Double-layer LED circuit board

Abstract

The utility model relates to a double -deck LED circuit board, including the positive surface character layer, positive surface windowing layer, positive surface circuit layer, back surface circuit layer, back surface windowing layer and back surface character layer that connect from up to down layer -by -layer connection in proper order, the positive surface circuit layer includes luminous unit, and luminous unit includes first resistance connecting point and LED lamp pearl connecting point, and first resistance connecting point and LED lamp pearl connecting point staggered arrangement, the positive surface circuit layer is used for pasting component, and the back surface circuit layer is used for wiring connection component, through setting positive surface circuit layer and back surface circuit layer, and first resistance connecting point and LED lamp pearl connecting point's position staggered connection, can increase the quantity of pasting component in the limited circuit board space.

Description

Technical Field

[0001] This utility model relates to the field of flexible circuit boards, and in particular to a double-layer LED circuit board. Background Technology

[0002] Flexible printed circuit boards (FPCs) are printed circuit boards that use a flexible insulating substrate (mainly polyimide or polyester film) as a carrier. They possess the characteristics of free bending, rolling, and folding. FPCs can effectively reduce the size of electronic products, meeting the demands for high density, miniaturization, and high reliability in electronic products. FPCs are available in single-sided, double-sided, and multilayer configurations. Their main substrate is polyimide copper-clad laminate, a material with high heat resistance and good dimensional stability. Through a pressing process, the polyimide copper-clad laminate is combined with a cover film that provides both mechanical protection and excellent electrical insulation to form the final product. Double-sided and multilayer FPCs achieve electrical connections between the surface and inner conductors through a metallization process. However, existing FPC circuit boards suffer from limited space and a lack of reasonable circuit layout, resulting in a relatively small number of internal solder pads. Utility Model Content

[0003] This invention provides a double-layer LED circuit board, which aims to solve at least one of the technical problems existing in the prior art.

[0004] The technical solution of this utility model is a double-layer LED circuit board, comprising: a front text layer, a front window layer, a front circuit layer, a back circuit layer, a back window layer, and a back text layer stacked sequentially from top to bottom. The front circuit layer includes a light-emitting unit, and the light-emitting unit includes a first resistor connection point and an LED lamp bead connection point, which are arranged alternately.

[0005] According to some embodiments of the present invention, the front circuit layer is elongated.

[0006] According to some embodiments of this utility model, multiple light-emitting units are connected end to end in sequence.

[0007] According to some embodiments of the present invention, the front circuit layer further includes a positive electrode bonding point, which is disposed on the upper left side of the front circuit layer, and the light-emitting unit is disposed on the right side of the front circuit layer.

[0008] According to some embodiments of the present invention, the light-emitting unit is formed by connecting the first resistor connection point and a plurality of LED lamp bead connection points through a circuit.

[0009] According to some embodiments of the present invention, the LED bead connection point includes a first LED bead connection point and a second LED bead connection point, which are connected sequentially from left to right.

[0010] According to some embodiments of the present invention, the first resistor connection point is located to the upper left of the first LED bead connection point.

[0011] According to some embodiments of the present invention, the double-layer LED circuit board further includes at least one substrate drilling hole, which is disposed below the reverse text layer and passes through the front text layer, the front window layer, the front circuit layer, the reverse circuit layer, the reverse window layer and the reverse text layer in sequence.

[0012] The beneficial effects of this utility model include: the double-layer LED circuit board includes a front text layer, a front window layer, a front circuit layer, a back circuit layer, a back window layer, and a back text layer stacked sequentially from top to bottom. The front circuit layer includes a light-emitting unit, which includes a first resistor connection point and an LED bead connection point. The first resistor connection point and the LED bead connection point are arranged alternately. The front circuit layer is used to attach components, and the back circuit layer is used to wire and connect components. By setting the front circuit layer and the back circuit layer, and by staggering the positions of the first resistor connection point and the LED bead connection point, the number of components that can be attached can be increased within the limited space of the circuit board.

[0013] Furthermore, additional aspects and advantages of this invention will be set forth in part in the description which follows. Some of the beneficial effects of this invention will become apparent from the description which follows, or may be learned by practice of this invention. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the positive electrode bonding point and one of the light-emitting units in the front circuit layer of a double-layer LED circuit board according to an embodiment of this utility model.

