Composite heat-conducting PCB circuit board

Abstract

The utility model discloses a kind of composite heat conduction PCB circuit board, including substrate, the top center of the substrate is provided with setting plate, electronic component is installed in the top center of setting plate, annular groove is set between substrate and setting plate, shielding frame is clamped in the inside of annular groove, and electronic component is located in the inside of shielding frame;Wherein, copper block is provided below electronic component, slot is opened in the top center of setting plate, copper block is fixed in the inner bottom center of slot, and the inner bottom surface of slot is opened around copper block with several groups of heat through hole.The utility model cooperates with groove, copper block, heat through hole and heat spreader, constructs the multidimensional composite heat conduction channel from chip to substrate, realizes efficient heat conduction in vertical direction by heat through hole, realizes rapid heat spreading in plane direction by using heat spreader, simultaneously, the embedded structure of groove and copper block is combined to enhance local heat dissipation capacity, finally realizes the uniform distribution and efficient heat dissipation of circuit board overall temperature field.

Description

Technical Field

[0001] This utility model relates to the field of PCB circuit board technology, specifically to a composite thermally conductive PCB circuit board. Background Technology

[0002] Printed circuit boards (PCBs) are the core support and connection carriers for electronic components. Through the conductive paths such as copper foil traces, pads and vias etched on a pre-designed insulating substrate, they provide mechanical fixation, electrical connection and signal transmission functions for electronic components. They can also achieve high-density wiring, heat dissipation management and electromagnetic compatibility through multi-layer stacking and special materials. They are an indispensable basic component of modern electronic equipment.

[0003] Existing high-density PCBs are limited by the design bottlenecks of single heat dissipation paths and independent electromagnetic shielding structures. When high-power components are running continuously, they are unable to coordinate efficient heat conduction and electromagnetic interference suppression. This not only causes local overheating but also leads to signal integrity degradation, ultimately restricting the reliability enhancement and performance improvement of electronic devices in compact spaces. Summary of the Invention

[0004] The purpose of this invention is to provide a composite thermally conductive PCB circuit board. This invention constructs a multi-dimensional composite thermally conductive channel from the chip to the substrate through the synergistic cooperation of slots, copper blocks, heat pipes, and a heat spreader. It achieves efficient vertical heat conduction through heat pipes and rapid planar heat equalization through the heat spreader. At the same time, the embedded structure of the slots and copper blocks enhances local heat dissipation capabilities, ultimately achieving uniform temperature distribution and efficient heat dissipation of the entire circuit board temperature field, thereby solving the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: A composite thermally conductive PCB circuit board includes a substrate, a mounting plate is disposed at the top center of the substrate, an electronic component is mounted at the top center of the mounting plate, an annular groove is disposed between the substrate and the mounting plate, a shielding frame is snapped into the inside of the annular groove, and the electronic component is located inside the shielding frame. Among them, a copper block is placed below the electronic component, a slot is opened at the top center of the mounting plate, a copper block is fixed at the bottom center of the slot, a number of heat passage holes are opened around the copper block on the bottom surface of the slot, and heat dissipation plates are opened at both ends of the top of the mounting plate. Several sets of symmetrical anti-interference shielding magnetic rings are provided on the front and back ends of the top of the electronic component.

[0006] Preferably, the anti-interference shielding magnetic ring has a through hole at its center, and an insulating fixing rod is provided inside the anti-interference shielding magnetic ring.

[0007] Preferably, one end of the insulating fixing rod that passes through the anti-interference shielding magnetic ring is engaged with a corresponding slot on the mounting plate, and the insulating fixing rod and the slot are compatible.

[0008] Preferably, the electronic component has connecting plates fixed at both ends of its front and back sides, and screws are provided on the top of the connecting plates. The screws pass through one end of the connecting plates and are threaded into the corresponding mounting holes on the mounting plate.

[0009] Preferably, the top two ends of the mounting plate are provided with mounting grooves, a heat spreader plate is snapped into the inside of the mounting grooves, an insulating threaded head is provided around the top of the heat spreader plate, and a threaded hole is provided around the inside of the mounting grooves. The insulating threaded head passes through one end of the heat spreader plate and is threadedly connected to the inside of the threaded hole.

[0010] Preferably, pin plates are fixed at both ends of the front and back sides of the substrate, and fixing holes are provided around the top of the substrate.

[0011] Compared with the prior art, the beneficial effects of this utility model are: This invention constructs a multi-dimensional composite heat conduction channel from chip to substrate through the coordinated cooperation of slots, copper blocks, heat-perforated holes and heat spreaders. It achieves efficient heat conduction in the vertical direction through heat-perforated holes, and rapid heat dissipation in the planar direction through heat spreaders. At the same time, the embedded structure of slots and copper blocks enhances local heat dissipation capabilities, ultimately achieving uniform temperature distribution and efficient heat dissipation of the entire circuit board temperature field.

