Impedance matching and radio frequency devices

Abstract

The application discloses an impedance matcher and a radio frequency device. The impedance matcher comprises a mounting shell, an inductor and a capacitor. The mounting shell is provided with a mounting cavity; the inductor is arranged in the mounting cavity and is provided with a containing cavity; the capacitor is nested with the inductor and comprises a first electrode piece, a second electrode piece and a first insulating piece. The first electrode piece is arranged in the containing cavity, the second electrode piece is nested with the first electrode piece, the first insulating piece is arranged between the first electrode piece and the second electrode piece, and the first electrode piece and the second electrode piece are fixedly arranged opposite to the mounting shell. The overlapping length of the capacitor and the inductor can be changed, and / or the overlapping length of the first electrode piece and the second electrode piece can be changed. Therefore, the impedance matcher is suitable for different power radio frequency injection use scenarios, the volume of the impedance matcher is reduced, the structure is simple and compact, and the production cost and the maintenance cost are reduced.

Description

Technical Field

[0001] This application relates to the technical field of radio frequency power supplies for semiconductor process equipment, and more particularly to an impedance matching device. Background Technology

[0002] The capacitance and inductance of existing impedance matching devices are fixed, which means that the matching network of the impedance matching device can usually achieve good impedance matching at a specific frequency point or a very narrow frequency range. Therefore, it cannot adapt to changes in load impedance and limits the application scenarios of impedance matching devices. Utility Model Content

[0003] In view of this, this application provides an impedance matching device and a radio frequency device, which solves the problem that the capacitance and inductance of existing impedance matching devices are fixed and cannot adapt to changes in load impedance, thus limiting the application scenarios of the impedance matching device.

[0004] In a first aspect, this application provides an impedance matching device, including a mounting housing, an inductor, and a capacitor. The mounting housing has a mounting cavity; the inductor is disposed within the mounting cavity and has a receiving cavity; the capacitor is nested with the inductor, and the capacitor includes a first electrode, a second electrode, and a first insulating member. The first electrode and the second electrode are fixedly disposed relative to the mounting housing, the first electrode passes through the receiving cavity, the second electrode is nested with the first electrode, and the first insulating member is disposed between the first electrode and the second electrode; the overlap length of the nested capacitor and the inductor can be varied; and / or, the overlap length of the nested first electrode and the second electrode can be varied.

[0005] The impedance matching device and RF device provided in this application, on the one hand, allow for adjustment of the inductance of the inductor by setting the overlap length of the nested capacitor and inductor to be variable; and / or, allow for adjustment of the capacitance of the capacitor by setting the overlap length of the nested first electrode and second electrode to be variable. This makes the impedance matching device suitable not only for high-power RF injection scenarios but also for low-power RF injection scenarios, thereby enabling the impedance matching device to be used in different power RF injection scenarios, meeting the requirements of varying load impedance, and enriching the application scenarios of the impedance matching device. On the other hand, by setting the capacitor and inductor nested, and by setting the first electrode and second electrode nested, the size of the impedance matching device is reduced, the structure is simple and compact, and production and maintenance costs are reduced.

[0006] In conjunction with the first aspect, in some implementations of the first aspect, the inductor includes an insulating base and a coil. The insulating base is connected to the mounting shell and has a receiving cavity. The coil is wound around the outer wall of the insulating base, and a heat dissipation channel is provided inside the coil to accommodate the cooling medium. Thus, on the one hand, the heat dissipation capacity of the inductor is improved by the heat dissipation channel that can transport the cooling medium inside the coil, thereby increasing the power limit of the impedance matching device during operation. This allows the impedance matching device to adapt to high-power applications. Furthermore, the inductor does not require water-cooled plates, heat dissipation ceramics, or other heat dissipation components, reducing the production cost of the impedance matching device and miniaturizing the space occupied by the inductor, achieving a miniaturized design. On the other hand, the capacitor is placed within the receiving cavity of the insulating base, thereby reducing the magnetic field generated by the capacitor and the inductor, reducing electromagnetic interference between the capacitor and the inductor, and reducing parasitic capacitance between the coil and ground. Finally, the insulating base provides a reliable solid insulation barrier, preventing arcing between the internal high-voltage capacitor and the external grounded shell, enhancing electrical safety and reliability.

[0007] In conjunction with the first aspect, in some implementations of the first aspect, a spiral groove is provided on the outer wall of the insulating base, and the coil is disposed within the spiral groove. Thus, on the one hand, by providing a spiral groove on the outer wall of the insulating base, precise positioning of the coil is achieved, the risk of coil deformation under vibration or temperature changes is reduced, the problem of short circuits caused by direct contact between the coil turns is prevented, electrical insulation is enhanced, and the heat exchange efficiency between the coil and the outside air is improved.

[0008] In conjunction with the first aspect, in some implementations of the first aspect, the inductor further includes an RF input connector and an RF output connector. The coil includes a first end and a second end disposed opposite to each other. The RF input connector is electrically connected to the first end. The second electrode includes a first segment and a second segment connected to the first segment. The first segment is nested within the first electrode, and the second segment extends beyond the first electrode. The RF output connector is sleeved on the outside of the second segment and is electrically connected to the second electrode and the second end. Thus, on the one hand, the RF output connector is sleeved on the second segment of the second electrode in a clamping manner, thereby increasing the contact area between the RF output connector and the second electrode, reducing the contact resistance, and thus increasing the transmission of RF power in different ranges, as well as enhancing the stability of the mechanical connection between the RF output connector and the second electrode. On the other hand, the heat generated by the capacitor can be quickly dissipated to the external environment through the clamping part of the RF output connector, improving the thermal management capability of the impedance matching device.

[0009] In conjunction with the first aspect, in some implementations of the first aspect, the inductor further includes two insulating terminals, the mounting housing is provided with two through holes communicating with the mounting cavity, the through holes are provided with insulating terminals, the two ends of the coil respectively pass through the two through holes, and are respectively connected to the mounting housing through the two insulating terminals, the insulating terminals including insulating sleeves and / or insulating coatings.

[0010] In conjunction with the first aspect, in some implementations of the first aspect, the inductor is fixed relative to the mounting housing, and the capacitor is movable relative to the inductor along the extension direction of the accommodating cavity; or, the capacitor is fixed relative to the mounting housing, and the inductor is movable relative to the capacitor along the extension direction of the accommodating cavity. This allows the adjustable inductor to enable the impedance matching network to cover a wider impedance region, and provides continuous and high-precision step adjustment, improving impedance mismatch between the RF power supply and the load. This, in turn, enables real-time response to dynamic changes in load impedance, improves power transmission efficiency, and protects the RF power supply.

