High-voltage copper bar leading-out structure and high-voltage control box

Abstract

The utility model relates to a kind of high-voltage copper bar lead-out structure and high-voltage control box, involve power battery pack control technical field, the lead-out structure includes multiple main copper bars, is set in the shell inside of high-voltage control box;Multiple collection copper sheets are all set in the lateral wall of the high-voltage control box, each collection copper sheet includes collection part, connecting part and lead-out part, the collection part is overlapped on corresponding main copper bar, the connecting part is connected between the collection part and the lead-out part, the lead-out part is set to the shell outside, for realizing that main copper bar inside electric signal is led out from shell side and is transmitted to copper bar opposite side.The utility model can effectively shorten signal transmission path, reduce contact resistance, simplify assembly process and improve the reliability and protection level of system.

Description

Technical Field

[0001] This utility model relates to the field of power battery pack control technology, and in particular to a high-voltage copper busbar lead-out structure and a high-voltage control box. Background Technology

[0002] In the power battery system of new energy vehicles, the power battery pack needs to be connected to the vehicle's electrical system for energy and signal transmission via a high-voltage control box. Traditional high-voltage control boxes typically use a main copper busbar for connection, followed by signal sampling via multiple wires or high-speed cables. In this configuration, the main copper busbar is responsible for transmitting high-voltage current, while the voltage acquisition wires are arranged separately to monitor the voltage signals at each circuit node and transmit them to the battery management system (BMS) for processing. This separate arrangement is quite common in the design of high-voltage control boxes for power battery packs.

[0003] However, existing high-voltage control box designs have several technical limitations. Because the acquisition and power lines are often arranged separately, the lead-out paths are long, leading to complex installation and sealing difficulties. Furthermore, this separate arrangement typically requires multiple drilling and sealing operations on the housing, resulting in complex processes and limitations on creepage distance. This traditional approach also commonly suffers from high contact resistance, rapid insulation aging, and poor assembly consistency, making it difficult to meet high protection level requirements. Therefore, a compact, efficient, and reliable integrated copper busbar lead-out solution is needed, capable of simultaneously meeting the transmission needs of both power and signals. Utility Model Content

[0004] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a high-voltage copper busbar lead-out structure and a high-voltage control box, which realizes the unified lead-out of power transmission and signal acquisition, effectively shortens the signal transmission path, reduces contact resistance, simplifies the assembly process, and improves the reliability and protection level of the system.

[0005] To achieve the above objectives, the present invention adopts the following technical solution.

[0006] In a first aspect, the present invention provides a high-voltage copper busbar lead-out structure, comprising: Multiple main copper busbars are located inside the housing of the high-voltage control box; Multiple copper sampling plates are disposed on the side wall of the high-voltage control box. Each copper sampling plate includes a sampling part, a connecting part, and a lead-out part. The sampling part overlaps the corresponding main copper busbar. The connecting part connects the sampling part and the lead-out part. The lead-out part is disposed outside the housing and is used to enable the electrical signal inside the main copper busbar to be led out from one side of the housing and transmitted to the opposite side of the copper busbar.

[0007] Furthermore, in the aforementioned high-voltage copper busbar lead-out structure, the housing, the main copper busbar, and the collecting copper sheet are integrally molded.

[0008] Furthermore, in the aforementioned high-voltage copper busbar lead-out structure, the main copper busbar includes a first copper busbar, a second copper busbar, a third copper busbar, a fourth copper busbar, a fifth copper busbar, and a sixth copper busbar; the first copper busbar and the fourth copper busbar are used to connect two adjacent relays in series within the housing, and the second copper busbar, the third copper busbar, the fifth copper busbar, and the sixth copper busbar are each individually connected to four relays.

[0009] Furthermore, in the aforementioned high-voltage copper busbar lead-out structure, the collecting copper plates include a first collecting plate, a second collecting plate, a third collecting plate, a fourth collecting plate, a fifth collecting plate, and a sixth collecting plate, which correspond one-to-one with the first copper busbar, the second copper busbar, the third copper busbar, the fourth copper busbar, the fifth copper busbar, and the sixth copper busbar, respectively.

[0010] Furthermore, in the aforementioned high-voltage copper busbar lead-out structure, the first and fourth acquisition chips are used to lead out the electrical signals of the first and fourth copper busbars, respectively, and the second, third, fifth, and sixth acquisition chips are used to acquire the electrical signals of the second, third, fifth, and sixth copper busbars, respectively.

[0011] Furthermore, in the above-mentioned high-voltage copper busbar lead-out structure, the connecting part is vertically arranged between the acquisition part and the lead-out part, and the lead-out part is horizontally arranged.

[0012] Furthermore, in the aforementioned high-voltage copper busbar lead-out structure, the acquisition unit is connected to the corresponding main copper busbar by welding or crimping.

