Printed circuit board, circuit board assembly, and electronic device

Abstract

The application discloses a printed circuit board, a circuit board assembly and an electronic device, and belongs to the terminal field. The printed circuit board is internally provided with a plurality of hole disc assemblies. The hole disc assembly comprises at least two disc bodies arranged in a first direction and a connecting piece for connecting the two adjacent disc bodies, and the disc body belongs to a part of a conductive circuit layer. The printed circuit board has a via hole penetrating through at least part of an insulating layer, and the connecting piece is located in the via hole arranged in a dielectric layer between the two adjacent disc bodies. For the plurality of disc bodies in the same layer of the conductive circuit layer, at least part of the two adjacent disc bodies are arranged at intervals, and at least one of the two adjacent disc bodies arranged at intervals has a cutting surface on the side close to the other disc body. In this way, the spacing between the two disc bodies can be increased without changing the positions of the two adjacent disc bodies, and the isolation between the two adjacent disc bodies can be improved, and the accuracy of the electronic components can be improved.

Description

Technical Field

[0001] This application relates to the field of terminal devices, and in particular to a printed circuit board, a circuit board assembly, and an electronic device. Background Technology

[0002] PCB (Printed Circuit Board) is a support structure for electronic components and a carrier for the electrical interconnection of these components. PCBs typically come in single-sided PCBs and multi-layer PCBs.

[0003] The multilayer printed circuit board contains multiple via assemblies. The multilayer printed circuit board includes multiple conductive line layers stacked together. Each conductive line layer has multiple conductive lines. The via assemblies are used to electrically connect the conductive lines of different layers. The conductive line layers can be electrically connected to different electronic components.

[0004] However, due to the limited wiring space on the printed circuit board, the spacing between two adjacent via assemblies that are electrically connected to different electronic components is small, resulting in low isolation between the two via assemblies. This means that the mutual interference of signals within the two adjacent via assemblies is significant, which in turn affects the accuracy of the electronic components. Utility Model Content

[0005] This application provides a printed circuit board, a circuit board assembly, and an electronic device, which can increase the isolation between two adjacent via pad assemblies. The technical solution is as follows: On the one hand, this application provides a printed circuit board, wherein a plurality of via disk assemblies are disposed therein, and the printed circuit board includes: a plurality of conductive line layers and a plurality of dielectric layers stacked and overlapping along a first direction; The via assembly includes: at least two disks arranged in a first direction, and a connector for connecting two adjacent disks, the disks being part of the conductive circuit layer; the printed circuit board has a via penetrating at least a portion of the insulating layer, and the connector is located within a via disposed in the dielectric layer between two adjacent disks; Among them, for multiple disks in the same conductive circuit layer, at least some of the adjacent disks are spaced apart, and at least one of the spaced adjacent disks has a cross-section on the side closer to the other disk.

[0006] In this way, at least some of the adjacent disks in the multiple disk assemblies are spaced apart, and at least one of the adjacent disks has a cross-section on the side closest to the other disk. The cross-section can increase the distance between the two disks without changing their positions, thereby improving the isolation between the two adjacent disks, reducing the interference between two closely spaced conductive lines, and improving the accuracy of electronic components.

[0007] In some possible implementations, for two adjacent disks spaced apart on the same layer, the two disks have the cut surfaces on their sides that are close to each other.

[0008] That is, the first disk of the two spaced disks has a cut surface on the side closer to the second disk, and the second disk also has a cut surface on the side closer to the first disk. This increases the distance between the two adjacent disks by twice the width of the cut portion, further increasing the isolation between the two spaced disks.

[0009] In some possible implementations, the two cross-sections of two adjacent disks are arranged in parallel and close to each other.

[0010] In this way, the distance between the two tangential surfaces of the two disks that are close to each other is equal at all positions in the target direction. This avoids the problem of signal instability caused by the two tangential surfaces not being parallel, which would result in the distance between the two tangential surfaces at a certain position being too small, and thus the signal interference at that position being large.

[0011] In some possible implementations, for two adjacent disks spaced apart on the same layer, the center points of the two disks are arranged in the target direction, and the cross-section is perpendicular to the target direction.

