A driving system suitable for packaging IGBT module and driving circuit board thereof

Abstract

The utility model discloses a kind of driving system and its driving circuit board suitable for packaging IGBT module, it is characterized in that, including several driving modules, each driving module includes first connector, second connector, third connector, fourth connector, upper bridge drive circuit and lower bridge drive circuit;Upper bridge drive circuit is connected with first connector and second connector in parallel, lower bridge drive circuit is connected with third connector and fourth connector in parallel;Driving module is connected between using "chrysanthemum chain" type connection.A kind of driving system and its driving circuit board suitable for packaging IGBT module, on single compact PCB, through upper bridge drive circuit collaborative optimization has been easy to expand the layout and interconnection of strong drive and driving circuit parallel 2 connectors, can significantly reduce the parasitic inductance of drive loop, inhibit gate voltage oscillation, improve the switching reliability and efficiency of IGBT;With the driving circuit interface of the convenience expansion ability and not affecting signal integrity, system expansibility is enhanced.

Description

Technical Field

[0001] This utility model belongs to the field of power electronics technology, and relates to a drive system and its drive circuit board suitable for packaging IGBT modules. Background Technology

[0002] In the existing technology, for EconoDUAL TM The drive circuits for high-power IGBT modules typically suffer from the following design flaws: Firstly, large parasitic parameters in the drive circuit lead to degraded switching performance. Current drive circuits generally employ integrated chips or discrete component push-pull structures. When using discrete components, large-package transistors are often chosen to construct push-pull circuits in scenarios requiring high drive current. However, such discrete solutions are highly sensitive to PCB layout—improper control of the lead length from the drive output to the IGBT gate will introduce significant parasitic inductance. This parasitic parameter, along with the IGBT input capacitance, forms an LC resonant network, which can easily induce gate voltage oscillations during nanosecond-level switching, potentially leading to catastrophic failures such as false turn-on or bridge arm shoot-through. Secondly, poor system scalability and impact on signal integrity: Many drive boards are designed with a single input interface. When facing multi-module parallel connection or system expansion requirements, external flying wires or adapter boards are used for signal / power distribution. This non-integrated connection method not only significantly increases assembly complexity but also introduces additional distributed inductance and interference, further deteriorating the electromagnetic environment and reducing system reliability and consistency. Furthermore, thermal detection signals are susceptible to interference: most IGBT modules integrate NTC negative temperature coefficient thermistors, but the temperature signal transmission between the driver and control unit still relies on long-distance leads. In multi-module systems, each NTC signal line becomes a potential noise coupling path. Utility Model Content

[0003] To solve the above problems, the present invention adopts the following technical solution:

[0004] In a first aspect, a driving system suitable for packaging IGBT modules includes a plurality of driving modules, each driving module including a first connector, a second connector, a third connector, a fourth connector, an upper bridge driving circuit, and a lower bridge driving circuit; the upper bridge driving circuit is connected in parallel to the first connector and the second connector, and the lower bridge driving circuit is connected in parallel to the third connector and the fourth connector;

[0005] The first connector of the first drive module is connected to the upper bridge drive signal of the IGBT, and the third connector of the first drive module is connected to the lower bridge drive signal of the IGBT; the first connector of the (n+1)th drive module is connected to the second connector of the nth drive module, and the second connector of the (n+1)th drive module is connected to the first connector of the (n+2)th drive module or is unloaded; the third connector of the (n+1)th drive module is connected to the fourth connector of the nth drive module, and the fourth connector of the (n+1)th drive module is connected to the third connector of the (n+2)th drive module or is unloaded, where n≥1;

[0006] The first connector is the upper bridge signal input terminal, the second connector is the upper bridge signal output terminal, the third connector is the lower bridge signal input terminal, and the fourth connector is the lower bridge signal output terminal.

