External integrated wireless module

Abstract

The utility model discloses a kind of external integrated wireless module, it includes shell, MCU, antenna, memory and connecting interface.The utility model reasonably integrates MCU, wireless communication module, memory etc. 2 In the shell, the number of peripheral parts is reduced, the overall appearance is small and exquisite, the occupied space is less, and it is convenient to use. The connecting interface is arranged on one surface of the shell, the power supply and the communication interface are integrated together, and multiple connections are not required during use. The operation is more convenient, and the connecting interface supports power supply and SPI, UART and I 2 C communication protocol. The wireless communication module includes one or more communication modules selected from Bluetooth, Wi-Fi, LoRa, 3G, 4G, 5G and 6G, and has good adaptability and expansibility. The memory is configured to realize local recording of data. In addition, the antenna can be flexibly selected as built-in or external, and the appropriate antenna type can be selected according to the application scenario and signal transmission requirements.

Description

Technical Field

[0001] This utility model relates to the field of wireless module technology, specifically to an external integrated wireless module. Background Technology

[0002] With the development of IoT technology, wireless modules, as core components for device communication, are widely used in sensors, instruments, and smart devices to achieve wireless data transmission and communication between devices. However, existing wireless modules have several shortcomings: firstly, the large number of peripheral components results in bulky modules, high costs, and complex assembly processes; secondly, the interface design is scattered, with communication and power interfaces often separated, requiring multiple connections and causing inconvenience; furthermore, most modules lack built-in memory storage, preventing direct local data recording, and their I / O interfaces support limited external protocols, resulting in poor adaptability and scalability, making it difficult to meet the diverse communication needs of different devices. Utility Model Content

[0003] To address the aforementioned shortcomings, the purpose of this utility model is to provide an externally integrated wireless module with a reasonable structural design and convenient use.

[0004] To achieve the above objectives, the technical solution provided by this utility model is as follows:

[0005] An external integrated wireless module includes a housing, an MCU housed within the housing, the MCU integrating at least one wireless communication module, an antenna connected to the MCU, a memory connected to the MCU for data recording and storage, and a connection interface disposed only on one surface of the housing, the connection interface including several interfaces supporting power supply and SPI, UART, and I2C communication. 2 I / O interfaces for one or more communication protocols in C.

[0006] In a preferred embodiment of this utility model, the housing includes a rectangular cylindrical shell and an end cap. One end of the cylindrical shell has an assembly opening, and the other end is closed. A positioning slot is provided inside the cylindrical shell for inserting a power supply board substrate. The end cap has a window for exposing the connection interface and a connector for inserting into the assembly opening. The connector has a locking protrusion, and a locking groove matching the locking protrusion is provided on the inner side of the assembly opening. The power supply board substrate is accurately installed inside the cylindrical shell through the positioning slot; the end cap is securely connected to the cylindrical shell by the locking protrusion of the connector engaging with the locking groove of the assembly opening of the cylindrical shell. Simultaneously, the connection interface is exposed through the window on the end cap for easy connection to external devices.

[0007] In a preferred embodiment of this invention, the circuit board substrate is provided with peripheral components connected to the MCU. These peripheral components include a crystal oscillator, capacitors, and resistors. The crystal oscillator provides a stable clock signal to the MCU; the capacitors are mainly used for filtering and decoupling to ensure power supply stability; and the resistors are used for current limiting and voltage division to control the current and voltage in the circuit, ensuring the stability and reliability of the MCU's operation and improving the overall performance of the module.

[0008] In a preferred embodiment of this invention, the MCU is an ESP32 series, STM32 series, PAN3029 series, OM6626 series, or W55MH32 series chip, etc. Different series of chips have their own advantages and can meet the requirements of different scenarios in terms of performance, power consumption, integration, etc., and can be flexibly selected according to different application needs, thus improving the applicability of the module.

[0009] As a preferred embodiment of this utility model, the memory model is W25032FWS or FM24C256A, which can meet the requirements of data storage capacity, read / write speed and reliability in different scenarios.

[0010] In a preferred embodiment of this invention, the wireless communication module includes one or more of the following: Bluetooth communication module, Wi-Fi communication module, LoRa communication module, 3G communication module, 4G communication module, 5G communication module, and 6G communication module. This provides a variety of wireless communication module options, allowing for flexible selection based on different application scenarios and communication requirements, thus achieving diversification of communication methods. The characteristics of different communication modules can meet the requirements of communication distance, transmission rate, and power consumption in different scenarios, improving applicability.

[0011] In a preferred embodiment of this invention, the number of I / O interfaces is four. This simplifies the connection interface, reduces connection complexity, and improves ease of use.

