding. Molecular diffusion welding uses high temperature and pressure to cause the atoms of the two base materials to diffuse into each other, forming a strong connection without interface defects; laser welding uses a high-energy beam to locally melt the base materials, achieving rapid fusion. The stamping process ensures that the base materials have a regular shape, which facilitates lamination alignment and welding positioning.

[0078] In one specific embodiment, a first busbar substrate 100 and a second busbar substrate 200 are formed by stamping, and both the first busbar substrate 100 and the second busbar substrate 200 have sheet-like structures. The stamped first busbar substrate 100 includes a body substrate 110 and a sampling terminal 120. The sampling terminal 120 protrudes from one side of the edge of the first busbar substrate 100. The second busbar substrate 200 and the body substrate 110 have the same external contour.

[0079] The first busbar substrate 100 and the second busbar substrate 200 are stacked at the welding station and welded by molecular diffusion welding or laser welding. The welded conductive busbars are then surface-treated.

[0080] This application also provides a battery pack, which includes the conductive busbar described in the above embodiments. The specific structure of the conductive busbar is the same as described in the above embodiments. Since this conductive busbar adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here.

[0081] The embodiments of this utility model have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A conductive busbar, characterized in that, include: The first busbar substrate (100) includes a body substrate (110) and a sampling terminal (120); the sampling terminal (120) and the body substrate (110) are integrally formed, and the sampling terminal (120) protrudes from the surface or edge of the body substrate (110); A second busbar substrate (200) is stacked on top of the first busbar substrate (100); the sampling terminal (120) extends beyond the second busbar substrate (200) in its own protruding direction.

2. The conductive busbar according to claim 1, characterized in that, The second busbar substrate (200) is stacked on the body substrate (110) along the first direction; the sampling terminal (120) protrudes from the edge of the body substrate (110) along the second direction; the first direction is perpendicular to the second direction.

3. The conductive busbar according to claim 2, characterized in that, The first busbar substrate (100) has a sheet structure; the main substrate (110) and the sampling terminal (120) both extend in the first plane.

4. The conductive busbar according to claim 3, characterized in that, The second busbar substrate (200) has a sheet structure, and the plane on which the second busbar substrate (200) is located is parallel to the first plane.

5. The conductive busbar according to claim 1, characterized in that, The second busbar substrate (200) does not extend beyond the edge of the body substrate (110) in the protruding direction of the sampling terminal (120).

6. The conductive busbar according to claim 5, characterized in that, The outer contour dimensions of the second busbar substrate (200) are the same as those of the main body substrate (110).

7. The conductive busbar according to claim 1, characterized in that, Multiple second busbar substrates (200) are provided, and multiple second busbar substrates (200) are stacked on the same side of the first busbar substrate (100).

8. The conductive busbar according to claim 1, characterized in that, Multiple second busbar substrates (200) are provided; the second busbar substrates (200) are respectively provided on the opposite sides of the first busbar substrate (100).

9. The conductive busbar according to any one of claims 1 to 8, characterized in that, The sampling terminal (120) has a through sampling hole (121).

10. The conductive busbar according to any one of claims 1 to 8, characterized in that, Both ends of the main body substrate (110) and both ends of the second busbar substrate (200) in the length direction are provided with connecting holes (300); the connecting holes (300) at the same end of the main body substrate (110) and the second busbar substrate (200) are connected.

11. The conductive busbar according to any one of claims 1 to 8, characterized in that, The main substrate (110) and the second busbar substrate (200) are connected together by laser welding or molecular diffusion welding.

12. A battery pack, characterized in that, Includes the conductive busbar according to any one of claims 1 to 11.

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