[0007] As a further embodiment of this utility model: the driving module also encapsulates a temperature signal module; the temperature signal module includes a fifth connector, a sixth connector, and a temperature signal processing module; the temperature signal processing module, the sixth connector, and the fifth connector are connected in series in sequence;

[0008] The fifth connector of the nth temperature signal processing module is connected to the sixth connector of the (n+1)th temperature signal processing module or an external main controller, where n≥1;

[0009] The fifth connector is the input terminal for the temperature signal, and the sixth connector is the output terminal for the temperature signal.

[0010] As a further embodiment of this utility model: the upper bridge driving circuit includes an NPN diode and a PNP transistor connected in series to form a push-pull amplifier circuit, and the push-pull amplifier circuit is connected to the first connector.

[0011] As a further embodiment of this utility model: the temperature signal processing module includes a signal conditioning circuit and a voltage divider circuit composed of a resistor and an NTC; one end of the signal conditioning circuit is connected to the voltage divider circuit, and the other end of the signal conditioning circuit is connected to the fifth connector and the sixth connector.

[0012] As a further embodiment of this utility model, the signal conditioning circuit includes a voltage follower composed of an RC low-pass filter and an operational amplifier, or an operational amplifier circuit.

[0013] As a further embodiment of this utility model: the first connector, the second connector, the third connector and the fourth connector are XHS pin headers.

[0014] As a further embodiment of this utility model: the fifth connector and the sixth connector are XHS pin headers.

[0015] In a second aspect, a driver circuit board suitable for packaging IGBT modules includes a plurality of driver boards, each driver board including a first connector, a second connector, a third connector, a fourth connector, an upper bridge driver circuit, and a lower bridge driver circuit; the upper bridge driver circuit is connected in parallel to the first connector and the second connector, and the lower bridge driver circuit is connected in parallel to the third connector and the fourth connector;

[0016] The first connector of the first driver board is connected to the upper bridge drive signal of the IGBT, and the third connector of the first driver board is connected to the lower bridge drive signal of the IGBT; the first connector of the (n+1)th driver board is connected to the second connector of the nth driver board, and the second connector of the (n+1)th driver board is connected to the first connector of the (n+2)th driver board or is unloaded; the third connector of the (n+1)th driver board is connected to the fourth connector of the nth driver board, and the fourth connector of the (n+1)th driver board is connected to the third connector of the (n+2)th driver board or is unloaded, where n≥1;

[0017] The first connector is the upper bridge signal input terminal, the second connector is the upper bridge signal output terminal, the third connector is the lower bridge signal input terminal, and the fourth connector is the lower bridge signal output terminal.

[0018] As a further embodiment of this utility model: the driver board is also encapsulated with a temperature signal circuit; the temperature signal circuit includes a fifth connector, a sixth connector, and a temperature signal processing circuit; the temperature signal processing circuit, the sixth connector, and the fifth connector are connected in series in sequence;

[0019] The fifth connector of the nth temperature signal circuit is connected to the sixth connector of the (n+1)th temperature signal circuit or an external main controller, where n≥1;

[0020] The fifth connector is the input terminal for the temperature signal, and the sixth connector is the output terminal for the temperature signal.

[0021] As a further embodiment of this utility model: the first connector, the second connector, the third connector, the fourth connector, the fifth connector and the sixth connector are XHS pin headers.

[0022] The beneficial effects of this utility model are:

[0023] A drive system and its drive circuit board suitable for packaged IGBT modules are disclosed. On a single compact PCB, the layout and interconnection of two connectors connected in parallel, which are designed for easy expansion, are optimized through the coordinated use of the upper bridge drive circuit. This significantly reduces the parasitic inductance of the drive circuit, suppresses gate voltage oscillation, and improves the switching reliability and efficiency of the IGBT. The drive circuit interface has convenient expansion capabilities without affecting signal integrity, thus enhancing the system's scalability. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of a drive system suitable for encapsulating IGBT modules;

[0025] Figure 2 This is a schematic diagram of a driver circuit board suitable for packaging IGBT modules;

[0026] Figure 3 This is a schematic diagram of a driver circuit board suitable for packaging IGBT modules.

