Redundant power supply control circuit, circuit board and satellite communication terminal

Abstract

The application provides a redundant power supply control circuit, a circuit board and a satellite communication terminal, relates to the technical field of satellite communication, and solves the problem that a satellite communication terminal in the prior art cannot be used after key devices fail. According to the scheme, the power supply and control are independently set as multiple power supply conversion modules and power amplification modules, a redundant output circuit is further built to supply power to other public circuits such as fan circuits and controller circuits in the system except for the power amplifier, and the current state of each synthesis branch is detected to switch and isolate the branch, so that the influence of the failed branch on the system is cut off, thereby effectively reducing the risk that the whole system cannot be used due to the failure of a single power supply, a final power amplifier and a fan and the like, and the reliability of the satellite communication terminal is improved, and reliable support can be provided in the demand for emergency communication.

Description

Technical Field

[0001] This application relates to the field of satellite communication technology, and in particular to a redundant power supply control circuit, circuit board and satellite communication terminal. Background Technology

[0002] Traditional satellite communication terminals (such as transmitters) lack redundancy design or fault tolerance for critical components (such as the final stage power amplifier, power supply, and fan) or modules. The failure of a single critical component or module often renders the entire terminal unusable, causing significant disruption in emergency scenarios. To achieve stable communication, related technologies typically employ full-system redundancy backups within the terminal, leading to increased system size and weight, thus limiting the application scenarios of satellite communication terminals. This prevents miniaturization and makes them unsuitable for portable applications. Furthermore, the effectiveness of fan cooling also affects terminal performance; fan failure can cause poor heat dissipation, leading to the failure of the final stage power amplifier and rendering the terminal unusable. Therefore, related technologies often fail to ensure the continued operation of satellite communication terminals after component failure. Utility Model Content

[0003] This application provides a redundant power supply control circuit, circuit board, and satellite communication terminal, which solves the problem in related technologies that satellite communication terminals cannot be used after component failure. This solution can perform redundant design and implement corresponding voltage control while ensuring equipment size, so that the equipment can still operate after some components fail.

[0004] In a first aspect, this application provides a redundant power supply control circuit, which includes a second power conversion module, a fan module, a low-dropout regulator, an up-converter and drive module, a microcontroller, at least two first power conversion modules, and a power amplifier module.

[0005] The input terminal of each first power conversion module is used to connect to a power source, and the output terminal of each first power conversion module is connected to the anode of a different diode. The first power conversion module is used to provide a first operating voltage. The number of power amplifier modules is the same as the number of first power conversion modules, and the power amplifier modules correspond one-to-one with the first power conversion modules and are connected to the output terminal of the first power conversion modules through the power supply terminal of the power amplifier modules. The input terminal of the second power conversion module is connected to the cathode of all diodes, and the second power conversion module is used to provide the second operating voltage; the power supply terminal of the fan module is connected to the cathode of the diodes, and the fan module is used to regulate the internal temperature of the equipment; the input terminal of the low dropout regulator is connected to the output terminal of the second power conversion module; the up-converter and drive module is connected to the output terminal of the second power conversion module. The microcontroller's power supply terminal is connected to the output terminal of the low dropout regulator. The microcontroller's first signal output terminal is connected to the control terminal of the power amplifier module and is used to turn the power amplifier module on or off. The microcontroller's second signal output terminal is connected to the control terminal of the first power conversion module and is used to control the output voltage of the first power conversion module in conjunction with the fan's operating status. The microcontroller's third signal output terminal is connected to the control terminal of the fan module and is used to control the fan speed in the fan module. The microcontroller's first signal receiving terminal is connected to the sampling terminal of the fan module and is used to detect the fan speed in the fan module. The microcontroller's second signal receiving terminal is connected to the sampling terminal of the power amplifier module and is used to identify whether the power amplifier module is malfunctioning.

[0006] Secondly, this application also provides a circuit board that includes the aforementioned redundant power supply control circuit.

[0007] Thirdly, this application also provides a satellite communication terminal, which includes the aforementioned circuit board.

