A circuit board structure for improving the performance of a radio frequency connector interconnect

Abstract

The utility model relates to a kind of circuit board structure for improving the interconnection performance of radio frequency connector, including the circuit board body being composed of shielding layer, bottom layer and ground layer, microstrip line is equipped on circuit board body, microstrip line is connected with impedance matching line, impedance matching line is connected with the conductor of a radio frequency connector, to realize the impedance matching between microstrip line and connector conductor, ensure signal transmission quality, metalized screw hole on circuit board, multiple first metallized via holes are distributed in the two sides of microstrip line, first metallized via hole penetrates ground layer and bottom layer, to form electromagnetic "fence" in the two sides of microstrip line, effectively suppress the excitation of parallel board module, multiple radio frequency circuits can also be separated, prevent crosstalk;Multiple second metallized via holes are distributed in the circumferential side of screw hole, second metallized via hole penetrates circuit board body, connects the connector shell and ground layer multiple points, low inductance, realize the shortest reflux path, reduce the signal transmission shadow of interconnection part.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a circuit board structure for improving the interconnection performance of radio frequency connectors. Background Technology

[0002] Printed circuit boards (PCBs), as the physical carriers for signal transmission in electronic products, play a crucial role in signal transmission. Especially in high-frequency environments, radio frequency (RF) connectors are widely used to interconnect PCBs with other devices or circuits. However, existing RF connectors are contact-type metal conductors, and their contact with the PCB introduces changes in signal integrity, leading to increased signal reflection and loss. Furthermore, the screw holes used for fixing the connectors on both sides typically employ metallized vias, which cause changes in the signal reference ground, further deteriorating the transmission performance of high-frequency signals and severely restricting the improvement of signal transmission quality and system performance. Therefore, this invention proposes a PCB structure for improving the interconnect performance of RF connectors. Utility Model Content

[0003] The main objective of this invention is to provide a circuit board structure for improving the interconnect performance of RF connectors. By using first technical vias distributed on both sides of the RF microstrip line, the stability and predictability of the characteristic impedance are ensured. Second metallized vias around the screw holes connect the connector housing 11 to the ground layer 3 of the circuit board body 4 at multiple points with low inductance, achieving the shortest return path, reducing the impact on signal transmission in the interconnection section, and solving the problems of increased signal reflection and loss and poor signal transmission quality in the prior art.

[0004] This utility model achieves the above-mentioned objective through the following technical solution: a circuit board structure for improving the interconnection performance of radio frequency connectors, comprising a circuit board body composed of a shielding layer, a bottom layer, and a ground layer, wherein a radio frequency microstrip line is provided on the circuit board body, the radio frequency microstrip line is connected to an impedance matching line, the impedance matching line is connected to a conductor of a radio frequency connector, and the circuit board is provided with metallized screw holes for fixing the radio frequency connector, characterized in that: multiple first metallized vias are distributed along the length direction on both sides of the radio frequency microstrip line, the first metallized vias penetrating the ground layer and the bottom layer, and multiple second metallized vias are distributed around the screw holes, the second metallized vias penetrating the circuit board body.

[0005] Preferably, one end of the conductor is laid parallel to the impedance matching line and fixed by welding.

[0006] Preferably, the bottom of the conductor near the impedance matching line has a horizontal contact surface, which is in close contact with the upper surface of the radio frequency microstrip line.

[0007] Preferably, the impedance matching line and the radio frequency microstrip line are integrally formed on the circuit board body, and the width of the impedance matching line is smaller than the width of the radio frequency microstrip line.

[0008] The beneficial effects of this utility model are as follows: the RF microstrip line is connected to an impedance matching line, which is connected to the conductor of the RF connector, thereby achieving impedance matching between the RF microstrip line and the conductor of the RF connector and ensuring signal transmission quality; multiple first metallized vias distributed on both sides of the RF microstrip line can form an electromagnetic "fence", effectively suppressing the excitation of parallel board molds and isolating multiple RF circuits to prevent crosstalk; the second metallized vias distributed around the screw holes can connect the connector housing and the ground plane of the circuit board body at multiple points with low inductance, achieving the shortest return path and reducing the impact on signal transmission of the interconnection part. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of a circuit board structure used to improve the interconnect performance of radio frequency connectors.

