A vehicle-mounted RGB intelligent surface lamp strip hardware system

Abstract

The utility model relates to a kind of vehicle-mounted RGB intelligent surface lamp strip hardware system, comprising: microprocessor MCU, CAN-FD chip, LIN-Bus chip, LDO low-dropout linear regulator chip and wireless bluetooth communication module;Microprocessor MCU is used to output control LED signal;CAN-FD chip is linked with microprocessor chip and is communicated with car machine CAN interface, receives car machine LED control strategy data, and sends working state;LIN-Bus chip is linked with microprocessor chip and is communicated with car machine LIN interface, receives car machine LED control strategy data, and sends working state;Wireless bluetooth communication module is linked with microprocessor MCU and carries out bluetooth wireless communication with mobile device, and LED lamp strip operating mode is arranged;LDO low-dropout linear regulator chip is used to convert into 5V, 3.3Vdc voltage source respectively by vehicle-mounted power supply;The utility model has the advantages that: the car gauge level power protection, bus protection, firmware OTA and safety verification of hardware system are realized.

Description

Technical Field

[0001] This utility model relates to the field of automotive sensor technology, and in particular to a vehicle-mounted RGB intelligent surface light strip hardware system. Background Technology

[0002] Automotive and home lighting strips often use a single-chip MCU or Bluetooth module to drive RGB LEDs, and are mostly designed for consumer applications. Consumer lighting strips typically operate on low-voltage DC (5V / 12V), which is insufficient for automotive-grade requirements such as voltage fluctuations, surges, and bus communication. Smart effects are mostly controlled by an app / cloud, with limited support for integration with the vehicle's infotainment system via the CAN / LIN bus. The main drawbacks are as follows: 1. Poor automotive voltage adaptability, unable to cover the wide input fluctuations (power-on surge, discharge, load transients) typical of automobiles (9–32V); 2. Lack of automotive-grade / anti-interference design (EMC, ESD, surge, temperature reliability), resulting in insufficient reliability of consumer devices in automotive environments; 3. Missing or insufficiently protected bus communication interfaces (CAN, LIN), making it difficult to integrate with vehicle systems or posing safety / interference risks to the vehicle bus; 4. Insufficient power supply and load capacity in high-power scenarios, leading to power overload or unstable brightness and color when the number of LEDs increases; 5. Basic power protections such as reverse connection protection and surge protection are often overlooked, and reverse connection or transients in the field can damage the controller; 6. Insufficient temperature and thermal management, which can easily reduce lifespan or cause failure under prolonged high brightness or high temperatures; 7. Poor universality between home and automotive versions, or requiring completely different hardware layouts for different voltages / communications.

[0003] Currently, most control circuits on the market use a single-chip MCU or low-power Bluetooth SoC to drive color / brightness PWM and handle Bluetooth communication. Complex effects require powerful main controller computing or cloud processing. Regarding the need for vehicle bus interaction (CAN / LIN), many consumer-grade controllers lack hardware-level support or rely solely on external gateways for forwarding, limiting real-time performance and reliability. Dynamic lighting effects, music rhythms, and voice control largely depend on mobile apps or cloud services, resulting in weak offline control capabilities. The main drawbacks are as follows: 1. Weak LED driving and color consistency control capabilities (especially with a large number of headlight beads), resulting in color deviation and uneven brightness; 2. When the number of LED beads connected in series / parallel is large, the refresh rate decreases, and the dynamic (gradient / flowing / rainbow) effects are not smooth; 3. Lack of low-latency, localized control on the vehicle side (such as offline voice, vehicle command response), resulting in system uncontrollability when there is a delay or connection failure; 4. Lack of CAN / LIN error detection, message protection and security mechanisms, making it prone to abnormalities when communication fails or is interfered with; 5. Insufficient OTA and firmware security support, firmware upgrades and rollbacks, and security verification requirements are high in vehicle scenarios and are often overlooked; 6. Lack of hardware / software mechanisms for light strip fault detection / diagnosis (such as short circuit, open circuit, overheating, driver failure); 7. Lack of hardware reservation for future functional expansion (such as CAN-FD reservation, group management, scene linkage interface); In summary, there is an urgent need for a vehicle-mounted RGB intelligent surface light strip hardware system that meets the requirements for wide voltage, pulse / surge, EMC / ESD, extreme temperature, and long-term reliability. Utility Model Content

[0004] In view of the above problems, the purpose of this utility model is to provide an automotive RGB intelligent surface light strip hardware system to realize automotive-grade power protection, bus protection, firmware OTA and security verification of the hardware system, so as to overcome the shortcomings of the prior art.

[0005] This utility model provides a vehicle-mounted RGB intelligent surface light strip hardware system, including: a microprocessor (MCU), a CAN-FD chip, a LIN-Bus chip, an LDO low dropout linear regulator chip, and a wireless Bluetooth communication module; The microprocessor (MCU) is used to output control signals for the LEDs. The CAN-FD chip is linked to the microprocessor chip and communicates with the vehicle's CAN interface to receive LED control strategy data from the vehicle and send its operating status. The LIN-Bus chip is linked to the microprocessor chip and communicates with the vehicle's LIN interface to receive LED control strategy data from the vehicle and send its operating status. The wireless Bluetooth communication module is linked to the microprocessor MCU and performs Bluetooth wireless communication with the mobile device, thus facilitating the LED light strip's working mode. The LDO low dropout linear regulator chip is used to convert the vehicle power supply into 5V and 3.3Vdc voltage sources respectively. The LDO low dropout linear regulator chip is connected to the microprocessor MCU, CAN-FD chip, LIN-Bus chip and wireless Bluetooth communication module respectively, and provides power supply with the corresponding voltage.

[0006] As a preferred embodiment of this invention, the 5V output terminal of the LDO low dropout linear regulator chip is connected to and powered by the CAN-FD chip, the 3.3V output terminal of the LDO low dropout linear regulator chip is connected to and powered by the wireless Bluetooth communication module, the microprocessor MCU and the LIN-Bus chip respectively, and the A3.3V output terminal of the LDO low dropout linear regulator chip is connected to and powered by the microphone ADC.

