Conductive member, circuit board assembly, and electronic device

Abstract

The application relates to the technical field of electronic equipment, and discloses a conductive piece, a circuit board assembly and electronic equipment. The conductive piece comprises a main body part, a first foot part and a second foot part. The main body part has a first end and a second end in a first direction; the first foot part is arranged at the first end and extends along a second direction, and the second direction is perpendicular to the first direction; and the second foot part is arranged at the second end and extends along the second direction. The length L1 of the conductive piece in the first direction satisfies 15mm<=L1<=25mm; the width K1 of the conductive piece in a third direction satisfies 5mm<=K1<=15mm; and the thickness H1 of the conductive piece satisfies 0.5mm<=H1<=1.5mm. By limiting the size of the conductive piece within a proper range, the manufacturing difficulty of the conductive piece, the conductive capacity of the conductive piece, the welding effect of the conductive piece and the circuit board and other factors can be considered, and the conductive piece installed on the circuit board can meet the large-current transmission requirement of the circuit board.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to a conductive component, a circuit board assembly, and an electronic device. Background Technology

[0002] PCBA (Printed Circuit Board Assembly) refers to an assembly formed by soldering electronic components onto a PCB (Printed Circuit Board). With the diversification of electronic device functions, the current that PCBA needs to transmit is also increasing. Existing circuit boards mainly rely on etching copper layers on a substrate to form circuits. The cross-sectional area of ​​the conductors formed by this process is small and the resistance is large. Under high current, it will generate serious heat and voltage drop, which can no longer meet the requirements. There is an urgent need to provide a structure that can transmit high current. Utility Model Content

[0003] This application provides a conductive component, a circuit board assembly, and an electronic device that facilitates assembly and meets the requirements for high current transmission on the circuit board.

[0004] In a first aspect, this application provides a conductive element, including a main body, a first foot, and a second foot. The main body has a first end and a second end in a first direction; the first foot is disposed at the first end and extends along a second direction, which is perpendicular to the first direction; the second foot is disposed at the second end and extends along the second direction. The length L1 of the conductive element in the first direction satisfies: 15mm ≤ L1 ≤ 25mm; the width K1 of the conductive element in the third direction satisfies: 5mm ≤ K1 ≤ 15mm; the thickness H1 of the conductive element satisfies: 0.5mm ≤ H1 ≤ 1.5mm.

[0005] In some embodiments, the length L1 of the conductive element in the first direction satisfies: 18mm≤L1≤22mm; the width K1 of the conductive element in the third direction satisfies: 8mm≤K1≤12mm; and the thickness H1 of the conductive element satisfies: 0.8mm≤H1≤1.2mm.

[0006] In some embodiments, the first foot and the second foot are located on the same side of the main body in the second direction; or, the first foot and the second foot are located on opposite sides of the main body in the second direction.

[0007] In some embodiments, the main body, the first foot, and the second foot are integrally formed; and / or, the conductive element comprises copper material.

[0008] In some embodiments, in a first direction, the surface of the first foot facing away from the second foot is a first flat surface, and the surface of the second foot facing away from the first foot is a second flat surface. The first flat surface of a conductive element is used to be attached and connected to the second flat surface of another conductive element.

[0009] In some embodiments, in a first direction, the surface of the first foot away from the second foot is a convex first arcuate surface, and the surface of the second foot away from the first foot is a concave second arcuate surface. The first arcuate surface of one conductive element is used to fit and connect with the second arcuate surface of another conductive element.

[0010] Secondly, this application provides a circuit board assembly, including a circuit board and conductive components. The circuit board includes a first solder portion and a second solder portion spaced apart, with a first lead soldered to the first solder portion and a second lead soldered to the second solder portion.

[0011] In some embodiments, the first soldering portion includes a first through hole and a first pad, the first pad being disposed at at least a partial edge of the first through hole, a first foot being disposed through the first through hole, and the first foot being soldered to the first pad; the second soldering portion includes a second through hole and a second pad, the second pad being disposed at at least a partial edge of the second through hole, a second foot being disposed through the second through hole, and the second foot being soldered to the second pad.

[0012] In some embodiments, a circuit layer is exposed between the first welded portion and the second welded portion, and the main body portion of the conductive element is in contact with the circuit layer.