[0027] As shown in the figure: 1-first connector, 2-second connector, 3-third connector, 4-fourth connector, 5-fifth connector, 6-sixth connector. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. It should be understood that this application is not limited to the exemplary embodiments disclosed herein. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0029] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0030] In the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0031] Example 1

[0032] like Figure 1As shown, a driving system suitable for packaging IGBT modules includes several driving modules. Each driving module includes a first connector, a second connector, a third connector, a fourth connector, an upper bridge driving circuit, and a lower bridge driving circuit. The upper bridge driving circuit is connected in parallel to the first connector and the second connector, and the lower bridge driving circuit is connected in parallel to the third connector and the fourth connector.

[0033] The first connector of the first drive module is connected to the upper bridge drive signal of the IGBT, and the third connector of the first drive module is connected to the lower bridge drive signal of the IGBT; the first connector of the (n+1)th drive module is connected to the second connector of the nth drive module, and the second connector of the (n+1)th drive module is connected to the first connector of the (n+2)th drive module or is unloaded; the third connector of the (n+1)th drive module is connected to the fourth connector of the nth drive module, and the fourth connector of the (n+1)th drive module is connected to the third connector of the (n+2)th drive module or is unloaded, where n≥1;

[0034] The first connector is the upper bridge signal input terminal, the second connector is the upper bridge signal output terminal, the third connector is the lower bridge signal input terminal, and the fourth connector is the lower bridge signal output terminal.

[0035] In this embodiment, the driving module also encapsulates a temperature signal module; the temperature signal module includes a fifth connector, a sixth connector, and a temperature signal processing module; the temperature signal processing module, the sixth connector, and the fifth connector are connected in series in sequence; the fifth connector of the nth temperature signal processing module is connected to the sixth connector of the (n+1)th temperature signal processing module or an external main controller, where n≥1; the fifth connector is the input terminal of the temperature signal, and the sixth connector is the output terminal of the temperature signal.

[0036] In this embodiment, the upper bridge drive circuit includes an NPN diode and a PNP transistor connected in series to form a push-pull amplifier circuit, which is connected to the first connector.

[0037] In this embodiment, the temperature signal processing module includes a signal conditioning circuit and a voltage divider circuit composed of a resistor and an NTC; one end of the signal conditioning circuit is connected to the voltage divider circuit, and the other end of the signal conditioning circuit is connected to the fifth connector and the sixth connector.

[0038] In this embodiment, the signal conditioning circuit includes a voltage follower consisting of an RC low-pass filter and an operational amplifier, or an operational amplifier circuit.

[0039] In this embodiment, the first connector, the second connector, the third connector, and the fourth connector are XHS connectors. The fifth connector and the sixth connector are XHS connectors.

[0040] A drive system suitable for packaged IGBT modules significantly reduces parasitic inductance in the drive circuit, suppresses gate voltage oscillation, and improves the switching reliability and efficiency of the IGBT. It includes a drive module and a temperature signal processing module, which exist independently. The specific principles are as follows:

[0041] Driver module:

[0042] A push-pull amplifier circuit is constructed using a pair of high-current, high-bandwidth NPN and PNP transistors, respectively responsible for the rapid turn-on and turn-off of the IGBT, providing a powerful gate charging and discharging current. On the driver circuit board, the push-pull circuit is placed close to the gate and emitter pin pads of the IGBT module it drives, minimizing the physical loop path of the drive current and thus reducing lead inductance at the source.

[0043] The input connector of the driver module uses two identical XHS pin headers connected in parallel. One header is defined as the main input interface (connectors 1 and 3), used to receive PWM signals and drive power from the control board; the other header is defined as the expansion output interface (connectors 2 and 4), and its electrical connection is completely parallel to the main input interface. When it is necessary to drive the next IGBT module, simply use a standard cable with XHS connectors at both ends to connect the expansion output interface of this board to the main input interface of the next driver board, achieving lossless "daisy-chain" signal expansion.