[0007] As a preferred embodiment of this utility model, the LDO low dropout linear regulator chip includes: a power supply chip unit U1, a power supply chip unit U2, and a power supply chip unit U3 connected in parallel. The power supply U1 chip unit includes: a power supply U1 chip, a TVS transient suppression diode D2, capacitors C1 and C2 disposed at the input terminal of the power supply U1 chip, and a capacitor C3 disposed at the output terminal of the power supply U1 chip. The TVS transient suppression diode D2 is disposed at the power input terminal and is used to prevent surge impact from damaging the subsequent circuit. The Schottky diode D1 utilizes the unidirectional conduction characteristic of diodes to prevent circuit damage caused by reverse power connection. The capacitors C1 and C2 are used to filter the input power supply to prevent the subsequent power supply from being damaged by input ripple. The capacitor C3 is used to filter the output 5V power network to prevent ripple from damaging the subsequent load. The power supply U1 chip is used to reduce the vehicle VBAT power supply to 5Vdc to power the CAN-FD chip. The power supply U2 chip unit includes: a power supply U2 chip, capacitors C4 and C5 located at the input terminal of the power supply U2 chip, and resistors R1, R2, and C6 located at the output terminal of the power supply U2 chip. Resistors R1 and R2 are configured using a voltage divider circuit to provide feedback to the FB pin of the output terminal of the power supply U2 chip. Capacitors C4 and C5 are used to filter the input ripple, and capacitor C6 is used to filter the output power of the power supply U2 chip to prevent the output ripple from causing breakdown damage to the downstream load. The power supply U2 chip is a domestically produced AEC-Q100 automotive-grade LN210451Q1TAR chip. The power supply U2 chip is used to reduce the vehicle's VBAT power supply to 3.3Vdc to provide logic levels for the microprocessor MCU, wireless Bluetooth communication module, LIN-Bus chip, and CAN-FD chip. The power supply U3 chip unit includes: a power supply U3 chip, capacitors C7 and C8 located at the input terminal of the power supply U3 chip, resistors R3 and R4, capacitors C9 and C10, and inductor L1 located at the output terminal of the power supply U3 chip. Resistors R3 and R4 are configured using a voltage divider circuit to provide feedback to the FB pin of the output terminal of the power supply U3 chip. Capacitors C7 and C8 are used for input ripple filtering. Capacitors C9, inductor L1, and capacitor C10 form a PI-type filter circuit to supply power to the subsequent Micphone audio sampling circuit board.

[0008] As a preferred embodiment of this invention, the LIN-Bus chip includes: a communication interface U7 chip, transient suppression diode D4, diode D3, resistor R5, capacitors C41, C42, and C43, pull-up resistors R34 and R36, and a digital transistor Q1. The LPUART1_RX pin of the communication interface U7 chip receives the LIN-Bus signal, converts it into a TTL signal, and sends it to the microprocessor MCU. The LPUART1_TX pin of the communication interface U7 chip converts the TTL signal sent by the microprocessor MCU into a LIN-Bus signal. After receiving a low-falling-edge Fall signal from the microprocessor MCU, the communication interface U7 chip enters a power-saving sleep state. After receiving a falling-edge Fall signal, the LPUART1_SLP pin of the communication interface U7 chip enters a power-saving sleep state. The LIN-Bus chip wakes up and enters the working state. The access terminal of the communication interface U7 chip uses the transient suppression diode D4. The transient suppression diode D4 is used to resist surges from the vehicle terminal and avoid damage to the communication interface U7 chip. The diode D3, resistor R5 and capacitor C43 form the vehicle terminal LIN master mode circuit. Capacitors C41 and C42 (combined capacitors) are used for power supply filtering of the communication interface U7 chip. The pull-up resistor R34 is used to keep the RXD pin at a high level by default when there is no signal and pull it low when there is a received signal. The resistor R36 and digital transistor Q1 form a sleep wake-up circuit. The WAKE_N pin of the communication interface U7 chip is internally pulled high by default and is in the enabled state. The microprocessor MCU pulls the collector of digital transistor Q1 flat by inputting a high level, turning off the communication interface U7 chip and putting it into sleep state.

[0009] As a preferred embodiment of this invention, the CAN-FD chip includes: a communication interface U8 chip, a dual-channel transient suppression diode DN1, a resistor R37, capacitors C44, C45, C46, ​​and C47. The CANFD1_RX pin of the communication interface U8 chip receives CAN-FD signals, converts them into TTL signals, and sends them to the microprocessor MCU. The CANFD1_TX pin of the communication interface U8 chip converts the TTL signals sent by the microprocessor MCU into CAN-FD signals. The CANFD1_S pin of the communication interface U8 chip receives signals from the microprocessor MCU. After the rising edge (Risa) signal, the communication interface U8 chip enters a silent state; after the falling edge (Fall) signal... The communication interface U8 chip enters high-speed communication mode. The input interface of the communication interface U8 chip uses the dual-channel transient suppression diode, which is used to resist surges from the vehicle's infotainment system to prevent damage to the communication interface U8 chip. Resistor R37 is used to pull the S pin of the communication interface U8 chip low, putting the communication interface U8 chip into operation. The microprocessor (MCU) outputs a high level to the CANFD1_S pin of the communication interface U8 chip to put it into sleep mode. Capacitors C44 and C45 are used to filter the VIO power supply pin of the communication interface U8 chip, and capacitors C46 and C47 are used to filter the VCC power supply pin of the communication interface U8 chip.

[0010] As a preferred embodiment of this invention, the microprocessor MCU integrates an LED bus compatible control circuit. This circuit enables compatible control of LED beads via both DIN-DOUT single bus and SDI-SDO / CKI-CKO dual bus systems. The LED bus compatible control circuit includes: a level conversion chip U10, resistors R46, R47, and R56, a dual-channel transient suppression diode DN3, capacitors C57, C58, C59, and C60, and a digital transistor Q2. The level conversion chip U10 receives the 3.3V signal from the microprocessor MCU and converts it into a 5V output signal for the LED strip. The series resistors R46 and R47 are 100 ohms to reduce electromagnetic radiation. The LED strip interface... The dual-channel transient suppression diode DN3 is used to prevent damage to the level conversion chip U10 due to electrostatic discharge from the human body. Capacitors C57 and C58 are used to filter the VCCA power supply pin of the level conversion chip U10, and capacitors C59 and C60 are used to filter the VCCB power supply pin of the level conversion chip U10. The drain enable pin OE of the level conversion chip U10 is pulled up to 3.3V by resistor R56 to enable the level conversion chip U10 to operate by default. The base of the digital transistor Q2 is connected to the LED_OE network pin of the microprocessor MCU. When the microprocessor MCU outputs a high level, the collector of the digital transistor Q2 outputs a low level, making the OE pin low and turning off the level conversion chip U10.

