A single-directional microphone and electronic device
Patent Information
- Application Number
- CN202521977473.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-12
- Publication Date
- 2026-10-16
- Estimated Expiration
- 2035-09-12
AI Technical Summary
然而，在组装生产过程中，由于不同目数的阻挡件在外观上非常相似，操作人员在作业过程中仔细辨识，不仅使得生产效率降低，还会因混淆经常发生出错的现象，导致各透气孔对应的阻挡组件出现反向设置，这样就会使产品性能达不到预期效果，因此，行业亟需解决现有组装生产所带来的困扰
[0026] This invention uses acoustic mesh with the same mesh size and adjusts the air permeability by changing the size of the through holes in the adhesive backing. Operators only need to identify the size of the through holes in the adhesive backing to solve the problems caused by assembly production and effectively improve production efficiency.
Smart Images
Figure CN224863131U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of audio equipment, specifically to a unidirectional microphone and electronic device. Background Technology
[0002] Microphones are key components for voice input in electronic devices such as mobile phones, headphones, and smart speakers. Unidirectional microphones can primarily receive sound from a specific direction while suppressing noise from other directions, thus improving speech clarity in noisy environments, and are therefore increasingly widely used. Currently, the main technical solution for achieving unidirectionality is through a mechanical acoustic structure that creates a path difference within a single microphone, resulting in a simple structure and low cost.
[0003] Existing unidirectional microphones generally include a housing mechanism and an acoustic sensing component. The housing mechanism includes a housing space, a propagation space, and a through-hole connecting the housing space and the propagation space. Ventilation holes are provided on the outside of the housing space and the propagation space. Different mesh count blocking components are used in each ventilation hole to address the corresponding airflow, thus achieving the function of a unidirectional microphone. However, during assembly and production, because the blocking components of different mesh counts are very similar in appearance, operators need to carefully identify them during operation. This not only reduces production efficiency but also frequently leads to errors due to confusion, resulting in the blocking components for each ventilation hole being set in reverse. This causes the product performance to fall short of expectations. Therefore, the industry urgently needs to solve the problems caused by the current assembly and production methods. Utility Model Content
[0004] To address the aforementioned deficiencies in the existing technology, the purpose of this utility model is to provide a unidirectional microphone and electronic device. By using acoustic mesh with the same mesh count and adjusting the air permeability by changing the size of the through holes in the adhesive backing, operators only need to identify the size of the through holes in the adhesive backing to solve the problems caused by assembly and production, effectively improving production efficiency.
[0005] To achieve the above objectives, this utility model provides the following technical solution:
[0006] In a first aspect, embodiments of this application provide a unidirectional microphone, comprising:
[0007] A receiving mechanism and a sound sensing component are disclosed. The receiving mechanism includes a receiving space, a propagation space, a first hole, a second hole, and a third hole. The receiving space and the propagation space are spaced apart. The first hole communicates with the receiving space, the second hole communicates with the propagation space, and the third hole communicates with both the receiving space and the propagation space. The sound sensing component is located within the receiving space and has a diaphragm. The first hole and the second hole are respectively secured with acoustic meshes of the same mesh size via adhesive tape. The adhesive tape has through-holes for adjusting the air permeability of the acoustic mesh, and the through-holes on the first hole are smaller than those on the second hole, so that the air permeability of the second hole is greater than that of the first hole.
[0008] Optionally, the first hole is larger than the second hole, the adhesive through-hole on the first hole is smaller than the first hole, and the adhesive through-hole on the second hole is larger than the second hole.
[0009] Optionally, the containment mechanism includes a first containment component and a second containment component;
[0010] The first receiving member is located on the first side of the second receiving member in the first direction, and the first receiving member and the second receiving member cooperate to form the receiving space. The first hole is opened on the first side of the first receiving member in the first direction.
[0011] The second hole, the third hole, and the propagation space are formed in the second receiving member. The third hole is located on the first side of the second receiving member in the first direction, and the propagation space is located on the second side of the third hole in the first direction. The second hole and the third hole are spaced apart in the second direction.
