Conductive diaphragm, sound emitting unit, and electronic device

Abstract

The application discloses a conductive diaphragm, a sound generating unit and an electronic device, and belongs to the terminal field. The conductive diaphragm comprises a diaphragm base layer and a conductive adhesive layer located on the diaphragm base layer; the diaphragm base layer comprises a center part, a folded ring part and a fixing part connected in sequence; the diaphragm base layer has a plurality of bending corner regions; the conductive adhesive layer is distributed at the bending corner regions; wherein the conductive adhesive layer has an avoiding hollow area, and at least part of the corner part of the folded ring part at the bending corner region is exposed through the avoiding hollow area. In this way, the conductive adhesive layer directly connects the terminal on the fixing part and the voice coil lead wire on the center part in the bending corner region, can reduce the length of the conductive adhesive layer, and reduce the impedance of the conductive adhesive layer. At the same time, the setting of the avoiding hollow area can reduce the conductive adhesive layer of the bending corner region, reduce the risk of fracture of the conductive adhesive layer at the bending corner region when the diaphragm base layer vibrates, that is, the reliability of the whole conductive diaphragm can be improved.

Description

Technical Field

[0001] This application relates to the field of terminals, and in particular to a conductive diaphragm, a sound-generating unit, and an electronic device. Background Technology

[0002] The core structure of a loudspeaker is a system that converts electricity, magnetism, force, and sound. Multiple components work together to convert electrical signals into sound waves. The conductive diaphragm is the key component that performs the energy conversion. The conductive diaphragm vibrates back and forth under the action of electromagnetic force, thereby compressing the surrounding air to form sound waves with alternating density.

[0003] The conductive diaphragm has terminals connected to its outer edge, a voice coil inside the diaphragm, and a conductive adhesive layer coated on it. The conductive diaphragm needs to receive external audio signals through the terminals and transmit them to the voice coil via the conductive adhesive layer on the diaphragm.

[0004] However, the conductive adhesive layer in related technologies can only achieve low impedance or high reliability, and cannot make both compatible. Utility Model Content

[0005] This application provides a conductive diaphragm, a sound-generating unit, and an electronic device that, while ensuring reliability, also meets the requirement of low impedance. The technical solution is as follows: On the one hand, this application provides a conductive diaphragm, comprising: a diaphragm base layer and a conductive adhesive layer located on the diaphragm base layer; The diaphragm base layer includes a central portion, a folded ring portion, and a fixing portion connected in sequence; the folded ring portion surrounds the periphery of the central portion, and the fixing portion surrounds the side of the folded ring portion away from the central portion; the folded ring portion protrudes from the central portion and from the fixing portion in a direction perpendicular to the diaphragm base layer; the diaphragm base layer has multiple curved areas; The conductive adhesive layer is distributed in the corner area, and the conductive adhesive layer is located on the fixing part, the folded ring part and the center part; The conductive adhesive layer has an avoidance cutout area, and at least a portion of the corner portion of the folded ring portion located in the bend area is exposed through the avoidance cutout area.

[0006] In this way, the conductive adhesive layer is distributed in the corner area, directly connecting the terminals on the fixing part to the voice coil lead on the center part within the corner area. This reduces the length of the conductive adhesive layer and its impedance. Simultaneously, at least a portion of the corner portion of the surround part is exposed through the avoidance cutout area. Reducing the amount of conductive adhesive layer in the corner area (high-stress area) lowers the risk of breakage of the conductive adhesive layer in the corner area during diaphragm base vibration, thus improving the overall reliability of the conductive diaphragm.

[0007] In some possible implementations, the portion of the folded ring within the bend region includes: the corner portion, and a first straight edge portion and a second straight edge portion connected to both ends of the corner portion; The portion of the conductive adhesive layer located on the fixing part is the first conductive part, the portion of the conductive adhesive layer located on the center part is the second conductive part, and the portion of the conductive adhesive layer connecting the first conductive part and the second conductive part is the conductive connection part; Wherein, at least a portion of the conductive connection portion is located on the first straight edge portion and / or the second straight edge portion, and the first conductive portion, the second conductive portion and the conductive connection portion are used to form the avoidance cutout area.