[0011] As a preferred embodiment of this invention, the microprocessor (MCU) includes: an MCU chip U4, capacitors C11 and C12, connectors J1 and J2, and resistors R5 to R22. The MCU chip U4 is equipped with CAN-FD and LIN-Bus interfaces. The MCU chip U4 receives CAN-FD or LIN-Bus signals from the vehicle's infotainment system, processes them, and then sends the LED operating strategy to the ESP32-S3 module via a UART asynchronous serial data interface. The input and output pins of the MCU chip U4 are connected to the access device via MCU resistors, which reduce the M... To reduce CU input / output overshoot current and electromagnetic radiation, the MCU uses resistors R5 to R22. The VCAP pin of the MCU chip U4 is the core power supply pin. Capacitor C11 and resistor R17 form an RC filter circuit. Capacitor C12 is used to connect the GND pin in parallel with the VDD power supply pin. Resistor R22 and capacitor C13 form a standard NRST reset pin circuit. Connector J1 connects to the UART universal asynchronous serial interface for connecting an external serial debugging assistant for data printing mode. Connector J2 is used to connect an external emulator to perform JTAG standard test access boundary scan debugging mode on the MCU chip U4.

[0012] As a preferred embodiment of this invention, the microphone circuit includes: an ADC analog-to-digital converter chip U5, resistors R25 to R33, and capacitors C16 to C34; the ADC analog-to-digital converter chip U5 has an onboard ZTS6216 microphone pickup chip MIC1 channel, used to pick up voice signals and convert them to the subsequent ESP32-S3 module for identification and driving the corresponding LED working status; resistors R25 and R26 are used to set the I2C interface communication address of the ADC analog-to-digital converter chip U5, through resistor R25 pulling up and resistor R26 pulling down. The communication address is set to 0x41. Capacitors C16, C17, and C18 are connected in parallel to the GND pin of the ADC analog-to-digital converter chip U5 to correct signal spike noise in the I2S communication interface of the ADC analog-to-digital converter chip U5. Resistors R27 and R28 are used to set the data input / output direction of the I2S interface of the ADC analog-to-digital converter chip U5. Capacitors C19 to C33 are connected in series to form an isolation circuit to isolate the DC component of the circuit board from the AC signal. Capacitor C39... Capacitor C40 is used to filter the analog 3.3V power supply pin of the ADC analog-to-digital converter chip U5. Capacitors C37 and C38, along with resistor R33, form an RC filter circuit for filtering the 3.3V sampling power supply pin of the analog ADC analog-to-digital converter chip U5. The audio sampling interface of the ADC analog-to-digital converter chip U5 is equipped with dual-channel transient suppression diodes DN2 to prevent damage to the audio chip of the ADC analog-to-digital converter chip U5 due to electrostatic discharge from the human body. Capacitors C53 and C54 are used for... For power filtering of the external microphone, capacitor C55 is connected in parallel to the GND pin of ADC analog-to-digital converter chip U5. Resistor R30, capacitor C36, and capacitor C35 together form an RC filter circuit for filtering the VDD pin of ADC analog-to-digital converter chip U5 sampling power supply. Resistor R29 and capacitor C34 together form an RC filter and compensation circuit to filter out signal surge spike noise. Resistor R31 and resistor R32 are connected in series in the signal chain, using 0 ohms, for oscilloscope test signals and circuit debugging.

[0013] As a preferred embodiment of this invention, the circuit of the ESP32-S3 module includes: a Bluetooth U9 wireless connector, resistors R50 to R54, capacitors C50 to C52, connector J5, connector J6, and a two-wire serial communication bus I2C. Capacitors C50 and C51 are used for filtering the 3V3 power supply pin of the Bluetooth U9 wireless connector. Resistor R50 and capacitor C52 form a RESET pin circuit. Resistor R50 is pulled up, and capacitor C52 is connected in parallel to pull down, used for the Bluetooth U9 to enter stable operation after initial power-on. 53. Resistor R54 is used to pull up the GND pin of Bluetooth U9. Connector J5 is used to connect an external emulator to perform JTAG standard test access boundary scan debugging mode on Bluetooth U9. Connector J6 is used to connect an external serial debugging assistant to perform firmware download and data printing mode on Bluetooth U9. The two-wire serial communication bus I2C is used for open-drain operation mode. Resistors R51 and R52 are respectively 1K pull-up for SDA data and CLK clock of Bluetooth U9 to match the communication bus speed.

[0014] The beneficial effects of this utility model are as follows: 1. This utility model design supports two power input ranges: 9–32V for vehicle mode and 5–24V for home mode. It features overall power management and input filtering / surge suppression design (built-in TVS, input voltage regulator / buck module, etc.).

[0015] 2. This utility model adopts a built-in CAN / LIN peripheral (connected via FM33FG or peripheral bridge), and adds TVS and differential terminal protection on the bus side, and reserves CAN-FD to ensure vehicle-machine interconnection and anti-interference capability.

[0016] 3. The hardware design of this utility model supports at least 8A output (example: 600 LEDs scenario), and has reasonable heat dissipation and current distribution design, as well as overcurrent protection and load balancing.

[0017] 4. This utility model incorporates reverse connection protection design, power supply TVS, and overvoltage / undervoltage protection circuit.

[0018] 5. This utility model adopts independent drive / constant current control and segmented drive design, and realizes PWM drive accuracy, calibration and grayscale control in software (EPS32-S3 is used as the dimming master controller, supporting high-precision PWM or digital drive protocol).

[0019] 6. This utility model rationally plans the number of LED beads connected in series and the bus refresh rate limit, adopts a high-speed controller and optimizes the protocol and refresh strategy (the requirements document has indicated that the maximum number of beads needs to be tested and planned), and improves the overall bandwidth through segmented parallel refresh.

[0020] 7. This utility model uses the ESP32-S3 module to provide Bluetooth and local intelligence (supporting offline voice wake-up / commands), and uses the FM33FG extension to realize vehicle bus communication, ensuring local offline control and low latency response.

[0021] 8. The control circuit of this utility model adds bus protection, terminal matching, level conversion and software layer error verification / retransmission strategy, reserves CAN-FD and realizes protocol verification and abnormal monitoring and reporting.

[0022] 9. This utility model reserves an IAP / OTA area in the MCU firmware architecture (the requirement has been specified to reserve OTA) to realize signature verification, rollback mechanism and upgrade through secure communication port.

[0023] 10. The control circuit design of this utility model incorporates current / voltage monitoring, temperature sensing, fault detection, and CAN or Bluetooth reporting functions, making it easy for the vehicle system or APP to read the status and alarms.

[0024] 11. The functional matrix of this utility model lists reserved interfaces such as CAN-FD, scene / linkage / OTA / macro command, etc. The reserved interfaces and resources of the control circuit ensure future upgrades.

[0025] 12. This utility model solves the difference in requirements for linkage with vehicle-mounted systems, and alleviates the problems of refresh bandwidth, grayscale and color consistency in large-scale LED scenarios through hardware (constant current, segmented drive) and software (buffering, parallel refresh, calibration).