[0012] This invention constructs a layered electromagnetic shielding structure by using a shielding frame and an anti-interference shielding magnetic ring. The shielding frame creates spatial isolation to suppress high-frequency radiated interference, while the shielding magnetic ring absorbs low-frequency conducted noise. This achieves multi-band electromagnetic interference coordinated protection for electronic components and small parts, significantly improving the electromagnetic compatibility and signal integrity of the circuit board. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a schematic diagram of the separation structure of the substrate, shielding frame and anti-interference shielding magnetic ring of this utility model; Figure 3 This is a schematic diagram of the separation structure of the mounting plate, electronic components, and heat spreader of this utility model; Figure 4 This is a top view of the substrate structure of this utility model.

[0014] In the diagram: 1. Substrate; 2. Lead plate; 3. Fixing hole; 4. Annular groove; 5. Shielding frame; 6. Mounting plate; 7. Electronic component; 701. Connecting plate; 702. Screw; 8. Slot; 9. Copper block; 10. Heat exchange hole; 11. Placement slot; 12. Heat spreader; 13. Insulated threaded head; 14. Threaded hole; 15. Anti-interference shielding magnetic ring; 16. Insulated fixing rod; 17. Slot. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] Please see Figures 1-4 This utility model provides a technical solution: A composite thermally conductive PCB circuit board includes a substrate 1, a mounting plate 6 disposed at the top center of the substrate 1, an electronic component 7 mounted at the top center of the mounting plate 6, an annular groove 4 between the substrate 1 and the mounting plate 6, a shielding frame 5 being snapped into the annular groove 4, and the electronic component 7 being located inside the shielding frame 5; several sets of symmetrical anti-interference shielding magnetic rings 15 are disposed on the front and back ends of the top of the electronic component 7. A through hole is opened in the center of the anti-interference shielding magnetic ring 15, and an insulating fixing rod 16 is disposed inside the anti-interference shielding magnetic ring 15. One end of the insulating fixing rod 16 passes through the anti-interference shielding magnetic ring 15 and is snapped into a corresponding slot 17 on the mounting plate 6, the insulating fixing rod 16 and the slot 17 being compatible.

[0017] This utility model constructs a layered electromagnetic shielding structure by using a shielding frame 5 and an anti-interference shielding magnetic ring 15. The shielding frame 5 forms spatial isolation to suppress high-frequency radiation interference, while the shielding magnetic ring absorbs low-frequency conducted noise. This achieves multi-band electromagnetic interference coordinated protection for electronic components 7 and small components, significantly improving the electromagnetic compatibility and signal integrity of the circuit board.

[0018] The shielding frame 5 is assembled with the base plate 1 and the mounting plate 6 through the annular groove 4 to form a detachable vertical snap-fit ​​assembly, realizing the rapid construction and separation of the shielding cavity; at the same time, the anti-interference shielding magnetic ring 15 passes through its central through hole through the insulating fixing rod 16 and is precisely inserted into the corresponding slot 17 on the mounting plate 6. The rod and slot adaptation structure realizes the precise positioning and insulating fixation of the magnetic ring, and finally forms a modular electromagnetic protection system that is easy to maintain and supports rapid assembly and disassembly.

[0019] The shielding frame 5 is a metal enclosure structure mounted on the PCB, usually made of copper-plated steel plate or aluminum alloy. It forms a closed or semi-closed cavity by surrounding sensitive circuits or noise components to suppress high-frequency radiation interference by reflecting and absorbing electromagnetic waves, and to provide electromagnetic isolation protection for internal circuits.

[0020] The anti-interference shielding magnetic ring 15 is a ring-shaped element made of soft magnetic material that is sleeved on a cable or signal line. It suppresses common-mode noise and high-frequency electromagnetic interference in the conductor through its high-frequency impedance characteristics. It can absorb energy in the unwanted frequency band and convert it into heat energy, thereby improving signal integrity and reducing external radiation interference.

[0021] Among them, a copper block 9 is set below the electronic component 7, a slot 8 is opened at the top center of the mounting plate 6, a copper block 9 is fixed at the bottom center of the slot 8, and several sets of heat passage holes 10 are opened around the copper block 9 on the bottom surface of the slot 8. A heat spreader plate 12 is opened at both ends of the top of the mounting plate 6; a placement groove 11 is opened at both ends of the top of the mounting plate 6, and a heat spreader plate 12 is snapped into the inside of the placement groove 11. An insulating threaded head 13 is set around the top of the heat spreader plate 12, and a threaded hole 14 is opened around the inside of the placement groove 11. The insulating threaded head 13 passes through one end of the heat spreader plate 12 and is threadedly connected to the inside of the threaded hole 14.

[0022] The heat spreader 12 is a two-dimensional high-efficiency heat-conducting element based on the principle of phase change heat transfer. Its internal structure adopts a vacuum cavity structure and capillary core layer design. Through the evaporation-condensation cycle of the working fluid, it achieves rapid absorption and uniform diffusion of heat. It can uniformly transfer local high heat flux density to the entire plate surface, thereby effectively eliminating hot spots and improving the uniformity of system heat dissipation.

