Middle frame assembly and electronic device

Abstract

The present disclosure provides a middle frame assembly and an electronic device, the middle frame assembly comprising: a middle plate; a frame body surrounding an outer periphery of the middle plate, the frame body and the middle plate enclosing a battery compartment for accommodating a battery; at least one flexible circuit board; the middle plate comprising at least one groove recessed in a direction away from the battery compartment from a first surface, the at least one flexible circuit board being correspondingly arranged in the at least one groove, the first surface being a surface of the middle plate close to the battery compartment; the middle frame assembly further comprising an adhesive layer having opposite first and second adhesive surfaces, the first adhesive surface being adhered to the first surface and a surface of the at least one flexible circuit board close to the battery compartment, and the second adhesive surface being used for adhering to the battery.

Description

Technical Field

[0001] This disclosure relates to the field of electronic device technology, and more particularly to a mid-frame assembly and an electronic device. Background Technology

[0002] All existing electronic devices, such as mobile phones, tablets, and wearable devices, include batteries, which are bonded to the battery compartment via adhesive layers. Taking mobile phones as an example, they often adopt a three-section design architecture: motherboard + battery + sub-board. The motherboard and sub-board are electrically connected through a flexible circuit board.

[0003] To reduce the overall thickness of the phone, the adhesive layer typically needs to avoid the location of the flexible circuit board during battery bonding. However, with the increasing functionality of mobile phones and the growing demand for low impedance flexible circuit boards, the width of the flexible circuit board needs to be wider, or two or more flexible circuit boards need to be used. This significantly reduces the battery bonding area and decreases the stability of the battery bond. Utility Model Content

[0004] To overcome the problems existing in the related technologies, this disclosure provides a mid-frame component and an electronic device.

[0005] According to a first aspect of this disclosure, a mid-frame assembly is provided, comprising: a mid-plate; a frame surrounding the outer periphery of the mid-plate, the frame and the mid-plate forming a battery compartment for accommodating a battery; at least one flexible circuit board; the mid-plate including at least one recess formed recessed from a first surface in a direction away from the battery compartment, the at least one flexible circuit board being correspondingly disposed within the at least one recess, the first surface being the surface of the mid-plate adjacent to the battery compartment; the mid-frame assembly further comprising an adhesive layer having opposing first adhesive surfaces and second adhesive surfaces, the first adhesive surfaces being bonded to the first surface and the surface of the at least one flexible circuit board adjacent to the battery compartment, the second adhesive surfaces being used for bonding to the battery.

[0006] In some embodiments, the surface of the flexible circuit board near the battery compartment is lower than the first surface; the adhesive layer includes at least one first portion corresponding to at least one groove and a plurality of second portions corresponding to areas outside the groove, wherein the thickness of the first portion is greater than the thickness of the second portions.

[0007] In some embodiments, the surface of the flexible circuit board near the battery compartment is flush with the first surface.

[0008] In some embodiments, the middle plate and the frame are integrally formed, or the middle plate and the frame are connected by connectors or welding.

[0009] In some embodiments, the at least one flexible circuit board is integrally formed with the middle plate.

[0010] According to a second aspect of the present disclosure, an electronic device is provided, including a mid-frame assembly and a battery. The mid-frame assembly includes a mid-plate, a frame, at least one flexible circuit board, and an adhesive layer. The frame surrounds the outer periphery of the mid-plate, forming a battery compartment with the mid-plate, and the battery is disposed within the battery compartment. The mid-plate includes at least one recess formed from a first surface in a direction away from the battery compartment. The at least one flexible circuit board is correspondingly disposed within the at least one recess. The first surface is the surface of the mid-plate adjacent to the battery compartment. A first adhesive surface of the adhesive layer is bonded to the first surface and the side of the at least one flexible circuit board adjacent to the battery compartment, and a second adhesive surface is bonded to the battery to fix the battery within the battery compartment.

[0011] In some embodiments, the surface of the flexible circuit board near the battery compartment is lower than the first surface; the adhesive layer includes at least one first portion corresponding to at least one groove and a plurality of second portions corresponding to areas outside the groove, wherein the thickness of the first portion is greater than the thickness of the second portions.

[0012] In some embodiments, the surface of the flexible circuit board near the battery compartment is flush with the first surface.