[0013] In some embodiments, there are multiple first welding portions and multiple second welding portions, multiple conductive elements, multiple conductive elements are connected end to end in a first direction, and / or multiple conductive elements are connected side to side in a third direction; adjacent conductive elements are welded together by a tin layer.

[0014] Thirdly, this application provides an electronic device, which includes a circuit board assembly.

[0015] The beneficial effects of this application embodiment are as follows: The conductive component includes a main body, a first foot, and a second foot. The main body has a first end and a second end in a first direction; the first foot is disposed at the first end and extends along a second direction, which is perpendicular to the first direction; the second foot is disposed at the second end and extends along the second direction. The length L1 of the conductive component in the first direction satisfies: 15mm≤L1≤25mm; the width K1 of the conductive component in the third direction satisfies: 5mm≤K1≤15mm; the thickness H1 of the conductive component satisfies: 0.5mm≤H1≤1.5mm. By limiting the size of the conductive component within a suitable range, this application can take into account various factors such as the manufacturing difficulty of the conductive component, the conductivity of the conductive component, and the soldering effect between the conductive component and the circuit board. The conductive component installed on the circuit board can meet the high current transmission requirements of the circuit board. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the specific embodiments of this application, the accompanying drawings used in the description of the specific embodiments will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0017] Figure 1 This is a schematic diagram of the conductive element in an embodiment of this application; Figure 2 This is another schematic diagram of the conductive element in an embodiment of this application; Figure 3 This is a schematic diagram of a conductive element according to another embodiment of this application; Figure 4 This is an exploded view of the circuit board assembly according to an embodiment of this application; Figure 5 This is a partial schematic diagram of a circuit board assembly according to an embodiment of this application; Figure 6 This is a partial schematic diagram of the circuit board of the circuit board assembly according to an embodiment of this application; Figure 7 This is a partial cross-sectional view of the circuit board assembly according to an embodiment of this application; Figure 8 This is a schematic diagram of a circuit board assembly according to another embodiment of this application; The reference numerals in the detailed embodiments are as follows: 100. Conductive component; X, first direction; Y, second direction; Z, third direction; 10. Main body; 11. First end; 12. Second end; 20. First foot; 21. First flat surface; 30. Second foot; 31. Second flat surface; 200, Circuit board assembly; 201, Circuit board; 202, First soldering part; 2021, First through hole; 2022, First pad; 203, Second soldering part; 2031, Second through hole; 2032, Second pad; 204, Circuit layer; 205, Tin layer. Detailed Implementation

[0018] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "upper," "lower," "inner," "outer," "vertical," "horizontal," etc., used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0019] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0020] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0021] Please see Figure 1 and Figure 2 This application provides a conductive element 100, which includes a main body 10, a first foot 20, and a second foot 30. For ease of description, the conductive element 100 is provided with a first direction X, a second direction Y, and a third direction Z that are perpendicular to each other, wherein the first direction X is the length direction of the main body 10, the second direction Y is the thickness direction of the main body 10, and the third direction Z is the width direction of the main body 10.

[0022] As an example, the main body 10 has a first end 11 and a second end 12 disposed opposite to each other in a first direction X. A first foot 20 is disposed at the first end 11 and extends in a second direction Y. A second foot 30 is disposed at the second end 12 and extends in the second direction Y. Both the first foot 20 and the second foot 30 are used for soldering to a circuit board, thereby connecting the conductive element 100 to the circuit on the circuit board.

[0023] In some embodiments, the length L1 of the conductive element 100 in the first direction X satisfies: 15mm ≤ L1 ≤ 25mm. By setting the length of the conductive element 100 within the above range, various factors such as the manufacturing difficulty of the conductive element 100, the conductivity of the conductive element 100, and the welding effect between the conductive element 100 and the circuit board can be taken into account. For example, when the length of the conductive element 100 is too short, it is difficult to bend it, making it difficult to bend it at both ends of the main body 10 to form the first foot 20 and the second foot 30, or when the length of the main body 10 is too short, it is difficult to weld it to the first foot 20 and the second foot 30, etc., which makes it difficult to manufacture. When the length of the conductive element 100 is too long, it cannot meet the requirements of some short-distance current connections on the circuit board. In addition, a longer conductive element 100 leads to a poor fit between the main body 10 and the circuit board, which is prone to local arching, resulting in poor contact between the conductive element 100 and the circuit board and poor current conduction. In a further embodiment, the length L1 of the conductive element 100 in the first direction X satisfies: 18mm≤L1≤22mm, for example, L1 can be 18mm, 18.5mm, 19mm, 19.5mm, 20mm, 20.5mm, 21mm, 21.5mm or 22mm.