[0026] 13. The power protection, bus protection, firmware OTA and security verification of this utility model all adopt automotive-grade products. Attached Figure Description

[0027] Figure 1 This is a block diagram of the overall structural design of this embodiment.

[0028] Figure 2 This is the circuit diagram of the LDO low dropout linear regulator chip in this embodiment.

[0029] Figure 3 This is the circuit diagram of the LIN-Bus chip in this embodiment.

[0030] Figure 4 This is the circuit diagram of the CAN-FD chip in this embodiment.

[0031] Figure 5This is a circuit diagram for LED bus compatible control in this embodiment.

[0032] Figure 6 This is the circuit diagram of the microprocessor (MCU) in this embodiment.

[0033] Figure 7 This is the microphone circuit diagram for this embodiment.

[0034] Figure 8 This is the circuit diagram of the ESP32-S3 module in this embodiment.

[0035] Figure 9 This is the connector interface circuit diagram for this embodiment.

[0036] Figure 10 This is a schematic diagram of the system interface in this embodiment.

[0037] Figure 11 This is the electromagnetic compatibility (EMC) circuit diagram for this embodiment.

[0038] Figure 12 This is a circuit diagram of the quartz crystal resonant circuit in this embodiment.

[0039] Figure 13 This is the circuit diagram of the vehicle-mounted LIN bus interface in this embodiment.

[0040] Figure 14 This is the circuit diagram of the vehicle CAN bus interface in this embodiment.

[0041] Figure 15 This is the circuit diagram of the vehicle LED light control bus interface in this embodiment. Detailed Implementation

[0042] See Figure 1As shown, this embodiment provides a vehicle-mounted RGB intelligent surface light strip hardware system, including: a microprocessor (MCU), a CAN-FD chip, a LIN-Bus chip, an LDO low-dropout linear regulator chip, and a wireless Bluetooth communication module; the microprocessor (MCU) is used to output control LED signals; the CAN-FD chip is connected to the microprocessor chip and communicates with the vehicle's CAN interface to receive LED control strategy data from the vehicle and send working status; The LIN-Bus chip connects to the microprocessor chip and communicates with the vehicle's LIN interface to receive LED control strategy data and send operating status. The wireless Bluetooth communication module connects to the microprocessor MCU and communicates wirelessly with mobile devices (phones, tablets, etc.) via Bluetooth to set LED light strip operating modes, such as breathing lights, flowing lights, gradient lights, rainbow lights, music rhythm, shooting star, and other control effects. The LDO low-dropout linear regulator chip converts the vehicle power supply into 5V and 3.3Vdc voltage sources respectively. The LDO low-dropout linear regulator chip is connected to the microprocessor MCU, CAN-FD chip, LIN-Bus chip, and wireless Bluetooth communication module, providing power at the corresponding voltages. The 5V output terminal of the LDO low-dropout linear regulator chip is connected to and powers the CAN-FD chip. The 3.3V output terminal of the LDO low-dropout linear regulator chip is connected to and powers the wireless Bluetooth communication module, microprocessor MCU, and LIN-Bus chip respectively. The A3.3V output terminal of the LDO low-dropout linear regulator chip is connected to and powers the microphone ADC.

[0043] See Figure 2In this embodiment, the LDO low-dropout linear regulator chip includes: power supply chip units U1, U2, and U3 connected in parallel. The power supply chip unit U1 includes: a power supply U1 chip, a TVS transient voltage suppressor diode D2, capacitors C1 and C2 disposed at the input terminal of the power supply U1 chip, and a capacitor C3 disposed at the output terminal of the power supply U1 chip. The TVS transient voltage suppressor diode D2 is disposed at the power input terminal and is used to prevent surge damage to subsequent circuits. The Schottky diode D1 utilizes the unidirectional conduction characteristic of diodes to prevent circuit damage due to reverse power connection. The capacitors C1 and C2 are used for filtering the input power supply. To prevent input ripple from damaging the downstream power supply, the power supply U1 chip uses a domestically produced AEC-Q100 automotive-grade LN210455Q1TAR chip. Capacitor C3 is used to filter the output 5V power network, preventing ripple from damaging the downstream load. The power supply U1 chip reduces the vehicle's VBAT power supply to 5Vdc to power the CAN-FD chip (CAN-FD vehicle bus). The power supply U2 chip unit includes: a power supply U2 chip, capacitors C4 and C5 at the input of the power supply U2 chip, and resistors R1, R2, and capacitor C6 at the output of the power supply U2 chip. Resistors R1 and R2 are connected via a voltage divider circuit to provide feedback to the FB pin of the power supply U2 chip's output. The feedback pin (FB pin) has an internal reference of 0.6V, designed according to the circuit formula as (1+453K / 100K)*0.6V=3.318V. Capacitors C4 and C5 are used for input ripple filtering, and capacitor C6 is used for power supply filtering of the U2 chip output to prevent power output ripple from damaging downstream loads. The U2 chip uses a domestically produced AEC-Q100 automotive-grade LN210451Q1TAR chip. The U2 chip reduces the vehicle's VBAT power supply to 3.3Vdc to provide logic levels for the microprocessor MCU, wireless Bluetooth communication module, LIN-Bus chip, and CAN-FD chip. The U3 chip unit includes: power supply U... The system includes three chips: capacitors C7 and C8 at the input of the power supply chip U3, and resistors R3, R4, capacitors C9 and C10, and inductor L1 at the output of the power supply chip U3. Resistors R3 and R4 form a voltage divider circuit to provide feedback to the FB pin of the power supply chip U3 output. The internal reference of the FB pin is 0.6V, and according to the circuit formula, it is designed as (1+453K / 100K)*0.6V=3.318V. Capacitors C7 and C8 are used to filter the input ripple because the load is an analog circuit that is easily interfered with by the DC component of the circuit board. Capacitors C9, L1, and C10 form a PI-shaped filter circuit to supply power to the subsequent Micphone audio sampling circuit board.