[0013] In some embodiments, the middle plate and the frame are integrally formed, or the middle plate and the frame are connected by connectors or welding.

[0014] In some embodiments, the at least one flexible circuit board is integrally formed with the middle plate.

[0015] The mid-frame assembly provided in this disclosure integrates the flexible circuit board with the mid-frame by creating a recessed groove on the mid-plate and embedding a flexible circuit board therein, then using an adhesive layer to bond the flexible circuit board to the mid-plate and the battery. This integrated design not only solves the problem of the flexible circuit board passing through the battery compartment and occupying adhesive space in traditional designs, but also reduces line impedance and improves overall electrical performance by increasing the trace width of the flexible circuit board. Attached Figure Description

[0016] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0017] Figure 1 This is a structural diagram of an exemplary mobile phone in the related art;

[0018] Figure 2 for Figure 1 AA section view;

[0019] Figure 3 A schematic structural diagram of the mid-frame component provided in an embodiment of this disclosure;

[0020] Figure 4 for Figure 3 BB section view;

[0021] Figure 5 A schematic structural diagram of a mid-frame assembly provided in another embodiment of this disclosure;

[0022] Figure 6 This is a schematic structural diagram of an electronic device provided in an embodiment of the present disclosure. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this disclosure clearer, the disclosure will be further described in detail below with reference to the accompanying drawings. The described embodiments should not be regarded as limitations on this disclosure. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0024] In the following description, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0025] In the following description, the terms “first, second, third” are used merely to distinguish similar objects and do not represent a specific ordering of objects. It is understood that “first, second, third” may be interchanged in a specific order or sequence where permitted, so that the embodiments of this disclosure described herein can be implemented in an order other than that illustrated or described herein.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing embodiments of this disclosure only and is not intended to be limiting of this disclosure.

[0027] With the development of technology, electronic products such as smartphones and tablets have rapidly become widespread. These products have greatly promoted social development and made people's lives more convenient. When designing electronic products like smartphones, while providing a comfortable user experience, there is an increasing pursuit of exquisite appearance and texture. This places increasingly higher demands on smartphone design, making smartphones thinner and lighter a key objective in smartphone structural design.

[0028] Figure 1 This is a structural diagram of an exemplary mobile phone in the related art. Figure 2 for Figure 1 AA sectional view. Figure 1 and Figure 2 The mobile phone 100 includes a mid-frame assembly 110, a motherboard 120, a sub-board 130, a battery 140, a flexible circuit board 150, a screen 160, and a back cover 170.

[0029] The mid-frame assembly 110 is a structural support component used to support and fix the internal components of the mobile phone 100, ensuring the stability of each component. The motherboard 120 integrates the core chip of the mobile phone 100 and various connection interfaces. The sub-board 130, also known as the small board, usually integrates the interfaces at the bottom of the mobile phone 100, speaker and microphone interfaces, and antennas, etc. The battery 140 is connected to the motherboard 120 through a connector to provide power to the components in the mobile phone 100. The screen 160 and the back cover 170 are respectively located on both sides of the mid-frame assembly 110.

[0030] In the mobile phone 100 described above, the mainboard 120 and the sub-board 130 are connected by a flexible printed circuit board 150. The flexible printed circuit board (FPC) 150 is a printed circuit board made of a flexible insulating substrate, possessing many advantages that rigid printed circuit boards (PCBs) lack. For example, the flexible circuit board 150 can be freely bent, rolled, and folded, and can be arranged arbitrarily according to spatial layout requirements, thereby achieving integrated component assembly and wire connection. Due to these advantages, using the flexible circuit board 150 can effectively reduce the size or thickness of electronic products, increase the flexibility of circuit layout, and meet the needs of electronic products developing towards high density, miniaturization, and high reliability.

[0031] In the related technical solution, the mid-frame assembly 110 includes a mid-plate 111 and a frame 112 surrounding the mid-plate. The main plate 120 and the sub-plate 130 are disposed at both ends of the mid-plate 111 along the length direction, and the flexible circuit board 150 is disposed between the battery 140 and the mid-plate 111.