[0023] Copper Block 9 is a solid, high thermal conductivity metal body embedded in a specific area of ​​the PCB (such as under high-heat components). It is usually made of pure copper or copper alloy. Its function is to establish a low thermal resistance path by directly contacting the heat source, and to quickly conduct concentrated heat to other heat dissipation layers of the PCB or external heat sinks with ultra-high thermal conductivity, significantly enhancing local heat dissipation capabilities.

[0024] The copper block 9 is embedded and fixed in the center of the mounting plate 6 through the slot 8 to form a core heat-conducting bridge. The array of heat-through holes 10 surrounds the copper block 9 to form a vertical heat dissipation channel. The heat spreader 12 is positioned by snapping it into the mounting plate 6 through the placement slot 11, and mechanical locking and electrical isolation are achieved by the cooperation of the insulated thread head 13 and the threaded hole 14, forming a planar heat spreader module that can be independently disassembled and maintained. Finally, a composite heat dissipation system with both high-efficiency heat conduction and convenient maintenance characteristics is constructed.

[0025] This invention constructs a multi-dimensional composite heat conduction channel from the chip to the substrate 1 through the coordinated cooperation of the slot 8, copper block 9, heat passage 10 and heat spreader 12. It achieves efficient heat conduction in the vertical direction through the heat passage 10 and rapid heat spread in the planar direction through the heat spreader 12. At the same time, the embedded structure of the slot 8 and copper block 9 enhances the local heat dissipation capacity, and finally achieves uniform temperature distribution and efficient heat dissipation of the circuit board as a whole.

[0026] The electronic component 7 has connecting plates 701 fixed at both ends of its front and back sides. A screw 702 is provided on the top of the connecting plate 701. The screw 702 passes through one end of the connecting plate 701 and is threaded to the mounting hole provided on the mounting plate 6.

[0027] The screw 702 passes through the through hole at the top of the connecting plate 701 and forms a threaded fastening connection with the preset mounting hole on the mounting plate 6, so as to achieve rigid fixation and reliable grounding of the electronic component 7 on the mounting plate 6. This structure ensures stable mechanical support while facilitating disassembly and maintenance with conventional tools, forming a modular assembly unit that can be reinstalled.

[0028] The front and back ends of the substrate 1 are fixed with pin plates 2, and the top of the substrate 1 is provided with fixing holes 3 around the perimeter.

[0029] The pinboard 2 extends to the edge of the substrate 1 to form an external electrical connection and lateral support structure. Meanwhile, the fixing hole 3 on the top of the substrate 1 provides a vertical mechanical mounting point. After being fastened to the device housing by external bolts, the circuit board achieves stable positioning, electrical interconnection and heat dissipation in three-dimensional space.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A composite thermally conductive PCB circuit board, comprising a substrate (1), characterized in that: The substrate (1) has a mounting plate (6) at the top center, and an electronic component (7) is mounted on the top center of the mounting plate (6). An annular groove (4) is provided between the substrate (1) and the mounting plate (6). A shielding frame (5) is snapped into the inside of the annular groove (4), and the electronic component (7) is located inside the shielding frame (5). Among them, a copper block (9) is provided below the electronic component (7), a slot (8) is provided at the top center of the mounting plate (6), a copper block (9) is fixed at the bottom center of the slot (8), a number of heat passage holes (10) are provided around the copper block (9) on the bottom surface of the slot (8), and heat dissipation plates (12) are provided at both ends of the top of the mounting plate (6). The electronic component (7) has several sets of symmetrical anti-interference shielding magnetic rings (15) on the front and back ends of the top.

2. The composite thermally conductive PCB circuit board according to claim 1, characterized in that: The anti-interference shielding magnetic ring (15) has a through hole in the center, and an insulating fixing rod (16) is provided inside the anti-interference shielding magnetic ring (15).

3. The composite thermally conductive PCB circuit board according to claim 2, characterized in that: The insulating fixing rod (16) passes through one end of the anti-interference shielding magnetic ring (15) and is engaged with the corresponding slot (17) on the mounting plate (6). The insulating fixing rod (16) and the slot (17) are compatible.

4. The composite thermally conductive PCB circuit board according to claim 1, characterized in that: The electronic component (7) has a connecting plate (701) fixed at both ends of its front and back sides. A screw (702) is provided on the top of the connecting plate (701). The screw (702) passes through one end of the connecting plate (701) and is threaded to the mounting hole provided on the mounting plate (6).

5. A composite thermally conductive PCB circuit board according to claim 1, characterized in that: The top two ends of the mounting plate (6) are provided with mounting grooves (11), and a heat spreader plate (12) is snapped into the inside of the mounting groove (11). An insulating threaded head (13) is provided around the top of the heat spreader plate (12), and a threaded hole (14) is provided around the inside of the mounting groove (11). The insulating threaded head (13) passes through one end of the heat spreader plate (12) and is threaded into the inside of the threaded hole (14).

6. A composite thermally conductive PCB circuit board according to claim 1, characterized in that: The substrate (1) has pin plates (2) fixed at both ends of the front and back sides, and fixing holes (3) are opened around the top of the substrate (1).

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