[0044] See Figure 3 The LIN-Bus chip in this embodiment includes: a communication interface U7 chip, transient suppression diodes D4 and D3, resistor R5, capacitors C41, C42, and C43, pull-up resistors R34 and R36, and a digital transistor Q1. The communication interface U7 chip uses a domestically produced AEC-Q100 automotive-grade SIT1021QT / 1. The LPUART1_RX pin of the communication interface U7 chip receives the LIN-Bus signal, converts it into a TTL signal, and sends it to the microprocessor MCU. The LPUART1_TX pin of the communication interface U7 chip converts the TTL signal sent by the microprocessor MCU into a LIN-Bus signal. After receiving a low-falling edge Fall signal from the microprocessor MCU, the communication interface U7 chip enters a power-saving sleep state. After receiving a falling edge Fall signal, the LPUART1_SLP pin of the communication interface U7 chip enters a power-saving sleep state. After receiving a falling edge Fall signal, the LIN-Bus chip enters a sleep state. The chip wakes up and enters the working state; the access end of the communication interface U7 chip uses the transient suppression diode D4, which is used to resist surges from the vehicle terminal and avoid damage to the communication interface U7 chip. The diode D3, resistor R5 and capacitor C43 form the vehicle terminal LIN master mode circuit (since this is a vehicle comfort component, the components are unattached and in slave mode). Capacitors C41 and C42 (combined capacitors) are used for power supply filtering of the communication interface U7 chip to avoid instability of the communication interface U7 chip due to voltage fluctuations. The pull-up resistor R34 is used to keep the RXD pin at a high level by default when there is no signal, and pull it low when there is a received signal. The resistor R36 and digital transistor Q1 form a sleep wake-up circuit. The WAKE_N pin of the communication interface U7 chip is internally pulled high by default and is in the enabled state. The microprocessor MCU pulls the collector of digital transistor Q1 flat by inputting a high level, turning off the communication interface U7 chip and putting it into sleep state.

[0045] See Figure 4The CAN-FD chip in this embodiment includes: a communication interface U8 chip, a dual-channel transient suppression diode DN1, a resistor R37, capacitors C44, C45, C46, ​​and C47. The communication interface U8 chip uses a domestically produced AEC-Q100 automotive-grade SIT1057QT / 3. The CANFD1_RX pin of the communication interface U8 chip receives CAN-FD signals, converts them into TTL signals, and sends them to the microprocessor MCU. The CANFD1_TX pin of the communication interface U8 chip converts the TTL signals sent by the microprocessor MCU into CAN-FD signals. The CANFD1_S pin of the communication interface U8 chip receives signals from the microprocessor MCU. After the rising edge of the Risa signal, the communication interface U8 chip enters a silent state; after the falling edge of the Fall signal, the communication interface U8... The chip enters high-speed communication mode. The input interface of the communication interface U8 chip uses the dual-channel transient suppression diode, which is used to resist surges from the vehicle's head unit to prevent damage to the communication interface U8 chip. The resistor R37 is used to pull the S pin of the communication interface U8 chip low to put the communication interface U8 chip into working mode. The microprocessor MCU outputs a high level to the CANFD1_S pin of the communication interface U8 chip to put the communication interface U8 chip into sleep mode. The capacitors C44 and C45 are used to filter the VIO power supply pin of the communication interface U8 chip to avoid instability caused by voltage fluctuations. The capacitors C46 and C47 are used to filter the VCC power supply pin of the communication interface U8 chip to avoid instability caused by voltage fluctuations.

[0046] See Figure 5In this embodiment, the microprocessor (MCU) integrates an LED bus compatible control circuit. This circuit is based on the integrated ICs of color LEDs currently available on the market, mainly divided into two types: one uses a DIN-DOUT single-bus to control LED beads, and the other uses an SDI-SDO or CKI-CKO dual-bus to control LED beads. This LED bus compatible control circuit is used to achieve compatibility between DIN-DOUT single-bus and SDI-SDO / CKI-CKO dual-bus control of LED beads. This circuit design architecture achieves a unified approach. The LED bus compatible control circuit includes: a level conversion chip U10, resistors R46, R47, and R56, a dual-channel transient suppression diode DN3, capacitors C57, C58, C59, and C60, and a digital transistor Q2. The level conversion chip U10 receives the 3.3V signal from the microprocessor MCU and converts it into a 5V output signal for the LED strip. To ensure EMC (electromagnetic compatibility), resistors R46 and R47 are connected in series with a 100-ohm resistor to reduce electromagnetic radiation and facilitate signal measurement by various testing instruments. The LED strip interface uses the dual-channel transient suppression diode DN3 to prevent damage to the level conversion chip U10 due to electrostatic discharge from the human body. Capacitors C57 and C58 filter the VCCA power supply pin of the level conversion chip U10 to prevent damage caused by electrostatic discharge from the human body. To prevent voltage fluctuations from affecting the instability of the level conversion chip U10, capacitors C59 and C60 are used to filter the VCCB power supply pin of the level conversion chip U10, thus avoiding instability caused by voltage fluctuations. The drain enable pin OE of the level conversion chip U10 is pulled up to 3.3V by resistor R56 to ensure that the level conversion chip U10 is powered on by default. The base of the digital transistor Q2 is connected to the LED_OE network pin of the microprocessor MCU. When the microprocessor MCU outputs a high level, the collector of the digital transistor Q2 outputs a low level, making the OE pin low and turning the level conversion chip U10 off.

[0047] See Figure 6In this embodiment, the microprocessor (MCU) includes: MCU chip U4, capacitors C11 and C12, connectors J1 and J2, and resistors R5 to R22. The MCU chip U4 is a domestically produced automotive-grade microprocessor conforming to AEC-Q100 standards. The MCU chip U4 is equipped with CAN-FD and LIN-Bus interfaces. It receives CAN-FD or LIN-Bus signals from the vehicle's infotainment system, processes them, and then sends the LED operating strategy to the ESP32-S3 module via a UART asynchronous serial data interface, thus establishing a data link from the vehicle's infotainment system to the LED driver. The input and output pins of the MCU chip U4 are connected to the access device via MCU resistors. These resistors reduce MCU input / output overshoot current and electromagnetic radiation. To ensure compliance with standards and facilitate signal measurement by various debugging instrument probes, the MCU uses resistors R5 to R22. The VCAP pin of the MCU chip U4 is the core power supply pin. Capacitor C11 and resistor R17 form an RC filter circuit to avoid instability factors affecting U4 due to voltage fluctuations. Capacitor C12 is used to connect the GND pin in parallel with the VDD power supply pin to avoid instability factors affecting the MCU chip U4 due to voltage fluctuations. Resistor R22 and capacitor C13 form a standard NRST reset pin circuit to ensure that the module can enter stable operation after initialization and power-on. Connector J1 connects to the UART universal asynchronous serial interface for connecting an external serial debugging assistant for data printing mode. Connector J2 is used for connecting an external emulator to perform JTAG standard test access boundary scan debugging mode on the MCU chip U4.