[0008] This application breaks down a single, large-capacity power conversion module into multiple smaller-capacity power conversion modules, each paired with a corresponding set of power amplifier modules. The power supply and control of these multiple power conversion and power amplifier modules are independent, minimizing the impact on the final combined output power even if individual power amplifier or power conversion modules fail. This solution also provides power to other common circuits in the system, such as fans and microcontrollers, through redundant output circuits. By monitoring the current and fan status of each combined branch, the solution performs switching isolation and voltage adjustment, cutting off or reducing the impact of a failed branch on the system. This effectively reduces the risk of system unavailability due to a single power supply failure, thereby improving the reliability of the satellite communication terminal and providing reliable support for emergency communication needs. Attached Figure Description

[0009] Figure 1 A logic block diagram of a redundant power supply control circuit provided in an embodiment of this application.

[0010] Figure 2 This is a schematic diagram of the circuit structure of a power supply control unit provided in an embodiment of this application.

[0011] Figure 3 This is a schematic diagram of the circuit structure of a first power conversion module provided in an embodiment of this application.

[0012] Figure 4 This is a schematic diagram of the circuit structure of a current sampling module provided in one embodiment of this application. Detailed Implementation

[0013] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the embodiments of the present application and are not intended to limit the scope of the present application. Furthermore, it should be noted that, for ease of description, the accompanying drawings only show the parts relevant to the embodiments of the present application, and not all structures. Those skilled in the art, after reading this specification, should be able to deduce that any combination of technical features can constitute an optional implementation method, provided that the technical features do not contradict each other.

[0014] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects, not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class, not limited in number; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship. In the description of this application, "multiple" means two or more, and "several" means one or more.

[0015] Traditional satellite communication terminals (such as transmitters) lack redundancy design or fault tolerance for critical components (such as power amplifiers, power supplies, and fans). The failure of a single critical component or module often renders the entire terminal unusable, causing significant disruption in emergency scenarios. To achieve stable communication, related technologies typically employ full-system redundancy backups within the terminal, increasing system size and weight, thus limiting the application scenarios of satellite communication terminals. This prevents miniaturization and makes them unsuitable for portable applications. Furthermore, the effectiveness of fan cooling also affects terminal performance; fan failure can lead to poor heat dissipation, causing the final power amplifier to fail and rendering the terminal unusable. Therefore, satellite communication terminals using these technologies often fail to function properly after component failure.

[0016] In response, this application provides a redundant power supply control circuit that can be applied to satellite communication terminals. This redundant power supply control circuit can achieve a redundant design to meet the redundancy requirements of the devices. In addition, feedback control is set in the redundant power supply control circuit to adjust the voltage and power provided by the system after detecting a corresponding fault, thereby maintaining the use of the terminal equipment. Figure 1The logic block diagram of a redundant power supply control circuit provided in an embodiment of this application is shown in the figure. The redundant power supply control circuit includes a power amplifier module 120, a second power conversion module 130, a fan module 140, a low dropout regulator 150, an up-converter and drive module 160, a microcontroller 170, and at least two first power conversion modules 110.

[0017] Specifically, the input terminal of each first power conversion module 110 is used to connect to a power source, and the output terminal of each first power conversion module 110 is connected to the anode of a different diode. The first power conversion module 110 is used to provide a first operating voltage. Optionally, the first power conversion module can be a DC-to-DC conversion module or an AC-to-DC conversion module. The number of power amplifier modules 120 is the same as the number of first power conversion modules 110, and the power amplifier modules 120 correspond one-to-one with the first power conversion modules 110 and are connected to the output terminal of the first power conversion module 110 through the power supply terminal of the power amplifier module 120. That is, each first power conversion module 110 is provided with a corresponding power amplifier module 120 to achieve redundancy design of the final stage power amplifier of the terminal equipment. In addition, a diode is provided at the output terminal of the first power conversion module 110 to achieve power isolation, and all diodes are connected with a common cathode. Optionally, the diodes used are all low forward voltage drop diodes, such as Schottky diodes.

[0018] When one of the primary power conversion modules 110 fails and has no output, the other primary power conversion modules 110 can continue to supply power to subsequent circuits through diodes. The primary power output of the failed module can be isolated from the faulty primary power conversion module 110 by utilizing the unidirectional nature of the diodes to prevent current backflow. Although one branch fails, because the output load capacity of a single primary power conversion module 110 is sufficiently large, the other circuits are not affected by the failure of this branch, and the subsequent common circuits, including the microcontroller 170, can still operate normally.