[0013] Secondly, this utility model provides a high-voltage control box, comprising: case; Multiple relays are disposed inside the housing; Multiple main copper busbars are disposed inside the housing and connected to the relay; Multiple copper sampling plates are disposed on the side wall of the housing. Each copper sampling plate includes a sampling part, a connecting part, and a lead-out part. The sampling part overlaps with the corresponding main copper busbar, the connecting part connects the sampling part and the lead-out part, and the lead-out part is disposed outside the housing.

[0014] Furthermore, in the aforementioned high-voltage control box, the relays are arranged vertically in sequence inside the housing, or arranged symmetrically in a two-horizontal-two-vertical configuration inside the housing.

[0015] Furthermore, in the aforementioned high-voltage control box, the leads of the copper sampling plates are neatly arranged on one side of the housing for unified connection to an external voltage sampling circuit.

[0016] In summary, compared with the prior art, the present invention has at least one of the following beneficial technical effects: This utility model's high-voltage copper busbar lead-out structure effectively solves the technical problems existing in traditional separate arrangement schemes by integrating the acquisition copper sheet with the main copper busbar. This structure significantly shortens the signal transmission path, reduces signal loss, minimizes material loss, and reduces contact resistance, thereby improving the reliability of signal transmission. By directly connecting the acquisition unit to the main copper busbar and achieving unified signal lead-out through the connecting and lead-out parts, the assembly process is simplified, reducing housing openings and sealing operations, and improving assembly consistency. Furthermore, this integrated design increases creepage distance, improves insulation performance, meets high protection level requirements, and achieves a compact structure and efficient connection, providing a safer and more reliable high-voltage control solution for new energy vehicle power battery systems. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a left-side external perspective view of an embodiment of the high-voltage copper busbar lead-out structure of this utility model.

[0019] Figure 2 This is a left-side internal perspective view of an embodiment of the high-voltage copper busbar lead-out structure of this utility model.

[0020] Figure 3 This is a right-side external perspective view of an embodiment of the high-voltage copper busbar lead-out structure of this utility model.

[0021] Figure 4 This is a circuit diagram of one embodiment of the high-voltage copper sheet lead-out structure of this utility model.

[0022] Figure 5 This is a left-side external perspective view of another embodiment of the high-voltage copper busbar lead-out structure of this utility model.

[0023] Figure 6 This is a left-side internal perspective view of another embodiment of the high-voltage copper busbar lead-out structure of this utility model.

[0024] Figure 7 This is a right-side external perspective view of another embodiment of the high-voltage copper busbar lead-out structure of this utility model.

[0025] Figure 8This is a circuit lead-out schematic diagram of another embodiment of the high-voltage copper sheet lead-out structure of this utility model.

[0026] Explanation of reference numerals in the attached diagram: 1. Housing; 2. Relay; 3. Main copper busbar; 31. First copper busbar; 32. Second copper busbar; 33. Third copper busbar; 34. Fourth copper busbar; 35. Fifth copper busbar; 36. Sixth copper busbar; 4. Acquisition copper plate; 41. First acquisition plate; 42. Second acquisition plate; 43. Third acquisition plate; 44. Fourth acquisition plate; 45. Fifth acquisition plate; 46. Sixth acquisition plate. Detailed Implementation

[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. Furthermore, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application.

[0028] It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, the descriptions of each embodiment in the following embodiments have their own emphasis; for parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0029] The following is in conjunction with the appendix Figure 1-8 The present invention will be described in further detail below.

[0030] Reference Figure 1 A high-voltage copper busbar lead-out structure includes multiple main copper busbars 3 and multiple acquisition copper plates 4. This structure is designed to achieve the lead-out and transmission of electrical signals in the high-voltage control box of a power battery pack. The main copper busbars 3 are disposed inside the housing 1 of the high-voltage control box and are used to carry the transmission of high-voltage current. The acquisition copper plates 4 are all disposed on the side wall of the high-voltage control box and realize the acquisition and lead-out of voltage signals through electrical connection with the main copper busbars 3. In some embodiments, this structure integrates the main copper busbars 3 and the acquisition copper plates 4 into the housing 1 through an integrated design, realizing the safe lead-out of high-voltage power and sampling signals with short path and low thermal resistance.

[0031] Reference Figure 5This high-voltage copper busbar lead-out structure demonstrates an alternative appearance configuration, in which the housing 1 employs a modular design with multiple internally partitioned chambers. The main copper busbar 3 provides electrical connectivity between the chambers within the housing 1, while the acquisition copper plates 4 are distributed along the side walls of the housing 1. In some embodiments, both the main copper busbar 3 and the acquisition copper plates 4 are positioned inside the high-voltage control box or embedded within the side wall region; this arrangement improves structural integration and insulation performance. The acquisition copper plates 4 are mounted at outlets on the side walls of the housing 1, enabling signal transmission from the interior of the housing 1 to the exterior.