[0011] In conjunction with the first aspect, in some implementations of the first aspect, the first electrode component includes an electrode plate, a connecting plate, and an adjusting rod. The electrode plate is nested with and insulated from the second electrode component. The adjusting rod is fixedly connected to the electrode plate via the connecting plate and is located on the side of the connecting plate facing away from the second electrode component. The mounting position of the adjusting rod relative to the mounting housing is variable and it is grounded to the mounting housing. Therefore, based on the electrode plate being connected to the mounting housing and grounded via the adjusting rod, on the one hand, the adjusting rod not only undertakes the mechanical function of supporting and fixing the electrode plate but also provides a current grounding path, enabling the impedance matching device to have good electrical functions. On the other hand, as the grounding plate of the capacitor, the adjusting rod can adjust the overlap length of the nested electrode plate and the second electrode component, and can also safely conduct large RF currents, improving the power handling capability of the entire impedance matching device. Furthermore, shortening the shortest path between the first electrode component and the mounting housing reduces the parasitic inductance of the grounding loop, allowing the variable capacitance capacitor to operate normally at higher frequencies.

[0012] In conjunction with the first aspect, in some implementations of the first aspect, the adjusting rod is rotatably connected to the mounting housing; or, the adjusting rod is slidably connected to the mounting housing. Therefore, by rotatably connecting the adjusting rod to the mounting housing, on the one hand, the precise positioning control of the capacitor's movement relative to the inductor is improved, enabling real-time response to dynamic changes in load impedance, improving power transmission efficiency, and protecting the RF power supply; on the other hand, the rotatable connection between the adjusting rod and the mounting housing reduces friction between the adjusting rod and the mounting housing, minimizing wear between the first electrode and the mounting housing, and extending the service life of the impedance matching device; furthermore, by sliding the adjusting rod relative to the mounting housing in a straight line, the overlap length between the capacitor and the coil is directly changed to achieve inductance change, simplifying the control software algorithm.

[0013] In conjunction with the first aspect, in some implementations of the first aspect, the impedance matching device further includes a movable insulating base, the movable insulating base being adjustable in position relative to the mounting housing, and the second electrode being fixedly connected to the mounting housing via the movable insulating base. Thus, the second electrode, acting as the ungrounded plate of a capacitor, is connected to the mounting housing via the movable insulating base. On the one hand, the movable insulating base improves the reliability of electrical insulation between the grounded mounting housing (i.e., ground potential) and the high-voltage second electrode. When the user adjusts the capacitor by adjusting the mechanism connected to the grounded housing, they will not touch the high-voltage part, improving the safety of the user and the impedance matching device, and providing a basis for manual or automatic adjustment. On the other hand, it reduces the introduction of parasitic capacitance or inductance onto the high-voltage second electrode, improving the accuracy and predictability of radio frequency performance.

[0014] In conjunction with the first aspect, in some implementations of the first aspect, the first electrode is located outside the second electrode, and the capacitor further includes a second insulating member. The second electrode is slidably disposed between the first and second insulating members, and the length of the second insulating member in the extending direction of the accommodating cavity is greater than the length of the first electrode in the extending direction of the accommodating cavity. Thus, on the one hand, the arrangement of the first and second insulating members increases the dielectric constant of the capacitor, improves the capacitance, and reduces the risk of breakdown and arcing between the first and second electrodes. On the other hand, the greater length of the second insulating member in the extending direction of the accommodating cavity than the length of the first electrode in the extending direction of the accommodating cavity allows the second insulating member to guide the movement of the second electrode relative to the first electrode, preventing the second electrode from tilting or wobbling, improving the smoothness of capacitance adjustment and the stability of the capacitance value, and preventing the edge of the second electrode from crossing the first insulating member and making metal contact with the first electrode when the second electrode moves to an extreme position, thus causing a short circuit. This allows for a safer achievement of a smaller overlap area and a lower capacitance value, thereby expanding the overall capacitance adjustment range.

[0015] In conjunction with the first aspect, in some implementations of the first aspect, the first electrode component includes an electrode plate, a connecting plate, and a positioning rod. The electrode plate is sleeved on the side of the first insulating component away from the second electrode component. The positioning rod is fixedly connected to the electrode plate through the connecting plate and is located on the side of the connecting plate facing the second electrode component. The second insulating component is provided with an insertion hole, and the positioning rod is inserted into the insertion hole. Thus, on the one hand, the positioning rod can guide the assembly of the second insulating component, and the first and second insulating components can limit and guide the second electrode component, reducing the wobbling and deflection of the second electrode component relative to the first electrode component, achieving precise adjustment of the capacitance, and enhancing the structural strength of the first electrode component. On the other hand, the positioning rod increases the overlap area between the second and first electrode components. The larger the overlap area of ​​the capacitor, the lower the equivalent series resistance, thereby reducing the energy loss of the capacitor. Furthermore, the positioning rod can disperse the heat source of the electrode plate, improving the reliability of the capacitor in maintaining a stable temperature during long-term high-power operation.

[0016] In conjunction with the first aspect, in some implementations of the first aspect, the first electrode is located inside the second electrode, and the length of the first insulating member in the extending direction of the accommodating cavity is greater than the length of the first electrode in the extending direction of the accommodating cavity.

[0017] In conjunction with the first aspect, in some implementations of the first aspect, the number of inductors is set to one and the number of capacitors is set to one, thereby reducing the cost of the impedance matching device, simplifying the structure, and reducing the size of the impedance matching device.

[0018] Secondly, this application provides a radio frequency device, including a radio frequency power supply, a load, and an impedance matching device as described above. The impedance matching device is electrically connected between the radio frequency power supply and the load, thereby enabling the transmission of radio frequency signals between the radio frequency power supply and the load, and adjusting the impedance mismatch between the radio frequency power supply and the load through the impedance matching circuit, thereby reducing the waste of radio frequency power. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the functional modules of the radio frequency device provided in the embodiments of this application.

[0021] Figure 2 yes Figure 1 A schematic diagram of the first embodiment of the impedance matching device in the radio frequency device.

[0022] Figure 3 yes Figure 2 An exploded view of the impedance matching circuit.

[0023] Figure 4 yes Figure 2 A cross-sectional view of the impedance matching device in the first operating state.

[0024] Figure 5 yes Figure 1 A cross-sectional view of a second embodiment of the impedance matching device in a radio frequency device.

[0025] Figure 6 yes Figure 1 A cross-sectional view of the third embodiment of the impedance matching device in the radio frequency device.

[0026] Figure 7 yes Figure 2 The circuit diagram of the impedance matching device.

[0027] Figure 8 yes Figure 2 A cross-sectional view of the impedance matching device in the second operating state.

[0028] Figure 9 yes Figure 2 A cross-sectional view of the impedance matching device in the third operating state.

[0029] Explanation of key component symbols: RF device - 1000; RF power supply - 100; Impedance matching device - 200; Load - 300; Mounting housing-10; Mounting cavity-101; Mounting hole-102; Through hole-103; Inductor-30; Receiving cavity-301; Insulating base-31; Spiral groove-3101; Support base plate-311; Support side plate-312; Transmission rod-313; Coil-32; Heat dissipation channel-3201; First end-321; Second end-322; RF input connector-41; RF output connector-42; connector body-421; connecting ring-422; connecting rod-423; insulating terminal-43; flexible connector-44; Capacitor-50; First electrode-51; Electrode plate-511; Connecting plate-512; Adjusting rod-513; Positioning rod-514; Second electrode-52; First section-521; Second section-522; First insulating component-53; Second insulating component-54; Socket-5401; Movable insulating base-56; Connecting part-562; Adjusting part-561; Extension direction - F.