[0015] Figure 2 This is a schematic diagram of a section of the front text layer of a double-layer LED circuit board according to an embodiment of this utility model.

[0016] Figure 3 This is a schematic diagram of a section of the front window layer of a double-layer LED circuit board according to an embodiment of the present invention.

[0017] Figure 4 This is a schematic diagram of a section of the reverse circuit layer of a double-layer LED circuit board according to an embodiment of this utility model.

[0018] Figure 5This is a schematic diagram of a section of the reverse window layer of a double-layer LED circuit board according to an embodiment of this utility model.

[0019] Figure 6 This is a schematic diagram of a section of the reverse text layer of a double-layer LED circuit board according to an embodiment of this utility model.

[0020] Figure 7 This is a schematic diagram of one segment of a double-layer LED circuit board according to an embodiment of the present invention.

[0021] The above figures include the following reference numerals: First resistor connection point 1, positive electrode soldering point 2, first LED bead connection point 3, second LED bead connection point 4.

[0022] In the above figures, for the sake of clarity, the positions of circuit components are indicated by reference numerals and radii, which may obscure the actual outlines of the circuit components, but do not affect the representation. Detailed Implementation

[0023] The following will provide a clear and complete description of the concept, specific structure, and technical effects of this utility model in conjunction with the embodiments and accompanying drawings, so as to fully understand the purpose, solution, and effects of this utility model. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0024] It should be noted that, unless otherwise specified, when a feature is referred to as "fixed" or "connected" to another feature, it can be directly fixed or connected to the other feature, or it can be indirectly fixed or connected to the other feature. Furthermore, the descriptions of "upper," "lower," "left," "right," "top," and "bottom" used in this utility model are only relative to the relative positional relationships of the various components of this utility model in the accompanying drawings.

[0025] Furthermore, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein is for the purpose of describing particular embodiments only and not for limiting the scope of the invention. The term "and / or" as used herein includes any combination of one or more of the associated listed items.

[0026] It should be understood that although the terms first, second, third, etc., may be used in this disclosure to describe various elements, these elements should not be limited to these terms. These terms are only used to distinguish elements of the same type from one another. For example, without departing from the scope of this disclosure, a first element may also be referred to as a second element, and similarly, a second element may also be referred to as a first element.

[0027] Reference Figures 1 to 7As shown, Figure 1 This is a schematic diagram of the positive electrode bonding point and one of the light-emitting units in the front circuit layer of a double-layer LED circuit board according to an embodiment of this utility model. Figure 2 This is a schematic diagram of a section of the front text layer of a double-layer LED circuit board according to an embodiment of this utility model. Figure 3 This is a schematic diagram of a section of the front window layer of a double-layer LED circuit board according to an embodiment of this utility model. Figure 4 This is a schematic diagram of a section of the reverse circuit layer of a double-layer LED circuit board according to an embodiment of this utility model. Figure 5 This is a schematic diagram of a section of the reverse window layer of a double-layer LED circuit board according to an embodiment of this utility model. Figure 6 This is a schematic diagram of a segment of the reverse text layer of a double-layer LED circuit board according to an embodiment of this utility model. Figure 7 This is a schematic diagram of a segment of a double-layer LED circuit board according to an embodiment of the present invention. In some embodiments, a double-layer LED circuit board according to the present invention includes a front text layer, a front window layer, a front circuit layer, a back circuit layer, a back window layer, and a back text layer stacked sequentially from top to bottom. The front circuit layer includes a light-emitting unit, and the light-emitting unit includes a first resistor connection point 1 and an LED lamp bead connection point, which are arranged alternately.

[0028] It should be understood that the front-side window layer is the open portion of the solder mask, that is, the part where the copper is exposed where soldering is required. The main function of the solder mask is to prevent solder from flowing into unwanted areas during soldering, while also protecting the circuit board from the effects of moisture, corrosion, and other environmental factors. The window allows the solder to come into contact with the copper area that needs to be soldered.

[0029] It should be understood that the front text layer and the back text layer are used to print text on the front and back sides, the front circuit layer is used to attach components, the back circuit layer is used to connect components by wiring, the front window layer is used to open windows to expose the front text layer and the front circuit layer, and the back window layer is used to open windows to expose the back text layer and the back circuit layer.