[0032] Each copper sampling plate 4 comprises three functional sections: a sampling section, a connecting section, and a lead-out section. The sampling section is attached to the corresponding main copper busbar 3, establishing an electrical connection through direct physical contact to collect electrical signals from the main copper busbar 3. The connecting section connects the sampling section and the lead-out section, serving as an intermediate bridge for signal transmission, conducting the collected electrical signals from the main copper busbar 3 to the outside of the housing 1. The lead-out section is located outside the housing 1, enabling the electrical signals inside the main copper busbar 3 to be led out from one side of the housing 1 and transmitted to the opposite side of the copper busbar, forming a complete "inside the housing → sidewall → outside the housing" electrical signal path.

[0033] In some implementations, this structure achieves rapid docking with the vehicle's high-voltage system by combining the three-section design of the acquisition copper plate 4 with the sidewall structure of the housing 1. The lead-out portion of the acquisition copper plate 4 extends to the outside of the housing 1, providing a unified connection point for the external voltage sampling circuit. This design avoids the complex wiring method of the traditional solution, which involves the main copper busbar passing through the wall and then being connected with soft copper wire, reducing the number of connection points and lowering contact resistance. The overall structure achieves integrated lead-out of high-voltage power and sampling signals while ensuring electrical isolation and mechanical strength.

[0034] In some embodiments, the housing 1, main copper busbar 3, and collecting copper sheet 4 can be manufactured using an injection molding process. The pre-processed main copper busbar 3 and collecting copper sheet 4 are placed as inserts in designated positions of the injection mold, and then molten insulating plastic material is injected to solidify the plastic material around the main copper busbar 3 and collecting copper sheet 4, forming the overall structure of the housing 1.

[0035] This integrated molding process ensures precise positioning of the main copper busbar 3 and the collecting copper sheet 4 within the housing 1, while forming a reliable insulating layer between the copper busbar and the housing 1. This avoids positioning deviations and uneven insulation gaps that may occur in traditional assembly methods. During injection molding, the plastic material can completely cover the non-conductive surface of the main copper busbar 3, leaving only conductive contact surfaces at locations requiring electrical connections. The lead-out portion of the collecting copper sheet 4 extends to the outside of the housing 1 through openings pre-reserved in the mold design, achieving a compact and reliably insulated integrated manufacturing process.

[0036] Reference Figure 2 The main copper busbar 3 includes a first copper busbar 31, a second copper busbar 32, a third copper busbar 33, a fourth copper busbar 34, a fifth copper busbar 35, and a sixth copper busbar 36. These six main copper busbars form a complete electrical connection network inside the high-voltage control box, with each busbar undertaking a specific current transmission function. The first copper busbar 31 and the second copper busbar 32 are located on one side of the structure, the third copper busbar 33 and the fourth copper busbar 34 are arranged on the opposite side, while the fifth copper busbar 35 and the sixth copper busbar 36 are located in the central area of ​​the structure. In some embodiments, this distributed layout allows for efficient electrical connections between the individual copper busbars within a limited space, while maintaining appropriate electrical clearances.

[0037] Reference Figure 3 The first copper busbar 31, the second copper busbar 32, the third copper busbar 33, the fourth copper busbar 34, the fifth copper busbar 35, and the sixth copper busbar 36 are arranged vertically inside the housing 1. The first copper busbar 31 is located in the upper region of the structure and establishes a connection with adjacent electrical components. The second copper busbar 32 and the third copper busbar 33 are respectively located in the middle position, forming intermediate links for current transmission. The fourth copper busbar 34 serves as a connecting copper busbar, acting as a bridge in the structure. The fifth copper busbar 35 and the sixth copper busbar 36 are respectively connected to their respective electrical ports. In some embodiments, the precise geometric arrangement of each copper busbar ensures optimized current paths and structural compactness.

[0038] Reference Figure 6 The arrangement of the six main copper busbars 3 within the housing illustrates another implementation scheme. The first copper busbar 31, second copper busbar 32, third copper busbar 33, fourth copper busbar 34, fifth copper busbar 35, and sixth copper busbar 36 are arranged symmetrically within the housing. The first copper busbar 31 and fourth copper busbar 34 form one symmetrical arrangement, the second copper busbar 32 and fifth copper busbar 35 form another symmetrical arrangement, and the third copper busbar 33 and sixth copper busbar 36 complete a third symmetrical arrangement. This symmetrical configuration achieves structural balance and stability while ensuring electrical performance. In some implementations, the symmetrical layout helps to evenly distribute current load and heat.

[0039] Reference Figure 7The first copper busbar 31, the second copper busbar 32, the fourth copper busbar 34, and the fifth copper busbar 35 form a specific connection pattern inside the housing 1. The first copper busbar 31 is located at one end of the structure and establishes an electrical connection with adjacent components through its conductivity. The second copper busbar 32 is positioned in the middle and serves as a relay for current transmission. The fourth copper busbar 34 acts as a bridging element, connecting different electrical circuits. The fifth copper busbar 35 is responsible for current conduction in a specific circuit. In some embodiments, the coordinated configuration of these four copper busbars ensures the electrical continuity and functional integrity of the entire high-voltage system, while the size and shape of each copper busbar are optimized according to the current it carries and the connection requirements.