[0030] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0031] To enable those skilled in the art to better understand the present application, the technical solutions of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present application.

[0032] The terms “first,” “second,” etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0033] Please see Figure 1 , Figure 1 This is a schematic diagram of the functional modules of the radio frequency device 1000 provided in this application embodiment. The radio frequency device 1000 includes a radio frequency power supply 100, a load 300, and an impedance matching circuit 200. The impedance matching circuit 200 is electrically connected between the radio frequency power supply 100 and the load 300, thereby enabling the transmission of radio frequency signals between the radio frequency power supply 100 and the load 300, and adjusting the impedance mismatch between the radio frequency power supply 100 and the load 300 through the impedance matching circuit, thereby reducing the waste of radio frequency power.

[0034] For example, in this embodiment, the RF power supply 100 is used to feed an RF signal to the load 300. Specifically, the RF power supply 100 outputs the RF signal to the load 300 after impedance matching by the impedance matching device 200. The RF device 1000 includes, but is not limited to, a plasma generating device, an antenna device, and a laser device. The plasma generating device includes, but is not limited to, a plasma etching machine, a plasma deposition equipment, and a plasma cleaning machine. It should be noted that, in order to enable those skilled in the art to better understand the plasma generating device, the following uses a plasma etching machine as an example. Figure 1 Detailed introduction. Understandably, plasma generation devices are extremely critical power systems in semiconductor manufacturing, and are core components of various semiconductor process equipment such as thin film deposition equipment and etching equipment.

[0035] It should be noted that, Figure 1 The purpose is only to schematically describe the connection method between the RF power supply 100, the load 300 and the impedance matching device 200, and is not to make specific limitations on the connection position, connection relationship and specific structure of each component. Figure 1 The structure of the radio frequency device 1000 illustrated in this application embodiment is merely a schematic representation and does not constitute a specific limitation on the radio frequency device 1000. In other embodiments of this application, the radio frequency device 1000 may include components such as... Figure 1The additional components shown, such as the RF device 1000, may also include, but are not limited to, impedance feedback components, controllers, etc. The impedance feedback component is used to provide feedback on the impedance at the input terminal of the load 300, and the controller is used to control the impedance matching circuit to adjust the impedance matching between the RF power supply 100 and the load 300.

[0036] Please refer to the following: Figures 2 to 4 , Figure 2 yes Figure 1 A schematic diagram of the first embodiment of the impedance matching device 200 of the radio frequency device 1000 in the diagram. Figure 3 yes Figure 2 An exploded view of the impedance matching device 200 in the diagram; Figure 4 yes Figure 2 The diagram shows a cross-sectional view of the impedance matching device 200 in its first operating state. The impedance matching device 200 includes a mounting housing 10, an inductor 30, and a capacitor 50. A mounting cavity 101 is provided within the mounting housing 10. The inductor 30 is disposed within the mounting cavity 101 and has a receiving cavity 301. The capacitor 50 is nested within the inductor 30. The capacitor 50 includes a first electrode 51, a second electrode 52, and a first insulating member 53. The first electrode 51 and the second electrode 52 are fixedly disposed relative to the mounting housing 10. The first electrode 51 passes through the receiving cavity 301, and the second electrode 52 is nested within the first electrode 51. The first insulating member 53 is disposed between the first electrode 51 and the second electrode 52. The overlap length of the nested capacitor 50 and inductor 30 can be changed; and / or the overlap length of the nested first electrode 51 and second electrode 52 can be changed, thereby adjusting the inductance and / or capacitance. This allows the impedance matching device 200 to be suitable not only for high-power RF injection scenarios but also for low-power RF injection scenarios, thus enabling the impedance matching device 200 to be applicable to different power RF injection scenarios and meet the requirements of varying impedance of the load 300, enriching the application scenarios of the impedance matching device 200. On the other hand, by nesting the capacitor 50 and inductor 30, and by nesting the first electrode 51 and second electrode 52, the size of the impedance matching device 200 is reduced, resulting in a simple and compact structure, as well as lower production and maintenance costs.

[0037] The term "nested arrangement" refers to the partial or complete installation of one or more mechanical components (nested parts) within the internal cavity, recess, or specific space of another larger mechanical component (base component or enclosure component). For example, in the embodiments of this application, the nested arrangement of the first electrode 51 and the second electrode 52 may be such that the first electrode 51 is installed inside the second electrode; or, the second electrode 52 is installed inside the first electrode 51.

[0038] like Figure 2As shown, exemplarily, in this embodiment, the mounting shell 10 is rectangular in shape. Of course, in some embodiments, the mounting shell 10 may be, but is not limited to, a cylinder, a cube, or a sphere. The material of the mounting shell 10 includes, but is not limited to, metal materials or aluminum alloy materials. Metal materials include, but are not limited to, stainless steel. The mounting shell 10 may be a sheet metal part or a machined part.

[0039] like Figure 4 As shown, an insulating layer (not shown) is provided on the inner wall of the mounting housing 10. The insulating layer can be at least one of an insulating coating layer and an insulating film layer. Understandably, since there is a radio frequency voltage difference between the components such as the capacitor 50 and the inductor 30 inside the mounting housing 10 and the mounting housing 10, when the radio frequency voltage difference reaches a preset value, it is easy to break down the air and generate an electric arc, thereby reducing the safety of the impedance matching device. Therefore, by providing an insulating layer on the inner wall of the mounting housing 10, on the one hand, electrical short circuits and arc breakdown are prevented; on the other hand, the insulating material of the insulating layer is a dielectric and non-conductive, so the insulating layer can prevent the alternating electromagnetic field generated by the impedance matching device during operation from penetrating into the conductive mounting housing 10 and generating eddy circuits. The insulating coating layer can be fixed to the inner wall of the mounting housing 10 by spraying, roller coating, screen printing, dip coating, deposition, etc. The insulating film layer can be fixed to the inner wall of the mounting housing 10 by coating or bonding.