[0012] This allows each cross-section to be symmetrically set about the target direction, thereby ensuring that the effective spacing area of ​​the cross-section in the direction perpendicular to the target is maximized, which can more directly cut off the coupling path between adjacent signals.

[0013] In some possible implementations, for two adjacent disks spaced apart on the same layer, the distance between the center points of the two disks is greater than the diameter of at least one of the disks.

[0014] In this way, without changing the positions of two adjacent disks, the spacing between two disks that are set at intervals can be increased, thereby improving the signal isolation between two adjacent disks.

[0015] In some possible implementations, for two adjacent disks spaced apart in the same layer, at least one of the disks has an auxiliary cross-section on the side facing away from the other disk. The auxiliary cutting surface is arranged parallel to the cutting surface.

[0016] In this way, the disk body has a symmetrical structure perpendicular to the target direction. This symmetrical structure can reduce the uneven stress distribution of the printed circuit board during the manufacturing process (such as etching and drilling), and reduce the risk of deformation and detachment of the disk body edge due to unbalanced force.

[0017] In some possible implementations, the vertical distance between the center of the disc and the cut surface is less than the radius of the disc, but greater than the radius of the through hole where the disc and the connected component are located.

[0018] If the vertical distance from the center of the disk to the cut surface is greater than the radius of the via, the cut surface will cut into the via area, severing the connection between the via edge and the disk edge, potentially causing a circuit break. Conversely, if the vertical distance from the center of the disk to the cut surface is less than the radius of the via, the cut surface will be located outside the via, ensuring the via is completely encased by the conductive copper foil of the disk. This guarantees a reliable electrical connection between the via and the disk, while also preventing damage to the via structure due to an excessively deep cut surface. Of course, a cut surface can only be formed on the disk when the vertical distance from the center point of the disk to the cut surface is less than the radius of the disk.

[0019] In some possible implementations, at least one of the conductive line layers includes a first signal line and a second signal line; The two adjacent, spaced-apart hole assemblies are respectively: a first hole hole assembly and a second hole hole assembly, wherein the first hole hole assembly is connected to the end of the first signal line, and the second hole hole assembly is connected to the end of the second signal line; The number of disks in the first perforated disk assembly is the same as the number of disks in the second perforated disk assembly; Specifically, for any conductive circuit layer of the same type, the disk body in the first hole disk assembly and the disk body in the second hole disk assembly respectively have the cross-section on the side that is close to each other.

[0020] This allows for a larger spacing between the disks in the first and second via disk assemblies on each conductive circuit layer, which helps improve the overall isolation.

[0021] In some possible implementations, for two adjacent disks in the same conductive circuit layer, the two disks have the same diameter, or the diameter of one disk is larger than the diameter of the other disk.

[0022] In this way, regardless of the type of disk, the isolation between two adjacent disks can be increased.

[0023] On the other hand, one embodiment of this application discloses a circuit board assembly, which includes electronic components and a printed circuit board, wherein the electronic components are electrically connected to the printed circuit board.

[0024] In another aspect, one embodiment of this application discloses an electronic device in which a circuit board assembly is integrated internally. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of the printed circuit board provided in the embodiment of this application; Figure 2 This is a schematic diagram of the structure of a two-hole disk assembly provided in one embodiment of this application; Figure 3 This is a schematic diagram of the planar structure of the two disks provided in the embodiments of this application; Figure 4 This is a schematic diagram of the structure of a two-hole disk assembly provided in another embodiment of this application; Figure 5 This is a schematic diagram of the structure of a two-hole disk assembly provided in another embodiment of this application; Figure 6 This is a schematic diagram of the structure of a two-hole disk assembly provided in another embodiment of this application. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0028] In electronic devices, printed circuit boards (PCBs) serve as the core carrier, requiring stable connections with various electronic components to ensure circuit functionality. PCBs have multiple conductive lines; for example, two lines might be the clock line and the data line for transmitting MIPI signals. MIPI signals are high-frequency signals, and the data line transmits encoded 0s and 1s. The receiving end has dedicated circuitry (such as a clock data recovery circuit) to interpret this data, tolerating minor timing deviations. The clock line transmits unencoded 0s and 1s; each tick directly determines when data is read. If noise (spurious signals) from the data line or other sources superimposed on the clock signal in the clock line, the receiving end will sample data at the wrong time.