[0019] It is understandable that the final output stage of this solution uses at least two power amplifier modules 120 for combined output. For example, taking a 100W requirement in the Ku band as an example, a combined scheme with two channels each having a maximum output of 80W can be selected. To achieve better combining efficiency and good heat dissipation, the maximum output power of a single channel is dated to 60W during actual combining. When one of the 60W channels fails and has no output, the actual maximum output power is one-quarter of 100W, i.e., 25W, which can still maintain the normal operation of the satellite communication terminal in the system in most scenarios. Optionally, if the equipment size and space are large enough, a lower wattage and more combining modules can be selected for power combining and power splitting. For an amplifier combined by N power amplifier modules 120, the RF output power and the number of faulty devices have the following relationship:

[0020] Where p out p represents the actual output power. n The power of the N-channel amplifier module is given by N, where N is the total combining power. f This represents the number of faulty components. Furthermore, the first-stage power conversion module in the system will be powered by at least two power modules of the same specifications. Each power conversion module will drive the same number of power amplifier modules 120, ensuring that the failure of one power conversion module minimizes the impact on the overall power amplifier module 120 and the combined output power. The load-carrying capacity of a single power conversion module at high temperatures is greater than its output load, and also greater than the total power consumption of the connected power amplifier modules 120 and the common circuitry outside the power amplifier modules 120, to ensure its redundancy capability.

[0021] The input terminal of the second power conversion module 130 is connected to the cathode terminals of all diodes. It is conceivable that the cathode terminals of all diodes are connected to the input terminal of the second power conversion module 130 to achieve a common cathode connection. The second power conversion module 130 is used to provide the second operating voltage. Furthermore, the power supply terminal of the fan module 140 is connected to the cathode terminals of the aforementioned diodes, the input terminal of the low-dropout regulator 150 is connected to the output terminal of the second power conversion module 130, and the up-conversion and drive module 160 is connected to the output terminal of the second power conversion module 130. The fan module 140 is used to regulate the internal temperature of the device, while the low-dropout regulator 150 provides the corresponding operating voltage to the microcontroller 170. The up-conversion and drive module 160, as a module in the satellite communication terminal used to adjust the input signal frequency, can generate higher frequency intermediate frequency signals.

[0022] The power supply terminal of microcontroller 170 is connected to the output terminal of low-dropout regulator 150. The first signal output terminal of microcontroller 170 is connected to the control terminal of power amplifier module 120 and used to turn power amplifier module 120 on or off. The second signal output terminal of microcontroller 170 is connected to the control terminal of first power conversion module 110 and used to control the output voltage of first power conversion module 110. The third signal output terminal of microcontroller 170 is connected to the control terminal of fan module 140 and used to control the fan speed in fan module 140. The first signal receiving terminal of microcontroller 170 is connected to the sampling terminal of fan module 140 and used to detect the fan speed in fan module 140. The second signal receiving terminal of microcontroller 170 is connected to the sampling terminal of power amplifier module 120 and used to identify whether power amplifier module 120 is malfunctioning, such as by detecting the current of power amplifier module 120 to determine whether the power amplifier module is malfunctioning.

[0023] It is conceivable that the microcontroller 170 can control the first power conversion module 110, the power amplifier module 120, and the fan module 140 in all circuits. The microcontroller 170 can control the first power conversion module 110 by detecting the fan speed, so as to adjust the output voltage of the first power conversion module 110, such as to realize buck-boost control. Moreover, the microcontroller 170 controls the power amplifier module 120 to control its working state, such as making the power amplifier module 120 work or turn it off.

[0024] Optionally, the microcontroller 170's control of the fan module 140 can be used to control the fan speed, thereby ensuring that the device can still dissipate heat when the temperature changes, so that the internal temperature of the device meets the operating temperature requirements. The third signal output terminal on the microcontroller 170 can be an output terminal for outputting a PWM (Pulse-Width Modulation) signal, so as to control the fan speed in the fan module 140 through the PWM signal. It is conceivable that the fan module 140 can be equipped with several fans, the number of which can be set according to the actual heat dissipation requirements. In some embodiments, the microcontroller 170 interacts with a tachometer through an I2C interface to obtain the real-time speed of multiple fans. When the microcontroller 170 detects that the internal temperature is higher than 40°C (15°C temperature rise inside when the ambient temperature is 25°C), and monitors in real time that the fan speed deviates from its preset fan speed by 50% or more, the microcontroller 170 can detect the abnormal fan operation and issue an alarm to remind the fan to be repaired. The preset fan speed is determined based on the rated speed of the fan and the PWM duty cycle output by the microcontroller 170 to control the fan.