[0040] like Figure 3 and Figure 4As shown, exemplarily, in this embodiment, the inductor 30 includes an insulating base 31 and a coil 32. The insulating base 31 is connected to the mounting housing 10 and has a receiving cavity 301. The coil 32 is wound around the outer wall of the insulating base 31. A heat dissipation channel 3201 is provided inside the coil 32. The heat dissipation channel 3201 is used to accommodate a cooling medium. Specifically, the heat dissipation channel 3201 is provided along the extension direction of the coil 32, that is, the coil 32 is a hollow tubular structure. Therefore, on the one hand, by setting a heat dissipation channel 3201 inside the coil 32, the heat dissipation channel 3201 can transport the cooling medium, thereby improving the heat dissipation capacity of the inductor 30 and increasing the power limit of the impedance matching device 200 during operation. This allows the impedance matching device 200 to adapt to high-power application scenarios. Furthermore, the inductor 30 does not require heat dissipation components such as water-cooled plates and heat dissipation ceramics, reducing the production cost of the impedance matching device 200 and reducing the space occupied by the inductor 30, thus realizing the miniaturization design of the impedance matching device 200. On the other hand, the capacitor 50 is set in the accommodating cavity 301 set in the insulating base 31, thereby reducing the magnetic field generated by the capacitor 50 and the inductor 30, reducing the electromagnetic interference between the capacitor 50 and the inductor 30, and reducing the parasitic capacitance 50 between the coil 32 and the ground. Moreover, the insulating base 31 can provide a reliable solid insulation barrier to prevent arc discharge between the internal high-voltage capacitor 50 and the external grounded shell, thereby enhancing electrical safety and reliability.

[0041] like Figure 3 As shown, the material of the insulating base 31 includes, but is not limited to, ceramic materials, Teflon materials, and other non-metallic materials with good heat resistance. Exemplarily, in this embodiment, the insulating base 31 is made of ceramic material. The coil 32 is a copper tube. The copper tube can be, but is not limited to, brass or copper. The surface of the coil 32 is covered with an insulating layer, thereby increasing the withstand voltage of the coil 32. The cooling medium is a liquid heat dissipation medium, such as deionized water, thereby avoiding the problem of ions in the cooling medium participating in conductivity and reducing electrical safety, and the flowing cooling medium can improve the heat exchange efficiency between the coil 32 and the cooling medium, improving the heat dissipation effect.

[0042] Of course, in some embodiments, the coil 32 can also be configured, but is not limited to, an aluminum tube, a silver tube, etc. The cooling medium can also be, but is not limited to, at least one of oil-based heat dissipation media, gas-based heat dissipation media, solid-based heat dissipation media, phase-change heat dissipation media, etc. The oil-based heat dissipation medium can be, but is not limited to, hydrocarbon oil, silicone oil, etc. The gas can be, but is not limited to, inert gases such as air, nitrogen, or helium. It should be noted that the material of the coil 32 and the type of cooling medium can be selected according to actual conditions, and this application embodiment does not impose specific limitations. For example, other media with good insulation and heat dissipation performance are also suitable as cooling media in this application embodiment.

[0043] like Figure 3 and Figure 4 As shown, a spiral groove 3101 is provided on the outer wall of the insulating base 31. The coil 32 is disposed within the spiral groove 3101. Therefore, by providing the spiral groove 3101 on the outer wall of the insulating base 31, precise positioning of the coil 32 is achieved, reducing the risk of deformation of the coil 32 under vibration or temperature changes, preventing short circuits caused by direct contact between the coil turns, enhancing electrical insulation, and improving the heat exchange efficiency between the coil 32 and the outside air. The spiral groove 3101 is a blind groove, meaning it does not penetrate the inner wall of the insulating base 31, thereby avoiding short circuits caused by contact between the coil 32 and the capacitor 50, further enhancing electrical insulation.

[0044] like Figure 4 As shown, exemplarily, in this embodiment, the insulating base 31 is a hollow cylinder. The insulating base 31 is cylindrical in shape. The coil 32 is also generally cylindrical in shape. The shape of the insulating base 31 can be adapted to the shape of the coil 32. In some embodiments, the shape of the coil 32 can also be a cube, cuboid, or regular prism. The shapes of the coil 32 and the insulating base 31 can be selected according to the actual application scenario, and this embodiment does not impose specific limitations.

[0045] like Figure 3 and Figure 4 As shown, the impedance matching device 200 also includes an RF input connector 41 and an RF output connector 42. The coil 32 includes a first end 321 and a second end 322 disposed opposite to each other. The RF input connector 41 is electrically connected to the first end 321. Specifically, the mounting housing 10 is provided with two mounting holes 102 communicating with the mounting cavity 101. The RF input connector 41 and the RF output connector 42 are respectively mounted at the two mounting holes 102.

[0046] The second electrode 52 includes a first section 521 and a second section 522 connected to the first section 521. The first section 521 is nested within the first electrode 51. The second section 522 extends out of the first electrode 51. The RF output connector 42 is sleeved on the outside of the second section 522 and is electrically connected to the second electrode 52 and the second end 322. Thus, on the one hand, the RF output connector 42 is sleeved on the second section 522 of the second electrode 52, thereby increasing the contact area between the RF output connector 42 and the second electrode 52, reducing the contact resistance, thereby increasing the transmission of RF power in different ranges, and enhancing the stability of the mechanical connection between the RF output connector 42 and the second electrode 52; on the other hand, the heat generated by the capacitor 50 can be quickly dissipated to the external environment through the clamping part of the RF output connector 42, improving the thermal management capability of the impedance matching device 200.

[0047] like Figure 3 and Figure 4 As shown, exemplarily, in this embodiment, the RF input connector 41 is used to input RF signals. The RF output connector 42 is used to output RF signals. The RF output connector 42 includes a connector body 421, a connecting ring 422, and a connecting rod 423. The connector body 421 passes through the mounting housing 10. The connector body 421 extends outside the mounting housing 10, thereby facilitating assembly and maintenance operations. The connecting ring 422 is sleeved on the outside of the second section 522 of the second electrode 52. One end of the connecting rod 423 is electrically connected to the connecting ring 422 and the second end 322 of the coil 32, and the other end of the connecting rod 423 passes through the mounting housing 10 and is electrically connected to the connector body 421. Thus, the heat generated by the capacitor 50 can be directly conducted to the connector body 421 through the connecting ring 422, improving the heat dissipation effect of the impedance matching device 200.

[0048] like Figure 3 and Figure 4 As shown, the RF input connector 41 and RF output connector 42 can be connected to the coil 32 by welding or screw fastening, thereby improving the stability of the mechanical connection between the coil 32 and the RF input connector 41 and RF output connector 42, and improving the electrical performance between the coil 32 and the RF input connector 41 and RF output connector 42. Exemplarily, in this embodiment, the RF input connector 41 is fixedly connected to the first end 321 of the coil 32 by screws, and the RF output connector 42 is fixedly connected to the second end 322 of the coil 32 by screws.

[0049] like Figure 2 As shown, the mounting housing 10 has two through holes 103 communicating with the mounting cavity 101. The impedance matching device 200 also includes two insulating terminals 43. Each through hole 103 has an insulating terminal 43, and the two ends of the coil 32 pass through the two through holes 103 respectively, and are insulated from the mounting housing 10 by the two insulating terminals 43 respectively. The insulating terminals 43 include insulating sleeves and / or insulating coatings, thereby improving the insulation performance between the coil 32 and the mounting housing 10. The material of the insulating terminals 43 may be at least one of ceramic materials, Teflon materials, and other non-metallic materials with good heat resistance, including but not limited to ceramic materials. Exemplarily, in this embodiment, the material of the insulating terminals 43 is ceramic material.