[0044] A drive system suitable for packaged IGBT modules significantly shortens the drive loop and reduces parasitic inductance by placing a high-current push-pull circuit close to the IGBT gate. This effectively suppresses gate voltage overshoot and oscillation during switching, reduces switching losses, and avoids the risk of false triggering and bridge arm shoot-through caused by voltage oscillation, thereby greatly improving the reliability and efficiency of the system.

[0045] Temperature signal processing module:

[0046] The temperature signal processing module includes a voltage divider circuit consisting of a precision resistor connected in series with the NTC, and subsequent signal conditioning circuitry, such as a voltage follower or amplifier circuit composed of an RC low-pass filter and an operational amplifier. The temperature signal processing module converts the resistance change of the NTC into a stable voltage signal output for the main controller to acquire for temperature monitoring and protection. Specifically, the temperature signal processing module is located directly on the driver circuit board at the position corresponding to the NTC pin of the IGBT module.

[0047] The temperature signal processing module connection also uses two XHS pin headers, which can realize lossless "daisy-chain" extension of the signal.

[0048] A drive system suitable for packaged IGBT modules integrates a temperature signal processing circuit on the driver board and close to the NTC pin. This localizes and processes the weak NTC signal at close range, and transmits the processed stable voltage signal over long distances. This effectively enhances anti-interference capabilities, ensures the accuracy of temperature sampling, and makes over-temperature protection more timely and reliable.

[0049] A driver system suitable for packaged IGBT modules, which integrates the driver, expansion interface, and temperature detection onto a compact PCB, specifically designed for EconoDUAL. TM 3. Optimized packaging, clear structure, and convenient installation. Furthermore, by utilizing low-cost discrete push-pull circuitry and standardized connectors, cost optimization is achieved while ensuring high performance.

[0050] Example 2

[0051] like Figure 2 and 3 As shown, a driver circuit board suitable for packaging IGBT modules includes several driver boards. Each driver board includes a first connector, a second connector, a third connector, a fourth connector, an upper bridge driver circuit, and a lower bridge driver circuit. The upper bridge driver circuit is connected in parallel to the first connector and the second connector, and the lower bridge driver circuit is connected in parallel to the third connector and the fourth connector.

[0052] The first connector of the first driver board is connected to the IGBT upper bridge drive signal, and the third connector of the first driver board is connected to the IGBT lower bridge drive signal; the first connector of the (n+1)th driver board is connected to the second connector of the nth driver board, and the second connector of the (n+1)th driver board is connected to the first connector of the (n+2)th driver board or is unloaded; the third connector of the (n+1)th driver board is connected to the fourth connector of the nth driver board, and the fourth connector of the (n+1)th driver board is connected to the third connector of the (n+2)th driver board or is unloaded, where n≥1; the first connector is the upper bridge signal input terminal, the second connector is the upper bridge signal output terminal, the third connector is the lower bridge signal input terminal, and the fourth connector is the lower bridge signal output terminal.

[0053] In this embodiment, the driver board also encapsulates a temperature signal circuit; the temperature signal circuit includes a fifth connector, a sixth connector, and a temperature signal processing circuit; the temperature signal processing circuit, the sixth connector, and the fifth connector are connected in series in sequence; the fifth connector of the nth temperature signal circuit is connected to the sixth connector of the (n+1)th temperature signal circuit or an external main controller, where n≥1; the fifth connector is the input terminal of the temperature signal, and the sixth connector is the output terminal of the temperature signal.

[0054] In this embodiment, the first connector, the second connector, the third connector, the fourth connector, the fifth connector, and the sixth connector are XHS pin headers.