[0032] To secure the battery 140 inside the phone 100, an adhesive layer 180 is also required at the bottom of the battery 140 to fix the battery 140 to the middle plate. See [link to relevant documentation]. Figure 2 As shown in the structure, the adhesive layer 180 needs to be placed away from the area where the flexible circuit board 150 is located. If the adhesive layer 180 covers the upper surface of the flexible circuit board 150, it will increase the space occupied in the thickness direction, which is not conducive to the thin and light design of the mobile phone 100.

[0033] However, for current mobile phones, the flexible circuit board has many traces, making it wider. With the same battery width, the wider the flexible circuit board, the smaller the area available for bonding, which can lead to unreliable battery bonding. If the width of the flexible circuit board is reduced in order to increase the bonding area, the impedance of the flexible circuit board will increase.

[0034] Therefore, how to increase the bonding area of ​​the battery to improve structural stability while ensuring the performance of the flexible circuit board has become an urgent problem to be solved.

[0035] In view of the above problems, the present disclosure provides a mid-frame component and an electronic device. The technical solution of the present disclosure will be described in detail below with reference to the accompanying drawings.

[0036] Figure 3 This is a schematic structural diagram of the mid-frame component provided in an embodiment of this disclosure. Figure 4 yes Figure 3 BB sectional view. For example... Figure 3 and Figure 4 As shown, the mid-frame assembly 300 includes a mid-plate 310, a frame 320, a flexible circuit board 330, and an adhesive layer 340.

[0037] It is understood that the mid-frame assembly 300 provided in this embodiment is typically used in various types of electronic devices such as mobile phones, tablets, and smart wearable devices. The frame 320 can be connected to components such as the screen and back cover in the electronic device. Simultaneously, the frame 320 can also be provided with multiple openings to accommodate buttons and form charging ports and headphone jacks for the electronic device. The middle plate 310 can be used to support the motherboard, sub-board, battery, and other electronic components in the electronic device, all of which can be fixed on the middle plate 310.

[0038] As core structural components of the mid-frame assembly 300, the frame 320 and the middle plate 310 typically possess high mechanical strength, ensuring the structural stability and reliability of the mid-frame assembly 300. The frame 320 and the middle plate 310 can be made of metallic materials such as magnesium alloy, stainless steel, and aluminum alloy, or they can be made of non-metallic materials such as plastic, glass, and ceramics; this disclosure does not specifically limit their use. It is also understood that the materials of the frame 320 and the middle plate 310 can be the same or different, and this disclosure also does not limit their use.

[0039] The frame 320 surrounds the outer periphery of the middle plate 310, together forming a complete middle frame structure. The frame 320 and the middle plate 310 together form a battery compartment. When applied to electronic devices with batteries, the electronic device's battery is housed within the aforementioned battery compartment.

[0040] The flexible circuit board 330 is a highly reliable and flexible printed circuit board made with polyimide or polyester film as a substrate. In this disclosure, the flexible circuit board 330 also includes a rigid-flex structure board, and a portion of the flexible circuit board 330 can be a rigid circuit board.

[0041] In this disclosure, the flexible circuit board 330 can be a conventional flexible circuit board, or a special flexible board such as chip-on flex or chip-on film (COF) or chip-on plastic (COP). This disclosure does not limit it in this regard.

[0042] In this disclosure, the flexible circuit board 330 can be of any shape, such as rectangular, rhomboid, trapezoidal, circular, or any irregular shape, and this disclosure does not limit it. In a specific embodiment of this disclosure, the flexible circuit board 330 is constructed as a long strip structure, and its two ends along the length direction can be connected to the main board and sub-board of the electronic device respectively, thereby realizing the electrical connection between the main board and the sub-board.

[0043] The number of at least one flexible circuit board 330 mentioned in the embodiments of this disclosure can be one or more, and the embodiments of this disclosure do not specifically limit this.

[0044] Continue reading Figure 3 and Figure 4 The middle plate 310 has at least one groove 312 formed from the first surface 311 in a direction away from the battery compartment. The aforementioned at least one flexible circuit board 330 is correspondingly disposed in the at least one groove 312, wherein the first surface 311 is the surface of the middle plate 310 near the battery compartment.

[0045] The shape of the groove 312 matches the shape of the flexible circuit board 330. For example, when the flexible circuit board 330 is rectangular, the shape of the groove 312 is rectangular.