[0024] In some embodiments, the width K1 of the conductive element 100 in the third direction Z satisfies: 5mm ≤ K1 ≤ 15mm; the thickness H1 of the conductive element 100 satisfies: 0.5mm ≤ H1 ≤ 1.5mm. Setting the width and thickness of the conductive element 100 within the above ranges allows the conductive element 100 to have a better current transmission area, reduce current transmission resistance, and possess sufficient structural strength. This ensures that the conductive element 100 maintains a good connection with the circuit board without affecting the bending process, thereby guaranteeing the quality of current transmission.

[0025] In a further embodiment, the width K1 of the conductive element 100 in the third direction Z satisfies: 8mm ≤ K1 ≤ 12mm; for example, K2 can be 8mm, 8.5mm, 9mm, 9.5mm, 10mm, 10.5mm, 11mm, 11.5mm, or 12mm. In a further embodiment, the thickness H1 of the conductive element 100 satisfies: 0.8mm ≤ H1 ≤ 1.2mm. For example, H1 can be 0.8mm, 0.9mm, 1mm, 1.1mm, or 1.2mm.

[0026] In some embodiments, please refer to Figure 2 The first foot 20 and the second foot 30 are located on the same side of the main body 10 in the second direction Y. This facilitates the connection of the first foot 20 and the second foot 30 to the same circuit board. In particular, when multiple conductive elements 100 are connected on the circuit board, the above-described structure of the conductive elements 100 is beneficial for soldering connections between the multiple conductive elements 100.

[0027] It is understood that in other embodiments, the conductive element 100 may also connect two circuit boards located in the same plane in the second direction Y, with the conductive element 100 spanning the two circuit boards. The first foot 20 of the conductive element 100 is soldered to one circuit board, and the second foot 30 of the conductive element is soldered to the other circuit board, so as to achieve an electrical connection between the two coplanar circuit boards.

[0028] In other embodiments, please refer to Figure 3 The first foot 20 and the second foot 30 are located on opposite sides of the main body 10 in the second direction Y. This facilitates the connection of the first foot 20 and the second foot 30 to two different circuit boards 201A and 201B respectively, achieving electrical connection between the stacked circuit boards 201A and 201B. For example, when 201A and 201B are stacked in the second direction Y, the first foot 20 is soldered to the lower circuit board 201B, the main body 10 is attached to the lower circuit board 201B or the upper circuit board 201A, and the second foot 30 is soldered to the upper circuit board 201A.

[0029] It is understood that the main body 10, the first foot 20, and the second foot 30 of the conductive element 100 are integrally formed, that is, the conductive element 100 can be formed by a flat plate structure through a stamping and bending process to form the first foot 20 and the second foot 30. In other embodiments, the conductive element 100 can also be formed by connecting the first foot 20 and the second foot 30 to both ends of the main body 10 through a secondary processing process, for example, by welding the independent first foot 20 and the second foot 30 to both ends of the main body 10.

[0030] In some embodiments, the conductive element 100 may be made of a material with high conductivity to give it good conductivity. For example, the conductive element 100 may be made of copper, and the conductive element 100 may be a copper busbar. This can reduce current transmission loss. At the same time, the copper material helps to bend and manufacture the first foot 20 and the second foot 30, reducing manufacturing difficulty.