[0012] Wherein, the first direction intersects with the second direction.
[0013] Optionally, the second receiving component includes a first circuit board, a second circuit board, and a third circuit board stacked sequentially from top to bottom. The second hole and the third hole are located on the third circuit board and the first circuit board, respectively. The second circuit board has a propagation through hole, which connects the second hole and the third hole to form the propagation space.
[0014] Optionally, the sound sensing component is electrically connected to the first circuit board, the first circuit board is electrically connected to the second circuit board, and the second circuit board is electrically connected to the third circuit board.
[0015] Optionally, the first circuit board and / or the third circuit board are connected to pads.
[0016] Optionally, the receiving mechanism includes a first substrate, a second substrate, a third substrate, a fourth substrate, and a fifth substrate stacked sequentially from top to bottom;
[0017] The first hole and the second hole are formed on the first substrate, and the second hole is located on the third side of the first hole in the second direction;
[0018] The containment space is formed on the second substrate, and the second substrate also has a first propagation space on the third side of the containment space in the second direction;
[0019] The third hole is formed on the third substrate, and the third substrate also has a tuning hole on the third side of the third hole in the second direction.
[0020] The fourth substrate has a second propagation space, which is located on the second side of the third hole and the tuning hole in the first direction;
[0021] Wherein, the first direction intersects with the second direction.
[0022] Optionally, the second hole is connected to the first propagation space, the tuning hole is connected to the first propagation space and the second propagation space, and the third hole is connected to the receiving space and the second propagation space.
[0023] Optionally, the fifth substrate is connected to the pads.
[0024] Secondly, embodiments of this application provide an electronic device, including: a unidirectional microphone as described in any of the preceding claims; and a processor connected to the unidirectional microphone.
[0025] Compared with the prior art, the beneficial effects of this utility model are:
[0026] This invention uses acoustic mesh with the same mesh size and adjusts the air permeability by changing the size of the through holes in the adhesive backing. Operators only need to identify the size of the through holes in the adhesive backing to solve the problems caused by assembly production and effectively improve production efficiency. Attached Figure Description
[0027] Figure 1 This is a schematic diagram of the structure of a unidirectional microphone according to the first embodiment of this application.
[0028] Figure 2 This is a schematic diagram of the structure of a unidirectional microphone according to the second embodiment of this application.
[0029] Figure 3 This is a schematic diagram of an electronic device.
[0030] Explanation of reference numerals in the attached diagram:
[0031] 100. Electronic devices;
[0032] 101. Processor;
[0033] 102. Unidirectional microphone;
[0034] 10. Containment mechanism; 11. Containment space; 12. Propagation space; 13. First hole; 14. Second hole; 15. Third hole; 16. First sound path; 17. Second sound path; 18. First containment component; 19. Second containment component; 191. First circuit board; 192. Second circuit board; 1921. Propagation through hole; 193. Third circuit board;
[0035] 20. Sound sensing components; 21. MEMS sensors; 211. Diaphragms; 22. ASIC amplifiers;
[0036] 30. Acoustics Network;
[0037] 40. Adhesive backing; 41. Through-hole;
[0038] 51. First substrate; 511. First hole; 512. Second hole; 52. Second substrate; 521. Receiving space; 522. First propagation space; 53. Third substrate; 531. Tuning hole; 532. Third hole; 54. Fourth substrate; 541. Second propagation space; 55. Fifth substrate;
[0039] 60. Solder pads. Detailed Implementation
[0040] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments.
[0041] Please see Figure 1 , Figure 1 A schematic diagram of the structure of the unidirectional microphone 102 provided in the first embodiment of this application is shown.
[0042] In this embodiment, the unidirectional microphone 102 may include a housing mechanism 10 and a sound sensing component 20.
[0043] The containment mechanism 10 includes a containment space 11 and a propagation space 12, which are spaced apart. A sound sensing component 20 is located within the containment space 11. The containment mechanism 10 also includes a first hole 13, a second hole 14, and a third hole 15. The first hole 13 communicates with the containment space 11 and is spaced apart from the propagation space 12. The second hole 14 communicates with the propagation space 12 and is spaced apart from the containment space 11. The third hole 15 communicates with both the containment space 11 and the propagation space 12.