[0008] In this way, at least a portion of the corner portion of the folded ring is exposed by avoiding the hollow area, which reduces the width of the conductive adhesive layer on the corner and results in a higher impedance of the conductive adhesive layer. Therefore, the conductive adhesive layer of this application is also provided on the first straight edge and / or the second straight edge, which increases the width of the conductive adhesive layer and thus reduces the impedance of the conductive adhesive layer. In addition, the conductive connection portion is attached to the first straight edge and / or the second straight edge where the deformation is smaller. The vibration stress is more gradual here, and the bonding stability between the conductive adhesive layer and the diaphragm base layer is higher, which can effectively avoid the peeling problem caused by the difference in deformation between the two and extend the service life of the product.

[0009] In some possible implementations, within the same bend area, the conductive connection portion includes a first conductive connection portion and a second conductive connection portion, and the clearance area is located between the first conductive connection portion and the second conductive connection portion.

[0010] In this way, the first conductive connection part and the second conductive connection part are located on both sides of the avoidance cutout area, so that the avoidance cutout area can be located in the core area of ​​the corner, effectively avoiding the high deformation area on the corner, reducing the risk of conductive adhesive layer breakage, and improving the reliability of the entire conductive diaphragm.

[0011] In some possible implementations, within the same corner region, a portion of the first conductive connection is located on the corner and another portion is located on the first straight edge; a portion of the second conductive connection is located on the corner and another portion is located on the second straight edge. The orthographic projection of the avoidance hollow area on the diaphragm base layer is located within the area where the corner is located.

[0012] In this way, the first conductive connection portion is located on the first straight edge and a portion of the corner near the first straight edge, which increases the width of the first conductive connection portion and reduces its impedance. Similarly, the second conductive connection portion is located on the second straight edge and a portion of the corner near the second straight edge, which increases the width of the second conductive connection portion and reduces its impedance. By ensuring that the orthographic projection of the hollow area onto the diaphragm substrate falls within the corner region, the area of ​​the conductive connection layer at the corner is reduced, thus lowering the risk of the conductive connection layer at the corner detaching.

[0013] In some possible implementations, within the same corner region, the first conductive connection portion is located on the first straight edge portion and does not overlap with the corner portion; the second conductive connection portion is located on the second straight edge portion and does not overlap with the corner portion. The orthographic projection of the avoidance hollow area onto the diaphragm base layer covers the area where the corner is located.

[0014] This configuration ensures that the first conductive connection completely avoids the corner region and is located on the first straight edge where deformation is minimal during vibration, reducing the risk of the first conductive connection detaching or breaking and improving the reliability of the conductive diaphragm. Similarly, this configuration also ensures that the second conductive connection completely avoids the corner region and is located on the second straight edge where deformation is minimal during vibration, reducing the risk of the second conductive connection detaching or breaking and improving the reliability of the conductive diaphragm.

[0015] In some possible implementations, within the same corner area, the ends of the first straight edge near the corner and the ends of the second straight edge near the corner are both exposed through the avoidance cutout area.

[0016] This is equivalent to not providing a first conductive connection part on the end where the first straight edge connects to the corner, and not providing a second conductive connection part on the end where the second straight edge connects to the corner. This can prevent the conductive connection part on the end where the first straight edge connects to the corner from breaking or falling off during vibration, and also prevent the conductive connection part on the end where the second straight edge connects to the corner from breaking or falling off during vibration.

[0017] In some possible implementations, the diaphragm base layer has a rectangular structure and four corner regions, with the conductive adhesive layer distributed in each corner region; The four clearance cutout areas in the four conductive adhesive layers are centrally symmetrical about the center of the rectangular structure.

[0018] In this way, the symmetrical distribution of the clearance areas in the four corner regions ensures consistent vibration resistance in all directions of the conductive diaphragm, avoiding vibration imbalance caused by local constraint differences. Simultaneously, the symmetrical layout ensures uniform distribution of flexibility and elasticity throughout the circumference of the surround, resulting in balanced force and consistent travel during vibration. This effectively suppresses eccentric and segmented vibrations, significantly reducing acoustic distortion and producing purer, more three-dimensional sound. Furthermore, the symmetry of the four clearance areas about the center of the rectangular diaphragm ensures that the structure of the four corner regions of the diaphragm base layer is completely identical. During assembly, there is no need to deliberately distinguish the installation direction of the conductive diaphragm; it can be directly attached and installed.

