Optical fiber differential protection measurement and control device

Abstract

The application discloses an optical fiber differential protection measurement and control device, which comprises a case, a front panel, a rear panel and internal function modules. The case adopts a layered structure, and from top to bottom, the case comprises an interface layer, a core processing layer and a power supply layer. The interface layer is connected with the core processing layer through a first backboard, and a plurality of hot-pluggable function interface modules are inserted into the interface layer, wherein the function interface modules comprise optical fiber interface modules with ST / SC type interfaces, and optional modules such as Ethernet, serial communication and analog quantity acquisition modules. The core processing layer is provided with a main processor module integrated with a multi-core processor and an FPGA, and hierarchical interconnection is realized through a second backboard. The power supply layer adopts a dual power supply redundancy module to provide two independent DC inputs and isolated power supply. The device has clear structure, high modularization degree, supports flexible configuration and hot-plug maintenance, and has high reliability and easy expansibility.

Description

Technical Field

[0001] This application relates to the field of line protection technology, and in particular to a fiber optic differential protection and control device. Background Technology

[0002] Fiber optic differential protection is based on Kirchhoff's Current Law (KCL). Under normal operating conditions, the current flowing into and out of the protected line is equal, and the differential current is theoretically zero. When a fault occurs within the line, the current balance is disrupted, and the differential current becomes greater than zero. When the differential current exceeds the device's setting value, the protection device will quickly trip the circuit breakers on both sides of the line, isolating the fault.

[0003] Chinese Patent, Publication No. CN220673093U, Publication Date: March 26, 2024, discloses a digital fiber optic differential protection and control device, specifically relating to the field of line protection technology. The device includes a main body, a display screen, and a terminal block. A display screen is installed at one end of the main body, and an indicator light is provided on one side of the display screen. A control button is provided at the bottom of one end of the main body, and a terminal block is installed at the center of the other end of the main body.

[0004] The shortcomings of the above technical solution are: it mainly focuses on external, auxiliary functional optimization, with its core innovation lying in cable management and physical protection, without addressing the core internal architecture of the device. The device still employs a traditional, highly integrated, all-in-one chassis design. This structure requires replacing the entire unit to add interfaces, resulting in poor scalability; in case of failure, it requires complete disassembly and repair, leading to poor maintainability; and strong and weak electrical signals are prone to mutual interference in a confined space, resulting in weak anti-interference capabilities. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this application aims to provide a fiber optic differential protection and control device that allows for flexible selection and replacement of different functional interface modules based on actual engineering needs, thereby improving the device's applicability and maintainability. Furthermore, it physically isolates the power supply layer, the high-speed digital processing core layer, and the interface layer, reducing mutual electromagnetic interference.

[0006] To achieve the above objectives, this application adopts the following technical solution: This application provides a fiber optic differential protection and control device, comprising: a chassis, a front panel, a rear panel, and functional modules disposed inside the chassis. The chassis adopts a layered structure, comprising, from top to bottom: an interface layer, a core processing layer, and a power supply layer. The interface layer is connected to the core processing layer via a first backplane. The interface layer has several hot-swappable functional interface modules arranged side-by-side. Each functional interface module includes a fiber optic interface module, the panel of which has at least two ST-type or SC-type fiber optic interfaces for connecting the fiber optic differential channel. The functional interface module also includes at least one of the following: an Ethernet interface module, a serial communication interface module, and an analog signal acquisition module. The core processing layer includes a main processor module, which is connected to the interface layer and the power supply layer via a second backplane. The main processor module uses a multi-core processor and integrates an FPGA chip. The power supply layer includes a dual-power redundancy module, the panel of which has two independent DC power input interfaces. The dual-power redundancy module provides isolated power to the core processing layer and the interface layer via the second backplane.

[0007] As a preferred technical solution, the rear panel is provided with a heat dissipation grille and a fan mounting position. A centrifugal fan is provided in the fan mounting position. The centrifugal fan is used to form a vertical air duct that draws in air from the bottom of the rear panel, passes through the power layer and the core processing layer, and exits from the heat dissipation grille at the top of the rear panel.