[0044] The sound sensing component 20 has a diaphragm 211. The position of the third hole 15 corresponds to the position of the diaphragm 211. The first hole 13 and the third hole 15 are located on the first and second sides of the diaphragm 211, respectively. The diaphragm 211 is used to vibrate in response to sound propagation to the diaphragm 211, thereby enabling the sound sensing component 20 to collect sound.
[0045] The first aperture 13 allows sound to enter the receiving space 11 and propagate to the diaphragm 211. The second aperture 14 allows sound to enter the propagation space 12, and after entering the propagation space 12, the sound propagates to the diaphragm 211 through the third aperture 15. Thus, a first sound path 16 is formed in the receiving mechanism 10 from the first aperture 13 to the diaphragm 211, and the first sound path 16 passes through the receiving space 11; a second sound path 17 is also formed in the receiving mechanism 10 from the second aperture 14 to the diaphragm 211, and the second sound path 17 passes through the propagation space 12 and the third aperture 15.
[0046] It is understood that the first side and the second side are two opposite sides in the first direction. In the embodiments of this application, the first direction is not specifically limited. For example, the first direction can be as follows: Figure 2 The X direction and its opposite direction are shown, where the first side of the first direction is the side towards which the X direction arrow points, and the second side of the first direction is the side away from which the X direction arrow points.
[0047] In the embodiments of this application, the location of the second hole 14 is not specifically limited. For example, as Figure 2 As shown, the second hole 14 is opened on the second side of the receiving mechanism 10 in the first direction, and the second hole 14 and the third hole 15 are spaced apart in the second direction.
[0048] It is understood that the second direction is the direction intersecting the first direction. In the embodiments of this application, the second direction is not specifically limited. For example, the second direction can be as follows: Figure 2 The diagram shows the Y-direction and its opposite direction, with the second direction intersecting the first direction. The third side of the second direction is the side towards which the Y-direction arrow points, and the fourth side of the second direction is the side away from which the Y-direction arrow points.
[0049] It is understood that when the unidirectional microphone 102 is working, part of the sound propagates from the first side to the diaphragm 211 through the first sound path 16 and acts on the diaphragm 211, while another part of the sound propagates from the second side to the diaphragm 211 through the second sound path 17 and acts on the diaphragm 211. After the sound acts on the diaphragm 211, the sound sensing component 20 can sense the sound, generate a sound signal based on the sensed sound, and output the sound signal to the processor 101.
[0050] In some scenarios, the sound sensing component 20 may include a MEMS sensor 21 and an ASIC amplifier 22. A diaphragm 211 is disposed on the MEMS sensor 21. The ASIC amplifier 22 is connected to the MEMS sensor 21 and to the processor 101. The MEMS sensor 21 generates sound information based on the reaction of the diaphragm 211 in response to the propagation of sound, and outputs the sound information to the ASIC amplifier 22. The ASIC amplifier 22 amplifies the sound information and outputs the processed sound to the processor 101.
[0051] It is understood that in other embodiments, the sound sensing component 20 may also be composed of other electronic components with sound sensing function and electronic components with signal processing function.
[0052] In embodiments of this application, the unidirectional microphone 102 further includes an acoustic mesh 30.
[0053] Acoustic mesh 30 with the same mesh size is fixed to the outer sides of the first hole 13 and the second hole 14 by adhesive backing 40. The acoustic mesh 30 is used to block the propagation of sound through the first sound path 16 and / or the second sound path 17, and to block external foreign objects from entering the containment space 11 and / or the propagation space 12.
[0054] The adhesive backing 40 has through holes for adjusting the air permeability of the acoustic mesh 30. The through hole 41 on the first hole 13 is smaller than the through hole 41 on the second hole 14, so that the air permeability of the second hole 14 is greater than that of the first hole 13. Based on the characteristic that a smaller air permeability in the positive sound inlet of a MEMS sensor is beneficial for improving sensitivity, the air permeability of the first sound path 16 on the front side of the diaphragm is designed to be smaller, effectively improving the microphone's sensitivity and contributing to improving the product's signal-to-noise ratio and overall acoustic performance. The size of the through hole 41 of the adhesive backing 40 can be freely adjusted; the air permeability is adjusted by changing the size of the through hole 41.