[0046] It is also understood that the depth of the aforementioned groove 312 is configured to match the thickness of the flexible circuit board 330 to ensure that when the flexible circuit board 330 is placed in the groove 312, the upper surface of the flexible circuit board 330 (i.e., the side near the battery compartment) does not protrude beyond the first surface 311 of the middle plate 310. For example, the thickness of the flexible circuit board 330 is 0.2 mm, and the depth of the groove 312 is 0.3 mm.

[0047] The adhesive layer 340 is disposed on the side of the middle plate 310 near the battery compartment and has a first adhesive surface 341 and a second adhesive surface 342. The first adhesive surface 341 is bonded to the first surface 311 and the surface of at least one flexible circuit board 330 near the battery compartment, and the second adhesive surface 342 is used to bond to the battery.

[0048] The aforementioned adhesive layer 340 can be various types of adhesive materials such as hot melt adhesive, pressure-sensitive adhesive, or easy-pull adhesive. Hot melt adhesive can be cured quickly under heating to form a strong adhesive effect, while pressure-sensitive adhesive can be directly applied at room temperature, and easy-pull adhesive can be quickly removed by pulling, thus facilitating maintenance and replacement.

[0049] In this embodiment of the disclosure, the shape of the second adhesive surface 342 is matched with the shape of the battery. For example, the shape of the battery in devices such as mobile phones and tablets is usually a regular square structure. The side of the battery that contacts the adhesive layer 340 is a flat surface. At this time, the second adhesive surface 342 is set as a plane, so that the contact area of ​​the battery when it is bonded to the second adhesive surface 342 is larger.

[0050] It is also understood that the first adhesive surface 341 of the adhesive layer 340 is in contact with both the surface of the flexible circuit board 330 and the first surface 311 of the middle plate 310. The first adhesive surface 341 also has a large contact area, which increases the overall adhesive area of ​​the battery and ensures that the battery is firmly bonded.

[0051] Compared to Figure 1 and Figure 2In the technical solution of the related technology shown in this disclosure, the first adhesive surface 341 of the adhesive layer 340 almost covers all areas of the middle plate 310, thus eliminating the need to consider the actual area available for bonding. Therefore, in order to reduce line impedance, the trace width of the flexible circuit board 330 can be appropriately increased without affecting the bonding area, thereby improving the electrical performance of electronic devices using this middle frame assembly 300. Simultaneously, this bonding method allows for a more flexible arrangement of the flexible circuit board 330, enabling it to be placed at any position on the middle plate 310, thus improving the design flexibility of electronic devices.

[0052] In summary, the mid-frame assembly provided in this disclosure achieves integrated construction of the flexible circuit board and the mid-frame by creating a recessed groove on the mid-plate and embedding a flexible circuit board therein, and then using an adhesive layer to bond the flexible circuit board to the mid-plate and the battery. This integrated design not only solves the problem of the flexible circuit board passing through the battery compartment and occupying adhesive space in traditional designs, but also reduces line impedance and improves overall electrical performance by increasing the trace width of the flexible circuit board.

[0053] In some embodiments, such as Figure 5 As shown, the surface of the flexible circuit board 330 near the battery compartment is lower than the first surface 311. This design effectively prevents interference between the flexible circuit board 330 and the battery. In this case, the adhesive layer 340 includes a first portion corresponding to the groove 312 and a second portion corresponding to the area outside the groove 312, so as to... Figure 5 For the middle plate 310 shown with a first groove 510 and a second groove 520, the adhesive layer 530 includes two first portions 531 and three second portions 532.

[0054] To ensure a tight fit between the adhesive layer 340 and the flexible circuit board 330, the thickness of the first part is set to be greater than that of the second part. This ensures that the adhesive layer 340 is firmly bonded to the flexible circuit board 330 and the first surface 311 of the middle plate 310. At the same time, the second adhesive surface 342 of the adhesive layer 340 near the battery compartment is ensured to be flat, which helps to ensure the flat fit of the battery during subsequent assembly.

[0055] According to the aforementioned technical means, the adhesive layer is designed with a non-uniform thickness structure. That is, the first part of the adhesive layer corresponding to the groove 312 on the middle frame is thicker, while the second part of the adhesive layer corresponding to the area outside the groove 312 is thinner. This non-uniform thickness structure design can enhance the adhesion of the adhesive layer in critical areas and prevent detachment caused by external impact or vibration.