[0008] As a preferred technical solution, the main processor module is covered with a number of heat dissipation fins, and the extension direction of the heat dissipation fins is parallel to the direction of the vertical airflow.

[0009] As a preferred technical solution, each of the functional interface modules is connected to a high-speed differential connector, and each of the functional interface modules is connected to the first backplane through the high-speed differential connector. The high-speed differential connector has a metal shell, and the metal shell is grounded to form electromagnetic shielding.

[0010] As a preferred technical solution, the analog signal acquisition module includes an analog signal input channel, which is equipped with an electromagnetic isolation transformer and an anti-aliasing filter.

[0011] As a preferred technical solution, the chassis includes an aluminum alloy casing with anodized and conductive anodized surfaces.

[0012] Compared with the prior art, the beneficial effects of this application are as follows: This application modularizes and centralizes functional interfaces on the upper layer of the chassis, allowing users to flexibly select and replace different functional interface modules according to actual engineering needs, such as increasing the number of optical ports or changing the communication type, without replacing the entire device. This greatly improves the applicability and economy of the fiber optic differential protection and control device. Hot-swapping of functional interface modules is supported, allowing for replacement of faulty modules without power interruption, significantly improving maintenance efficiency and system reliability. This application uses a layered structure with a high-voltage power supply layer, a high-speed digital processing core layer, and an interface layer, physically isolating them to reduce mutual electromagnetic interference. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the fiber optic differential protection and control device of this application; Figure 2 This is a structural schematic diagram of the fiber optic differential protection and control device from the rear-view perspective of this application; The components include: 1. Fiber optic differential protection and control device; 11. Chassis; 111. Interface layer; 1111. Fiber optic interface module; 1112. Ethernet interface module; 1113. Serial communication interface module; 1114. Analog acquisition module; 112. Core processing layer; 1121. Heat sink; 113. Power supply layer; 12. Rear panel; 121. Heat dissipation grille; 122. Centrifugal fan. Detailed Implementation

[0014] To enable those skilled in the art to better understand the present application, the technical solutions in specific embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.

[0015] like Figure 1 As shown, this application provides a fiber optic differential protection and control device 1, which includes a chassis 11, a front panel, a rear panel 12, and functional modules disposed inside the chassis 11. For example, the functional modules include a main processor module of a core processing layer 112, etc.

[0016] In this application, the chassis 11 includes an aluminum alloy casing with anodized and conductive anodized surfaces, which also has heat dissipation and electromagnetic shielding functions.

[0017] The chassis 11 adopts a layered structure, which includes, from top to bottom, an interface layer 111, a core processing layer 112, and a power supply layer 113.

[0018] The interface layer 111 is connected to the core processing layer 112 through the first backplane, and several hot-swappable functional interface modules are plugged into the interface layer 111 side by side.

[0019] The functional interface module includes a fiber optic interface module 1111. The panel of the fiber optic interface module 1111 has at least two ST-type or SC-type fiber optic interfaces for connecting fiber optic differential channels. The fiber optic differential interface module is used to implement the core function of fiber optic differential protection. It is responsible for sending and receiving sampled data to and from the peer device and performing differential calculations. For example, the fiber optic differential interface module includes two or four SC / ST-type fiber optic interfaces for multi-channel or primary / backup redundancy.

[0020] The functional interface module also includes at least one of the following: Ethernet interface module 1112, serial communication interface module 1113, and analog signal acquisition module 1114.

[0021] The Ethernet interface module 1112 provides high-speed network communication for communication with station control layer devices such as monitoring back-end systems, dispatch master stations, or other intelligent devices using GOOSE, SV, and MMS protocols. For example, the Ethernet interface module 1112 includes 4-8 RJ45 ports or SFP optical port slots.

[0022] The serial communication interface module 1113 provides traditional serial communication for communicating with older relay protection devices, measurement and control devices, or RTUs, supporting protocols such as Modbus and IEC 60870-5-103. For example, the serial communication interface module 1113 includes 2-4 RS-485 or RS-232 interfaces.