[0031] In some embodiments, please refer to Figure 1 and Figure 2In the first direction X, the surface of the first foot 20 facing away from the second foot 30 is a first flat surface 21, and the surface of the second foot 30 facing away from the first foot 20 is a second flat surface 31. When two conductive elements 100 are connected, the first flat surface 21 of one conductive element 100 is used to fit and connect with the second flat surface 31 of the other conductive element 100. By setting the two end faces of the conductive elements 100 as flat surfaces, when the two conductive elements 100 are connected end to end, the flat surfaces of the two conductive elements 100 can be well fitted. On the one hand, multiple conductive elements 100 can be spliced ​​in a straight line, and the overall length of the conductive line can be controlled by controlling the number of conductive elements 100, thereby improving the wiring accuracy. On the other hand, the fitted setting can increase the contact area between the two conductive elements 100, reduce the resistance at the connection, and thus reduce the transmission loss of current between the two conductive elements 100. In addition, the end faces of the two conductive elements 100 are spliced ​​with flat surfaces, and the joint is relatively flat, which is beneficial for soldering at the connection of the two conductive elements 100.

[0032] In some embodiments, in the first direction X, the surface of the first foot 20 facing away from the second foot 30 is a convex first arcuate surface, and the surface of the second foot 30 facing away from the first foot 20 is a concave second arcuate surface. The first arcuate surface of one conductive element 100 is used to fit and connect with the second arcuate surface of another conductive element 100. By setting the end of the conductive element 100 as an arcuate surface structure, it is convenient to change the layout extension direction of the conductive line when the two conductive elements 100 are connected, thereby changing the current transmission direction and meeting different current transmission requirements. Furthermore, since it is a nested arcuate surface structure, even if the layout direction of the two conductive elements 100 is changed, they can still maintain the end face fit, reducing the resistance at the connection.

[0033] In some embodiments, please refer to Figures 4 to 7 This application also provides a circuit board assembly 200, which includes a circuit board 201 and the aforementioned conductive element 100. The circuit board 201 includes a first soldering portion 202 and a second soldering portion 203 spaced apart, which are connected to the circuit layer 204 inside the circuit board 201. When the conductive element 100 is connected to the circuit board 201, a first lead 20 is soldered to the first soldering portion 202, and a second lead 30 is soldered to the second soldering portion 203, thereby fixing the conductive element 100 onto the circuit board 201 and achieving electrical connection with the circuit layer 204 of the circuit board 201.

[0034] As an example, the first soldering portion 202 includes a first through-hole 2021 and a first pad 2022. The first pad 2022 is disposed at least partially at the edge of the first through-hole 2021, and a first foot 20 passes through the first through-hole 2021 and is soldered to the first pad 2022. The second soldering portion 203 includes a second through-hole 2031 and a second pad 2032. The second pad 2032 is disposed at least partially at the edge of the second through-hole 2031, and a second foot 30 passes through the second through-hole 2031 and is soldered to the second pad 2032.

[0035] By providing through-holes and pads on the circuit board 201, the conductive component 100, with its first lead 20 and second lead 30, can also form a DIP connector during the DIP soldering stage. This allows the leads of the conductive component 100 to pass directly through the through-holes, achieving initial positioning and installation of the conductive component 100 and the circuit board 201. Then, the conductive component 100 and the circuit board 201 are placed together in a soldering device for soldering, making the operation convenient and fast. As an example, the conductive component 100 and the circuit board 201 are wave soldered in the soldering device.

[0036] In some embodiments, when there are multiple conductive elements 100, adjacent first through holes 2021 and second through holes 2031 on the circuit board 201 can be connected so that the ends of two adjacent conductive elements 100 can be fitted together.

[0037] In some embodiments, please refer to Figure 6 A circuit layer 204 is exposed between the first soldering portion 202 and the second soldering portion 203 of the circuit board 201, and the main body portion 10 of the conductive member 100 is in contact with the circuit layer 204. By providing an exposed circuit layer 204 on the circuit board 201 and making the surface of the main body portion 10 adhere to the circuit layer 204, the current-conducting area can be increased and the resistance reduced. In addition, by limiting the length and width of the conductive member 100 within a suitable range, the contact between the main body portion 10 of the conductive member 100 and the circuit layer 204 can be improved, further reducing the resistance.

[0038] By setting a circuit layer 204 on the circuit board 201, during the SMT surface mount technology (SMT) soldering process, the conductive component 100 can be inserted into the first through-hole 2021 and the second through-hole 2031, at which point the main body 10 is bonded to the circuit layer 204. After the conductive component 100 and other surface mount components are mounted on the circuit board 201, it is placed in a surface mount soldering machine for SMT soldering, thereby fixing the conductive component 100 to the circuit board 201 and soldering the circuit layer 204 to the conductive component 100.