[0019] In some possible implementations, the portion of the conductive adhesive layer located on the fixing portion is the first conductive portion, and the portion of the conductive adhesive layer located on the central portion is the second conductive portion; Wherein, the dimension of the second conductive portion on the side away from the first conductive portion is smaller than the dimension of the second conductive portion on the side facing the first conductive portion.

[0020] This increases the connection area between the second conductive part and the conductive connection part, making the transition of the conductive path more stable and reducing connection breaks or impedance increases caused by vibration. Simultaneously, since the side of the second conductive part furthest from the first conductive part is used to connect the voice coil lead, only a smaller connection area is needed to correspondingly reduce the size of the side of the second conductive part furthest from the first conductive part, which helps reduce the loss of the conductive adhesive layer.

[0021] On the other hand, this application provides a sound generating unit, including: a voice coil and a conductive diaphragm, wherein the leads on the voice coil are connected to the conductive adhesive layer on the central portion.

[0022] In another aspect, this application provides an electronic device, including a sound-generating unit. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a planar schematic diagram of a conductive diaphragm in related technologies; Figure 2 This is a schematic diagram of the planar structure of the diaphragm substrate in the embodiments of this application; Figure 3 This is a schematic diagram of the planar structure of a conductive diaphragm provided in an embodiment of this application; Figure 4 This is a three-dimensional structural diagram of the generating unit in the embodiments of this application; Figure 5 This is a schematic diagram of the planar structure of a conductive diaphragm provided in another embodiment of this application; Figure 6 This is a schematic diagram of the planar structure of the generating unit in the embodiment of this application. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0026] The core structure of a loudspeaker is a system that converts electricity, magnetism, force, and sound. Multiple components work together to convert electrical signals into sound waves. The conductive diaphragm is the key component that performs the energy conversion. The conductive diaphragm vibrates back and forth under the action of electromagnetic force, thereby compressing the surrounding air to form sound waves with alternating density.

[0027] See Figure 1 , Figure 1 This is a planar schematic diagram of a conductive diaphragm in related technologies. The conductive diaphragm includes a diaphragm base layer 010 and a conductive adhesive layer 020 located on the diaphragm base layer 010. The diaphragm base layer 010 includes a central portion 011, a folded loop portion 012, and a fixing portion 013 connected in sequence. The folded loop portion 012 surrounds the periphery of the central portion 011, and the fixing portion 013 surrounds the side of the folded loop portion 012 opposite to the central portion 011. The folded loop portion 012 protrudes from the central portion 011 and the fixing portion 013 in a direction perpendicular to the diaphragm base layer 010. The central portion 011 is used to connect the voice coil, and the fixing portion 013 is used to connect the terminals. When the voice coil 20 drives the central portion 011 to vibrate up and down, the folded loop portion 012 can absorb vibration stress through its own stretching and contraction, preventing damage to the central portion 011 or the fixing portion 013 due to rigid tension. The conductive adhesive layer 020 is used to electrically connect the connecting terminals to the voice coil, so that external audio electrical signals can be transmitted to the voice coil.

[0028] In the related technology, the diaphragm base layer 010 has a rectangular structure with corner regions 014 located at its four corners. Connecting terminals are respectively provided on the fixing portions 013 within the two corner regions 014 along the width direction of the conductive diaphragm 10. The conductive adhesive layer 020 can have three structures. In the first structure, the conductive adhesive layer starts from the connecting terminal position in the corner region, extends along the width direction of the fixing portion to the short side between the two corner regions, then passes through the folded portion on the short side and returns to the center of the corner region to connect with the voice coil lead in the center of the corner region. In the second structure, the conductive adhesive layer starts from the connecting terminal position in the corner region, extends along the length direction of the fixing portion to the middle of the diaphragm base layer along the length direction, and then passes through the folded portion to connect with the voice coil lead in the center. The third structure involves a conductive adhesive layer 020 extending diagonally along the rectangular structure from the connection terminal located in the bend region 014, directly passing through the surround portion 012, and connecting to the voice coil lead on the central portion 011 within the bend region 014. In simulated stress tests, the maximum stress values ​​for the first and second structures were 29.9 MPa, while the maximum stress value for the third structure was 129.6 MPa. Furthermore, the larger the area of ​​the conductive adhesive layer 020 on the surround portion 012, the greater the maximum stress value.