[0023] The analog signal acquisition module 1114 acquires analog signals from a traditional current transformer, isolates, conditions, and samples the input AC current and voltage signals using a high-speed ADC, converting them into digital signals. For example, the analog signal acquisition module 1114 includes phoenix terminals or European terminals for connecting to the secondary lines of a current transformer (CT) / physical transformer (PT). Examples include 4 current channels and 4 voltage channels.

[0024] Furthermore, the analog signal acquisition module 1114 includes an analog signal input channel, which is equipped with an electromagnetic isolation transformer and an anti-aliasing filter. The electromagnetic isolation transformer physically isolates the device from potentially fatal common-mode interference that may enter during high-voltage side faults, protecting the downstream precision circuits and system safety, directly improving the device's shock resistance and safety. The anti-aliasing filter is crucial for signal fidelity. Power signals contain abundant harmonics; without filtering, spectral aliasing will occur during ADC sampling, leading to errors in the protection algorithm calculation. This filter ensures the accuracy of the sampled data, guaranteeing the correctness of the protection action from the source. This application encapsulates sophisticated analog signal processing functions within a separate, hot-swappable analog signal acquisition module 1114. During maintenance, the entire device does not need to be modified; during upgrades, a higher sampling rate and higher precision analog signal acquisition module 1114 can be replaced.

[0025] The core processing layer 112 includes a main processor module, which is connected to the interface layer 111 and the power layer 113 via a second backplane. The main processor module runs an embedded real-time operating system (such as VxWorks or Linux RT) and executes core algorithms such as protection logic (differential, distance, overcurrent, etc.), fault recording, fault location, and human-machine interaction processing.

[0026] The main processor module employs a multi-core processor and integrates an FPGA chip. The multi-core processor (such as the ARM Cortex-A series) has one core dedicated to protection calculations (ensuring real-time performance), while the other cores are used for communication, management, etc. The FPGA chip is used to implement high-speed digital signal processing, such as filtering harmonics from sampled signals, and precise time synchronization, such as timekeeping compensation and multi-channel synchronous data acquisition and control—all hard real-time tasks.

[0027] More specifically, the main processor module also includes a time synchronization subboard and a storage subboard. The time synchronization subboard provides a high-precision time synchronization signal for the entire device, ensuring the correctness of Sequence of Events (SOE) and differential protection. The time synchronization subboard supports multiple time synchronization methods, including IRIG-B (DC / AC), PTP (IEEE 1588), and 1PPS pulse time synchronization. The storage subboard provides non-volatile memory for storing fault waveform data, device settings, event logs, program files, etc.

[0028] The power supply layer 113 includes a dual-power redundancy module. The module's panel has two independent DC power input interfaces. Through a second backplane, the dual-power redundancy module provides isolated power to the core processing layer 112 and the interface layer 111. The dual-power redundancy module converts the input DC or AC power into various levels of low-voltage DC power (e.g., +5V, ±12V, +24V) required by the internal modules of the device. The dual-power redundancy module supports a wide range of DC input (e.g., 80V-300V DC) or AC input (85V-265V AC) through dual independent inputs. Both power supplies operate simultaneously, serving as backups for each other. When one power supply fails, the other seamlessly takes over the entire load and reports the power status to the core processing layer 112 through the second backplane. The dual-power redundancy module internally incorporates a high-efficiency isolation transformer and EMI filter to prevent interference from the power grid from entering the device's low-voltage system.

[0029] like Figure 2As shown, the rear panel 12 further includes a heat dissipation grille 121 and a fan mounting position, within which a centrifugal fan 122 is installed. The centrifugal fan 122 forms a vertical airflow channel that draws air in from the bottom of the rear panel 12, passes through the power supply layer 113 and the core processing layer 112, and exits from the heat dissipation grille 121 at the top of the rear panel 12. Furthermore, the main processor module is covered with several heat dissipation fins 1121, the extension direction of which is parallel to the direction of the vertical airflow channel. This application, through its unique vertical airflow design, combined with the metal material of the chassis 11 and the heat dissipation fins 1121 on the main processor module, effectively and quickly dissipates the heat generated by the power supply and main processor module inside the device, ensuring the stability and lifespan of the device during long-term operation in high-temperature environments.