[0030] It is understood that a double-layer LED circuit board includes a front text layer, a front window layer, a front circuit layer, a back circuit layer, a back window layer, and a back text layer stacked sequentially from top to bottom. The front circuit layer includes a light-emitting unit, which includes a first resistor connection point 1 and an LED bead connection point. The first resistor connection point 1 and the LED bead connection point are arranged alternately. The front circuit layer is used to attach components, and the back circuit layer is used to wire and connect components. By setting up a front circuit layer and a back circuit layer, and by staggering the positions of the first resistor connection point 1 and the LED bead connection point, the number of components that can be attached can be increased within the limited space of the circuit board.

[0031] Reference Figure 1 As shown, in some embodiments, the front-side circuit layer is elongated.

[0032] Reference Figure 1 As shown, in some embodiments, multiple light-emitting units are connected end to end in sequence.

[0033] Reference Figure 1 As shown, in some embodiments, the front circuit layer further includes a positive electrode bonding point 2, which is located on the upper left side of the front circuit layer, and the light-emitting unit is located on the right side of the front circuit layer. It should be noted that the positive electrode bonding point 2 is a soldering point used to connect the positive electrode wire.

[0034] Reference Figure 1 As shown, in some embodiments, the light-emitting unit is formed by connecting a first resistor connection point 1 and multiple LED bead connection points 1 via a circuit. It should be noted that the first resistor connection point 1 is connected to a 0603 resistor.

[0035] Reference Figure 1 As shown, in some embodiments, the LED bead connection points include a first LED bead connection point 3 and a second LED bead connection point 4, which are connected sequentially from left to right.

[0036] Reference Figure 1 As shown, in some embodiments, the first resistor connection point 1 is located to the upper left of the first LED bead connection point.

[0037] In some embodiments, the double-layer LED circuit board further includes at least one substrate hole, which is disposed below the reverse text layer and passes sequentially through the front text layer, the front window layer, the front circuit layer, the reverse circuit layer, the reverse window layer, and the reverse text layer. Specifically, a double-layer LED circuit board includes a front text layer, a front window layer, a front circuit layer, a reverse circuit layer, a reverse window layer, a reverse text layer, a substrate hole, and the stacked layers, which are sequentially stacked from top to bottom.

[0038] The above description is merely a preferred embodiment of this utility model. This utility model is not limited to the above-described embodiments. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this disclosure, as long as they achieve the same technical effect, should be included within the scope of protection of this disclosure and fall under the protection scope of this utility model. Within the protection scope of this utility model, the technical solutions and / or implementation methods can have various modifications and variations.

Claims

1. A double-layer LED circuit board, characterized in that, include: The front text layer, front window layer, front circuit layer, back circuit layer, back window layer, and back text layer are stacked sequentially from top to bottom. The front circuit layer includes a light-emitting unit, which includes a first resistor connection point (1) and an LED lamp bead connection point. The first resistor connection point (1) and the LED lamp bead connection point are arranged alternately. The front window layer is used to perform windowing to expose the front text layer and the front circuit layer. The back window layer is used to perform windowing to expose the back text layer and the back circuit layer.

2. The double-layer LED circuit board according to claim 1, characterized in that, The front-side circuit layer is elongated.

3. A double-layer LED circuit board according to claim 2, characterized in that, The multiple light-emitting units are connected end to end in sequence.

4. A double-layer LED circuit board according to claim 1, characterized in that, The front circuit layer also includes a positive electrode bonding point (2), which is located on the upper left side of the front circuit layer, and the light-emitting unit is located on the right side of the front circuit layer.

5. A double-layer LED circuit board according to claim 1, characterized in that, The light-emitting unit is formed by connecting the first resistor connection point (1) and multiple LED lamp bead connection points through a circuit.

6. A double-layer LED circuit board according to claim 5, characterized in that, The LED bead connection points include a first LED bead connection point (3) and a second LED bead connection point (4), which are connected sequentially from left to right.

7. A double-layer LED circuit board according to claim 6, characterized in that, The first resistor connection point (1) is located to the upper left of the first LED lamp bead connection point (3).

8. A double-layer LED circuit board according to claim 1, characterized in that, The double-layer LED circuit board also includes at least one substrate hole, which is located below the reverse text layer and passes through the front text layer, the front window layer, the front circuit layer, the reverse circuit layer, the reverse window layer, and the reverse text layer in sequence.

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