[0029] Based on the stress value comparison, the first and second structures have lower stress, but the conductive adhesive layer 020 in the first and second structures is longer, resulting in higher impedance, which leads to greater signal transmission loss and response delay. The third structure has a shorter conductive adhesive layer 020 and lower impedance, but according to the simulation stress test results, the folded ring 012 in the bend region 014 is a high-stress area. During the vibration of the conductive diaphragm, the conductive adhesive layer 020 in the high-stress area is prone to breakage and failure, which in turn leads to lower reliability of the entire conductive diaphragm.

[0030] Therefore, this application provides a conductive diaphragm that can reduce the impedance value of the conductive adhesive layer while ensuring the reliability of the conductive diaphragm.

[0031] See Figure 2 , Figure 2 This is a schematic diagram of the planar structure of the diaphragm substrate in the embodiments of this application; Figure 3This is a schematic diagram of the planar structure of the conductive diaphragm 10 provided in an embodiment of this application. The conductive diaphragm 10 of this application includes a diaphragm base layer 100 and a conductive adhesive layer 200 located on the diaphragm base layer 100. The diaphragm base layer 100 includes a central portion 110, a folded ring portion 120, and a fixing portion 130 connected in sequence. The folded ring portion 120 surrounds the periphery of the central portion 110, and the fixing portion 130 surrounds the side of the folded ring portion 120 opposite to the central portion 110. The folded ring portion 120 protrudes from the central portion 110 and from the fixing portion 130 along a direction perpendicular to the diaphragm base layer 100. The diaphragm base layer 100 has multiple bend regions 140. Folded ring patterns are provided within the bend regions 140. The folded ring patterns are used to reduce the bending stress of the bend regions 140 and enhance the reliability of the diaphragm base layer 100 during vibration.

[0032] See Figure 2 and Figure 4 , Figure 4 This is a three-dimensional structural diagram of the generating unit in this embodiment of the application; the conductive adhesive layer 200 is distributed at the corner region 140, and the conductive adhesive layer 200 is located on the fixing part 130, the folded ring part 120, and the center part 110; the conductive adhesive layer 200 is distributed on the fixing part 130, the folded ring part 120, and the center part 110 at the corner region 140, which facilitates the direct connection of the conductive adhesive layer 200 to the terminal 30 on the fixing part 130 and the voice coil lead 21 on the center part 110 within the corner region 140, thereby reducing the length of the conductive adhesive layer 200 and reducing the impedance of the conductive adhesive layer 200. The conductive adhesive layer 200 can be applied to the diaphragm base layer 100 by screen printing, blade coating, or spraying.

[0033] Among them, participants Figure 2 and Figure 3 The conductive adhesive layer 200 has a clearance perforation area 201, through which at least a portion of the corner portion 141 of the folded ring portion 120 located in the corner region 140 is exposed. The corner portion 141, as a stress concentration point in the corner region 140, experiences the greatest deformation amplitude and most significant fatigue loss during vibration. The clearance perforation area 201 allows at least a portion of the corner portion 141 to escape the constraint of the conductive adhesive layer 200, preventing the conductive adhesive layer 200 from cracking or detaching during repeated bending. Simultaneously, it reduces the resistance of the conductive adhesive layer 200 to the deformation of the corner portion 141 on the diaphragm base layer 100, lowers the risk of tearing of the diaphragm base layer 100, and improves the overall reliability of the conductive diaphragm 10.

[0034] In summary, the conductive adhesive layer is distributed in the corner area, directly connecting the terminals on the fixing part to the voice coil lead on the center part within the corner area. This reduces the length and impedance of the conductive adhesive layer. Simultaneously, at least a portion of the corner portion of the surround part is exposed through the avoidance of the cutout area, reducing the amount of conductive adhesive layer in the corner area (high-stress area). This lowers the risk of the conductive adhesive layer in the corner area detaching or breaking during diaphragm base vibration, thus improving the overall reliability of the conductive diaphragm.