[0030] Furthermore, each functional interface module is connected to a high-speed differential connector, and each functional interface module is connected to the first backplane through the high-speed differential connector. The high-speed differential connector has a metal shell, and the metal shell is grounded to form electromagnetic shielding.

[0031] This application modularizes and centralizes the functional interfaces on the upper layer of the chassis 11, allowing users to flexibly select and replace different functional interface modules according to actual engineering needs, such as increasing the number of optical ports or changing the communication type, without replacing the entire device. This greatly improves the applicability and economy of the fiber optic differential protection and control device 1. It supports hot-swapping of functional interface modules, allowing for replacement of faulty modules without power interruption, significantly improving maintenance efficiency and system reliability. This application uses a layered structure with a high-voltage power supply layer 113, a high-speed digital processing core processing layer 112, and an interface layer 111 for physical isolation, reducing mutual electromagnetic interference.

[0032] It should be noted that the terms "first," "second," and similar terms used in this application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, "a" or "one," and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. "A plurality" or "several" indicates at least two. Unless otherwise stated, terms such as "front," "back," "left," "right," "lower," and / or "upper" are for illustrative purposes only and are not limited to a location or spatial orientation. Terms such as "comprising" or "including" indicate that the elements or objects preceding "comprising" encompass the elements or objects listed following "comprising" or "including" and their equivalents, and do not exclude other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect.

[0033] The singular forms “a,” “the,” and “the” used in this application specification and appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0034] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A fiber optic differential protection and control device, characterized in that, The fiber optic differential protection and control device includes: a chassis, a front panel, a rear panel, and functional modules installed inside the chassis. The chassis adopts a layered structure, and from top to bottom, the chassis includes: an interface layer, a core processing layer, and a power supply layer. The interface layer is connected to the core processing layer through the first backplane. The interface layer has several hot-swappable functional interface modules plugged in side by side. The functional interface modules include fiber optic interface modules. The fiber optic interface module panel is provided with at least two ST or SC type fiber optic interfaces for connecting fiber optic differential channels. The functional interface modules also include at least one of the following: Ethernet interface module, serial communication interface module, and analog signal acquisition module. The core processing layer includes a main processor module, which is connected to the interface layer and power layer through a second backplane. The main processor module uses a multi-core processor and integrates an FPGA chip. The power layer includes a dual power redundancy module. The panel of the dual power redundancy module is provided with two independent DC power input interfaces. The dual power redundancy module provides isolated power to the core processing layer and the interface layer through the second backplane.

2. The fiber optic differential protection and control device according to claim 1, characterized in that, The rear panel is provided with a heat dissipation grille and a fan mounting position. A centrifugal fan is installed in the fan mounting position. The centrifugal fan is used to form a vertical airflow channel that draws in air from the bottom of the rear panel, passes through the power layer and the core processing layer, and exits from the heat dissipation grille at the top of the rear panel.

3. The fiber optic differential protection and control device according to claim 2, characterized in that, The main processor module is covered with several heat dissipation fins, and the extension direction of the heat dissipation fins is parallel to the direction of the vertical airflow.

4. The fiber optic differential protection and control device according to claim 1, characterized in that, Each of the aforementioned functional interface modules is connected to a high-speed differential connector, and each of the aforementioned functional interface modules is connected to the first backplane through the high-speed differential connector. The high-speed differential connector has a metal shell, and the metal shell is grounded to form electromagnetic shielding.

5. The fiber optic differential protection and control device according to claim 1, characterized in that, The analog signal acquisition module includes an analog signal input channel, which is equipped with an electromagnetic isolation transformer and an anti-aliasing filter.

6. The fiber optic differential protection and control device according to claim 1, characterized in that, The chassis includes an aluminum alloy casing with anodized and conductive anodized surfaces.

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