[0029] However, due to the limited wiring space on the printed circuit board, the spacing between two adjacent disks that are electrically connected to different electronic components is small, resulting in a small degree of isolation between the two disks. This means that the mutual interference of signals in the two adjacent disks is greater, which in turn affects the accuracy of the electronic components.

[0030] Therefore, this application provides a printed circuit board, see reference. Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of the printed circuit board provided in the embodiment of this application. Figure 2 This is a schematic diagram of the structure of two via-plate assemblies provided in an embodiment of this application. This application proposes a printed circuit board, comprising: multiple conductive line layers 210 and multiple dielectric layers 220 stacked and overlapping along a first direction Z. For example, the structure of the printed circuit board is conductive line layer 210, dielectric layer 220, conductive line layer 210, dielectric layer 220, and conductive line layer 210. The conductive line layers 210 are made of conductive materials such as copper foil, and each conductive line layer 210 is etched with a preset signal line. The dielectric layer 220 is made of insulating materials such as epoxy resin and glass fiber, and is located between two adjacent conductive line layers 210. The dielectric layer 220 is used to prevent short circuits caused by direct connection between two adjacent conductive line layers 210, and at the same time provides structural support for the conductive line layers 210 to maintain the overall shape of the printed circuit board.

[0031] The printed circuit board has multiple via assemblies 100, wherein at least one dielectric layer 220 has a via 221 penetrating through the dielectric layer 220. The via assembly 100 may include a connector 120, which may be a metal layer electroplated on the inner wall of the via 221. The metal layer is used to electrically connect the conductive line layers 210 on both sides of the dielectric layer 220 along the first direction Z, so that the two spaced conductive line layers 210 can be electrically connected.

[0032] The via assembly 100 may further include at least two disks 110 arranged in the first direction Z, and connectors 120 for connecting the at least two disks 110, wherein the disks 110 are part of the conductive circuit layer 210. Taking a printed circuit board including a first conductive circuit layer, a dielectric layer 220 and a second conductive circuit layer stacked along the first direction Z as an example, wherein a via 221 is formed in the dielectric layer 220, and the two ends of the connector 120 in the via 221 are respectively connected to the disks 110, one disk 110 being part of the first conductive circuit layer and the other disk 110 being part of the second conductive circuit layer, thereby enabling electronic components to be traced on both the first conductive circuit layer and the second conductive circuit layer simultaneously, increasing wiring space.

[0033] In this application, for multiple disks 110 within the same conductive line layer 210, at least some adjacent disks 110 are spaced apart. For example, a portion of the multiple via-disk assemblies 100 are used to connect to the conductive lines in the conductive line layer 210. In this case, to reduce signal interference between two different conductive lines, this portion of the via-disk assemblies 100 is not connected; that is, the disks 110 corresponding to this portion of the via-disk assemblies are spaced apart to increase the isolation between adjacent signals. Another portion of the multiple via-disk assemblies is used for heat dissipation or connection to the ground plane in the printed circuit board. The disks in this portion of the via-disk assemblies can be interconnected to allow for more via-disk assemblies to be placed within a unit area. The via-disk assembly 100 involved in this application is used to connect to the conductive lines in the conductive line layer 210.

[0034] At least one of two adjacent disks 110 spaced apart has a cross-section 111 on the side closest to the other disk 110. In this way, without changing the position of the two adjacent disks 110, the distance between the two spaced disks 110 can be increased, thereby improving the signal isolation between the two adjacent disks 110.

[0035] In summary, in a multi-hole disk assembly, at least some of the adjacent disks are spaced apart, and at least one of the adjacent disks has a cross-section on the side closest to the other disk. The cross-section can increase the distance between the two disks without changing their positions, thereby improving the isolation between the two adjacent disks, reducing the interference between two closely spaced conductive lines, and improving the accuracy of electronic components.