[0055] Therefore, the final effective air permeability of the first hole 13 and the second hole 14 is determined by the size of the through hole 41 of the adhesive backing 40. In the embodiments of this application, the aperture of the first hole 13 is larger than that of the second hole 14, which is more advantageous when adjusting the sound. Assemblers can freely cut out adhesive holes of different sizes based on acoustic simulation or preliminary test results for rapid verification and adjustment until optimal acoustic performance (such as optimal sensitivity and directivity) is obtained. This adjustment method is more flexible, faster, and extremely low in cost. At the same time, this application can also be used for the first hole 13 and the second hole 14 with the same aperture size, which can be further explained, except that the second hole 14 is smaller than the first hole 13, which makes it easier for operators to identify without making mistakes. In addition, the through hole 41 of the adhesive backing 40 on the first hole 13 is smaller than that of the first hole 13, and the through hole 41 of the adhesive backing 40 on the second hole 14 is larger than that of the second hole 14, so that operators can intuitively attach the same mesh size of the blocking parts according to the through hole and aperture size.
[0056] It is understood that the acoustic mesh 30 can be a damping material with the function of slowing down sound propagation. In the embodiments of this application, the type of acoustic mesh 30 is not specifically limited. The damping material can be the acoustic mesh 30, or other damping components, such as tuning paper, insulating cloth, non-woven fabric, woven cloth, non-woven fabric, and sponge, etc.
[0057] In the embodiments of this application, acoustic mesh 30 of the exact same material and mesh size is used, with only the pore size of the adhesive backing being changed to adjust the air permeability. During assembly, operators can intuitively attach blocking elements of the same mesh size according to the pore size. Operators only need to identify the through-hole size of the adhesive backing to solve the problems caused by assembly production, effectively improving production efficiency and completely avoiding confusion caused by different mesh sizes. At the same time, attaching the acoustic mesh 30 to the outside of the first hole 13 and the second hole 14 also facilitates later debugging and replacement.
[0058] The receiving mechanism includes a first receiving member 18 and a second receiving member 19, which cooperate to form the receiving space 11. The first receiving member 18 is located on a first side of the second receiving member 19 in the first direction, and a first hole 13 is formed on the first side of the first receiving member 18 in the first direction. A second hole 14, a third hole 15, and a propagation space 12 are formed on the second receiving member 19. The third hole 15 is located on a first side of the second receiving member 19 in the first direction, and the propagation space 12 is located on a second side of the third hole 15 in the first direction. The second hole 14 and the third hole 15 are spaced apart in the second direction.
[0059] Furthermore, the second receiving component 19 includes a first circuit board 191, a second circuit board 192, and a third circuit board 193 stacked sequentially from top to bottom. The second hole 14 and the third hole 15 are located on the third circuit board 193 and the first circuit board 191, respectively. The second circuit board 192 has a propagation through hole 1921, which connects the second hole 14 and the third hole 15 to form the propagation space 12.
[0060] By replacing the integrated processing structure with a three-layer circuit board stack, holes are drilled on each of the three circuit boards, and then they are stacked to form an acoustic channel, which greatly reduces the processing difficulty and production cost of precision structural components.
[0061] The sound sensing component 20 is electrically connected to the first circuit board 191, the first circuit board 191 is electrically connected to the second circuit board 192, and the second circuit board 192 is electrically connected to the third circuit board 193.
[0062] The upper surface of the first circuit board 191 and / or the lower surface of the third circuit board 193 are connected to the pad 60.
[0063] Please refer to the following: Figure 2 , Figure 2 A schematic diagram of the structure of a unidirectional microphone 102 provided in the second embodiment of this application is shown. Figure 2 The unidirectional microphone 102 shown is Figure 1 The structures of the housing mechanism 10 differ between the unidirectional microphones 102 shown.