[0055] like Figure 3 As shown, the dimensions of the PCB board are similar to those of the EconoDUAL. TM The drive interface areas of the three modules are matched. The push-pull circuit consists of an NPN transistor (Q1) and a PNP transistor (Q2) along with their base resistor, gate resistor, and other peripheral components. This circuit is centrally located in the lower right corner of the PCB board, adjacent to the gate and emitter pin pads of the IGBT module. This PCB layout technique, with the core objective of minimizing parasitic inductance in the drive loop, reduces the inductance of the drive leads.

[0056] The upper bridge driver circuit has two parallel XHS-5 connectors (CN1, CN2) located at the top edge of the PCB. Connector (CN1) serves as the main input, with pin definitions such as VCC+, VCC-, GND, and PWM. Connector (CN2) serves as the extended output, with pin definitions corresponding one-to-one with connector (CN1) and internally electrically connected in parallel. The lower bridge driver circuit is located on the lower left side of the PCB, with the connectors arranged in the same way as the upper bridge driver circuit.

[0057] The temperature signal processing circuit is located in the lower right corner of the PCB board, near the NTC pin pads. The circuit includes a voltage divider resistor R25 connected in series with the NTC, a low-pass filter composed of R26 and C16, and a voltage follower composed of an operational amplifier U1.

[0058] A driver circuit board for packaging IGBT modules, specifically adapted to EconoDUAL. TM A 3-package IGBT module. It includes a push-pull driver circuit composed of discrete transistors and two standardized interface connectors connected in parallel. The push-pull driver circuit is positioned on the PCB adjacent to the gate and emitter pins of the IGBT module it drives. Of the two interface connectors, the first connector serves as the input interface for drive signals and power, and the second connector serves as an extended output interface for drive signals and power. It also includes a temperature signal processing circuit integrated on the circuit board, located corresponding to the NTC thermistor pins of the IGBT module, used to convert the resistance change of the NTC into a voltage signal and output it. The specific working principle is as follows:

[0059] Driving process: The PWM signal is connected from the main input pin socket (CN1) to control the transistors Q1 and Q2 in the push-pull circuit to conduct alternately, generating a strong driving current that acts directly on the gate of the IGBT through an extremely short trace.

[0060] Expansion process: The driver circuit board connects sequentially to the input interface of the next-level driver circuit board through its expansion output interface, forming a daisy-chain topology. When a second IGBT module needs to be driven, an XHS cable with a male connector on one end and a female connector on the other is used to connect the expansion output pin header of this board to the main input pin header of the second driver board, thus completing the signal and power distribution.

[0061] Temperature detection process: The NTC inside the IGBT module forms a voltage divider with R25 on the driver board. After the voltage is filtered and buffered by the follower, a stable and interference-resistant Temp_out signal is output and sent back to the main controller through the main input pin header (CN6).

[0062] In summary, a drive system and its drive circuit board suitable for packaged IGBT modules, on a single compact PCB, optimizes the layout and interconnection of three major functional modules—strong drive, easy expansion with dual-interface connectors, and precise temperature detection—through a push-pull circuit. This significantly reduces parasitic inductance in the drive circuit, suppresses gate voltage oscillation, and improves the switching reliability and efficiency of the IGBT. It also features a drive circuit interface with convenient expansion capabilities without affecting signal integrity, and a highly integrated, highly anti-interference temperature detection scheme to ensure accurate and rapid over-temperature protection.

[0063] It should also be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0064] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A driving system suitable for encapsulating IGBT modules, characterized in that, It includes several drive modules, each of which includes a first connector, a second connector, a third connector, a fourth connector, an upper bridge drive circuit, and a lower bridge drive circuit; the upper bridge drive circuit is connected in parallel to the first connector and the second connector, and the lower bridge drive circuit is connected in parallel to the third connector and the fourth connector; The first connector of the first drive module is connected to the upper bridge drive signal of the IGBT, and the third connector of the first drive module is connected to the lower bridge drive signal of the IGBT; the first connector of the (n+1)th drive module is connected to the second connector of the nth drive module, and the second connector of the (n+1)th drive module is connected to the first connector of the (n+2)th drive module or is unloaded; the third connector of the (n+1)th drive module is connected to the fourth connector of the nth drive module, and the fourth connector of the (n+1)th drive module is connected to the third connector of the (n+2)th drive module or is unloaded, where n≥1; The first connector is the upper bridge signal input terminal, the second connector is the upper bridge signal output terminal, the third connector is the lower bridge signal input terminal, and the fourth connector is the lower bridge signal output terminal.