[0040] Reference Figure 4 The first copper busbar 31 and the fourth copper busbar 34 form a series connection configuration inside the high-voltage control box, used to connect two adjacent relays 2 within the housing, thus forming a series connection configuration within the high-voltage control box. The relays 2, as electrical control elements, are located inside the housing and achieve circuit switching control functions through the connection of the main copper busbars. The first copper busbar 31 extends from the output terminal of one relay 2 to the input terminal of an adjacent relay 2, establishing an electrical connection path between the two relays 2. The fourth copper busbar 34 uses the same connection method, forming a series circuit between another set of adjacent relays 2. In some embodiments, this series configuration allows current to pass through multiple relays 2 sequentially, achieving segmented control and protection functions. The geometry and dimensions of the first copper busbar 31 and the fourth copper busbar 34 are designed according to the distance between the relays 2 and the current carrying requirements to ensure connection reliability and electrical performance.

[0041] The second copper busbar 32, the third copper busbar 33, the fifth copper busbar 35, and the sixth copper busbar 36 are each individually connected to one of the four relays 2, with each busbar forming an independent electrical connection with its corresponding relay 2. The second copper busbar 32 is connected to a specific port of the first relay 2, handling the current input or output function of that relay 2. The third copper busbar 33 establishes a separate connection with the second relay 2, forming an independent electrical circuit. The fifth copper busbar 35 is connected to the third relay 2, while the sixth copper busbar 36 is connected to the fourth relay 2. In some embodiments, this individual connection method allows each relay 2 to independently control its corresponding circuit branch, providing flexible circuit management capabilities. The connection ends of each copper busbar are designed with a geometry adapted to the ports of the relay 2, ensuring connection stability and conductivity.

[0042] Reference Figure 8The relays 2 are arranged in a specific spatial layout within the housing 1, forming an orderly connection network with the main copper busbars. The first copper busbar 31 forms a bridging structure between the relays 2, with its conductive path extending from the first relay 2 to the adjacent second relay 2. The fourth copper busbar 34 also acts as a bridging element, connecting two other adjacent relays 2. In some embodiments, the series-connected relays 2 form a sequential current transmission path through the first copper busbar 31 and the fourth copper busbar 34, achieving multi-level control functions. The second copper busbar 32, third copper busbar 33, fifth copper busbar 35, and sixth copper busbar 36 are each led out from their respective relays 2, forming independent electrical branches. This connection configuration ensures the integrity of the circuit function while combining series control and parallel branches, meeting the control requirements of complex electrical systems. The connection points between each copper busbar and the relays 2 employ reliable electrical connection methods to ensure connection stability and electrical performance during long-term use.

[0043] Reference Figure 2 The six acquisition copper plates 4 include a first acquisition plate 41, a second acquisition plate 42, a third acquisition plate 43, a fourth acquisition plate 44, a fifth acquisition plate 45, and a sixth acquisition plate 46. These six acquisition copper plates are configured in a one-to-one correspondence with the first copper busbar 31, the second copper busbar 32, the third copper busbar 33, the fourth copper busbar 34, the fifth copper busbar 35, and the sixth copper busbar 36, respectively. The first acquisition plate 41 is located at the corresponding position of the first copper busbar 31 and establishes an electrical connection with the first copper busbar 31 through its acquisition part, realizing the function of acquiring the power signal of the first copper busbar 31. The second acquisition plate 42 corresponds to the second copper busbar 32 and acquires the voltage signal of the second copper busbar 32 using the same connection method. The third acquisition plate 43, the fourth acquisition plate 44, the fifth acquisition plate 45, and the sixth acquisition plate 46 correspond to the third copper busbar 33, the fourth copper busbar 34, the fifth copper busbar 35, and the sixth copper busbar 36, respectively, forming a complete signal acquisition network. In some implementations, the pairing relationship between each acquisition copper plate and its corresponding main copper busbar ensures the accuracy of voltage sampling and the integrity of system monitoring.

[0044] Reference Figure 3The first acquisition piece 41, the second acquisition piece 42, the third acquisition piece 43, the fourth acquisition piece 44, the fifth acquisition piece 45, and the sixth acquisition piece 46 are arranged vertically inside the housing 1. The first acquisition piece 41 is located in the upper region of the housing 1, and its acquisition part is in close contact with the surface of the first copper busbar 31. The connecting part extends vertically from the position of the first copper busbar 31 to the side wall of the housing 1, and the lead-out part extends horizontally to the outside of the housing 1. The second acquisition piece 42 and the third acquisition piece 43 are respectively located in the middle position and establish corresponding electrical connections with the second copper busbar 32 and the third copper busbar 33. The fourth acquisition piece 44 serves as a matching acquisition element for the bridging copper busbar and forms a pairing relationship with the fourth copper busbar 34. The fifth acquisition piece 45 and the sixth acquisition piece 46 correspond to the fifth copper busbar 35 and the sixth copper busbar 36, respectively, completing the configuration of the entire acquisition system. In some embodiments, the vertical arrangement of each acquisition copper piece is consistent with the layout of the main copper busbar to ensure the shortening of the acquisition path and the stability of signal transmission.