[0048] See Figure 7The microphone circuit in this embodiment includes: an ADC analog-to-digital converter chip U5, resistors R25 to R33, and capacitors C16 to C34. The ADC analog-to-digital converter chip U5 uses a domestically produced ES7210 four-channel microphone audio chip. The ADC analog-to-digital converter chip U5 has an onboard ZTS6216 microphone pickup chip with channel MIC1, used to pick up voice signals and convert them to the subsequent ESP32-S3 module for identification and driving the corresponding LED operating status. Channel MIC4 is reserved at the connector for additional placement. Resistors R25 and R26 are used to set the I2C interface communication address of the ADC analog-to-digital converter chip U5. This is achieved through pull-up resistor R25 and capacitors C16 to C34. Resistor R26 is used to set the communication address to 0x41. Capacitors C16, C17, and C18 are connected in parallel to the GND pin of the ADC analog-to-digital converter chip U5 to correct signal spike noise in the I2S communication interface of the ADC analog-to-digital converter chip U5. Resistors R27 and R28 are used to set the data input / output direction of the I2S interface of the ADC analog-to-digital converter chip U5. Capacitors C19 to C33 are connected in series to form an isolation circuit to isolate the DC component of the circuit board from the AC signal, making the AC signal more stable and avoiding audio frame loss caused by the DC component participating in the AC signal. Capacitors C39 and C40 are used to provide power to the ADC analog-to-digital converter chip U5. The analog 3.3V power supply pin of the ADC chip U5 is filtered to prevent voltage fluctuations from affecting the instability of the U5 interface chip. Capacitors C37 and C38, and resistor R33 form an RC filter circuit to filter the 3.3V sampling power supply pin of the analog-to-digital converter chip U5, preventing voltage fluctuations from affecting the audio acquisition performance of the U5 chip. The audio sampling interface of the ADC chip U5 is equipped with dual-channel transient suppression diodes DN2 to prevent damage to the ADC chip U5 audio chip caused by electrostatic discharge. Capacitors C53 and C54 are used to filter the power supply to the external microphone to prevent voltage fluctuations from affecting its performance. To improve the sampling effect of the external microphone, capacitor C55 is connected in parallel to the GND pin of the ADC analog-to-digital converter chip U5 to correct surge noise from the external microphone interface signal. Resistor R30, capacitor C36, and capacitor C35 together form an RC filter circuit for filtering the VDD pin of the ADC analog-to-digital converter chip U5's sampling power supply, preventing voltage fluctuations from affecting the audio acquisition effect of the U6 chip. Resistor R29 and capacitor C34 together form an RC filter and compensation circuit to filter out signal surge noise. Resistors R31 and R32 are connected in series in the signal chain, using 0 ohms, for oscilloscope test signals and circuit debugging.

[0049] See Figure 8The circuit of the ESP32-S3 module in this embodiment includes: Bluetooth U9, resistors R50 to R54, capacitors C50 to C52, connector J5, connector J6, and a two-wire serial communication bus I2C. The Bluetooth U9 uses the domestically produced Espressif ESP32-S3 integrated Bluetooth module, supporting peripherals to establish communication with the module via Bluetooth and publish LED operating strategies. It has an embedded intelligent AI voice recognition algorithm engine; after recognizing wake words and pre-defined voice commands, it outputs data and clock signals to the subsequent LED driver circuit. The LED changes accordingly upon receiving the corresponding data and clock signals. Capacitors C50 and C51 are used to filter the 3V3 power supply pin of the Bluetooth U9. Resistor R50 and capacitor C52 form a standard RESET pin circuit; resistor R50 is pulled up, and capacitor C52 is connected in parallel to pull down for Bluetooth U9 initialization. After power-on, the device enters stable operation. Resistors R53 and R54 are used to pull up the GND pin of the Bluetooth U9 module to set its operating mode. Resistor R55 is used to pull up the 3.3V of the Bluetooth U9 module to a high level. After initial power-on, the Bluetooth U9 module enters normal operating mode. Removing resistor R55 and setting the pin to a low level allows the Bluetooth U9 module to enter Boot program download, installation, and burning mode. Connector J5 is used to connect an external emulator to perform JTAG standard test access boundary scan debugging mode on the Bluetooth U9 module. Connector J6 is used to connect an external serial debugging assistant to perform firmware download and data printing mode on the Bluetooth U9 module. The two-wire serial communication bus I2C is used for open-drain operation mode. Resistors R51 and R52 are 1KΩ pull-up resistors for the SDA data and CLK clock of the Bluetooth U9 module to match the communication bus speed.

[0050] See Figure 9 In this embodiment, the connector interface circuit uses the domestic DL3810 series 3.81mm pin pitch automotive connector, single row 12Pin model, with a reserved microphone pickup channel for placement in the passenger compartment.

[0051] The overall layout of the circuit board in this embodiment is as follows: the circuit board size is 61mm*67mm*1.6mm, it is a 4-layer board. The Top layer is mainly for signal transmission, the GND layer is a complete ground plane and signal lines should be avoided as much as possible, the POWER layer is used for VIN, VBAT, 5V, 3V3, A3V3, and ADC3V3 power networks with copper pouring to reduce impedance and heat generation, and the Bottom layer is mainly for signal transmission. GND network VIA vias are placed in the blank areas to both dissipate heat and reduce impedance. The circuit board involves many manufacturing processes, including chemical immersion gold, lead-free tin plating, leaded tin plating, OSP anti-oxidation metal film, resin plugging, and matte solder mask.

[0052] See Figure 11 In this embodiment, the electromagnetic compatibility (EMC) is such that the power input D2 is a TVS transient suppression diode that is compliant with ISO7637-2 for surge protection. The Schottky diode D1 utilizes the unidirectional conduction characteristic of diodes to prevent damage to downstream electronic components due to reverse power connection.

[0053] See Figure 12 In the quartz crystal resonant circuit of this embodiment, resistors 51R are connected in series with XTHIN and XTHOUT of the MCU quartz crystal resonant circuit to reduce the high-frequency radiation intensity of the crystal.

[0054] See Figure 13 In the vehicle-mounted LIN bus interface circuit of this embodiment, the LIN bus interface D4 is a TVS transient suppression diode that is compliant with ISO7637-2 standard to prevent damage to the LIN bus interface chip due to static electricity.

[0055] See Figure 14 In the vehicle CAN bus interface circuit of this embodiment, the CAN bus interface DN1 is a TVS transient suppression diode that is compliant with ISO7637-2 standard to prevent damage to the CAN bus interface chip due to static electricity.

[0056] See Figure 15 In this embodiment, the LED interface DN3 is a TVS transient suppression diode that is compliant with ISO7637-2 standard to prevent damage to electronic components due to static electricity.

[0057] In the power inlet layout of this embodiment, in addition to placing transient suppression diode D2 in the power inlet VIN network, the transient suppression diode D2 is placed as close as possible to the connector pin to reduce impedance and reduce loop distance. The fixing screw holes are single-point connected to GND. The screw holes used for fixing near the power supply are metallized and connected to GND. If the components are fixed with metal shells, static electricity and surge current can be quickly discharged through the GND cable to accumulate energy.