[0036] The cross-section 111 can be a plane or a curved surface. The disk body 110 can be circular, elliptical, or polygonal.

[0037] In the first embodiment, the first disc of the two spaced discs has a cut surface on the side closer to the second disc, while the second disc does not have a cut surface. This increases the width of the cut portion by increasing the distance between the two spaced discs, thereby increasing the isolation between the two spaced discs.

[0038] In the second embodiment, for two adjacent disks 110 arranged at intervals in the same layer, the two disks 110 have cross-sections 111 on their sides that are close to each other.

[0039] That is, the first disk of the two disks 110 that are spaced apart has a cut surface 111 on the side closer to the second disk, and the second disk also has a cut surface 111 on the side closer to the first disk. This makes the distance between the two adjacent disks 110 twice the width of the cut portion on the original basis, which further increases the isolation between the two disks 110 that are spaced apart.

[0040] See Figure 3 , Figure 3 This is a schematic diagram of the planar structure of two disks provided in an embodiment of this application. The original distance between two adjacent disks 110 is D1. When the two disks 110 have tangent surfaces 111 on their sides that are close to each other, the final distance D between the two disks 110 can be considered as D1 + 2W, where W is the maximum width of the tangent surface 111 in the target direction Q. The target direction Q is parallel to the direction of the line connecting the center points of the two disks 110.

[0041] In some possible embodiments, the two cross-sections 111 of two adjacent disks 110 are arranged in parallel and close to each other.

[0042] The two cut surfaces 111 are arranged in parallel, meaning that the distance between the two cut surfaces 111 of the two disks 110 that are close to each other is equal at all positions in the target direction Q. This avoids the problem of signal instability caused by the two cut surfaces 111 not being parallel, which would result in the distance between the two cut surfaces 111 at a certain position being too small, and thus the signal interference at that position being large.

[0043] In some possible embodiments, for two adjacent disks 110 spaced apart in the same layer, the center points of the two disks 110 are arranged in the target direction Q, and the cross-section 111 is perpendicular to the target direction Q.

[0044] The target direction Q can be the direction of the line connecting the center points of the two disks 110. When the cross-section 111 is perpendicular to this target direction Q, each cross-section 111 is symmetrically arranged about the target direction Q, thereby ensuring that the effective spacing area of ​​the cross-section 111 perpendicular to the target direction Q is maximized, and the coupling path between adjacent signals can be cut off more directly. In addition, since vias 221 for connecting different conductive circuit layers 210 are usually required in the disk 110, the drilling path of the vias 221 needs to be aligned with the center point of the disk 110, and the drilling direction is perpendicular to the circuit board plane. When the cross-section 111 is perpendicular to the target direction Q, the contour of the disk 110 in the target direction Q is more regular. Even if there is a small precision deviation during drilling, the vias 221 are not likely to exceed the boundary of the disk 110, thus ensuring the effective electrical connection between the disk 110 and the connector 120 in the vias 221.

[0045] Continue reading Figure 3In some possible embodiments, for two adjacent disks 110 spaced apart on the same layer, the distance D2 between the center points of the two disks 110 is greater than the diameter d of at least one disk 110.

[0046] This configuration ensures that the two disks 110 are spaced apart without considering the cross-section 111, and similarly, the two disks 110 are also spaced apart with the cross-section 111 in mind. That is, without changing the distance between the spaced disks 110, the distance between the two disks 110 is D1. After the two disks 110 have cross-sections 111 on their sides that are close to each other, the maximum width of the cross-section 111 in the target direction Q is W. Therefore, the final distance D between the two disks 110 can be considered as D1 + 2W. Thus, this application can increase the spacing between two spaced disks 110 without changing their positions, thereby improving the signal isolation between adjacent disks 110.

[0047] In some possible embodiments, see Figure 4 , Figure 4 This is a schematic diagram of the structure of two perforated disk assemblies provided in another embodiment of this application. For two adjacent disk bodies 110 arranged at intervals in the same layer, at least one disk body 110 has an auxiliary cut surface 112 on the side facing away from the other disk body 110; wherein, the auxiliary cut surface 112 is arranged parallel to the cut surface 111.