[0064] like Figure 2 As shown, in this embodiment, the receiving mechanism 10 is formed by stacking and fixing five layers of printed circuit boards, which are arranged from top to bottom as follows: first substrate 51, second substrate 52, third substrate 53, fourth substrate 54 and fifth substrate 55.
[0065] The first substrate 51 serves as the top cover plate, and the first hole 511 and the second hole 512 are formed on the first substrate 51. The second hole 512 is located on the third side of the first hole 511 in the second direction.
[0066] The containment space 521 is formed on the second substrate 52, and the second substrate 52 also has a first propagation space 522 formed on the third side of the containment space 521 in the second direction.
[0067] The third hole 532 is formed on the third substrate 53, and the third substrate 532 also has a tuning hole 531 on the third side of the third hole 532 in the second direction; the sound sensing component 20 is fixed to the upper surface of the third substrate 53 and is housed inside the receiving space 521.
[0068] The fourth substrate 54 has a second propagation space 541, which is located on the second side of the third hole 532 and the tuning hole 531 in a first direction.
[0069] The fifth substrate 55 serves as a bottom cover plate and is a complete printed circuit board used to seal the bottom of the entire propagation space 12. The lower surface of the fifth substrate 55 is connected to the pad 60.
[0070] The first substrate 51, the second substrate 52, and the third substrate 53 cooperate to form a receiving space 521. The first hole 511 communicates with the receiving space 521, and the sound sensing component 20 is disposed therein. The sound sensing component 20 has a diaphragm 211.
[0071] The first substrate 51, the second substrate 52, the third substrate 53, the fourth substrate 54, and the fifth substrate 55 cooperate to form a complete propagation space. Specifically, the complete propagation space includes a first propagation space 522 and a second propagation space 541. The second hole 512 communicates with the first propagation space 522, the tuning hole 531 communicates with the first propagation space 522 and the second propagation space 541, and the third hole 532 communicates with the receiving space 521 and the second propagation space 541.
[0072] Thus, a first sound path 16 is formed in the housing mechanism 10 from the first hole 511 to the diaphragm 211, and the first sound path 16 passes through the housing space 521; a second sound path 17 is also formed in the housing mechanism 10 from the second hole 512 to the diaphragm 211, and the second sound path 17 passes through the first propagation space 522, the tuning hole 531, the second propagation space 541 and the third hole 532 in sequence.
[0073] In this embodiment, the second hole 512, the first propagation space 522, and the tuning hole 531 have the same aperture size, which can reduce echo.
[0074] Please see Figure 3 , Figure 3 A schematic diagram of an electronic device 100 provided for an embodiment of this application.
[0075] It is understood that the type of electronic device 100 is not specifically limited in the embodiments of this application. For example, electronic device 100 may include, but is not limited to, wired headphones, wireless headphones, walkie-talkies, telephones, recorders, and mobile phones, tablets, desktop computers, laptops, handheld computers, laptops, ultra-mobile personal computers (UMPCs), netbooks, cellular phones, personal digital assistants (PDAs), augmented reality (AR) devices, virtual reality (VR) devices, artificial intelligence (AI) devices, wearable devices, in-vehicle devices, smart home devices, and / or smart city devices, etc.
[0076] In this embodiment, the electronic device 100 may include a processor 101 and a unidirectional microphone 102. The processor 101 is communicatively connected to the unidirectional microphone 102. The unidirectional microphone 102 is used to collect sound from a specified direction or location and output audio information to the processor 101 based on the collected sound. After receiving the audio information, the processor 101 can respond to operations on the electronic device 100 by storing, playing, or transmitting the audio information.
[0077] It is understood that in other embodiments, the electronic device 100 may also include Figure 3 Other components not shown.
[0078] In the embodiments of this application, the implementation method of the communication connection is not specifically limited. For example, the communication connection can be a wired communication connection implemented through hardware devices such as signal lines. As another example, the communication connection can be a wireless communication connection implemented through wireless communication technologies such as wireless networks, Bluetooth, 3G, 4G, and 5G.