[0050] like Figure 3 and Figure 4As shown, in the first embodiment, the inductor 30 is fixedly disposed relative to the mounting housing 10, thereby fixing the mounting positions of the RF input connector 41 and the RF output connector 42 with the mounting housing 10. This achieves a rigid connection between the RF input connector 41 and the RF output connector 42 and the coil 32, improving the stability of the mechanical connection between the coil 32 and the RF input connector 41 and the RF output connector 42, and improving the electrical performance between the coil 32 and the RF input connector 41 and the RF output connector 42. Furthermore, the inductor 30 is movable relative to the capacitor 50 along the extending direction F of the accommodating cavity 301. In other words, the position of the capacitor 50 relative to the inductor 30 can be changed along the extending direction F of the accommodating cavity 301. Therefore, the inductance can be adjusted, allowing the impedance matching network to cover a wider impedance range. The adjustable inductor 30 provides continuous and high-precision step adjustment, improving the impedance mismatch between the RF power supply 100 and the load 300, thereby responding in real-time to the dynamic changes in the impedance of the load 300, improving power transmission efficiency, and protecting the RF power supply 100.

[0051] like Figure 3 As shown, exemplarily, in this embodiment, both the first electrode 51 and the second electrode 52 are made of copper. Of course, in some embodiments, the materials of the first electrode 51 and the second electrode 52 may also include, but are not limited to, aluminum, silver, gold, etc. The materials of the first electrode 51 and the second electrode 52 can be set according to actual conditions, and this application embodiment does not impose specific limitations. The first electrode 51 and the second electrode 52 respectively serve as the two plates of the capacitor 50, thereby enabling the storage of charge.

[0052] like Figure 3 and Figure 4As shown, exemplarily, in this embodiment, the first electrode 51 passes through the mounting housing 10 and is grounded to the mounting housing 10. The portion of the first electrode 51 passing through the mounting housing 10 is housed within the receiving cavity 301. Specifically, the first electrode 51 includes an electrode plate 511, a connecting plate 512, and an adjusting rod 513. The electrode plate 511 is nested with and insulated from the second electrode 52. The adjusting rod 513 is fixedly connected to the electrode plate 511 via the connecting plate 512 and is located on the side of the connecting plate 512 facing away from the second electrode 52. The mounting position of the adjusting rod 513 relative to the mounting housing 10 is variable, and it is grounded to the mounting housing 10. Therefore, based on the fact that the electrode plate 511 is connected to the mounting housing 10 and grounded through the adjusting rod 513, on the one hand, the adjusting rod 513 not only undertakes the mechanical function of supporting and fixing the electrode plate 511, but also provides a current grounding path, so that the impedance matching device 200 has good electrical function; on the other hand, the first electrode 51 serves as the grounding electrode of the capacitor 50, and the adjusting rod 513 can adjust the overlap length of the nested electrode plate 511 and the second electrode 52, and can also safely conduct huge radio frequency currents, improving the power handling capability of the entire impedance matching device 200; furthermore, it shortens the shortest path between the first electrode 51 and the mounting housing 10, reduces the parasitic inductance 30 of the grounding loop, and enables the variable capacitance capacitor 50 to operate normally at higher frequencies. The electrode plate 511 and the connecting plate 512 are housed in the receiving cavity 301. One end of the adjusting rod 513 connected to the connecting plate 512 is movably housed in the receiving cavity 301 or extends out of the receiving cavity 301. The first insulating member 53 is housed in the receiving cavity 301.

[0053] like Figure 4 As shown, both the electrode plate 511 and the second electrode 52 are configured as hollow cylindrical structures, thereby increasing the overlap area between the first electrode 51 and the second electrode 52, reducing the current density, and improving the power handling capability of the impedance matching circuit 200. Specifically, the shape of both the electrode plate 511 and the second electrode 52 is cylindrical. The electrode plate 511 and the second electrode 52 are coaxially arranged. Thus, the first electrode 51 and the second electrode 52 of the capacitor 50 provide a near-ideal electric field distribution, with electric field lines uniformly distributed radially, avoiding the problem of electric field concentration at the edge of the capacitor 50, eliminating local electric field spikes, enabling the capacitor 50 to withstand very high radio frequency voltages before arc breakdown, and reducing parasitic inductance 30. Of course, in some embodiments, the shape of the electrode plate 511 and the second electrode 52 can also be, but is not limited to, prismatic, flat, etc., and this application embodiment does not make specific limitations.

[0054] The extension direction of the adjusting rod 513 is parallel to the extension direction F of the accommodating cavity 301, thereby improving the guiding precision of the movement of the capacitor 50 relative to the inductor 30, improving the stability of the movement of the capacitor 50 relative to the inductor 30, and avoiding the problem of unstable inductance value caused by tilting or shaking of the capacitor 50. The outer contour of the adjusting rod 513 in the transverse section perpendicular to the extension direction F of the accommodating cavity 301 is approximately circular, thereby improving the reliability of the sealed connection between the adjusting rod 513 and the mounting shell 10, and thus improving the sealing performance of the mounting cavity 101, thereby avoiding the problems of oxidation, contamination and performance drift caused by humidity of the first electrode 51 and the second electrode 52 of the capacitor 50. Of course, in some embodiments, the outer contour of the adjusting part 561 in the transverse section perpendicular to the extension direction F of the accommodating cavity 301 can also be square, rectangular, polygonal, etc., and this application embodiment does not make specific limitations.

[0055] For example, in this embodiment, the adjusting rod 513 is rotatably connected to the mounting housing 10. Therefore, by rotatably connecting the adjusting rod 513 to the mounting housing 10, on the one hand, the precise positioning control of the movement of the capacitor 50 relative to the inductor 30 is improved, allowing real-time response to dynamic changes in the impedance of the load 300, improving power transmission efficiency, and protecting the RF power supply 100; on the other hand, the rotatable connection between the adjusting rod 513 and the mounting housing 10 reduces friction between the adjusting rod 513 and the mounting housing 10, reduces wear between the first electrode 51 and the mounting housing 10, and extends the service life of the impedance matching device 200. Specifically, the adjusting rod 513 is screwed to the mounting housing 10.

[0056] Of course, in some embodiments, the adjusting rod 513 is slidably connected to the mounting housing 10. Thus, by sliding the adjusting rod 513 relative to the mounting housing 10 in a straight line, the overlap length between the capacitor 50 and the coil 32 is directly changed to achieve the change in inductance 30, simplifying the control software algorithm. Specifically, the adjusting rod 513 moves relative to the mounting housing 10 along the extending direction F of the accommodating cavity 301. It should be noted that the sliding connection in this embodiment refers to a constraint or connection method that restricts relative rotation and allows for relative translation between two components.