[0012] In a preferred embodiment of this invention, the antenna is either an internal antenna or an external antenna. An internal antenna, integrated within the housing, offers advantages such as small size and ease of use; an external antenna provides advantages such as adjustable signal strength and good directivity. The appropriate antenna type can be selected based on the application scenario and signal transmission requirements.

[0013] The beneficial effects of this utility model are as follows: The utility model has a reasonable structural design, integrating the MCU, wireless communication module, and memory into a single housing, reducing the number of external parts, resulting in a compact overall size, minimal space occupation, and ease of use. Furthermore, the connection interface is only located on one surface of the housing, integrating the power supply and communication interfaces together, eliminating the need for multiple connections during use and making operation more convenient. Additionally, the included memory enables local data recording, and the I / O interface supports multiple communication protocols, offering good adaptability and expandability to meet the diverse communication needs of different devices.

[0014] The present invention will be further described below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of Embodiment 1 of this utility model.

[0016] Figure 2 This is an exploded structural diagram of Embodiment 1 of this utility model.

[0017] Figure 3 This is the circuit schematic diagram of Embodiment 1 of this utility model.

[0018] Figure 4 This is a three-dimensional structural diagram of Embodiment 2 of this utility model.

[0019] Figure 5 This is the circuit schematic diagram of Embodiment 2 of this utility model.

[0020] Figure 6 This is a three-dimensional structural diagram of Embodiment 3 of this utility model. Detailed Implementation

[0021] Example 1, see Figures 1 to 3 This embodiment provides an external integrated wireless module, which includes a housing 1, an MCU 2, an antenna 3, a memory 4, a connection interface 5, and peripheral components.

[0022] In this embodiment, antenna 3 is a built-in antenna.

[0023] The MCU2, antenna 3, memory 4, connection interface 5, and peripheral components are all arranged on the circuit board substrate. The antenna 3, memory 4, connection interface 5, and peripheral components are all connected to the MCU2. The memory 4 is used for data recording and storage; the connection interface 5 includes several interfaces supporting power supply and SPI, UART, and I / O. 2C provides an I / O interface for one or more communication protocols. The connection interface 5 is located only on one surface of the housing 1, integrating the power supply and communication interfaces together. This eliminates the need for multiple connections during use, making operation more convenient. Preferably, there are four I / O interfaces. This simplifies the connection interface 5, reduces connection complexity, and improves ease of use.

[0024] The housing 1 includes a rectangular cylindrical shell 11 and an end cap 12. One end of the cylindrical shell 11 has an assembly opening, and the other end is closed. A positioning slot is provided inside the cylindrical shell 11 for inserting the power supply board substrate 6. The end cap 12 has a window 123 for exposing the connection interface 5. The end cap 12 also has a connector 121 for inserting into the assembly opening. The connector 121 has a latching protrusion 122, and the inner side of the assembly opening has a slot 111 that matches the latching protrusion 122. The design of the positioning slot and the latching protrusion 122 and slot 111 makes the installation of the power supply board substrate 6 and the end cap 12 more accurate and convenient, improving assembly efficiency. The circuit board substrate 6 is accurately installed inside the cylindrical shell 11 through the positioning slot; the end cover 12 is firmly connected to the cylindrical shell 11 by the engagement protrusion 122 of the insertion part 121 engaging with the slot 111 of the assembly opening of the cylindrical shell 11. At the same time, the connection interface 5 is exposed through the window 123 on the end cover 12 for easy connection with external equipment.

[0025] The MCU2 integrates at least one wireless communication module; the wireless communication module includes one or more of the following: Bluetooth communication module, Wi-Fi communication module, LoRa communication module, 3G communication module, 4G communication module, 5G communication module, and 6G communication module. It provides a variety of wireless communication module options, allowing for flexible selection based on different application scenarios and communication requirements, thus achieving diversified communication methods. The characteristics of different communication modules can meet the requirements of communication distance, transmission rate, and power consumption in different scenarios, improving applicability.

[0026] In this embodiment, the MCU2 is selected from the OM6626 series, such as the OM6626B, which has a built-in Bluetooth communication module and a Wi-Fi communication module, such as the 2.4GHz band and the 5.0GHz band. Alternatively, the OM6621DB / DQ (SOC) series or the NRF24L01 can be used. Of course, in other embodiments, the MCU2 can also be selected from the ESP32 series, STM32 series, PAN3029 series, or W55MH32 series chips. Different series of chips have their own advantages and can meet the requirements of different scenarios in terms of performance, power consumption, and integration. Flexible selection based on different application needs improves the applicability of the module.

