An HDMI high-definition transmission connector

Abstract

The utility model discloses a HDMI high definition transmission connector relates to the technical field of connector, include: the rubber core is composed of colloid and tongue plate, and is equipped with upper row terminal and lower row terminal in the rubber core, and upper row terminal and lower row terminal have upper contact portion and lower contact portion respectively that protrude on the surface of tongue plate, and the electricity department that protrudes from the rear end of colloid, the heat dissipation shell, the heat dissipation shell is wrapped in the rubber core periphery, wherein, colloid and heat dissipation shell inner wall are pasted, and the insertion port is formed between tongue plate and heat dissipation shell, the heat conduction plate, the heat conduction plate is located in the inside of tongue plate, and is between upper row terminal and lower row terminal, wherein, the heat conduction plate is provided with the heat transfer part that protrudes on the both sides of colloid, and the heat transfer part and heat dissipation shell inner wall are pasted and can build the efficient heat transfer path from the inside of rubber core to heat dissipation shell, solve the problem of heat accumulation in the inside of rubber core, effectively reduce the working temperature in the inside of sensor, improve the stability of signal transmission.

Description

Technical Field

[0001] This utility model relates to the field of connector technology, and in particular to an HDMI high-definition transmission connector. Background Technology

[0002] An HDMI high-speed connector is a special type of connector used to transmit audio and video signals. It is mainly used to transmit high-definition audio and video signals and is suitable for connecting high-definition TVs, projectors, monitors, and even professional audio and video equipment.

[0003] According to the high-frequency connector housing and high-frequency connector disclosed in announcement number CN212342877U, the connector includes an access part with a mounting channel for mounting pins and an output part. The access part and the output part are integrally formed, the mounting channel passes through the output part, and the output part has heat dissipation holes extending from the inside of the mounting channel to the outside.

[0004] While the aforementioned technical solution can effectively dissipate heat from the mounting channel by providing heat dissipation holes on the housing, thus avoiding problems such as poor safety performance and easy deformation of the housing due to overheating of the pins, it has limitations in practical use. When an external male connector is inserted into the connector, it will cover the tongue plate of the housing. Even if there are heat dissipation holes to dissipate heat, the heat dissipation path will be blocked by the male connector, severely hindering the effective dissipation of heat and affecting the expected heat dissipation effect.

[0005] Therefore, it is necessary to propose a new technical solution to address the above problems. Utility Model Content

[0006] To overcome the shortcomings mentioned above, this utility model aims to provide a technical solution that can solve the aforementioned problems.

[0007] To achieve the above objectives, this utility model provides the following technical solution: an HDMI high-definition transmission connector, comprising: The core is composed of a glue body and a tongue plate. The core is provided with an upper row of terminals and a lower row of terminals. The upper row of terminals and the lower row of terminals respectively have an upper contact portion and a lower contact portion that protrude from the surface of the tongue plate, and a contact portion that protrudes from the rear end of the glue body. A heat dissipation shell is wrapped around the periphery of the adhesive core, wherein the adhesive is in contact with the inner wall of the heat dissipation shell, and an insertion port is formed between the tongue plate and the heat dissipation shell; A heat-conducting plate is located inside the tongue plate and between the upper and lower rows of terminals. The heat-conducting plate is provided with heat transfer parts that extend through both sides of the colloid and are in contact with the inner wall of the heat dissipation shell.

[0008] As a further embodiment of this utility model: the tongue plate has an inner groove for accommodating the heat-conducting plate, and the tongue plate has surface grooves on both sides corresponding to the upper and lower rows of terminals, and the surface grooves are provided with through grooves that communicate with the inner groove.

[0009] As a further embodiment of this utility model: multiple bonding blocks are provided on both sides of the heat-conducting plate, and the multiple bonding blocks on both sides are respectively bonded to the upper row of terminals and the lower row of terminals through through grooves.

[0010] As a further embodiment of this utility model, the heat-conducting plate is made of ceramic material.

[0011] As a further embodiment of this utility model: the upper surface of the heat dissipation shell is provided with a plurality of heat dissipation grooves arranged in an array.

[0012] As a further embodiment of this utility model: the upper row of terminals, the lower row of terminals, and the heat-conducting plate are embedded into the core through a pre-embedded injection molding process to form an integrated structure.