[0056] In some embodiments, the surface of the flexible circuit board 330 near the battery compartment is flush with the first surface 311 of the middle plate 310. That is, after the flexible circuit is embedded into the groove 312 of the middle plate 310, the surface of the flexible circuit board 330 and the first surface 311 are at the same level, and there is no height difference between them. In this case, the adhesive layer 340 can be set to have a uniform thickness, and the adhesive layer 340 can be tightly bonded to both the flexible circuit board 330 and the middle plate 310.

[0057] According to the above technical means, by keeping the surface of the flexible circuit board 330 close to the battery compartment flush with the first surface 311 of the middle plate 310, the flatness and assembly consistency of the overall structure are improved, thereby increasing the bonding area between the battery and the middle plate 310, and further improving the fixing strength and structural stability of the battery.

[0058] In some embodiments, the middle plate 310 and the frame 320 in the middle frame assembly 300 are integrally formed, that is, the middle plate 310 and the frame 320 are not two separate parts, but an integral structure.

[0059] It is also understandable that when the middle plate 310 and the frame 320 are integrally molded, the middle plate 310 and the frame 320 can be made of the same material or different materials. When the middle plate 310 and the frame 320 are made of the same material, for metal materials such as stainless steel or aluminum alloy, they can be manufactured using forging, CNC machining, or die casting; for non-metallic materials, they can be molded using injection molding or 3D printing. When the middle plate 310 and the frame 320 are made of different materials, for example, when the middle plate 310 is made of metal and the frame is made of plastic, they can be manufactured using insert injection molding or nano-injection molding, thus achieving an integrally molded structure. This integral molding method can reduce assembly errors and failure rates.

[0060] In this embodiment, the middle plate 310 and the frame 320 can also be separate structures, and are connected by connectors or welding.

[0061] Understandably, the thickness of the middle plate 310 in the middle frame assembly 300 is usually small (e.g., less than 0.5 mm). During the CNC machining of the overall structure, the frame 320 of the middle frame assembly 300 is usually clamped on the machine tool fixture, and the middle plate 310 is partially suspended. When machining the groove 312 on the middle plate 310, the machining tool will apply a large pressure in a direction perpendicular to the surface of the middle plate 310. At this time, since there is no other supporting structure behind the suspended middle plate 310, the middle plate 310 will deform under the action of the tool pressure, and its flatness cannot be guaranteed, resulting in a decrease in the yield of the middle frame assembly 300.

[0062] By designing the middle plate 310 and the frame 320 as separate structures, the middle plate 310 and the frame 320 can be machined independently. When machining the middle plate 310, it can be fixed on a flat worktable and machined using a vertical milling machine or precision engraving machine. In this case, the back of the middle plate 310 always rests against the worktable, thus avoiding significant deformation under tool pressure. Furthermore, the separate machining method is lower in cost and more efficient than the one-piece molding method.

[0063] As mentioned above, the middle plate 310 and the frame 320 can be connected by a connector, such as a screw or a snap-fit ​​connector. The connector can be located at the edge of the middle plate 310 near the frame 320. In this case, the middle plate 310 and the frame 320 are detachably connected.

[0064] When both the middle plate 310 and the frame 320 are made of metal, they can also be connected by welding. For example, the middle plate 310 can be fixedly connected to the frame 320 by spot welding at the edge of the frame 320.

[0065] In some embodiments, the flexible circuit board 330 and the middle plate 310 are integrally formed. When the middle frame assembly 300 is processed by injection molding, the flexible circuit board 330 can be pre-placed into the injection mold of the middle frame assembly 300, and then the material of the middle frame assembly 300 can be injected into the injection mold, so as to achieve the effect of integrally forming the flexible circuit board 330 and the middle plate 310.

[0066] It should be noted that to achieve the effect of integral molding of the flexible circuit board 330 and the middle plate 310, the material of the flexible circuit board 330 needs to match the integral molding method. For example, when the method for manufacturing the middle frame assembly 300 is high-temperature injection molding, at least a portion of the flexible circuit board 330 can be made of a high-temperature resistant material. Alternatively, as a possible implementation, the flexible circuit board 330 can be embedded inside the middle plate 310 during the integral molding process.