[0025] As described above, this solution breaks down the original single, large-capacity power conversion module into multiple smaller-capacity power conversion modules, each paired with a corresponding set of power amplifier modules. The power supply and control of these multiple power conversion and power amplifier modules are independent, minimizing the impact on the final combined output power even if individual power amplifier or power conversion modules fail. This solution also provides power to other common circuits in the system, such as fans and power amplifiers, through redundant output circuits. Furthermore, by monitoring the current status of each combined branch, the system isolates and cuts off the impact of a failed branch on the system, effectively reducing the risk of system unavailability due to a single power supply failure. This solution achieves redundant operation without significantly increasing product size, weight, or cost. Even if critical components or modules within a single unit fail, satellite communication connections will not be interrupted, thus improving the reliability of the satellite communication terminal and providing reliable support for emergency communication needs.

[0026] In one embodiment, the power amplification module includes a power amplifier and a power supply control unit. The drain terminal of the power amplifier is connected to the output terminal of the power supply control unit, the power supply terminal of the power supply control unit is connected to the output terminal of the first power conversion module, and the control terminal of the power supply control unit is connected to the first signal output terminal of the microcontroller. The power supply control unit is used to control the voltage at the drain terminal of the power amplifier to control the operating state of the power amplifier upon receiving a control signal. The microcontroller can control the power amplifier by providing a corresponding control signal to the power supply control unit. For example, for an up-conversion amplifier transmitter, the controlled power amplifier can correspond to the power amplifier in the final stage.

[0027] Optionally, Figure 2 The circuit structure diagram of the power supply control unit provided in an embodiment of this application is shown in the figure. The power supply control unit includes a first NMOS transistor Q1, a first PMOS transistor, a first resistor R1, a second resistor R2, a third resistor R3, a first capacitor C1, a second capacitor C2, a third capacitor C3, and a Zener diode D1.

[0028] Specifically, the gate of the first NMOS transistor Q1 is connected to the first terminal of the first resistor R1, the second terminal of the first resistor R1 is connected to the microcontroller, and the two terminals of the first capacitor C1 are connected to the gate and source terminals of the first NMOS transistor Q1, respectively, with the source terminal of the first NMOS transistor Q1 grounded. The drain of the first NMOS transistor Q1 is connected to the first terminal of the second resistor R2, the second terminal of the second resistor R2 is connected to the first terminal of the third resistor R3, the second terminal of the third resistor R3 is connected to the first power conversion module, and the second terminal of the third resistor R3 is also grounded through the second capacitor C2.

[0029] The gate of the first PMOS transistor is connected to the first terminal of the third resistor R3, the source terminal of the first PMOS transistor is connected to the second terminal of the third resistor R3, and the drain terminal of the first PMOS transistor is connected to the drain terminal of the power amplifier. The drain terminal of the first PMOS transistor is also grounded through the third capacitor C3. The anode terminal of the Zener diode D1 is connected to the first terminal of the third resistor R3, and the cathode terminal of the Zener diode D1 is connected to the second terminal of the third resistor R3.

[0030] Understandably, when a power amplifier is needed, the microcontroller sends a high-level signal, which is transmitted to the gate of the first NMOS transistor Q1 through the first resistor R1. This causes the first NMOS transistor Q1 to meet the conduction condition, opening its source and drain terminals. The second resistor R2 is then connected to ground. The output voltage of the first power conversion module is divided by the second resistor R2 and the third resistor R3. When the Vgs (voltage difference between the source and gate terminals) of the first PMOS transistor exceeds the threshold voltage, the first PMOS transistor meets the conduction condition, opening its source and drain terminals, and the power amplifier operates normally. When the control signal sent by the microprocessor is a low-level signal, the source and drain terminals of the first NMOS transistor Q1 cannot open, the first resistor R1 is left floating, resulting in a Vgs of 0V for the first PMOS transistor. This prevents the source and drain terminals of the first PMOS transistor from opening, thus shutting down the power amplifier. Therefore, this solution uses the settings of the first NMOS transistor Q1 and the first PMOS transistor to control the switching of the power amplifier, thereby controlling the operating state of the power amplifier module.