[0039] In some embodiments, please refer to Figure 8The circuit has multiple first welding portions 202 and second welding portions 203, and multiple conductive elements 100. These conductive elements 100 are connected end-to-end in a first direction X, and / or, they are connected side-by-side in a third direction Z. This structure allows the multiple conductive elements 100 to form a high-current transmission path on the circuit board 201, thus meeting the high-current transmission requirements of the PCBA circuit board.

[0040] In some embodiments, please refer to Figure 7 and Figure 8 When there are multiple conductive components 100 connected end-to-end and / or side-by-side, adjacent conductive components 100 are directly bonded together and connected at the connection point by a solder layer 205. This results in a small voltage drop and low resistance when current is transmitted between the two conductive components 100, which helps to reduce current loss. As an example, the solder layer 205 can be completed during the DIP soldering stage, that is, during the process of soldering the first pin 20 to the first pad 2022 and the second pin 30 to the second pad 2032, soldering is performed at the connection point of adjacent conductive components 100 to form the solder layer 205.

[0041] This application also provides an electronic device, which includes a circuit board assembly 200. The structure and function of the circuit board assembly 200 can be found in the above embodiments, and will not be repeated here.

[0042] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A conductive element, characterized in that, include: The main body has a first end and a second end in a first direction; A first foot is disposed at the first end and extends along a second direction, the second direction being perpendicular to the first direction; The second foot is disposed at the second end and extends along the second direction; The length L1 of the conductive element in the first direction satisfies: 15mm≤L1≤25mm; The width K1 of the conductive element in the third direction satisfies: 5mm≤K1≤15mm; The thickness H1 of the conductive component satisfies: 0.5mm≤H1≤1.5mm.

2. The conductive element according to claim 1, characterized in that, The length L1 of the conductive element in the first direction satisfies: 18mm≤L1≤22mm; The width K1 of the conductive element in the third direction satisfies: 8mm≤K1≤12mm; The thickness H1 of the conductive component satisfies: 0.8mm≤H1≤1.2mm.

3. The conductive element according to claim 1, characterized in that, The first foot and the second foot are located on the same side of the main body in the second direction; Alternatively, the first foot and the second foot are located on either side of the main body in the second direction.

4. The conductive element according to claim 1, characterized in that, The main body, the first foot, and the second foot are integrally formed; and / or, the conductive element comprises copper material.

5. The conductive element according to claim 1, characterized in that, In the first direction, the surface of the first foot away from the second foot is a first flat surface, and the surface of the second foot away from the first foot is a second flat surface. The first flat surface of one conductive element is used to fit and connect with the second flat surface of the other conductive element. or, In the first direction, the surface of the first foot away from the second foot is a convex first arc-shaped surface, and the surface of the second foot away from the first foot is a concave second arc-shaped surface. The first arc-shaped surface of one conductive element is used to fit and connect with the second arc-shaped surface of the other conductive element.

6. A circuit board assembly, characterized in that, Includes a circuit board and a conductive element as described in any one of claims 1-5. The circuit board includes a first welding portion and a second welding portion spaced apart, wherein the first foot is welded to the first welding portion and the second foot is welded to the second welding portion.

7. The circuit board assembly according to claim 6, characterized in that, The first welding portion includes a first through hole and a first pad, the first pad being disposed at at least a partial edge of the first through hole, the first foot being disposed through the first through hole, and the first foot being welded to the first pad; The second welding portion includes a second through hole and a second pad, the second pad being disposed at at least a partial edge of the second through hole, the second foot being disposed through the second through hole, and the second foot being welded to the second pad.

8. The circuit board assembly according to claim 6, characterized in that, A circuit layer is exposed between the first welded portion and the second welded portion, and the main body portion of the conductive component is in contact with the circuit layer.

9. The circuit board assembly according to claim 6, characterized in that, The number of the first welding part and the second welding part is multiple, the number of the conductive parts is multiple, the multiple conductive parts are connected end to end in the first direction, and / or, the multiple conductive parts are connected side by side in the third direction; adjacent two conductive parts are welded by a tin layer.

10. An electronic device, characterized in that, Includes the circuit board assembly as described in any one of claims 6-9.

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