[0048] In this embodiment, when the disk 110 is a circular structure and a main tangent 111 is provided on the side of the disk 110 facing another disk 110, if there is only a tangent 111 on one side, one side of the disk 110 is a plane and the other side is an arc surface. That is, in the vertical target direction Q, the disk 110 has an asymmetrical structure. However, after adding a parallel auxiliary tangent 112 on the side of the disk 110 away from the other disk 110, the disk 110 has a symmetrical structure in the vertical target direction Q. This symmetrical structure can reduce the uneven stress distribution of the printed circuit board during the manufacturing process (such as etching and drilling) and reduce the risk of deformation and detachment of the edge of the disk 110 due to unbalanced force.

[0049] In one embodiment, the target direction Q is a straight line. Multiple spaced discs are arranged sequentially along the target direction Q. These spaced discs are divided into a first end disc, a middle disc, and a second end disc. The first end disc has a cross-section on the side of the target direction Q closest to the middle disc. The middle disc has cross-sections on both sides of the target direction Q. The second end disc has a cross-section on the side of the target direction Q closest to the middle disc. That is, for the middle disc, the auxiliary cross-section also serves as a cross-section, used to increase the spacing between the middle disc and the first end disc, or between the middle disc and the second end disc.

[0050] In one of the second embodiments, the target direction Q includes multiple different directions. For example, there are three disks spaced apart on the same conductive line layer. The three disks are arranged in a triangular structure. In this case, the auxiliary cut surface on each disk is located on the side away from the cut surface. The auxiliary cut surface is not used as a cut surface to increase the isolation.

[0051] For example, a disk may have multiple facets, each with a minimum distance equal to the center of the disk. For instance, if four disks are evenly distributed around the center disk, the center disk may have four facets, each corresponding to one of the four disks.

[0052] In some possible embodiments, see Figure 3 The vertical distance D3 between the center point of the disk body 110 and the tangent surface 111 is less than the radius R of the disk body 110, but greater than the radius r of the through hole 221 where the disk body 110 and the connecting member 120 are located.

[0053] If the vertical distance D3 from the center of disk 110 to the cut surface 111 is greater than the radius r of via 221, it means that the cut surface 111 will cut into the area of ​​via 221, causing the connector 120 between the edge of via 221 and the edge of disk 110 to be cut off, which can easily lead to a circuit break. Conversely, if the vertical distance D3 from the center of disk 110 to the cut surface 111 is less than the radius r of via 221, it ensures that the cut surface 111 is located outside the via 221, and the via 221 can be completely wrapped by the conductive copper foil of disk 110, ensuring a reliable electrical connection between via 221 and disk 110, while also preventing damage to the structural integrity of via 221 due to an excessively deep cut surface 111. Of course, the cut surface 111 can only be formed on disk 110 when the vertical distance D3 from the center point of disk 110 to the cut surface 111 is less than the radius R of disk 110.

[0054] In some possible embodiments, see Figure 1 At least one conductive circuit layer 210 includes a first signal line 211 and a second signal line 212; two adjacent spaced-apart hole assemblies 100 are respectively: a first hole hole assembly 150 and a second hole hole assembly 160, the first hole hole assembly 150 is connected to the end of the first signal line 211, and the second hole hole assembly 160 is connected to the end of the second signal line 212; the number of disks 110 in the first hole hole assembly 150 is the same as the number of disks 110 in the second hole hole assembly 160; wherein, for any conductive circuit layer 210, the sides of the disks 110 in the first hole hole assembly 150 and the disks 110 in the second hole hole assembly 160 that are close to each other have a cross surface 111.

[0055] In this embodiment, the printed circuit board has a multilayer structure, wherein the via 221 penetrates both the multilayer dielectric layer 220 and the conductive line layer 210. The first via assembly 150 includes a plurality of disks 110 arranged sequentially along the first direction Z, and the inner wall of each disk 110 is connected to the connector 120 in the via 221. For any conductive line layer 210, the disks 110 in the first via assembly 150 and the disks 110 in the second via assembly 160 have a cross-section 111 on their respective sides, which allows for a larger spacing between the disks 110 in the first via assembly 150 and the disks 110 in the second via assembly 160 on each conductive line layer 210, which is beneficial for improving the overall isolation.