[0067] like Figure 6 As shown, this disclosure also provides an electronic device, such as a mobile phone, tablet computer, wearable device, etc., which is not specifically limited in this disclosure. Figure 6 The electronic device 600 includes a mid-frame assembly 610 and a battery 620.

[0068] The mid-frame assembly 610 further includes a mid-plate 611, a frame 612, at least one flexible circuit board 613, and an adhesive layer 614.

[0069] The frame surrounds the outer periphery of the middle plate, forming a battery compartment together with the middle plate, and the battery is disposed within the battery compartment. The middle plate includes at least one recess formed from a first surface in a direction away from the battery compartment, and at least one flexible circuit board is disposed within the at least one recess. The first surface is the surface of the middle plate near the battery compartment. The first adhesive surface of the adhesive layer is bonded to the first surface and the side of the at least one flexible circuit board near the battery compartment, and the second adhesive surface is bonded to the battery to fix the battery in the battery compartment.

[0070] The aforementioned mid-frame component 610 may be the mid-frame component 300 described in any of the preceding embodiments.

[0071] In this embodiment of the disclosure, the battery 620 in the electronic device 600 can be a lithium-ion battery, for example, a nickel-lithium battery (LiNiO2) or a nickel-cobalt-lithium battery (LiNiO2). 0 .8 Co 0 .2 O2), lithium manganese battery (LiMn2O4), ternary battery (LiNiO) .3 Co 0 .3 Mn 0 .3 O 2） The battery can be a lithium-ion battery, such as lithium iron phosphate (LFP) batteries, but this disclosure is not limited to this and other types of batteries are also possible. The battery can be square in shape, but this disclosure is not limited to this and other shapes such as cylindrical, button, wound, and stacked are also possible.

[0072] In some embodiments, the surface of the flexible circuit board near the battery compartment is lower than the first surface; the adhesive layer includes at least one first portion corresponding to at least one groove and a plurality of second portions corresponding to areas outside the groove, wherein the thickness of the first portion is greater than the thickness of the second portions.

[0073] In some embodiments, the surface of the flexible circuit board near the battery compartment is flush with the first surface.

[0074] In some embodiments, the middle plate and the frame are integrally formed, or the middle plate and the frame are connected by connectors or welding.

[0075] In some embodiments, the at least one flexible circuit board is integrally formed with the middle plate.

[0076] In some embodiments, the electronic device further includes one or more of the following components: a processing component, a memory, a power supply component, a multimedia component, an audio component, an input / output (I / O) interface, a sensor component, and a communication component.

[0077] Processing components typically control the overall operation of electronic devices, such as operations associated with display, telephone calls, data communication, camera operation, and recording. A processing component may include one or more processors. Furthermore, a processing component may include one or more modules to facilitate interaction between the processing component and other components. For example, a processing component may include a multimedia module to facilitate interaction between multimedia components and the processing component.

[0078] Memory is configured to store various types of data to support the operation of a device. Examples of this data include instructions for any application or method operating on an electronic device, contact data, phonebook data, messages, pictures, videos, etc. Memory can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0079] Power supply components provide power to various components of electronic devices. Power supply components may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to electronic devices.

[0080] The multimedia component includes a screen that provides an output interface between the electronic device and the user. This screen can be the aforementioned display module or display module.

[0081] In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touchscreen to receive input signals from a user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors may sense not only the boundaries of the touch or swipe action but also the duration and pressure associated with the touch or swipe operation. In some embodiments, the multimedia component includes a front-facing camera and / or a rear-facing camera. When the device is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or the rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0082] The audio component is configured to output and / or input audio signals. For example, the audio component includes a microphone (MIC) configured to receive external audio signals when the electronic device is in an operating mode, such as call mode, recording mode, or voice recognition mode. The received audio signals may be further stored in memory or transmitted via a communication component. In some embodiments, the audio component also includes a speaker for outputting audio signals.

[0083] The I / O interface provides an interface between the processing component and peripheral interface modules, which may be a keyboard, click wheel, buttons, etc. These buttons may include, but are not limited to, a home button, volume buttons, a power button, and a lock button. These buttons adopt the button modules described in the foregoing embodiments.