[0058] In the microphone analog signal sampling circuit layout of this embodiment, since the microphone circuit is an analog circuit, it is easily interfered with by the digital signal network, which affects the microphone noise floor. Therefore, in addition to using a separate LDO to supply the A3V3 network, it is constructed as an island design. Its analog reference ground can be connected to the digital signal ground network at a single point through resistor R33 to avoid the analog / digital ground bounce crosstalk problem.

[0059] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A vehicle-mounted RGB intelligent surface light strip hardware system, characterized in that, include: Microprocessor (MCU), CAN-FD chip, LIN-Bus chip, LDO low dropout linear regulator chip, and wireless Bluetooth communication module; The microprocessor (MCU) is used to output control signals for the LEDs. The CAN-FD chip is linked to the microprocessor chip and communicates with the vehicle's CAN interface to receive LED control strategy data from the vehicle and send its operating status. The LIN-Bus chip is linked to the microprocessor chip and communicates with the vehicle's LIN interface to receive LED control strategy data from the vehicle and send operating status. The wireless Bluetooth communication module is linked to the microprocessor MCU and performs Bluetooth wireless communication with the mobile device to arrange the LED light strip in working mode. The LDO low dropout linear regulator chip is used to convert the vehicle power supply into 5V and 3.3Vdc voltage sources respectively. The LDO low dropout linear regulator chip is connected to the microprocessor MCU, CAN-FD chip, LIN-Bus chip and wireless Bluetooth communication module respectively, and provides power supply with the corresponding voltage. The microprocessor (MCU) includes: MCU chip U4, capacitors C11 and C12, connectors J1 and J2, and resistors R5 to R22. MCU chip U4 is equipped with CAN-FD and LIN-Bus interfaces. MCU chip U4 receives CAN-FD or LIN-Bus signals from the vehicle's infotainment system, processes them, and then sends the LED operating strategy to the ESP32-S3 module via the UART asynchronous serial data interface. The input and output pins of MCU chip U4 are connected to the access device via MCU resistors, which reduce the input / output voltage of the MCU. To reduce overcurrent and electromagnetic radiation, the MCU uses resistors R5 to R22. The VCAP pin of the MCU chip U4 is the core power supply pin. Capacitor C11 and resistor R17 form an RC filter circuit. Capacitor C12 is used to connect the GND pin in parallel with the VDD power supply pin. Resistor R22 and capacitor C13 form a standard NRST reset pin circuit. Connector J1 connects to the UART universal asynchronous serial interface for connecting an external serial debugging assistant for data printing mode. Connector J2 is used to connect an external emulator to perform JTAG standard test access boundary scan debugging mode on the MCU chip U4.

2. The vehicle-mounted RGB intelligent surface light strip hardware system according to claim 1, characterized in that, The 5V output terminal of the LDO low dropout linear regulator chip is connected to and powers the CAN-FD chip. The 3.3V output terminal of the LDO low dropout linear regulator chip is connected to and powers the wireless Bluetooth communication module, the microprocessor MCU and the LIN-Bus chip respectively. The A3.3V output terminal of the LDO low dropout linear regulator chip is connected to and powers the microphone ADC.

3. The vehicle-mounted RGB intelligent surface light strip hardware system according to claim 1, characterized in that, The LDO low dropout linear regulator chip includes: a power supply chip unit U1, a power supply chip unit U2, and a power supply chip unit U3 connected in parallel; The power supply U1 chip unit includes: a power supply U1 chip, a TVS transient suppression diode D2, capacitors C1 and C2 disposed at the input terminal of the power supply U1 chip, and a capacitor C3 disposed at the output terminal of the power supply U1 chip. The TVS transient suppression diode D2 is disposed at the power input terminal and is used to prevent surge impact from damaging the subsequent circuit. The Schottky diode D1 utilizes the unidirectional conduction characteristic of diodes to avoid circuit damage caused by reverse power connection. The capacitors C1 and C2 are used to filter the input power supply to prevent the subsequent power supply from being damaged by input ripple. The capacitor C3 is used to filter the output 5V power network to prevent ripple from damaging the subsequent load. The power supply U1 chip is used to reduce the vehicle VBAT power supply to 5Vdc to power the CAN-FD chip. The power supply U2 chip unit includes: a power supply U2 chip, capacitors C4 and C5 located at the input terminal of the power supply U2 chip, and resistors R1, R2, and C6 located at the output terminal of the power supply U2 chip. Resistors R1 and R2 are configured using a voltage divider circuit to provide feedback to the FB pin of the output terminal of the power supply U2 chip. Capacitors C4 and C5 are used to filter the input ripple, and capacitor C6 is used to filter the output power of the power supply U2 chip to prevent the output ripple from causing breakdown damage to the downstream load. The power supply U2 chip is a domestically produced AEC-Q100 automotive-grade LN210451Q1TAR chip. The power supply U2 chip is used to reduce the vehicle's VBAT power supply to 3.3Vdc to provide logic levels for the microprocessor MCU, wireless Bluetooth communication module, LIN-Bus chip, and CAN-FD chip. The power supply U3 chip unit includes: a power supply U3 chip, capacitors C7 and C8 located at the input terminal of the power supply U3 chip, resistors R3 and R4, capacitors C9 and C10, and inductor L1 located at the output terminal of the power supply U3 chip. Resistors R3 and R4 are configured using a voltage divider circuit to provide feedback to the FB pin of the output terminal of the power supply U3 chip. Capacitors C7 and C8 are used for input ripple filtering. Capacitors C9, inductor L1, and capacitor C10 form a PI-type filter circuit to supply power to the subsequent Micphone audio sampling circuit board.

4. The vehicle-mounted RGB intelligent surface light strip hardware system according to claim 1, characterized in that, The LIN-Bus chip includes: a communication interface U7 chip, transient suppression diodes D4 and D3, resistor R5, capacitors C41, C42, and C43, pull-up resistors R34 and R36, and a digital transistor Q1. The LPUART1_RX pin of the communication interface U7 chip receives the LIN-Bus signal, converts it into a TTL signal, and sends it to the microprocessor MCU. The LPUART1_TX pin of the communication interface U7 chip converts the TTL signal sent by the microprocessor MCU back into LIN-Bus. After receiving a low-falling-edge Fall signal from the microprocessor MCU, the communication interface U7 chip enters a power-saving sleep state. After receiving a falling-edge Fall signal, the LPUART1_SLP pin of the communication interface U7 chip enters a power-saving sleep state. The N-Bus chip wakes up and enters the working state; the access terminal of the communication interface U7 chip uses the transient suppression diode D4, which is used to resist surges from the vehicle terminal and avoid damage to the communication interface U7 chip. The diode D3, resistor R5 and capacitor C43 form the vehicle terminal LIN master mode circuit. Capacitors C41 and C42 are used for power filtering of the communication interface U7 chip input. The pull-up resistor R34 is used to keep the RXD pin at a high level by default when there is no signal, and pull it low when there is a received signal. The resistor R36 and digital transistor Q1 form a sleep wake-up circuit. The WAKE_N pin of the communication interface U7 chip is internally pulled high by default and is in the enabled state. The microprocessor MCU pulls the collector of digital transistor Q1 flat by inputting a high level, and shuts down the communication interface U7 chip and puts it into sleep state.