[0056] For example, the printed circuit board includes ten dielectric layers. The vias in the first via assembly are formed by mechanical drilling. The disk body in the first via assembly is a first disk body. The vias in the first via assembly simultaneously penetrate from the third to the eighth dielectric layer. At this time, there are first disk bodies on the third to the ninth dielectric layer respectively, i.e., a total of seven first disk bodies. Each first disk body is electrically connected to a connector within the via. The vias in the second via assembly are also formed by mechanical drilling. The disk body in the second via assembly is a second disk body. The vias in the second via assembly simultaneously penetrate from the third to the eighth dielectric layer. At this time, there are second disk bodies on the third to the ninth dielectric layer respectively, i.e., a total of seven second disk bodies. Each second disk body is electrically connected to a connector within the via. Each first disk body has a cross-section on the side adjacent to the second disk body on the same layer, and each second disk body has a cross-section on the side adjacent to the first disk body on the same layer.

[0057] In some possible embodiments, see Figure 2 , Figure 5 as well as Figure 6 , Figure 5 This is a schematic diagram of the structure of a two-hole disk assembly provided in another embodiment of this application; Figure 6 This is a schematic diagram of the structure of a two-hole disk assembly provided in another embodiment of this application. For two adjacent disks 110 in the same conductive line layer 210, the diameters of the two disks 110 are the same, or the diameter of one disk 110 is larger than the diameter of the other disk 110.

[0058] The size of the disk body 110 is related to the drilling method of the corresponding via 221. The via 221 can be drilled mechanically or by laser drilling. The disk body 110 corresponding to the via 221 drilled mechanically is larger than the disk body 110 corresponding to the via 221 drilled by laser drilling. In this way, the isolation between two spaced disk bodies 110 can be increased regardless of which type of disk body 110 is used.

[0059] In the first embodiment, see Figure 2 On the same conductive circuit layer 210, two disks 110 spaced apart each have a diameter of 16 mm. For example, the via 221 corresponding to the disk 110 can be drilled mechanically. The diameter of the via 221 drilled mechanically can be 8 mm, and the diameter of the disk 110 connected to the connector 120 in the via 221 is 16 mm.

[0060] In the second embodiment, see Figure 5 On the same conductive layer 210, two disks 110 spaced apart each have a diameter of 8 mm. For example, a via 221 is created on the dielectric layer 220 using laser drilling. The diameter of the via 221 created by laser drilling can be 3 mm, and the outer diameter of the disk 110 connected to the connector 120 within the via 221 is 8 mm.

[0061] In the third embodiment, see Figure 6 The two disks 110 are spaced apart. One disk 110 has a dimension of 8 mm in the target direction Q, and the other disk 110 has a dimension of 16 mm in the target direction Q. For example, one via 221 is formed by mechanical drilling, and the other via 221 is formed by laser drilling.

[0062] In some possible embodiments, the maximum width of the cut surface 111 in the target direction Q is 2 millimeters.

[0063] An embodiment of this application also discloses a circuit board assembly, which includes electronic components and a printed circuit board, wherein the electronic components are electrically connected to the printed circuit board.

[0064] For example, in combination Figure 1 The system includes multiple electronic components, including an image sensor and a processor. The image sensor is connected to the first aperture assembly 150 via a first signal line 211, and the processor is connected to the second aperture assembly 160 via a second signal line 212. The first aperture assembly 150 and the second aperture assembly 160 are spaced apart. Since the image sensor is highly susceptible to interference from other signals, it is necessary to ensure a high degree of isolation between the first aperture assembly 150 and the second aperture assembly 160 to reduce interference to the image sensor. To achieve this, the disk bodies 110 in the first aperture assembly 150 and the disk bodies 110 in the second aperture assembly 160 can each have a cross-section 111 on their sides that are close to each other. This increases the distance between the first aperture assembly 150 and the second aperture assembly 160 while keeping their positions unchanged, thereby increasing the isolation between them.