[0084] The sensor assembly includes one or more sensors for providing state assessments of various aspects of the electronic device. For example, the sensor assembly can detect the device's on / off state, the relative positioning of components such as the electronic device's display and keypad, changes in the position of the electronic device or a component of the electronic device, the presence or absence of user contact with the electronic device, the orientation or acceleration / deceleration of the electronic device, and temperature changes of the electronic device. The sensor assembly may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly may also include an accelerometer, a gyroscope, a magnetometer, a pressure sensor, or a temperature sensor. In some embodiments, the sensor assembly may be the aforementioned fingerprint sensor.

[0085] The communication component is configured to facilitate wired or wireless communication between electronic devices and other devices. The electronic device can access wireless networks based on communication standards, such as Wi-Fi, 4G, or 5G, or combinations thereof. In one exemplary embodiment, the communication component receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, the communication component further includes a Near Field Communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, Infrared Data Association (IrDA) technology, Ultra-Wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0086] It is understood that in this disclosure, "multiple" refers to two or more, and other quantifiers are similar. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. The singular forms "a," "the," and "the" are also intended to include the plural forms unless the context clearly indicates otherwise.

[0087] It is further understood that the terms "first," "second," etc., are used to describe various types of information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another, and do not indicate a specific order or degree of importance. In fact, expressions such as "first," "second," etc., are completely interchangeable.

[0088] It is further understood that the terms “center,” “longitudinal,” “lateral,” “front,” “rear,” “up,” “down,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this embodiment and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation.

[0089] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0090] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0091] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the claims.

[0092] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A mid-frame component, characterized in that, include: middle plate; A frame surrounds the outer periphery of the middle plate, and the frame and the middle plate together form a battery compartment for accommodating the battery; At least one flexible circuit board; The middle plate includes at least one groove formed by recessing from the first surface in a direction away from the battery compartment, and the at least one flexible circuit board is correspondingly disposed in the at least one groove. The first surface is the surface of the middle plate close to the battery compartment. The mid-frame assembly further includes an adhesive layer having opposing first and second adhesive surfaces. The first adhesive surface is bonded to the first surface and the surface of the at least one flexible circuit board near the battery compartment, and the second adhesive surface is used to bond to the battery.

2. The mid-frame assembly according to claim 1, characterized in that, The surface of the flexible circuit board near the battery compartment is lower than the first surface; The adhesive layer includes at least one first portion corresponding to at least one groove and a plurality of second portions corresponding to areas outside the groove, wherein the thickness of the first portion is greater than the thickness of the second portions.

3. The mid-frame assembly according to claim 1, characterized in that, The surface of the flexible circuit board near the battery compartment is flush with the first surface.

4. The mid-frame assembly according to any one of claims 1-3, characterized in that, The middle plate and the frame are integrally formed, or the middle plate and the frame are connected by connectors or welding.

5. The mid-frame assembly according to any one of claims 1-3, characterized in that, The at least one flexible circuit board is integrally formed with the middle plate.

6. An electronic device, characterized in that, It includes a mid-frame assembly and a battery, wherein the mid-frame assembly includes a mid-plate, a frame, at least one flexible circuit board, and an adhesive layer; The frame surrounds the outer periphery of the middle plate, forming a battery compartment together with the middle plate, and the battery is disposed inside the battery compartment. The middle plate includes at least one groove formed by recessing from the first surface in a direction away from the battery compartment, and the at least one flexible circuit board is correspondingly disposed in the at least one groove. The first surface is the surface of the middle plate close to the battery compartment. The first adhesive surface of the adhesive layer is bonded to the first surface and the side of the at least one flexible circuit board near the battery compartment, and the second adhesive surface is bonded to the battery to fix the battery in the battery compartment.

7. The electronic device according to claim 6, characterized in that, The surface of the flexible circuit board near the battery compartment is lower than the first surface; The adhesive layer includes at least one first portion corresponding to at least one groove and a plurality of second portions corresponding to areas outside the groove, wherein the thickness of the first portion is greater than the thickness of the second portions.

8. The electronic device according to claim 6, characterized in that, The surface of the flexible circuit board near the battery compartment is flush with the first surface.

9. The electronic device according to any one of claims 6-8, characterized in that, The middle plate and the frame are integrally formed, or the middle plate and the frame are connected by connectors or welding.

10. The electronic device according to any one of claims 6-8, characterized in that, The at least one flexible circuit board is integrally formed with the middle plate.

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