[0045] Reference Figure 6 The arrangement of six copper acquisition plates within the housing demonstrates a symmetrical distribution implementation. The first acquisition plate 41 and the fourth acquisition plate 44 form a symmetrical arrangement, corresponding to the electrical signal acquisition of the first copper busbar 31 and the fourth copper busbar 34, respectively. The second acquisition plate 42 and the fifth acquisition plate 45 form another symmetrical arrangement, corresponding to the second copper busbar 32 and the fifth copper busbar 35. The third acquisition plate 43 and the sixth acquisition plate 46 complete a third symmetrical arrangement, acquiring the voltage signals of the third copper busbar 33 and the sixth copper busbar 36, respectively. The L-shaped structure design of each acquisition copper plate allows for good electrical contact between the acquisition section and the corresponding main copper busbar, the connection section provides a signal transmission path, and the lead-out section forms a unified connection interface outside the housing. In some embodiments, the symmetrical distribution of the acquisition copper plates helps to balance the load distribution and heat dissipation of signal acquisition, while simplifying the wiring complexity of external connection circuits.

[0046] Reference Figure 7The first acquisition piece 41, the second acquisition piece 42, the third acquisition piece 43, the fourth acquisition piece 44, the fifth acquisition piece 45, and the sixth acquisition piece 46 are arranged in an orderly manner on the side wall region of the housing 1. The first acquisition piece 41 is electrically connected to the first copper busbar 31 through its three-segment structure. The acquisition part is attached to the conductive surface of the first copper busbar 31, the connection part passes through the side wall thickness of the housing 1, and the lead-out part extends to the outside of the housing 1 to form a signal output terminal. The second acquisition piece 42 adopts the same structural configuration and is connected to the second copper busbar 32. The fourth acquisition piece 44 and the fifth acquisition piece 45 correspond to the fourth copper busbar 34 and the fifth copper busbar 35, respectively. In some embodiments, the lead-out parts of each acquisition copper piece are arranged neatly on the same side of the housing 1, providing a unified connection interface for the external voltage sampling circuit. This one-to-one correspondence ensures that the voltage signal of each main copper busbar can be accurately acquired and transmitted through its dedicated acquisition copper piece, forming a complete voltage monitoring system.

[0047] Reference Figure 2 The first acquisition piece 41 and the fourth acquisition piece 44, in the high-voltage copper busbar lead-out structure, perform the function of signal lead-out, forming a functional division of labor with the signal acquisition functions of other acquisition copper pieces. The first acquisition piece 41 establishes an electrical connection with the first copper busbar 31 through its acquisition section, transmitting the electrical signal inside the first copper busbar 31 to the lead-out section through the connection section, realizing the lead-out transmission of electrical signals from inside the housing to the outside. The fourth acquisition piece 44 adopts the same working principle, forming an electrical connection with the fourth copper busbar 34, and undertaking the function of lead-out of the electrical signals from the fourth copper busbar 34. In some embodiments, the lead-out function of the first acquisition piece 41 and the fourth acquisition piece 44 corresponds to the series bridging effect of the first copper busbar 31 and the fourth copper busbar 34, forming a complete electrical signal transmission path. The lead-out sections of the first acquisition piece 41 and the fourth acquisition piece 44 extend to the outside of the housing, providing an electrical signal access point from the series copper busbar for external circuit systems.

[0048] The second acquisition piece 42, the third acquisition piece 43, the fifth acquisition piece 45, and the sixth acquisition piece 46 in the system are responsible for acquiring electrical signals, establishing a one-to-one acquisition relationship with the second copper busbar 32, the third copper busbar 33, the fifth copper busbar 35, and the sixth copper busbar 36 respectively. The acquisition part of the second acquisition piece 42 forms electrical contact with the conductive surface of the second copper busbar 32, and transmits the acquired voltage signal to the lead-out part through the connection part, realizing the monitoring and acquisition of the electrical signal of the second copper busbar 32. The third acquisition piece 43 establishes the same acquisition connection with the third copper busbar 33 to obtain the voltage information on the third copper busbar 33. The fifth acquisition piece 45 and the sixth acquisition piece 46 respectively acquire electrical signals from the fifth copper busbar 35 and the sixth copper busbar 36, forming a voltage monitoring network for each independently connected copper busbar. In some embodiments, the acquisition functions of these four acquisition pieces are matched with the individual connection characteristics of the corresponding main copper busbars, realizing the independent signal acquisition of each electrical branch.

[0049] Reference Figure 6 The functional division of the copper sampling plates is further reflected in the symmetrical layout implementation. The first sampling plate 41 and the fourth sampling plate 44 are located at corresponding positions in the structure in the symmetrical configuration, guiding the electrical signals from the first copper busbar 31 and the fourth copper busbar 34 to the external connection system through their lead-out function. The L-shaped structure design of the first sampling plate 41 allows its sampling part to form a stable electrical connection with the first copper busbar 31. The connection part passes through the side wall of the housing, and the lead-out part forms a signal output port outside the housing. The fourth sampling plate 44 adopts the same structural configuration, establishing a lead-out connection with the fourth copper busbar 34. In some embodiments, the symmetrical distribution of the first sampling plate 41 and the fourth sampling plate 44 helps to balance the load distribution of the electrical signal leads, while simplifying the design complexity of the external connection circuit.