[0035] See Figure 2 The portion of the folded ring portion 120 within the bend region 140 includes: a corner portion 141, and a first straight edge portion 142 and a second straight edge portion 143 connected to both ends of the corner portion 141. The corner portion 141 is provided with a folded ring pattern. The corner portion 141 is a bend or an arc-shaped structure, while the first straight edge portion 142 and the second straight edge portion 143 are straight lines. The shape of the folded ring portion 120 can be a polygonal structure such as a triangle, quadrilateral, pentagon, or hexagon.

[0036] See Figure 3 The portion of the conductive adhesive layer 200 located on the fixing portion 130 is the first conductive portion 210, the portion of the conductive adhesive layer 200 located on the center portion 110 is the second conductive portion 220, and the portion of the conductive adhesive layer 200 connecting the first conductive portion 210 and the second conductive portion 220 is the conductive connecting portion 230. The conductive connecting portion 230 is located on the folded ring portion 120.

[0037] At least a portion of the conductive connection portion 230 is located on the first straight edge portion 142 and / or the second straight edge portion 143, and the first conductive portion 210, the second conductive portion 220 and the conductive connection portion 230 are used to form an avoidance cutout area 201.

[0038] In this embodiment, at least a portion of the corner portion 141 provided in the bend region 140 of the folded ring portion 120 is exposed by avoiding the hollow area 201, which reduces the width of the conductive adhesive layer 200 on the corner portion 141, resulting in a larger impedance of the conductive adhesive layer 200. Therefore, the conductive adhesive layer 200 of this application is also provided on the first straight edge portion 142 and / or the second straight edge portion 143, which can increase the width of the conductive adhesive layer 200 and thereby reduce the impedance of the conductive adhesive layer 200.

[0039] In addition, the conductive connection portion 230 is attached to the first straight edge portion 142 and / or the second straight edge portion 143 where the deformation is smaller. The vibration stress is more gentle here, and the bonding stability between the conductive adhesive layer 200 and the diaphragm base layer 100 is higher. This can effectively avoid the peeling problem caused by the difference in deformation between the two and extend the service life of the product.

[0040] The first conductive part 210, the second conductive part 220, and the conductive connecting part 230 are used to form an avoidance cutout area 201 without damaging the overall connectivity of the conductive adhesive layer 200. This allows the first conductive part 210, the conductive connecting part 230, and the second conductive part 220 to form a complete conductive link, which satisfies the electrical connection requirements between the terminal 30 and the voice coil 20 without causing signal loss or interruption due to the avoidance design.

[0041] In one of the first embodiments, a portion of the conductive connection is located on the first straight edge, and another portion is located on the corner.

[0042] In one of the second embodiments, a portion of the conductive connection is located on the second straight edge, and another portion is located on the corner.

[0043] In one of the third embodiments, the first part of the conductive connection portion 230 is located on the first straight edge portion 142, the second part is located on the second straight edge portion 143, and the third part is located on the corner portion 141.

[0044] See Figure 3 and Figure 5 , Figure 5 This is a schematic diagram of the planar structure of a conductive diaphragm provided in another embodiment of this application; within the same bend region 140, the conductive connection portion 230 includes a first conductive connection portion 231 and a second conductive connection portion 232, and the clearance cutout area 201 is located between the first conductive connection portion 231 and the second conductive connection portion 232. At least a portion of the first conductive connection portion 231 is located on the first straight edge portion 142 and / or the second straight edge portion 143, and at least a portion of the second conductive connection portion 232 is located on the first straight edge portion 142 and / or the second straight edge portion 143.

[0045] In this embodiment, the first conductive connection portion 231 and the second conductive connection portion 232 are respectively located on both sides of the avoidance cutout area 201, so that the avoidance cutout area 201 can be located in the core area of ​​the corner 141, effectively avoiding the high deformation area on the corner 141, reducing the risk of breakage of the conductive adhesive layer 200, and improving the reliability of the entire conductive diaphragm 10.

[0046] Of course, in other embodiments, the conductive connection portion may include a plurality of conductive connection portions spaced apart, with any two adjacent conductive connection portions forming an avoidance cutout area.