[0031] In related technologies, power modules adjust their output voltage by using a voltage divider with fixed external resistors or potentiometers. However, this approach cannot achieve automatic adjustment of the power output voltage, making it difficult to maintain equipment operation and increasing heat dissipation, thus affecting equipment performance. To address this, the first power conversion module provided in this solution can intelligently adjust the power module's output voltage to reduce the rated power of key components (such as power amplifiers), effectively reducing overall heat dissipation while ensuring high product performance.

[0032] In one embodiment, the first power conversion module includes a power conversion chip, a boost control unit, and a buck control unit. The control terminal of the boost control unit is connected to a microcontroller, and its output terminal is connected to the controlled terminal of the power conversion chip. The control terminal of the buck control unit is also connected to the microcontroller, and its output terminal is connected to the controlled terminal of the power conversion chip. The positive and negative output terminals of the power conversion chip are connected via a fourth and a fifth capacitor, and the negative output terminal is grounded. The microcontroller can control the output of the power conversion chip by controlling the boost or buck control unit, thereby adjusting the output voltage of the first power conversion module by boosting or bucking it. Furthermore, the microcontroller can detect the fan module to determine its speed, thus determining if the fan has failed. It is conceivable that in the event of fan failure, the internal temperature of the device cannot be regulated, leading to heat accumulation, excessive internal temperature rise, and affecting the device's operation and reliability. Accordingly, the microcontroller can adjust the output voltage of the first power conversion module by bucking it in conjunction with the fan speed, thereby derating the overall critical components and effectively reducing overall heat dissipation while ensuring the device maintains high performance. This solution, through the setting of boost control unit and buck control unit, combined with fan failure and internal temperature, can flexibly adjust the output voltage of the first power conversion module, which helps to maintain the stable operation of the equipment.

[0033] Optionally, such as Figure 3 As shown, Figure 3 This is a schematic diagram of the circuit structure of a first power conversion module provided in one embodiment of this application. In one embodiment, the boost control unit 111 includes a PNP transistor Q2, an NPN transistor Q3, a fourth resistor R4, a fifth resistor R5, a sixth resistor R6, a seventh resistor R7, and a sixth capacitor C6. Specifically, the base of the PNP transistor Q2 is connected to the first terminal of the fourth resistor R4, the second terminal of the fourth resistor R4 is connected to the microcontroller, and the second terminal of the fourth resistor R4 is also grounded through the sixth capacitor C6. The collector of the PNP transistor Q2 is grounded, and the collector of the PNP transistor Q2 is also connected to the first terminal of the fifth resistor R5, and the second terminal of the fifth resistor R5 is connected to the second terminal of the fourth resistor R4. The emitter of the PNP transistor Q2 is connected to the base of the NPN transistor Q3, the base of the NPN transistor Q3 is connected to the first terminal of the sixth resistor R6, the second terminal of the sixth resistor R6 is connected to the collector of the NPN transistor Q3, and the collector of the NPN transistor Q3 is also connected to the positive output terminal of the power conversion chip U1. The emitter of NPN transistor Q3 is connected to the first terminal of the seventh resistor R7, and the second terminal of the seventh resistor R7 is connected to the controlled terminal of power conversion chip U1.

[0034] Understandably, the microcontroller provides an analog voltage signal for boost control via a DAC output pin (DAC1 in the diagram). This allows the current to be divided by resistors R4 and R5 before entering the base of PNP transistor Q2. PNP transistor Q2 and NPN transistor Q3 form a voltage follower circuit, transmitting the signal through the emitter of NPN transistor Q3 to resistor R7. This adjusts the voltage at the controlled terminal (OUTPUT TRIM pin) of power conversion chip U1, thus adjusting the module's output voltage to the target voltage. This solution combines the microcontroller's analog voltage signal to control the switching states of PNP transistor Q2 and NPN transistor Q3, enabling the microcontroller to dynamically adjust the OUTPUT TRIM voltage and ultimately regulate the output voltage.