[0057] Please refer to the following: Figure 1 , Figure 3 and Figure 5 , Figure 5 yes Figure 1 A cross-sectional view of a second embodiment of the impedance matching device 200 of the radio frequency device 1000. (See diagram below.) Figure 1 and Figure 6As shown, in the second embodiment, the structure of the impedance matching device 200 is similar to that of the impedance matching device 200 in the first embodiment. The difference is that in the second embodiment, the capacitor 50 is fixedly disposed relative to the mounting housing 10, while the inductor 30 is movable relative to the capacitor 50 along the extending direction F of the accommodating cavity 301. In other words, the position of the inductor 30 relative to the capacitor 50 can be changed along the extending direction F of the accommodating cavity 301. The RF input connector 41 and the RF output connector 42 are flexibly connected to the coil 32 through the flexible connector 44. The flexible connector 44 can compensate for the assembly error caused by the large difference in the thermal expansion coefficients of the inductor 30, the coil 32, and the mounting housing 10, and can adapt to changes in the position of the coil 32, thereby improving the stability and reliability of the connection between the RF input connector 41 and the RF output connector 42 and the coil 32.

[0058] Understandably, when capacitor 50 is fixed relative to mounting housing 10 and inductor 30 is movable relative to capacitor 50 along the extension direction F of accommodating cavity 301, impedance matching device 200 is suitable for low-power radio frequency signal injection scenarios, thereby reducing the risk of flexible connector 44 melting in high-power radio frequency signal injection scenarios, thus improving the safety of impedance matching device 200 and extending its service life.

[0059] like Figure 1 and Figure 6 As shown, the structure and arrangement of the insulating base 31 and the first electrode 51 in the second embodiment differ from those in the first embodiment. Specifically, in the second embodiment, the insulating base 31 includes a supporting base plate 311, a supporting side plate 312, and a transmission rod 313. The supporting side plate 312 is nested and insulated from the first electrode 51 and is movably connected to the mounting shell 10. The supporting base plate 311 is sealed to the periphery of the supporting side plate 312 at the end opposite to the second electrode 52, and the transmission rod 313 is fixedly connected to the supporting side plate 312 through the supporting base plate 311. The user can directly operate the transmission rod 313 to move relative to the mounting shell 10, or the impedance matching device 200 is provided with a driving member, which is connected to the transmission rod 313 and is used to drive the transmission rod 313 to move the inductor 30 relative to the capacitor 50 along the extension direction F of the accommodating cavity 301. The longitudinal cross-sectional area of ​​the first electrode 51 is approximately mountain-shaped. The first electrode 51, the second electrode 52, and the first insulating member 53 are housed within the receiving cavity 301. Please refer again. Figure 1 , Figures 3 to 4 For example, such as Figure 1As shown, in this embodiment, the impedance matching device 200 also includes a movable insulating base 56. The mounting position of the movable insulating base 56 relative to the mounting housing 10 is adjustable. The second electrode 52 is fixedly connected to the mounting housing 10 via the movable insulating base 56. Thus, the second electrode 52, as the ungrounded plate of the capacitor 50, is connected to the mounting housing 10 via the movable insulating base 56. On the one hand, the movable insulating base 56 can improve the reliability of electrical insulation between the grounded mounting housing 10 (i.e., ground potential) and the high-voltage second electrode 52. When the user changes the capacitor 50 by adjusting the mechanism connected to the grounded housing, they will not touch the high-voltage part, improving the safety of the user and the impedance matching device 200, and realizing the basis for manual or automatic adjustment. On the other hand, it reduces the parasitic capacitance 50 or parasitic inductance 30 introduced onto the high-voltage second electrode 52, improving the accuracy and predictability of radio frequency performance.

[0060] like Figure 3 As shown, exemplarily, in this embodiment, the movable insulating base 56 includes a connecting portion 562 and an adjusting portion 561. The connecting portion 562 is fixedly connected between the second electrode 52 and the adjusting portion 561. The second electrode 52 is detachably connected to the connecting portion 562, thereby facilitating the replacement, repair, and other operations of the second electrode 52. Alternatively, the second electrode 52 and the connecting portion 562 can be non-detachably connected. For example, the second electrode 52 and the connecting portion 562 can be fixedly connected together by snap-fitting, bonding, or other methods. The material of the movable insulating base 56 can be at least one of, but not limited to, ceramic materials, Teflon materials, and other non-metallic materials with good heat resistance. Exemplarily, in this embodiment, the material of the movable insulating base 56 is ceramic.

[0061] like Figure 4 As shown, the extension direction of the adjusting part 561 is parallel to the extension direction F of the accommodating cavity 301, thereby improving the guiding precision of the movement of the second electrode 52 relative to the first electrode 51, improving the stability of the second electrode 52 relative to the first electrode 51, and avoiding the problem of unstable capacitance 50 value caused by tilting or shaking of the second electrode 52. The outer contour of the adjusting part 561 in the transverse section perpendicular to the extension direction F of the accommodating cavity 301 is approximately circular, thereby improving the reliability of the sealed connection between the adjusting part 561 and the mounting shell 10, and further improving the sealing performance of the mounting cavity 101, thus avoiding the problems of oxidation, contamination and performance drift caused by humidity of the first electrode 51 and the second electrode 52 of the capacitor 50. Of course, in some embodiments, the outer contour of the adjusting part 561 in the transverse section perpendicular to the extension direction F of the accommodating cavity 301 can also be square, rectangular, polygonal, etc., and this application embodiment does not make specific limitations. The adjusting part 561 can be screwed or slidably connected to the mounting shell 10, and this application embodiment does not make specific limitations.

[0062] like Figure 4 As shown, in the first embodiment, the first electrode 51 is located outside the second electrode 52. The capacitor 50 also includes a second insulating member 54. The second electrode 52 is disposed between the first insulating member 53 and the second insulating member 54, and is movably disposed relative to the first electrode 51 along the extending direction F of the accommodating cavity 301. The length of the second insulating member 54 in the extending direction F of the accommodating cavity 301 is greater than the length of the first electrode 51 in the extending direction F of the accommodating cavity 301. Therefore, on the one hand, the arrangement of the first insulating member 53 and the second insulating member 54 can increase the dielectric constant of the capacitor 50, improve the capacitance of the capacitor 50, and reduce the risk of breakdown and arcing between the first electrode 51 and the second electrode 52 of the capacitor 50; on the other hand, the length of the second insulating member 54 in the extension direction F of the accommodating cavity 301 is greater than the length of the first electrode 51 in the extension direction F of the accommodating cavity 301, so the second insulating member 54 can guide the movement of the second electrode 52 relative to the first electrode 51, avoid the problem of the second electrode 52 tilting or shaking, improve the smoothness of capacitance adjustment and the stability of the capacitance 50 value, and avoid the problem of the edge of the second electrode 52 crossing the first insulating member 53 and making metal contact with the first electrode 51 when the second electrode 52 moves to an extreme position relative to the first electrode 51, thus causing a short circuit. In this way, a smaller overlapping area and a lower capacitance 50 value can be safely achieved, thereby expanding the adjustment range of the entire capacitor 50. The length of the first insulating member 53 in the extending direction F of the accommodating cavity 301 is equal to the length of the first electrode member 51 in the extending direction F of the accommodating cavity 301. Alternatively, the lengths of the first insulating member 53 and the second insulating member 54 in the extending direction F of the accommodating cavity 301 may be greater than the length of the first electrode member 51 in the extending direction F of the accommodating cavity 301. The first insulating member 53 and the second insulating member 54 are housed within the accommodating cavity 301.