[0027] In this embodiment, the memory 4 is preferably a W25032FWS model. The W25032FWS has a large storage capacity and fast read / write speed, making it suitable for scenarios that require storing large amounts of data and have high read / write performance requirements. In other embodiments, the memory 4 can be other models, such as FM24C256A. For example, FM24C256A has non-volatility and high reliability, making it suitable for scenarios with high data security requirements. In specific applications, the choice can be flexible.

[0028] The peripheral components include a crystal oscillator, capacitors, and resistors. The crystal oscillator provides a stable clock signal for the MCU2; in this embodiment, the crystal oscillator preferably includes a 32MHz high-frequency crystal oscillator and a 32.768kHz low-frequency crystal oscillator. The 32MHz high-frequency crystal oscillator is connected to the high-speed clock input pin and high-speed clock output pin of the OM6626B; the 32.768kHz low-frequency crystal oscillator is connected to the real-time clock input pin and real-time clock output pin of the OM6626B. The capacitors are mainly used for filtering and decoupling to ensure the stability of the power supply; the resistors are used for current limiting and voltage division to control the current and voltage in the circuit, ensuring the stability and reliability of the MCU operation and improving the overall performance of the module.

[0029] Example 2, see Figures 4 to 5 This embodiment provides an external integrated wireless module, which includes a housing 1, an MCU 2, an antenna 3, a memory 4, a connection interface 5, and peripheral components. It is basically the same as Embodiment 1, except that the antenna 3 is an external antenna, and the external antenna is rod-shaped. The MCU is an STM32 series MCU with LoRa communication modules, and can be selected from the 433MHz, 868MHz, or 915MHz frequency bands.

[0030] Example 3, see Figure 6 This embodiment provides an external integrated wireless module, which includes a housing 1, an MCU 2, an antenna 3, a memory 4, a connection interface 5, and peripheral components. It is basically the same as Embodiment 2, except that the antenna 3 is an external antenna, and the external antenna is linear.

[0031] In use, since the MCU2, wireless communication module, and memory 4 are integrated into a single housing 1, the overall shape is compact, occupies little space, and is easy to use. Furthermore, the connection interface 5 is only located on one surface of the housing 1, integrating the power supply and communication interfaces together, eliminating the need for multiple connections and making operation more convenient. The connection interface 5 has four I / O interfaces, allowing connection and communication with different functional sensor modules, such as temperature and humidity sensor modules, distance sensor modules, voltage sensor modules, and current sensor modules, meeting diverse functional requirements.

[0032] Based on the disclosure and teachings of the above specification, those skilled in the art can make changes and modifications to the above embodiments. Therefore, this utility model is not limited to the specific embodiments disclosed and described above, and some modifications and changes to this utility model should also fall within the protection scope of the claims of this utility model. Furthermore, although some specific terms are used in this specification, these terms are only for convenience of explanation and do not constitute any limitation on this utility model. As described in the above embodiments of this utility model, other grinding machines obtained using the same or similar structures are all within the protection scope of this utility model.

Claims

1. An external integrated wireless module, comprising a housing, characterized in that, It also includes An MCU is disposed within the housing, the MCU integrating at least one wireless communication module; Antenna connected to the MCU; The memory connected to the MCU is used for data recording and storage; Connection interfaces are provided only on one surface of the housing, and these connection interfaces include several interfaces that support power supply and support SPI, UART, and I2C interfaces. 2 I / O interfaces for one or more communication protocols in C.

2. The external integrated wireless module according to claim 1, characterized in that: The housing includes a rectangular cylindrical shell and an end cap. One end of the cylindrical shell has an assembly opening, and the other end is closed. The cylindrical shell has a positioning slot for inserting a power supply board substrate. The end cap has a window for exposing the connection interface. The end cap has a connector for inserting into the assembly opening. The connector has a locking protrusion. The inner side of the assembly opening has a locking groove that matches the locking protrusion.

3. The external integrated wireless module according to claim 2, characterized in that: The circuit board substrate is provided with peripheral components connected to the MCU, including crystal oscillators, capacitors and resistors.

4. The external integrated wireless module according to any one of claims 1-3, characterized in that: The MCU is an ESP32 series, STM32 series, PAN3029 series, OM6626 series, or W55MH32 series chip.

5. The external integrated wireless module according to claim 4, characterized in that: The memory model is W25032FWS or FM24C256A.

6. The external integrated wireless module according to claim 4, characterized in that: The wireless communication module includes one or more of the following: Bluetooth communication module, Wi-Fi communication module, LoRa communication module, 3G communication module, 4G communication module, 5G communication module, and 6G communication module.

7. The external integrated wireless module according to claim 4, characterized in that: The number of I / O interfaces is four.

8. The external integrated wireless module according to claim 1, characterized in that: The antenna can be a built-in antenna or an external antenna.

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