[0047] In some other embodiments, within the same bend area, there is one conductive connection portion, with a portion of the conductive connection portion located on the first straight edge and another portion located on the corner; or a portion of the conductive connection portion located on the second straight edge and another portion located on the corner.

[0048] See Figure 5In some embodiments, within the same corner region 140, a portion of the first conductive connection portion 231 is located on the corner 141, and another portion is located on the first straight edge portion 142; a portion of the second conductive connection portion 232 is located on the corner 141, and another portion is located on the second straight edge portion 143; wherein, the orthographic projection of the avoidance hollow area 201 on the diaphragm base layer 100 is located in the region where the corner 141 is located.

[0049] In this embodiment, the first conductive connection portion 231 is located on the first straight edge portion 142 and on a portion of the corner portion 141 near the first straight edge portion 142, which increases the width of the first conductive connection portion 231 and reduces its impedance. Similarly, the second conductive connection portion 232 is located on the second straight edge portion 143 and on a portion of the corner portion 141 near the second straight edge portion 143, which increases its width and reduces its impedance. By avoiding the orthographic projection of the hollow area 201 onto the diaphragm base layer 100, which lies within the area of ​​the corner portion 141, the area of ​​the conductive connection portion 230 on the corner portion 141 is reduced, thus reducing the risk of the conductive connection portion 230 on the corner portion 141 detaching or breaking.

[0050] See Figure 2 and Figure 3 In some other embodiments, within the same corner region 140, the first conductive connection portion 231 is located on the first straight edge portion 142 and does not overlap with the corner portion 141; the second conductive connection portion 232 is located on the second straight edge portion 143 and does not overlap with the corner portion 141; wherein, the orthographic projection of the avoidance hollow area 201 on the diaphragm base layer 100 covers the area where the corner portion 141 is located.

[0051] This configuration ensures that the first conductive connection 231 completely avoids the corner region 141, and is located on the first straight edge 142 where deformation is minimal during vibration. This reduces the risk of the first conductive connection 231 detaching or breaking, thus improving the reliability of the conductive diaphragm 10. Similarly, this configuration also ensures that the second conductive connection 232 completely avoids the corner region 141, and is located on the second straight edge 143 where deformation is minimal during vibration. This reduces the risk of the second conductive connection 232 detaching or breaking, further improving the reliability of the conductive diaphragm 10.

[0052] In some embodiments, within the same bend region 140, the ends of the first straight edge 142 near the corner 141 and the ends of the second straight edge 143 near the corner 141 are both exposed through the avoidance cutout area 201. This is equivalent to the orthographic projection of the avoidance cutout area 201 onto the diaphragm base layer 100 being larger than the area where the corner 141 is located; that is, the first straight edge 142 is spaced apart from the corner 141, and the second straight edge 143 is spaced apart from the corner 141. This prevents the conductive connection portion 230 at the end where the first straight edge 142 connects to the corner 141 from breaking or detaching during vibration, and also prevents the conductive connection portion 230 at the end where the second straight edge 143 connects to the corner 141 from breaking or detaching during vibration.

[0053] In some other embodiments, the first conductive connection portion 231 is located on the first straight edge portion 142; the second conductive connection portion 232 is located on the second straight edge portion 143; wherein the orthographic projection of the avoidance hollow area 201 on the diaphragm base layer 100 is equal in size to the area where the corner portion 141 is located.

[0054] In some embodiments, the diaphragm base layer 100 is a rectangular structure, and the diaphragm base layer 100 has four corner regions 140, each corner region 140 having a conductive adhesive layer 200 distributed thereon; the four clearance cutout regions 201 of the four conductive adhesive layers 200 are centrally symmetrically distributed about the center of the rectangular structure.

[0055] The four corner regions 140 have symmetrically distributed clearance areas 201, ensuring consistent vibration resistance in all directions of the conductive diaphragm 10 and preventing vibration imbalance caused by local constraint differences. Simultaneously, the symmetrical layout ensures uniform distribution of flexibility and elasticity throughout the circumference of the surround 120, resulting in balanced force and consistent travel during vibration. This effectively suppresses eccentric and segmented vibrations, significantly reducing acoustic distortion and producing purer, more three-dimensional sound. Furthermore, the four clearance areas 201 are symmetrical about the center of the rectangular diaphragm, making the four corner regions 140 of the diaphragm base layer 100 structurally identical. During assembly, there is no need to distinguish the installation direction of the conductive diaphragm 10; it can be directly attached and installed.