[0013] Compared with existing technologies, the beneficial effects of this technical solution are as follows: When the connector is connected for data transmission, the heat-conducting plate can directly absorb the heat generated by the upper and lower terminals in the tongue plate, and transfer the absorbed heat to the external heat dissipation shell through the heat transfer part. After the heat is successfully transferred to the heat dissipation shell, due to the large surface area of ​​the heat dissipation shell, the heat will be carried away by the air flow on the surface of the heat dissipation shell, thereby continuously exchanging heat and quickly removing the heat inside the core. This creates an efficient heat transfer path from the core to the heat dissipation shell, solving the problem of heat accumulation inside the core, effectively reducing the internal operating temperature of the sensor, and improving the stability of signal transmission.

[0014] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is an exploded structural diagram of the present invention; Figure 3 This is a schematic diagram of the structure of the adhesive core of this utility model; Figure 4 This is a schematic diagram of the structure of the heat-conducting plate of this utility model; The corresponding labels in the attached diagram are explained as follows: 1. Core; 11. Glue; 12. Tongue plate; 121. Inner groove; 122. Surface groove; 123. Through groove; 2. Heat dissipation shell; 21. Insertion port; 22. Heat dissipation groove; 3. Upper row of terminals; 31. Upper contact part; 4. Lower row of terminals; 41. Lower contact part; 5. Heat-conducting plate; 51. Heat transfer part; 52. Adhesive block; 6. Electrical connection part. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Please see Figure 1-4 An HDMI high-definition transmission connector, comprising: The core 1 is composed of a colloid 11 and a tongue plate 12. The core 1 is provided with an upper row of terminals 3 and a lower row of terminals 4. The upper row of terminals 3 and the lower row of terminals 4 respectively have an upper contact portion 31 and a lower contact portion 41 that protrude from the surface of the tongue plate 12, and a power receiving portion 6 that protrudes from the rear end of the colloid 11. Heat dissipation shell 2, which is wrapped around the core 1, wherein the adhesive 11 is attached to the inner wall of the heat dissipation shell 2, and the tongue plate 12 forms an insertion port 21 between it and the heat dissipation shell 2; The heat-conducting plate 5 is located inside the tongue plate 12 and between the upper row of terminals 3 and the lower row of terminals 4. The heat-conducting plate 5 is provided with heat transfer parts 51 that protrude from both sides of the colloid 11, and the heat transfer parts 51 are in contact with the inner wall of the heat dissipation shell 2.

[0019] Specifically, when the connector is connected for data transmission, the heat-conducting plate 5 can directly absorb the heat generated by the upper row of terminals 3 and the lower row of terminals 4 in the tongue plate 12. After assembly, the heat dissipation shell 2 will wrap the glue 11 of the glue core 1, and the heat transfer part 51 provided on the heat-conducting plate 5 will protrude from the surface of the glue 11 and be in close contact with the heat dissipation shell 2, so that the heat transfer part 51 can transfer the absorbed heat to the external heat dissipation shell 2. When the heat is successfully transferred to the heat dissipation shell 2, due to the large surface area of ​​the heat dissipation shell 2, the heat will be carried away by the air flow on the surface of the heat dissipation shell 2, thereby continuously exchanging heat and quickly removing the heat inside the glue core 1. This creates an efficient heat transfer path from the inside of the glue core 1 to the heat dissipation shell 2, solving the problem of heat accumulation inside the glue core 1, effectively reducing the working temperature inside the sensor, and improving the stability of signal transmission. Preferably, in order to further improve the heat transfer efficiency between the heat transfer part 51 and the heat dissipation shell 2, thermally conductive silicone can be added between the two. Preferably, the connector can dissipate heat to the external environment through contact with the device housing (i.e., the connector is assembled in the circuit board, and the circuit board is installed inside the device for application).

[0020] Based on the above embodiments, it is further proposed that the tongue plate 12 has an inner groove 121 inside to accommodate the heat-conducting plate 5, and the tongue plate 12 has surface grooves 122 on both sides corresponding to the upper row of terminals 3 and the lower row of terminals 4. A through groove 123 communicating with the inner groove 121 is opened on the surface groove 122.