[0065] One embodiment of this application also discloses an electronic device, which integrates the aforementioned circuit board assembly. Exemplarily, this electronic device may be a mobile phone, tablet, laptop, smart wearable device (such as a watch or earphone), energy storage battery pack, or other hermetically sealed or semi-hermetically sealed electronic device.

[0066] In summary, in a multi-hole disk assembly, at least some of the adjacent disks are spaced apart, and at least one of the adjacent disks has a cross-section on the side closest to the other disk. The cross-section can increase the distance between the two disks without changing their positions, thereby improving the isolation between the two adjacent disks, reducing the interference between two closely spaced conductive lines, and improving the accuracy of electronic components.

[0067] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0068] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0069] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A printed circuit board, characterized in that, The printed circuit board is provided with a plurality of hole disk assemblies (100), and the printed circuit board includes: a plurality of conductive line layers (210) and a multilayer dielectric layer (220) stacked and overlapping along a first direction (Z). The via assembly (100) includes: at least two disks (110) arranged in a first direction (Z), and a connector (120) for connecting two adjacent disks (110), the disks (110) being part of the conductive circuit layer (210); the printed circuit board has a via (221) penetrating at least a portion of the insulating layer, and the connector (120) is located within the via (221) disposed in the dielectric layer (220) between two adjacent disks (110); Among them, for a plurality of disks (110) in the same conductive circuit layer (210), at least two adjacent disks (110) are spaced apart, and at least one of the spaced adjacent disks (110) has a cross-section (111) on the side closer to the other disk (110).

2. The printed circuit board according to claim 1, characterized in that, For two adjacent disks (110) arranged at intervals in the same layer, the two disks (110) have the cut surface (111) on their sides that are close to each other.

3. The printed circuit board according to claim 2, characterized in that, The two cut surfaces (111) of two adjacent disks (110) are arranged in parallel and close to each other.

4. The printed circuit board according to claim 2, characterized in that, For two adjacent disks (110) arranged at intervals in the same layer, the center points of the two disks (110) are arranged in the target direction (Q), and the cross-section (111) is perpendicular to the target direction (Q).

5. The printed circuit board according to claim 4, characterized in that, For two adjacent disks (110) spaced apart on the same layer, the distance between the center points of the two disks (110) is greater than the diameter of at least one disk (110).

6. The printed circuit board according to claim 2, characterized in that, For two adjacent disks (110) arranged at intervals in the same layer, at least one disk (110) has an auxiliary cross section (112) on the side facing away from the other disk (110). The auxiliary cut surface (112) is arranged parallel to the cut surface (111).

7. The printed circuit board according to any one of claims 1-6, characterized in that, The vertical distance between the center of the disc (110) and the cut surface (111) is less than the radius of the disc (110) and greater than the radius of the through hole (221) where the disc (110) and the connected connector (120) are located.

8. The printed circuit board according to any one of claims 1-6, characterized in that, At least one of the conductive circuit layers (210) includes a first signal line (211) and a second signal line (212); The two adjacent perforated disk assemblies (100) are respectively: a first perforated disk assembly (150) and a second perforated disk assembly (160). The first perforated disk assembly (150) is connected to the end of the first signal line (211), and the second perforated disk assembly (160) is connected to the end of the second signal line (212). The number of disk bodies (110) in the first hole disk assembly (150) is the same as the number of disk bodies (110) in the second hole disk assembly (160); Among them, for any conductive circuit layer (210), the disk body (110) in the first hole disk assembly (150) and the disk body (110) in the second hole disk assembly (160) respectively have the cut surface (111) on the side that is close to each other.

9. The printed circuit board according to any one of claims 1-6, characterized in that, For two adjacent disks (110) in the same conductive circuit layer (210), the two disks (110) have the same diameter, or the diameter of one disk (110) is larger than the diameter of the other disk (110).

10. A circuit board assembly, characterized in that, The circuit board assembly includes electronic components and a printed circuit board as described in any one of claims 1-9, wherein the electronic components are electrically connected to the printed circuit board.

11. An electronic device, characterized in that, The electronic device integrates the circuit board assembly as described in claim 10.

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