[0063] In a first embodiment, the first electrode 51, the first insulating member 53, the second electrode 52, and the second insulating member 54 are nested together to form an integral structure. This allows the entire capacitor 50 to move relative to the inductor 30 along the extending direction F of the accommodating cavity 301 when the first electrode 51 rotates relative to the mounting housing 10. The materials of the first insulating member 53 and the second insulating member 54 can include, but are not limited to, ceramic materials, plastic films, or other non-metallic materials. The materials of the first insulating member 53 and the second insulating member 54 can be the same or different. In this embodiment, for example, both the first insulating member 53 and the second insulating member 54 are ceramic materials, thereby giving them good insulation properties.

[0064] like Figure 3 and Figure 4As shown, in some embodiments, the first electrode 51 further includes a positioning rod 514. The positioning rod 514 is fixedly connected to the electrode plate 511 via a connecting plate 512 and is located on the side of the connecting plate 512 facing the second electrode 52. The second insulating member 54 is provided with a socket 5401, and the positioning rod 514 is inserted into the socket 5401. Therefore, on the one hand, the positioning rod 514 can guide the assembly of the second insulating member 54, and the first insulating member 53 and the second insulating member 54 can limit and guide the second electrode member 52, reducing the wobbling and deflection of the second electrode member 52 relative to the first electrode member 51, realizing precise adjustment of the capacitance, and enhancing the structural strength of the first electrode member 51; on the other hand, the setting of the positioning rod 514 increases the overlap area of ​​the second electrode member 52 and the first electrode member 51. The larger the overlap area of ​​the capacitor 50, the lower the equivalent series resistance, thereby reducing the energy loss of the capacitor 50; furthermore, the positioning rod 514 can disperse the heat source of the electrode plate 511, improving the reliability of the capacitor 50 in maintaining a stable temperature during long-term high-power operation. The socket 5401 can be a through hole or a blind hole, and this application embodiment does not specifically limit it. Of course, in some embodiments, the positioning rod 514 can be omitted from the first electrode member 51, that is, the first electrode member 51 only includes the electrode plate 511, the connecting plate 512, and the adjusting rod 513.

[0065] For example, in this embodiment, the electrode plate 511, connecting plate 512, adjusting rod 513, and positioning rod 514 are integrally formed, thereby improving the reliability and stability of the connection between the electrode plate 511, connecting plate 512, adjusting rod 513, and positioning rod 514. Of course, in some embodiments, the electrode plate 511, connecting plate 512, adjusting rod 513, and positioning rod 514 can be fixedly connected to each other by snap-fit, screw connection, or other means, thereby reducing the processing difficulty of the first electrode component 51.

[0066] Please refer to the following: Figure 1 , Figure 3 and Figure 6 , Figure 6 yes Figure 1 A cross-sectional view of a third embodiment of the impedance matching device 200 of the radio frequency device 1000. (See diagram below.) Figure 1 and Figure 7As shown, in the third embodiment, the structure of the impedance matching device 200 is similar to that of the impedance matching device 200 in the first embodiment. The difference is that in the third embodiment, the first electrode 51 is located inside the second electrode 52, and the length of the first insulating member 53 in the extending direction F of the accommodating cavity 301 is greater than the length of the first electrode 51 in the extending direction F of the accommodating cavity 301. Therefore, on the one hand, the arrangement of the first insulating member 53 increases the dielectric constant of the capacitor 50, improves the capacitance of the capacitor 50, and reduces the risk of breakdown and arcing between the first electrode 51 and the second electrode 52 of the capacitor 50; on the other hand, the length of the first insulating member 53 in the extension direction F of the accommodating cavity 301 is greater than the length of the first electrode 51 in the extension direction F of the accommodating cavity 301, so the first insulating member 53 can guide the movement of the second electrode 52 relative to the first electrode 51, avoiding the problem of the second electrode 52 tilting or shaking, improving the smoothness of capacitance adjustment and the stability of the capacitance 50 value, and avoiding the problem of the edge of the second electrode 52 crossing the first insulating member 53 and making metal contact with the first electrode 51 when the second electrode 52 moves to an extreme position relative to the first electrode 51, thus causing a short circuit. In this way, a smaller overlapping area and a lower capacitance 50 value can be safely achieved, thereby expanding the adjustment range of the entire capacitor 50. The length of the second insulating member 54 in the extending direction F of the accommodating cavity 301 is equal to the length of the first electrode member 51 in the extending direction F of the accommodating cavity 301. Of course, the length of the second insulating member 54 in the extending direction F of the accommodating cavity 301 can also be greater than the length of the first electrode member 51 in the extending direction F of the accommodating cavity 301.

[0067] Please refer to the following: Figures 1 to 7 , Figure 7 yes Figure 2 The circuit diagram of the impedance matching device 200 is shown. In the first to third embodiments, the impedance matching device 200 adopts an L+C type circuit. Specifically, the number of inductors 30 is set to one, and the number of capacitors 50 is set to one, thereby reducing the cost of the impedance matching device 200, simplifying the structure, and reducing the size of the impedance matching device 200. The radio frequency signal emitted by the radio frequency power supply 100 is connected to the coil 32 of the inductor 30 through the radio frequency input connector 41. The capacitor 50 is connected in series with the inductor 30. The radio frequency input connector 41 is connected to the coil 32 and the load 300.