[0035] Optionally, refer to Figure 3 In one embodiment, the buck control unit 112 includes a second NMOS transistor Q4, an eighth resistor R8, a ninth resistor R9, and a seventh capacitor C7. Specifically, the gate of the second NMOS transistor Q4 is connected to the first terminal of the eighth resistor R8, and the second terminal of the eighth resistor R8 is connected to the microcontroller. The gate of the second NMOS transistor Q4 is also connected to the first terminal of the seventh capacitor C7, and the source of the second NMOS transistor Q4 is connected to the second terminal of the seventh capacitor C7, and the source of the second NMOS transistor Q4 is grounded. The drain of the second NMOS transistor Q4 is connected to the first terminal of the ninth resistor R9, and the second terminal of the ninth resistor R9 is connected to the controlled terminal of the power conversion chip U1.

[0036] Understandably, the microcontroller can send a high-level signal through one of its GPIO pins (GPIO1 in the figure), which is then connected to the gate of the second NMOS transistor Q4 through the eighth resistor R8. After the gate-source voltage difference of the second NMOS transistor Q4 exceeds the conduction threshold, the second NMOS transistor Q4 is turned on, and the ninth resistor R9 is grounded. This allows the ninth resistor R9 to participate in the shunting of the controlled terminal of the power conversion chip U1 to ground, thereby reducing the voltage of the controlled terminal of the power conversion chip U1. This reduces the module's voltage from the rated voltage, effectively reducing the maximum output power of the power amplifier, and also effectively reducing the risk of power amplifier failure after fan failure.

[0037] This solution reduces the output voltage of the first power conversion module by controlling the switching state of the second NMOS transistor Q4 in conjunction with the signal output from the microcontroller. Figure 3 The switching state of the second NMOS transistor Q4 changes the resistance to ground on the low side of the power output (i.e., the resistance to ground of the controlled terminal of the power conversion chip U1 mentioned above), thereby reducing the output voltage of the module.

[0038] In one embodiment, the redundant power supply control circuit further includes a current sampling module. The sampling terminal of the current sampling module is connected to the power supply terminal of the power amplifier module and the output terminal of the first power conversion module, and the output terminal of the current sampling module is connected to a microcontroller. The current sampling module is used to detect the current flowing into the power amplifier module so that the microcontroller can detect the operating state of the power amplifier module. Optionally, Figure 4 This is a schematic diagram of the circuit structure of a current sampling module provided in one embodiment of this application, as shown below. Figure 4 As shown, in one embodiment, the current sampling module includes a shunt monitor chip U2, a sampling resistor Rp, a tenth resistor R10, an eleventh resistor R11, an eighth capacitor C8, a ninth capacitor C9, and a tenth capacitor C10.

[0039] Specifically, the first end of the sampling resistor Rp is connected to the output terminal of the first power conversion module, the second end of the sampling resistor Rp is connected to the power supply terminal of the power amplifier module, and the first end of the sampling resistor Rp is also connected to the positive input terminal of the shunt monitor chip U2, and the second end of the sampling resistor Rp is also connected to the negative input terminal of the shunt monitor chip U2. The positive input terminal of the shunt monitor chip U2 is grounded through the eighth capacitor C8, the power supply terminal of the shunt monitor chip U2 is connected to the operating voltage and grounded through the ninth capacitor C9, the output terminal of the shunt monitor chip U2 is connected to the first end of the tenth resistor R10, the second end of the tenth resistor R10 is connected to the microcontroller, and the output terminal of the shunt monitor chip U2 is also grounded through the eleventh resistor R11. The tenth capacitor C10 and the eleventh resistor R11 are connected in parallel. Understandably, the sampling resistor Rp connects the first power conversion module and the power amplifier module to sample the current flowing to the power amplifier module. The shunt monitor chip U2 acts as a detector, converting the current flowing to the power amplifier module into an analog voltage through the sampling resistor Rp. It also outputs the detected voltage value to the microcontroller through its output terminal and via resistors R10 and R11. For example, resistor R10 is connected to the microcontroller's ADC (Analog to Digital Converter) pin so that the microcontroller can acquire the detected analog voltage. Therefore, this solution detects the current of the power amplifier module to achieve current anomaly monitoring. This allows the microcontroller to collect data on the real-time operating current of multiple power amplifier modules converted into analog voltage, identifying whether there are output anomalies in the power amplifier module or the first power conversion module, and issuing an alarm when an anomaly occurs.