[0050] The second acquisition piece 42, the third acquisition piece 43, the fifth acquisition piece 45, and the sixth acquisition piece 46 form a distributed acquisition configuration in a symmetrical layout. The second acquisition piece 42 and the fifth acquisition piece 45 constitute a symmetrical acquisition unit, respectively acquiring electrical signals from the second copper busbar 32 and the fifth copper busbar 35, and transmitting the acquired voltage signals to the outside of the housing through their respective three-segment structures. The third acquisition piece 43 and the sixth acquisition piece 46 form another symmetrical acquisition configuration, establishing acquisition connections with the third copper busbar 33 and the sixth copper busbar 36. In some embodiments, this symmetrically distributed acquisition configuration achieves signal acquisition path equalization, with the leads of each acquisition copper piece arranged neatly on both sides of the housing, providing a unified connection interface for the external voltage sampling circuit. The symmetrically arranged acquisition copper pieces optimize the system's thermal performance and signal response speed by shortening part of the acquisition path.

[0051] This functional division of labor produces multiple benefits in terms of technical implementation. The clear separation of lead-out and acquisition functions enables the electrical signal transmission system to have layered processing capabilities. The first acquisition chip 41 and the fourth acquisition chip 44 are specifically responsible for the lead-out of electrical signals from the series copper busbars, ensuring the stability of signal transmission along the main current path. The second acquisition chip 42, the third acquisition chip 43, the fifth acquisition chip 45, and the sixth acquisition chip 46 focus on acquiring electrical signals from each independent copper busbar, achieving precise monitoring of each electrical branch. In some implementations, this functional division reduces the possibility of signal interference; lead-out signals and acquired signals are processed through different acquisition copper chips, avoiding signal aliasing and mutual interference. The lead-out sections of each acquisition copper chip form a unified connection interface on the outside of the housing, simplifying the connection complexity of the external circuitry and improving the reliability and maintenance convenience of the entire voltage monitoring system.

[0052] The structure of the copper acquisition plate 4 can adopt a three-section design, forming an L-shaped configuration through the vertical arrangement of the connecting part and the horizontal arrangement of the lead-out part. The connecting part is vertically positioned between the acquisition part and the lead-out part, serving as an intermediate bridge for electrical signal transmission, vertically transmitting the electrical signal acquired by the acquisition part to the side wall area of ​​the housing 1. The lead-out part is horizontally positioned, extending horizontally from the end of the connecting part to the outside of the housing 1, forming a signal output terminal parallel to the outer surface of the housing 1. In some embodiments, the vertical orientation of the connecting part allows the electrical signal to be transmitted directly upwards or downwards from the position of the main copper busbar 3 to the opening in the side wall of the housing 1, avoiding bending and detours in the signal transmission path. The horizontal arrangement of the lead-out part ensures the convenience of external connection, with the lead-out parts of all the copper acquisition plates 4 arranged neatly on the same horizontal plane.

[0053] The L-shaped structure configuration effectively guides electrical signals through a combination of vertical and horizontal sections. The vertical section, or connecting part, undertakes the vertical transmission function of the signal. Starting from the surface of the main copper busbar 3 where the acquisition unit is located, it passes vertically through the sidewall thickness of the housing 1, conducting the electrical signal from the inside of the housing 1 to the outer surface of the sidewall. The horizontal section, or lead-out part, continues the signal transmission from the connecting part, extending the electrical signal horizontally to a designated location outside the housing 1, forming an access point for external circuit connections. In some embodiments, the geometry of the L-shaped structure matches the sidewall structure of the housing 1, the length of the connecting part is designed according to the thickness of the sidewall of the housing 1, and the length of the lead-out part is determined according to the space requirements of the external connection.

[0054] The L-shaped structure optimizes the signal transmission path. The vertical connecting section directly transmits the electrical signal from the surface of the main copper busbar 3 to the side wall of the housing 1, avoiding signal interference that may be caused by oblique or curved transmission. The horizontal lead-out section ensures that all electrical signals are output externally on the same horizontal plane, forming a unified signal interface standard. In some embodiments, this structural configuration allows the acquisition copper plate 4 to adapt to different layouts of the main copper busbar 3. Regardless of whether the main copper busbar 3 is arranged vertically or symmetrically, the L-shaped structure can provide a consistent signal lead-out method. The geometric relationship formed by the vertical setting of the connecting section and the horizontal setting of the lead-out section is coordinated with the structural features of the housing 1, achieving a balance between structural compactness and functional integrity.