[0068] Please refer to the following: Figure 4 , Figure 8 and Figure 9 , Figure 8 yes Figure 2 A cross-sectional view of the impedance matching device 200 in the second operating state; Figure 9 yes Figure 2The diagram shows a cross-sectional view of the impedance matching circuit 200 in its third operating state. During inductance adjustment, the capacitor 50 of the impedance matching circuit 200 can be moved upwards or downwards as a whole. Figure 4 and Figure 8 When the adjusting rod 513 rotates relative to the mounting shell 10 in the first direction, the adjusting rod 513 drives the electrode plate 511, connecting plate 512, and positioning rod 514 to rotate relative to the insulating base 31, and to move relative to the mounting shell 10 in the extending direction F of the accommodating cavity 301. Furthermore, the rotation of the first electrode drives the first insulating component 53, the second insulating component 54, the second electrode component 52, and the movable insulating seat 56 to rotate as a whole relative to the insulating base 31. This allows the first electrode component 51 to drive the first insulating component 53, the second insulating component 54, the second electrode component 52, and the movable insulating seat 56 to move upward relative to the mounting shell 10 in the extending direction F of the accommodating cavity 301. In other words, the overall structure of the capacitor 50 moves upward relative to the inductor 30 in the extending direction F of the accommodating cavity 301. At this time, because the volume of the capacitor 50 inside the coil 32 increases, the inductance of the coil 32 decreases. When the adjusting rod 513 rotates relative to the mounting shell 10 in a second direction opposite to the first direction, the first electrode 51 drives the first insulating member 53, the second insulating member 54, the second electrode 52, and the movable insulating seat 56 to move downward relative to the mounting shell 10 along the extension direction F of the accommodating cavity 301. That is, the overall structure of the capacitor 50 moves downward relative to the inductor 30 along the extension direction F of the accommodating cavity 301. At this time, since the volume of the capacitor 50 inside the coil 32 decreases, the inductance of the coil 32 increases. It can be understood that during the process of the overall structure of the capacitor 50 moving upward or downward relative to the inductor 30, since the first electrode 51 and the second electrode 52 remain relatively stationary, the overlap area of ​​the first electrode 51 and the second electrode 52 remains unchanged. Therefore, the equivalent capacitance of the capacitor 50 remains unchanged, thereby realizing that the impedance matching device 200 can adjust the inductance without affecting the capacitance.

[0069] like Figure 4 and Figure 9During the capacitance adjustment process, the user moves the adjustment part 561 of the second electrode 52 along the extension direction F of the accommodating cavity 301, thereby changing the overlap length between the first electrode 51 and the second electrode 52. Specifically, when the user moves the adjustment part 561 downward along the extension direction F of the accommodating cavity 301, the adjustment part 561 drives the connecting part 562 and the second electrode 52 to move closer to the first electrode 51, increasing the overlap area between the second electrode 52 and the first electrode 51, and thus increasing the capacitance of the capacitor 50. When the user pulls the adjustment part 561 upward along the extension direction F of the accommodating cavity 301, the adjustment part 561 drives the connecting part 562 and the second electrode 52 to move away from the first electrode 51, decreasing the overlap area between the second electrode 52 and the first electrode 51, and thus decreasing the capacitance of the capacitor 50. Understandably, during the movement of the second electrode 52 relative to the first electrode 51, since the insulating base 31 remains relatively stationary relative to the mounting shell 10, the relative volume of the capacitor 50 inside the coil 32 remains unchanged, and therefore the inductance remains unchanged. This allows the impedance matching device 200 to adjust the capacitance without affecting the inductance. Of course, the user can also adjust both the inductance and capacitance of the impedance matching device 200 simultaneously; this embodiment does not impose specific limitations.

[0070] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent replacements can be made to some of the technical features. Such modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An impedance matching device, characterized in that, include: Mounting housing, wherein a mounting cavity is provided inside the mounting housing; An inductor is disposed within a mounting cavity and has a receiving cavity. A capacitor, nested with an inductor, includes a first electrode, a second electrode, and a first insulating member. The first and second electrodes are fixedly disposed relative to the mounting housing. The first electrode passes through the accommodating cavity, and the second electrode is nested with the first electrode. The first insulating member is disposed between the first and second electrodes. The overlap length of the nested capacitor and inductor can be varied. And / or, the overlap length of the nested first and second electrodes can be varied.

2. The impedance matching device as described in claim 1, characterized in that, The inductor includes an insulating base and a coil. The insulating base is connected to the mounting shell and has the accommodating cavity. The coil is wound around the outer wall of the insulating base, and a heat dissipation channel is provided inside the coil to accommodate the cooling medium.

3. The impedance matching device as described in claim 2, characterized in that, The outer wall of the insulating base is provided with a spiral groove, and the coil is disposed in the spiral groove.

4. The impedance matching device as described in claim 2, characterized in that, The impedance matching device further includes an RF input connector and an RF output connector. The coil includes a first end and a second end disposed opposite to each other. The RF input connector is electrically connected to the first end. The second electrode includes a first segment and a second segment connected to the first segment. The first segment is nested with the first electrode. The second segment extends out of the first electrode. The RF output connector is sleeved on the outside of the second segment and is electrically connected to the second electrode and the second end.

5. The impedance matching device as described in claim 2, characterized in that, The impedance matching device further includes two insulating terminals. The mounting housing is provided with two through holes communicating with the mounting cavity. Each through hole is provided with an insulating terminal. The two ends of the coil pass through the two through holes respectively and are insulated from the mounting housing through the two insulating terminals respectively. The insulating terminals include insulating sleeves and / or insulating coatings.

6. The impedance matching device according to any one of claims 1-5, characterized in that, The inductor is fixed relative to the mounting housing, and the capacitor is movable relative to the inductor along the extension direction of the accommodating cavity; or, the capacitor is fixed relative to the mounting housing, and the inductor is movable relative to the capacitor along the extension direction of the accommodating cavity.

7. The impedance matching device according to any one of claims 1-5, characterized in that, The first electrode component includes an electrode plate, a connecting plate, and an adjusting rod. The electrode plate is nested with and insulated from the second electrode component. The adjusting rod is fixedly connected to the electrode plate through the connecting plate and is located on the side of the connecting plate facing away from the second electrode component. The mounting position of the adjusting rod relative to the mounting shell is variable and is grounded to the mounting shell.

8. The impedance matching device as claimed in claim 7, characterized in that, The adjusting rod is rotatably connected to the mounting housing; or, the adjusting rod is slidably connected to the mounting housing.

9. The impedance matching device according to any one of claims 1-5, characterized in that, The impedance matching device also includes a movable insulating base, the mounting position of which is adjustable relative to the mounting housing, and the second electrode is fixedly connected to the mounting housing via the movable insulating base.

10. The impedance matching device according to any one of claims 1-5, characterized in that, The first electrode is located outside the second electrode. The capacitor also includes a second insulating member. The second electrode is slidably disposed between the first insulating member and the second insulating member. The length of the second insulating member in the extending direction of the accommodating cavity is greater than the length of the first electrode in the extending direction of the accommodating cavity.

11. The impedance matching device as claimed in claim 10, characterized in that, The first electrode component includes an electrode plate, a connecting plate, and a positioning rod. The electrode plate is sleeved on the side of the first insulating component away from the second electrode component. The positioning rod is fixedly connected to the electrode plate through the connecting plate and is located on the side of the connecting plate facing the second electrode component. The second insulating component is provided with a socket, and the positioning rod is inserted into the socket.

12. The impedance matching device according to any one of claims 1-5, characterized in that, The first electrode is located inside the second electrode, and the length of the first insulating member in the extending direction of the accommodating cavity is greater than the length of the first electrode in the extending direction of the accommodating cavity.

13. The impedance matching device according to any one of claims 1-5, characterized in that, The number of inductors is set to one, and the number of capacitors is set to one.

14. A radio frequency device, characterized in that, It includes an RF power supply, a load, and an impedance matching device as described in any one of claims 1-13, wherein the impedance matching device is electrically connected between the RF power supply and the load.

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