[0040] This application also provides a circuit board that includes the redundant power supply control circuit provided in the above embodiments. This circuit board enables the device to operate redundantly without significantly increasing the product size, weight and cost. Even if the key components or modules inside the unit fail, the satellite communication connection will not be interrupted, thereby improving the reliability of the satellite communication terminal and providing reliable support for emergency communication needs.

[0041] This application also provides a satellite communication terminal, which includes the circuit board provided in the above embodiments. The satellite communication terminal internally incorporates redundant output circuits. Even if a critical power supply or power amplifier module fails, the product is derated but the system can still maintain operation. This provides the most reliable communication link for users with emergency communication needs, such as disaster relief or emergency support, effectively improving equipment reliability. Furthermore, compared to the existing 1:1 backup solution, this solution has significant advantages in size, weight, power consumption, and cost, allowing for more flexible combination with different antennas to build miniaturized communication systems.

[0042] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0043] Note that the above description is merely a preferred embodiment and the technical principles employed in this application. Those skilled in the art will understand that this application is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of this application. Therefore, although this application has been described in detail through the above embodiments, this application is not limited to the above embodiments. Many other equivalent embodiments may be included without departing from the concept of this application, and the scope of this application is determined by the scope of the appended claims.

Claims

1. A redundant power supply control circuit, characterized in that, include: At least two first power conversion modules, each first power conversion module has an input terminal for connecting to a power source, and each first power conversion module has an output terminal connected to the anode of a different diode. The first power conversion module is used to provide a first operating voltage. The power amplifier module has the same number as the first power conversion module, and the power amplifier module corresponds one-to-one with the first power conversion module and is connected to the output terminal of the first power conversion module through the power supply terminal of the power amplifier module. The second power conversion module has its input terminal connected to the cathode of all the diodes and is used to provide a second operating voltage. A fan module, wherein the power supply terminal of the fan module is connected to the cathode terminal of the diode, and the fan module is used to regulate the internal temperature of the device; A low-dropout regulator, wherein the input terminal of the low-dropout regulator is connected to the output terminal of the second power conversion module; An up-converter and drive module, wherein the up-converter and drive module is connected to the output terminal of the second power conversion module; The microcontroller has its power supply terminal connected to the output terminal of the low dropout voltage regulator. Its first signal output terminal is connected to the control terminal of the power amplifier module and is used to turn the power amplifier module on or off. Its second signal output terminal is connected to the control terminal of the first power conversion module and is used to control the output voltage of the first power conversion module in conjunction with the fan's operating status. Its third signal output terminal is connected to the control terminal of the fan module and is used to control the fan speed in the fan module. Its first signal receiving terminal is connected to the sampling terminal of the fan module and is used to detect the fan speed in the fan module. Its second signal receiving terminal is connected to the sampling terminal of the power amplifier module and is used to identify whether the power amplifier module is malfunctioning.

2. The redundant power supply control circuit according to claim 1, characterized in that, The power amplifier module includes a power amplifier and a power supply control unit. The drain terminal of the power amplifier is connected to the output terminal of the power supply control unit. The power supply terminal of the power supply control unit is connected to the output terminal of the first power conversion module. The control terminal of the power supply control unit is connected to the first signal output terminal of the microcontroller. The power supply control unit is used to control the voltage of the drain terminal of the power amplifier to control the operating state of the power amplifier when a control signal is received.

3. The redundant power supply control circuit according to claim 2, characterized in that, The power supply control unit includes a first NMOS transistor, a first PMOS transistor, a first resistor, a second resistor, a third resistor, a first capacitor, a second capacitor, a third capacitor, and a Zener diode; The gate of the first NMOS transistor is connected to the first end of the first resistor, the second end of the first resistor is connected to the microcontroller, the two ends of the first capacitor are respectively connected to the gate and source of the first NMOS transistor, and the source of the first NMOS transistor is grounded. The drain terminal of the first NMOS transistor is connected to the first terminal of the second resistor, the second terminal of the second resistor is connected to the first terminal of the third resistor, the second terminal of the third resistor is connected to the first power conversion module, and the second terminal of the third resistor is also grounded through the second capacitor. The gate of the first PMOS transistor is connected to the first terminal of the third resistor, the source of the first PMOS transistor is connected to the second terminal of the third resistor, the drain of the first PMOS transistor is connected to the drain of the power amplifier, and the drain of the first PMOS transistor is also grounded through the third capacitor. The anode of the Zener diode is connected to the first terminal of the third resistor, and the cathode of the Zener diode is connected to the second terminal of the third resistor.