2. The driving system for packaged IGBT modules according to claim 1, characterized in that, The drive module also encapsulates a temperature signal module; the temperature signal module includes a fifth connector, a sixth connector, and a temperature signal processing module; the temperature signal processing module, the sixth connector, and the fifth connector are connected in series in sequence. The fifth connector of the nth temperature signal processing module is connected to the sixth connector of the (n+1)th temperature signal processing module or an external main controller, where n≥1; The fifth connector is the input terminal for the temperature signal, and the sixth connector is the output terminal for the temperature signal.

3. The driving system for packaged IGBT modules according to claim 2, characterized in that, The upper bridge drive circuit includes an NPN diode and a PNP transistor connected in series to form a push-pull amplifier circuit, which is connected to the first connector.

4. The driving system for packaged IGBT modules according to claim 2, characterized in that, The temperature signal processing module includes a signal conditioning circuit and a voltage divider circuit composed of a resistor and an NTC; one end of the signal conditioning circuit is connected to the voltage divider circuit, and the other end of the signal conditioning circuit is connected to the fifth connector and the sixth connector.

5. The driving system for packaged IGBT modules according to claim 4, characterized in that, The signal conditioning circuit includes a voltage follower consisting of an RC low-pass filter and an operational amplifier, or an operational amplifier circuit.

6. The driving system suitable for packaged IGBT modules according to claim 1 or 2, characterized in that, The first connector, the second connector, the third connector, and the fourth connector are XHS pin headers.

7. The driving system for packaged IGBT modules according to claim 2, characterized in that, The fifth and sixth connectors are XHS pin headers.

8. A driver circuit board suitable for packaging IGBT modules, characterized in that, It includes several driver boards, each driver board including a first connector, a second connector, a third connector, a fourth connector, an upper bridge driver circuit and a lower bridge driver circuit; the upper bridge driver circuit is connected in parallel to the first connector and the second connector, and the lower bridge driver circuit is connected in parallel to the third connector and the fourth connector; The first connector of the first driver board is connected to the upper bridge drive signal of the IGBT, and the third connector of the first driver board is connected to the lower bridge drive signal of the IGBT; the first connector of the (n+1)th driver board is connected to the second connector of the nth driver board, and the second connector of the (n+1)th driver board is connected to the first connector of the (n+2)th driver board or is unloaded; the third connector of the (n+1)th driver board is connected to the fourth connector of the nth driver board, and the fourth connector of the (n+1)th driver board is connected to the third connector of the (n+2)th driver board or is unloaded, where n≥1; The first connector is the upper bridge signal input terminal, the second connector is the upper bridge signal output terminal, the third connector is the lower bridge signal input terminal, and the fourth connector is the lower bridge signal output terminal.

9. The driver circuit board for packaging IGBT modules according to claim 8, characterized in that, The driver board also encapsulates a temperature signal circuit; the temperature signal circuit includes a fifth connector, a sixth connector, and a temperature signal processing circuit; the temperature signal processing circuit, the sixth connector, and the fifth connector are connected in series in sequence. The fifth connector of the nth temperature signal circuit is connected to the sixth connector of the (n+1)th temperature signal circuit or an external main controller, where n≥1; The fifth connector is the input terminal for the temperature signal, and the sixth connector is the output terminal for the temperature signal.

10. The driver circuit board for packaging IGBT modules according to claim 9, characterized in that, The first connector, second connector, third connector, fourth connector, fifth connector and sixth connector are XHS pin headers.

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