[0021] Specifically, the heat-conducting plate 5 is located in the inner groove 121. When the upper row of terminals 3 and the lower row of terminals 4 dissipate heat, the through groove 123 connected to the inner groove 121 will form a heat transfer space, allowing heat to pass through the tongue plate 12 and directly contact the heat-conducting plate 5, making the heat-conducting plate 5 absorb heat more directly and quickly.

[0022] Based on the above embodiments, it is further proposed that multiple bonding blocks 52 are provided on both sides of the heat-conducting plate 5, and the multiple bonding blocks 52 on both sides are respectively bonded to the upper row of terminals 3 and the lower row of terminals 4 through the through grooves 123.

[0023] Specifically, the heat-conducting plate 5 is bonded to the upper row of terminals 3 and the lower row of terminals 4 through multiple bonding blocks 52, thereby increasing the effective contact area with the upper row of terminals 3 and the lower row of terminals 4, thus improving the efficiency of heat transfer from the upper row of terminals 3 and the lower row of terminals 4 to the heat-conducting plate 5, and further improving the heat dissipation efficiency.

[0024] Preferably, the heat-conducting plate 5 is made of ceramic material.

[0025] Specifically, ceramic materials (such as alumina and aluminum nitride) have excellent thermal conductivity and are also insulators. This characteristic solves the problem of needing to conduct heat efficiently inside the connector while ensuring electrical insulation between terminals.

[0026] Based on the above embodiments, it is further proposed that the upper surface of the heat dissipation shell 2 is provided with multiple heat dissipation grooves 22 arranged in an array.

[0027] Specifically, the array of heat dissipation trenches 22 forms a textured surface on the heat dissipation shell 2, allowing airflow to flow on the surface of the heat dissipation shell 2, promoting air convection, and thus dissipating heat to the surrounding environment more quickly.

[0028] Preferably, the upper row of terminals 3, the lower row of terminals 4, and the heat-conducting plate 5 are embedded into the core 1 through a pre-embedded injection molding process to form an integrated structure; this allows the upper row of terminals 3, the lower row of terminals 4, and the heat-conducting plate 5 to be stably connected to the core 1.

[0029] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An HDMI high-definition transmission connector, characterized in that, include: The core (1) is composed of a colloid (11) and a tongue plate (12). The core (1) is provided with an upper row of terminals (3) and a lower row of terminals (4). The upper row of terminals (3) and the lower row of terminals (4) respectively have an upper contact portion (31) and a lower contact portion (41) that protrude from the surface of the tongue plate (12), and a power receiving portion (6) that protrudes from the rear end of the colloid (11). Heat dissipation shell (2), the heat dissipation shell (2) is wrapped around the outer periphery of the glue core (1), wherein the glue (11) is attached to the inner wall of the heat dissipation shell (2), and the tongue plate (12) forms an insertion port (21) between the heat dissipation shell (2). The heat-conducting plate (5) is located inside the tongue plate (12) and between the upper row of terminals (3) and the lower row of terminals (4). The heat-conducting plate (5) is provided with heat transfer parts (51) that protrude from both sides of the colloid (11), and the heat transfer parts (51) are in contact with the inner wall of the heat dissipation shell (2).

2. The HDMI high-definition transmission connector according to claim 1, characterized in that, The tongue plate (12) has an inner groove (121) inside to accommodate the heat-conducting plate (5). The tongue plate (12) has surface grooves (122) on both sides of its surface corresponding to the upper row of terminals (3) and the lower row of terminals (4). The surface grooves (122) have through grooves (123) that communicate with the inner grooves (121).

3. The HDMI high-definition transmission connector according to claim 2, characterized in that, Multiple bonding blocks (52) are provided on both sides of the heat-conducting plate (5), and the multiple bonding blocks (52) on both sides are bonded to the upper row terminal (3) and the lower row terminal (4) respectively through the through groove (123).

4. The HDMI high-definition transmission connector according to claim 3, characterized in that, The heat-conducting plate (5) is made of ceramic material.

5. The HDMI high-definition transmission connector according to claim 4, characterized in that, The upper surface of the heat dissipation shell (2) is provided with multiple heat dissipation grooves (22) arranged in an array.

6. The HDMI high-definition transmission connector according to claim 5, characterized in that, The upper row of terminals (3), the lower row of terminals (4), and the heat-conducting plate (5) are embedded into the core (1) through a pre-embedded injection molding process to form an integrated structure.

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