4. The redundant power supply control circuit according to claim 1 or 2, characterized in that, The first power conversion module includes a power conversion chip, a boost control unit, and a buck control unit; The control terminal of the boost control unit is connected to the microcontroller, and the output terminal of the boost control unit is connected to the controlled terminal of the power conversion chip. The control terminal of the buck control unit is connected to the microcontroller, and the output terminal of the buck control unit is connected to the controlled terminal of the power conversion chip.

5. The redundant power supply control circuit according to claim 4, characterized in that, The boost control unit includes a PNP transistor, an NPN transistor, a fourth resistor, a fifth resistor, a sixth resistor, a seventh resistor, and a sixth capacitor; The base of the PNP transistor is connected to the first end of the fourth resistor, the second end of the fourth resistor is connected to the microcontroller, and the second end of the fourth resistor is also grounded through the sixth capacitor. The collector of the PNP transistor is grounded, and the collector of the PNP transistor is also connected to the first end of the fifth resistor, and the second end of the fifth resistor is connected to the second end of the fourth resistor. The emitter of the PNP transistor is connected to the base of the NPN transistor, the base of the NPN transistor is connected to the first end of the sixth resistor, the second end of the sixth resistor is connected to the collector of the NPN transistor, and the collector of the NPN transistor is also connected to the positive output terminal of the power conversion chip. The emitter of the NPN transistor is connected to the first end of the seventh resistor, and the second end of the seventh resistor is connected to the controlled end of the power conversion chip.

6. The redundant power supply control circuit according to claim 4, characterized in that, The buck control unit includes a second NMOS transistor, an eighth resistor, a ninth resistor, and a seventh capacitor; The gate of the second NMOS transistor is connected to the first terminal of the eighth resistor, and the second terminal of the eighth resistor is connected to the microcontroller; the gate of the second NMOS transistor is also connected to the first terminal of the seventh capacitor, the source of the second NMOS transistor is connected to the second terminal of the seventh capacitor, and the source of the second NMOS transistor is grounded; the drain of the second NMOS transistor is connected to the first terminal of the ninth resistor, and the second terminal of the ninth resistor is connected to the controlled terminal of the power conversion chip.

7. The redundant power supply control circuit according to claim 1, characterized in that, It also includes a current sampling module, the sampling end of which is connected to the power supply end of the power amplifier module and the output end of the first power conversion module, and the output end of the current sampling module is connected to the microcontroller. The current sampling module is used to detect the current flowing into the power amplifier module so that the microcontroller can detect the operating status of the power amplifier module.

8. The redundant power supply control circuit according to claim 7, characterized in that, The current sampling module includes a shunt monitor chip, a sampling resistor, a tenth resistor, an eleventh resistor, an eighth capacitor, a ninth capacitor, and a tenth capacitor; The first end of the sampling resistor is connected to the output end of the first power conversion module, the second end of the sampling resistor is connected to the power supply end of the power amplifier module, and the first end of the sampling resistor is also connected to the positive input end of the shunt monitor chip, and the second end of the sampling resistor is also connected to the negative input end of the shunt monitor chip. The positive input terminal of the shunt monitor chip is grounded through the eighth capacitor. The power supply terminal of the shunt monitor chip is connected to the working voltage and grounded through the ninth capacitor. The output terminal of the shunt monitor chip is connected to the first terminal of the tenth resistor. The second terminal of the tenth resistor is connected to the microcontroller. The output terminal of the shunt monitor chip is also grounded through the eleventh resistor. The tenth capacitor and the eleventh resistor are connected in parallel.

9. A circuit board, characterized in that, Includes the redundant power supply control circuit as described in any one of claims 1-8.

10. A satellite communication terminal, characterized in that, Includes the circuit board as described in claim 9.

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