[0055] A stable electrical connection is established between the acquisition unit and the corresponding main copper busbar using welding or crimping. Welding uses a high-temperature melting process to metallurgically bond the conductive material of the acquisition unit to the surface of the main copper busbar, forming a continuous conductive path. In some embodiments, resistance welding, laser welding, or ultrasonic welding techniques are employed, with appropriate welding parameters selected based on the material properties of the acquisition unit and the main copper busbar. The welded interface exhibits good conductivity and mechanical strength, capable of withstanding vibrations and temperature variations within the high-voltage control box. Crimping uses mechanical pressure to tightly bond the contact surfaces of the acquisition unit and the main copper busbar, forming a low-impedance electrical connection. By controlling the crimping force and contact area, the crimping process ensures stable metal-metal contact between the acquisition unit and the main copper busbar, enabling effective transmission of electrical signals.

[0056] These two connection methods have distinct technical characteristics and are suitable for different application scenarios. Welding provides a permanent electrical connection with low interface resistance and good long-term stability, making it suitable for applications requiring high connection reliability. In some implementations, welding effectively prevents loosening due to vibration or thermal expansion and contraction, ensuring stable electrical connection between the acquisition unit and the main copper busbar throughout its service life. Crimping offers advantages such as simple process and lower cost; reliable electrical connections can be achieved through precise control of crimping parameters. Crimping allows for disassembly during maintenance or replacement, facilitating product repair and upgrades. Both connection methods achieve low contact resistance between the acquisition unit and the main copper busbar, reducing power loss during signal transmission and improving voltage sampling accuracy and overall system performance.

[0057] The high-voltage copper busbar lead-out structure in the above embodiments effectively solves the technical problems existing in the traditional separate arrangement scheme by integrating the acquisition copper sheet with the main copper busbar. This structure can significantly shorten the signal transmission path, reduce signal loss, and reduce contact resistance, thereby improving the reliability of signal transmission. By directly connecting the acquisition unit to the main copper busbar and achieving unified signal lead-out through the connection part and the lead-out part, the assembly process can be simplified, reducing housing openings and sealing operations, and improving assembly consistency. In addition, this integrated design can increase the creepage distance, improve insulation performance, meet high protection level requirements, and achieve the technical effects of compact structure and efficient connection, providing a safer and more reliable high-voltage control solution for new energy vehicle power battery systems.

[0058] This utility model embodiment also discloses a high-voltage control box.

[0059] Reference Figure 4 and Figure 8A high-voltage control box includes an integrated configuration of a housing, multiple relays 2, multiple main copper busbars, and multiple sampling copper plates. The housing serves as the outer shell of the entire high-voltage control box, providing mechanical protection and electrical isolation for the internal electrical components. Multiple relays 2 are located inside the housing, acting as circuit control elements to perform switching and protection functions for the high-voltage circuit. Multiple main copper busbars are located inside the housing and connected to the relays 2, forming a high-voltage current transmission network. Each main copper busbar achieves segmented control and current distribution of the circuit through its connection with the relays 2. Multiple sampling copper plates are located on the side walls of the housing. Each sampling copper plate has a three-section structure configuration including a sampling section, a connecting section, and a lead-out section. The sampling section overlaps with the corresponding main copper busbar to establish an electrical connection. The connecting section connects the sampling section and the lead-out section to form a signal transmission path. The lead-out section is located outside the housing to provide a connection interface for an external voltage sampling circuit.

[0060] Reference Figure 4 The relays 2 are arranged vertically inside the housing, forming a vertically arranged array of electrical control units. Four relays 2 are arranged vertically along the longitudinal axis of the housing, each occupying a specific vertical position and maintaining an appropriate distance from adjacent relays 2. The first copper busbar 31 and the fourth copper busbar 34, in this vertical arrangement, serve as series connections between adjacent relays 2, transferring current from one relay 2 to the next through vertically extending conductive paths. The second copper busbar 32, the third copper busbar 33, the fifth copper busbar 35, and the sixth copper busbar 36 are each led out from their respective relays 2, forming independent electrical branch connections. In some embodiments, the vertical arrangement allows the relays 2 to be compactly arranged within a limited horizontal space, with the control ports and electrical connection points of each relay 2 distributed vertically, facilitating the wiring of the main copper busbars. The lead-out portions of the sampling copper plates form vertically arranged signal output interfaces on one side of the housing, coordinating with the vertical arrangement of the relays 2 and providing an orderly connection interface for the external voltage sampling circuit.

[0061] Reference Figure 8The relays 2 are arranged symmetrically inside the housing in a two-horizontal-two-vertical configuration, forming a more compact and balanced spatial arrangement. The four relays 2 are arranged symmetrically, with two relays arranged horizontally and the other two vertically, forming a "cross" or "L" symmetrical geometric structure. This symmetrical arrangement ensures the integrity of electrical functions while optimizing space utilization and balancing the structural center of gravity. The main copper busbars form a corresponding connection network between the symmetrically arranged relays 2. The first copper busbar 31 and the fourth copper busbar 34 adjust their connection paths according to the symmetrical positions of the relays 2, and the other copper busbars establish electrical connections with their corresponding relays 2. In some embodiments, the symmetrical arrangement is suitable for applications with special spatial shapes or compact layouts. The symmetrical distribution of the acquisition copper plates on both sides of the housing shortens some signal acquisition paths and optimizes the system's thermal performance and response speed. Both arrangements can meet the electrical control requirements of the high-voltage control box. The vertical arrangement is suitable for installation environments with ample longitudinal space, while the symmetrical arrangement is suitable for applications requiring a balanced layout and compact design.