5. The vehicle-mounted RGB intelligent surface light strip hardware system according to claim 1, characterized in that, The CAN-FD chip includes: a communication interface U8 chip, dual transient suppression diodes DN1, resistor R37, capacitors C44, C45, C46, ​​and C47. The CANFD1_RX pin of the communication interface U8 chip receives CAN-FD signals, converts them into TTL signals, and sends them to the microprocessor MCU. The CANFD1_TX pin of the communication interface U8 chip converts the TTL signals sent by the microprocessor MCU into CAN-FD signals. The CANFD1_S pin of the communication interface U8 chip receives signals from the microprocessor MCU. After the rising edge (Risa) signal, the communication interface U8 chip enters a silent state; after the falling edge (Fall) signal, the communication interface U8 chip enters a silent state. The U8 chip enters high-speed communication mode. The input interface of the communication interface U8 chip uses a dual-channel transient suppression diode, which is used to resist surges from the vehicle's infotainment system to prevent damage to the communication interface U8 chip. Resistor R37 pulls the S pin of the communication interface U8 chip low to put it in working mode. The microprocessor (MCU) outputs a high level to the CANFD1_S pin of the communication interface U8 chip to put it into sleep mode. Capacitors C44 and C45 filter the VIO power supply pin of the communication interface U8 chip, and capacitors C46 and C47 filter the VCC power supply pin of the communication interface U8 chip.

6. The vehicle-mounted RGB intelligent surface light strip hardware system according to claim 1, characterized in that, The microprocessor (MCU) integrates an LED bus compatible control circuit. This circuit enables compatible control of LED beads via both DIN-DOUT single bus and SDI-SDO / CKI-CKO dual bus systems. The LED bus compatible control circuit includes: a level conversion chip U10, resistors R46, R47, and R56, a dual-channel transient suppression diode DN3, capacitors C57, C58, C59, and C60, and a digital transistor Q2. The level conversion chip U10 receives the 3.3V signal from the MCU and converts it into a 5V output signal for the LED strip. Resistors R46 and R47, connected in series, are 100 ohms to reduce electromagnetic radiation. The LED strip interface uses the dual-channel... Transient voltage suppressor diode DN3 is used to prevent damage to level conversion chip U10 due to electrostatic discharge from the human body. Capacitors C57 and C58 are used to filter the VCCA power supply pin of level conversion chip U10. Capacitors C59 and C60 are used to filter the VCCB power supply pin of level conversion chip U10. The drain enable pin OE of level conversion chip U10 is pulled up to 3.3V by resistor R56 to enable level conversion chip U10 to operate by default. The base of digital transistor Q2 is connected to the LED_OE network pin of microprocessor MCU. When the microprocessor MCU outputs a high level, the collector of digital transistor Q2 outputs a low level, making the OE pin low and level conversion chip U10 in the off state.

7. The vehicle-mounted RGB intelligent surface light strip hardware system according to claim 2, characterized in that, The microphone circuit includes: an ADC analog-to-digital converter chip U5, resistors R25 to R33, and capacitors C16 to C34. The ADC analog-to-digital converter chip U5 has an onboard ZTS6216 microphone pickup chip's MIC1 channel, used to pick up voice signals and convert them to the subsequent ESP32-S3 module for identification and driving the corresponding LED operating status. Resistors R25 and R26 are used to set the I2C interface communication address of the ADC analog-to-digital converter chip U5. Resistor R25 is used as a pull-up resistor, and resistor R26 as a pull-down resistor to set the communication address to 0x41. Capacitors C16, C17, and C18 are connected in parallel to the GND pin of the ADC analog-to-digital converter chip U5 to correct signal spike noise in the I2S communication interface of the ADC analog-to-digital converter chip U5. Resistors R27 and R28 are used to set the data input / output direction of the I2S interface of the ADC analog-to-digital converter chip U5. Capacitors C19 to C33 are connected in series to form an isolation circuit to isolate the DC component of the circuit board from the AC signal. The capacitors C39 and C40 are used to filter the analog 3.3V power supply pin of the ADC analog-to-digital converter chip U5. The capacitors C37, C38, and resistor R33 form an RC filter circuit for filtering the 3.3V sampling power supply pin of the analog ADC analog-to-digital converter chip U5. The audio sampling interface of the ADC analog-to-digital converter chip U5 is equipped with dual-channel transient suppression diodes DN2 to prevent damage to the audio chip of the ADC analog-to-digital converter chip U5 due to electrostatic discharge from the human body. The capacitors C53 and... Capacitor C54 is used for power filtering of the external microphone. Capacitor C55 is connected in parallel to the GND pin of the ADC analog-to-digital converter chip U5. Resistor R30, capacitor C36, and capacitor C35 together form an RC filter circuit for filtering the VDD pin of the ADC analog-to-digital converter chip U5 for sampling power supply. Resistor R29 and capacitor C34 together form an RC filter and compensation circuit to filter out signal surge spike noise. Resistors R31 and R32 are connected in series in the signal chain and are 0 ohms, used for oscilloscope test signals and circuit debugging.

8. The vehicle-mounted RGB intelligent surface light strip hardware system according to claim 7, characterized in that, The circuit of the ESP32-S3 module includes: Bluetooth U9, resistors R50 to R54, capacitors C50 to C52, connector J5, connector J6, and a two-wire serial communication bus I2C. Capacitors C50 and C51 are used for filtering the 3V3 power supply pin of the Bluetooth U9. Resistor R50 and capacitor C52 form a RESET pin circuit, with resistor R50 pulled up and capacitor C52 connected in parallel for pulling down, used to ensure stable operation after the Bluetooth U9 initializes and powers on. Resistors R53 and R... 54 is used to pull up the GND pin of the Bluetooth U9 wireless device. The connector J5 is used to connect an external emulator to perform JTAG standard test access boundary scan debugging mode on the Bluetooth U9 wireless device. The connector J6 is used to connect an external serial debugging assistant to perform firmware download and data printing mode on the Bluetooth U9 wireless device. The two-wire serial communication bus I2C is used for open-drain operation mode. The resistors R51 and R52 are respectively 1K pull-up resistors for the SDA data and CLK clock of the Bluetooth U9 wireless device to match the communication bus speed.

Images