[0056] See Figure 3 In some embodiments, the portion of the conductive adhesive layer 200 located on the fixing portion 130 is the first conductive portion 210, and the portion of the conductive adhesive layer 200 located on the center portion 110 is the second conductive portion 220; wherein, the size of the second conductive portion 220 on the side away from the first conductive portion 210 is smaller than the size of the second conductive portion 220 on the side facing the first conductive portion 210.

[0057] This configuration increases the connection area between the second conductive part 220 and the conductive connection part 230, making the transition of the conductive path more stable and reducing connection breaks or impedance increases caused by vibration. Simultaneously, since the side of the second conductive part 220 furthest from the first conductive part 210 is used to connect the voice coil lead 21, only a smaller connection area is needed to correspondingly reduce the size of the side of the second conductive part 220 furthest from the first conductive part 210, which helps reduce the loss of the conductive adhesive layer 200.

[0058] For example, the second conductive part 220 includes an intermediate connecting section 221 and a voice coil connecting section 222 connected together. One end of the intermediate connecting section 221 away from the voice coil connecting section 222 is connected to the conductive part 230. The end of the intermediate connecting section 221 away from the voice coil connecting section 222 has an arc-shaped structure, the voice coil connecting section 222 has a rectangular structure, and the voice coil lead 21 is used to connect to the voice coil connecting section 222.

[0059] According to stress simulation tests, when the present application simultaneously provides a first conductive connection part and a second conductive connection part, and the clearance area just coincides with the corner, the maximum stress value of the conductive connection part is 56.2 MPa; when the present application simultaneously provides a first conductive connection part and a second conductive connection part, and the clearance area is larger than the corner, the maximum stress value of the conductive connection part is 22.5 MPa; when only the first conductive connection part is provided to connect the first conductive part and the second conductive part, the maximum stress value of the first conductive connection part is 55.8 MPa; when only the second conductive connection part is provided to connect the first conductive part and the second conductive part, the maximum stress value of the second conductive connection part is 50.2 MPa. The comparison shows that, compared to the conductive connection parts in the related technologies that do not have a clearance area, the stress value of the conductive connection parts in this application is significantly reduced after setting a clearance area. In addition, when the first conductive connection part and the second conductive connection part are set in this application at the same time, and the clearance area is larger than the corner, the maximum stress value of the conductive connection part is 22.5MPa, which is less than the maximum stress value of 29.9MPa of the first structure in the related technologies, and less than the maximum stress value of 29.9MPa of the second structure. Moreover, the impedance is smaller than that of the first structure and the second structure. That is, this application can simultaneously achieve low impedance or high reliability.

[0060] See Figure 5 and Figure 6 , Figure 6 This is a schematic diagram of the planar structure of the generating unit in an embodiment of this application. Another embodiment of this application provides a sound generating unit, including: a voice coil 20 and a conductive diaphragm 10, wherein the voice coil lead 21 on the voice coil 20 is connected to the conductive adhesive layer 200 on the central portion 110.

[0061] One embodiment of this application also provides an electronic device, including the aforementioned sound-generating unit. The electronic device may be a mobile phone, tablet, laptop computer, smart wearable device (such as a watch, headphones), etc.

[0062] In summary, the conductive adhesive layer is distributed in the corner area, directly connecting the terminals on the fixing part to the voice coil lead on the center part within the corner area. This reduces the length of the conductive adhesive layer and its impedance. Simultaneously, at least a portion of the corner portion of the surround part is exposed through the avoidance cutout area. Reducing the amount of conductive adhesive layer in the corner area (high-stress area) lowers the risk of breakage of the conductive adhesive layer in the corner area during diaphragm base vibration, thus improving the overall reliability of the conductive diaphragm.