[0062] The leads of the copper sampling plates 4 are arranged neatly on one side of the housing 1, providing standardized connection points for the external voltage sampling circuit through a unified geometric layout. The leads of each copper sampling plate 4 are arranged at regular intervals on the same plane outside the housing 1, forming a linearly distributed signal output array. The position and orientation of each lead are consistent, ensuring that external connectors or wire harnesses can be accessed in a uniform manner. In some embodiments, the neat arrangement of the leads eliminates the wiring complexity of traditional distributed signal output methods. The integrated output configuration achieves a single integrated connector connection, avoiding signal interference caused by the cross-tangle of multiple sampling wires. This unified connection method allows all voltage sampling signals to be simultaneously accessed to the external voltage sampling circuit through a single integrated connector, simplifying system integration complexity, improving connection reliability and maintenance convenience. Furthermore, the entire high-voltage copper busbar lead structure, through optimized sealing design and material selection, meets the IP6K9K high protection level requirements, making it suitable for high-voltage connection applications in harsh environments.

[0063] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A high-voltage copper busbar lead-out structure, characterized in that, include: Multiple main copper busbars (3) are installed inside the housing (1) of the high-voltage control box; Multiple copper sampling plates (4) are disposed on the side wall of the high voltage control box. Each copper sampling plate (4) includes a sampling part, a connecting part and a lead-out part. The sampling part overlaps with the corresponding main copper busbar (3). The connecting part connects the sampling part and the lead-out part. The lead-out part is disposed outside the housing (1) to realize that the electrical signal inside the main copper busbar (3) is led out from one side of the housing (1) and transmitted to the opposite side of the copper busbar.

2. The high-voltage copper busbar lead-out structure according to claim 1, characterized in that, The housing (1), the main copper busbar (3), and the collecting copper sheet (4) are integrally injection molded.

3. The high-voltage copper busbar lead-out structure according to claim 1, characterized in that, The main copper busbar (3) includes a first copper busbar (31), a second copper busbar (32), a third copper busbar (33), a fourth copper busbar (34), a fifth copper busbar (35), and a sixth copper busbar (36); wherein, the first copper busbar (31) and the fourth copper busbar (34) are used to connect two adjacent relays (2) in series in the housing (1), and the second copper busbar (32), the third copper busbar (33), the fifth copper busbar (35), and the sixth copper busbar (36) are each individually connected to four relays (2).

4. The high-voltage copper busbar lead-out structure according to claim 3, characterized in that, The copper sampling plates (4) include a first sampling plate (41), a second sampling plate (42), a third sampling plate (43), a fourth sampling plate (44), a fifth sampling plate (45), and a sixth sampling plate (46), which correspond one-to-one with the first copper busbar (31), the second copper busbar (32), the third copper busbar (33), the fourth copper busbar (34), the fifth copper busbar (35), and the sixth copper busbar (36), respectively.

5. The high-voltage copper busbar lead-out structure according to claim 4, characterized in that, The first acquisition chip (41) and the fourth acquisition chip (44) are used to extract the electrical signals of the first copper busbar (31) and the fourth copper busbar (34), respectively. The second acquisition chip (42), the third acquisition chip (43), the fifth acquisition chip (45) and the sixth acquisition chip (46) are used to acquire the electrical signals of the second copper busbar (32), the third copper busbar (33), the fifth copper busbar (35) and the sixth copper busbar (36), respectively.

6. The high-voltage copper busbar lead-out structure according to claim 1, characterized in that, The connecting part is vertically disposed between the collecting part and the lead-out part, and the lead-out part is horizontally disposed.

7. The high-voltage copper busbar lead-out structure according to claim 1, characterized in that, The acquisition unit is connected to the corresponding main copper busbar (3) by welding or pressing.

8. A high-voltage control box, characterized in that, include: Shell (1); Multiple relays (2) are disposed inside the housing (1); Multiple main copper busbars (3) are disposed inside the housing (1) and connected to the relay (2); Multiple copper collection plates (4) are disposed on the side wall of the housing (1). Each copper collection plate (4) includes a collection part, a connecting part and an output part. The collection part overlaps with the corresponding main copper busbar (3). The connecting part connects the collection part and the output part. The output part is disposed outside the housing (1).

9. The high-voltage control box according to claim 8, characterized in that, The relays (2) are arranged vertically inside the housing (1) or in a symmetrical arrangement of two horizontal and two vertical lines inside the housing (1).

10. The high-voltage control box according to claim 9, characterized in that, The leads of the copper sampling plate (4) are arranged neatly on one side of the housing (1) for unified connection to the external voltage sampling circuit.

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