[0010] Figure 2 for Figure 1 Enlarged view of point A in the middle.

[0011] Figure 3 This is a schematic diagram of the circuit board body structure.

[0012] The numbers in the diagram represent: 1. Shielding layer; 2. Bottom layer; 3. Ground layer; 4. Circuit board body; 5. RF microstrip line; 6. Impedance matching line; 7. Conductor; 8. Screw hole; 9. First metallized via; 10. Second metallized via; 11. Connector housing; 12. Horizontal contact surface. Detailed Implementation

[0013] The present invention will be further described in detail below with reference to specific embodiments.

[0014] Example: like Figure 1-3As shown, this utility model discloses a circuit board structure for improving the interconnection performance of RF connectors. It includes a circuit board body 4 composed of a shielding layer 1, a bottom layer 2, and a ground layer 3. An RF microstrip line 5 is provided on the circuit board body 4. The RF microstrip line 5 is connected to an impedance matching line 6, which is connected to a conductor 7 of an RF connector. This achieves impedance matching between the RF microstrip line 5 and the conductor 7 of the RF connector, ensuring signal transmission quality. The circuit board has metallized screw holes 8 for fixing the RF connector. Multiple first metallized vias 9 are distributed along the length of the RF microstrip line 5 on both sides. The first metallized vias 9 penetrate the ground layer 3 and the bottom layer 2, thereby forming an electromagnetic "fence" on both sides of the RF microstrip line 5, "wrapping" the microstrip line and disrupting the resonance formed on the top layer of the circuit board body 4. The cavity divides the resonant cavity into very small units that cannot effectively support resonance, thereby effectively suppressing the excitation of parallel board modules. At the same time, it can force the RF return current to be limited to the signal line and the narrow ground plane area directly below it, thus providing a clear and consistent reference ground, ensuring the stability and predictability of the characteristic impedance, and isolating multiple RF circuits to prevent crosstalk. Multiple second metallized vias 10 are distributed around the screw hole 8. The second metallized vias 10 penetrate the circuit board body 4. After the connector is fixed, the second metallized vias 10 can connect the connector shell 11 to the ground layer 3 of the circuit board body 4 at multiple points with low inductance, realizing the shortest return path and reducing the signal transmission impact of the interconnection part. The distribution area of ​​the second metallized vias 10 forms the connector mark, and the connector mark is gold-plated.

[0015] One end of the conductor 7 is laid parallel to the impedance matching line 6 and fixed by welding.

[0016] The bottom of the conductor 7 near the impedance matching line 6 has a horizontal contact surface 12. The horizontal contact surface 12 is in close contact with the upper surface of the radio frequency microstrip line 5, which greatly reduces the contact inductance and resistance, making the impedance of the connection point very close to the characteristic impedance of the microstrip line itself, thereby minimizing signal reflection.

[0017] The impedance matching line 6 and the radio frequency microstrip line 5 are integrally formed on the circuit board body 4, and the width of the impedance matching line is smaller than the width of the radio frequency microstrip line 5.

[0018] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.

Claims

1. A circuit board structure for improving the interconnect performance of radio frequency connectors, characterized in that: The circuit board body comprises a shielding layer, a bottom layer, and a ground layer. The circuit board body has a radio frequency (RF) microstrip line connected to an impedance matching line, which in turn connects to a conductor of an RF connector. The circuit board has metallized screw holes for securing the RF connector. Multiple first metallized vias are distributed along the length of the RF microstrip line on both sides, penetrating the ground layer and the bottom layer. Multiple second metallized vias are distributed around the screw holes, penetrating the circuit board body.

2. The circuit board structure for improving the interconnect performance of radio frequency connectors according to claim 1, characterized in that: One end of the conductor is laid parallel to the impedance matching line and fixed by welding.

3. The circuit board structure for improving the interconnect performance of radio frequency connectors according to claim 2, characterized in that: The bottom of the conductor near the impedance matching line has a horizontal contact surface, which is in close contact with the upper surface of the radio frequency microstrip line.

4. The circuit board structure for improving the interconnect performance of RF connectors according to claim 1, characterized in that: The impedance matching line and the radio frequency microstrip line are integrally formed on the circuit board body, and the width of the impedance matching line is smaller than the width of the radio frequency microstrip line.

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