[0079] In the embodiments of this application, there are no specific restrictions on the installation position of the unidirectional microphone 102 in the electronic device 100.
[0080] In summary, the key design features of this utility model are:
[0081] This invention uses acoustic mesh with the same mesh size and adjusts the air permeability by changing the size of the through holes in the adhesive backing. Operators only need to identify the size of the through holes in the adhesive backing to solve the problems caused by assembly production and effectively improve production efficiency.
[0082] The accompanying drawings of the embodiments disclosed in this utility model only involve the structures involved in the embodiments disclosed in this utility model. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this utility model can be combined with each other.
[0083] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A unidirectional microphone, comprising a housing mechanism and a sound sensing component, wherein the housing mechanism has a housing space, a propagation space, a first hole, a second hole, and a third hole, the housing space and the propagation space being spaced apart, the first hole communicating with the housing space, the second hole communicating with the propagation space, and the third hole communicating with both the housing space and the propagation space; the sound sensing component is located within the housing space and has a diaphragm; characterized in that, The first hole and the second hole are respectively fixed with acoustic mesh of the same mesh size by adhesive backing. The adhesive backing has through holes for adjusting the air permeability of the acoustic mesh, and the through holes of the adhesive backing on the first hole are smaller than the through holes of the adhesive backing on the second hole, so that the air permeability of the second hole is greater than that of the first hole.
2. A unidirectional microphone according to claim 1, characterized in that: The first hole is larger than the second hole, the adhesive through-hole on the first hole is smaller than the first hole, and the adhesive through-hole on the second hole is larger than the second hole.
3. A unidirectional microphone according to claim 1, characterized in that, The containment mechanism includes a first containment component and a second containment component; The first receiving member is located on the first side of the second receiving member in a first direction, and the first receiving member and the second receiving member cooperate to form the receiving space. The first hole is opened on the first side of the first receiving member in the first direction. The second hole, the third hole, and the propagation space are formed in the second receiving member. The third hole is located on the first side of the second receiving member in the first direction, and the propagation space is located on the second side of the third hole in the first direction. The second hole and the third hole are spaced apart in the second direction. Wherein, the first direction intersects with the second direction.
4. A unidirectional microphone according to claim 3, characterized in that, The second receiving component includes a first circuit board, a second circuit board, and a third circuit board stacked sequentially from top to bottom. The second hole and the third hole are located on the third circuit board and the first circuit board, respectively. The second circuit board has a propagation through hole, which connects the second hole and the third hole to form the propagation space.
5. A unidirectional microphone according to claim 4, characterized in that, The sound sensing component is electrically connected to the first circuit board, the first circuit board is electrically connected to the second circuit board, and the second circuit board is electrically connected to the third circuit board.
6. A unidirectional microphone according to claim 4, characterized in that, The first circuit board and / or the third circuit board are connected to the pads.
7. A unidirectional microphone according to claim 1 or 2, characterized in that, The receiving mechanism includes a first substrate, a second substrate, a third substrate, a fourth substrate, and a fifth substrate stacked from top to bottom; The first hole and the second hole are formed on the first substrate, and the second hole is located on the third side of the first hole in the second direction; The containment space is formed on the second substrate, and the second substrate also has a first propagation space on the third side of the containment space in the second direction; The third hole is formed on the third substrate, and the third substrate also has a tuning hole on the third side of the third hole in the second direction. The fourth substrate has a second propagation space, which is located on the second side of the third hole and the tuning hole in the first direction; Wherein, the first direction intersects with the second direction.
8. A unidirectional microphone according to claim 7, characterized in that, The second hole is connected to the first propagation space, the tuning hole is connected to the first propagation space and the second propagation space, and the third hole is connected to the receiving space and the second propagation space.
9. A unidirectional microphone according to claim 7, characterized in that, The fifth substrate is connected to the solder pads.
10. An electronic device, characterized in that, include: A unidirectional microphone as described in any one of claims 1 to 9; The processor is connected to the unidirectional microphone.