[0063] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0064] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0065] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A conductive diaphragm (10), characterized in that, include: Diaphragm base layer (100) and conductive adhesive layer (200) located on the diaphragm base layer (100). The diaphragm base layer (100) includes a central portion (110), a folded ring portion (120), and a fixing portion (130) connected in sequence; the folded ring portion (120) surrounds the periphery of the central portion (110), and the fixing portion (130) surrounds the side of the folded ring portion (120) away from the central portion (110); the folded ring portion (120) protrudes from the central portion (110) and from the fixing portion (130) in a direction perpendicular to the diaphragm base layer (100); the diaphragm base layer (100) has multiple bend regions (140). The conductive adhesive layer (200) is distributed in the corner area (140), and the conductive adhesive layer (200) is located on the fixing part (130), the folded ring part (120) and the center part (110); The conductive adhesive layer (200) has an avoidance cutout area (201), and at least a portion of the corner (141) of the folded ring portion (120) provided at the corner area (140) is exposed through the avoidance cutout area (201).

2. The conductive diaphragm (10) according to claim 1, characterized in that, The portion of the folded ring (120) within the bend region (140) includes: the corner (141), and a first straight edge (142) and a second straight edge (143) connected to both ends of the corner (141). The portion of the conductive adhesive layer (200) located on the fixing portion (130) is the first conductive portion (210), the portion of the conductive adhesive layer (200) located on the center portion (110) is the second conductive portion (220), and the portion of the conductive adhesive layer (200) connecting the first conductive portion (210) and the second conductive portion (220) is the conductive connecting portion (230). At least a portion of the conductive connection portion (230) is located on the first straight edge portion (142) and / or the second straight edge portion (143), and the first conductive portion (210), the second conductive portion (220) and the conductive connection portion (230) are used to form the avoidance hollow area (201).

3. The conductive diaphragm (10) according to claim 2, characterized in that, Within the same bend area (140), the conductive connection portion (230) includes a first conductive connection portion (231) and a second conductive connection portion (232), and the clearance cutout area (201) is located between the first conductive connection portion (231) and the second conductive connection portion (232).

4. The conductive diaphragm (10) according to claim 3, characterized in that, Within the same corner region (140), a portion of the first conductive connection (231) is located on the corner (141), and another portion is located on the first straight edge (142); a portion of the second conductive connection (232) is located on the corner (141), and another portion is located on the second straight edge (143); The orthographic projection of the avoidance hollow area (201) on the diaphragm base layer (100) is located in the area where the corner (141) is located.

5. The conductive diaphragm (10) according to claim 3, characterized in that, Within the same corner region (140), the first conductive connection portion (231) is located on the first straight edge portion (142) and does not overlap with the corner portion (141); the second conductive connection portion (232) is located on the second straight edge portion (143) and does not overlap with the corner portion (141); The orthographic projection of the avoidance hollow area (201) onto the diaphragm base layer (100) covers the area where the corner (141) is located.

6. The conductive diaphragm (10) according to claim 5, characterized in that, Within the same corner region (140), the ends of the first straight edge (142) near the corner (141) and the ends of the second straight edge (143) near the corner (141) are both exposed through the avoidance cutout area (201).

7. The conductive diaphragm (10) according to any one of claims 1-6, characterized in that, The diaphragm base layer (100) has a rectangular structure and has four corner regions (140), each of which has a conductive adhesive layer (200). The four clearance cutout areas (201) of the four conductive adhesive layers (200) are centrally symmetrical about the center of the rectangular structure.

8. The conductive diaphragm (10) according to any one of claims 1-6, characterized in that, The portion of the conductive adhesive layer (200) located on the fixing portion (130) is the first conductive portion (210), and the portion of the conductive adhesive layer (200) located on the center portion (110) is the second conductive portion (220). The dimension of the second conductive portion (220) on the side away from the first conductive portion (210) is smaller than the dimension of the second conductive portion (220) on the side facing the first conductive portion (210).

9. A sound-generating unit, characterized in that, include: The voice coil (20) and the conductive diaphragm (10) according to any one of claims 1-8, wherein the lead on the voice coil (20) is connected to the conductive adhesive layer (200) on the center portion (110).

10. An electronic device, characterized in that, Includes the sound-generating unit as described in claim 9.

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