Optical communication integrated circuit board

Abstract

The utility model belongs to the technical field of signal transmission discloses a kind of line board of optical communication integration.The line board of optical communication integration includes line board body and fiber coupler.Wherein, line board body has opposite first face and second face, and first face and second face are used for integrated device;Fiber coupler is in the direction from first face to second face, and it is through line board body, and the device in first face is connected with fiber coupler by fiber, and the device in second face is connected with fiber coupler by fiber, to make the device on the both sides of line board body signal connection by fiber coupler.Through the utility model, the selectivity of fiber line layout can be expanded, so as to solve the problems of difficulty in assembly, difficulty in troubleshooting and maintenance, and improve the overall space utilization efficiency.

Description

Technical Field

[0001] This utility model relates to the technical field of signal transmission, and in particular to a circuit board for optical communication integration. Background Technology

[0002] The application of artificial intelligence and deep learning is driving the demand for high-speed computing and high-speed data transmission. In high-speed computing centers, such as deep learning computations, the data exchange speed between server chip modules has become a bottleneck. Many computations can only continue after sufficient data has been transmitted to the chip.

[0003] In high-frequency signal transmission, traditional PCB copper traces exhibit significant insertion loss. For example, a 200µm wide, 10cm trace transmitting at 1 terahertz can experience insertion loss exceeding 20 dB. Therefore, technological advancements could consider utilizing light for signal transmission. An optical communication engine can be integrated into CPU / GPU / NPU units via a packaged structure, becoming a single computing unit. This approach transforms traditional chip modules into optical communication transmission, effectively improving data transmission speed and bandwidth.

[0004] Integrating optical paths and fiber optic couplers into the structure of traditional PCB boards can easily lead to poor selectivity in optical circuit layout, resulting in increased assembly difficulty, difficulty in error detection and maintenance, and relatively low overall space utilization. Utility Model Content

[0005] The purpose of this invention is to provide an integrated optical communication circuit board that expands the options for fiber optic line layout, thereby solving problems such as increased assembly difficulty, difficulty in error detection and maintenance, and improving overall space utilization efficiency.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] Optical communication integrated circuit boards include:

[0008] The circuit board body has a first side and a second side, both of which are used to integrate devices.

[0009] An optical fiber coupler extends through the circuit board body in the direction from the first surface to the second surface. Devices located on the first surface are connected to the optical fiber coupler via optical fibers, and devices located on the second surface are connected to the optical fiber coupler via optical fibers, so that devices on both sides of the circuit board body are connected via the optical fiber coupler.

[0010] As an optional solution for an integrated optical communication circuit board, the circuit board body has a mounting hole extending through the circuit board body from the first surface to the second surface, and the fiber optic coupler portion is located within the mounting hole; or,

[0011] All of the fiber optic couplers are located inside the mounting holes.

[0012] As an optional solution for an integrated optical communication circuit board, the fiber optic coupler is bonded to the inner wall of the mounting hole.

[0013] As an optional solution for an integrated optical communication circuit board, the fiber optic coupler is interference-fitted to the inner wall of the mounting hole.

[0014] As an alternative solution for an integrated optical communication circuit board, the axis of the mounting hole is perpendicular to the extended plane where the first surface is located or the extended plane where the second surface is located.

[0015] As an optional solution for an integrated optical communication circuit board, the axis of the mounting hole is set at a first angle to the extended plane of the first surface or the extended plane of the second surface on the circuit board body, wherein the first angle is an acute angle.

[0016] As an optional solution for an integrated optical communication circuit board, multiple fiber optic coupler arrays are disposed on the circuit board body.

[0017] As an optional solution for an integrated optical communication circuit board, some components on one side of the circuit board body are circuit connectors and electro-optic signal conversion devices, while some components on the other side are optical path connectors.

[0018] As an optional solution for an integrated optical communication circuit board, some components on one side of the circuit board body are connected to the optical fiber coupler using a single optical fiber, while some components on the other side are connected to the optical fiber coupler using multiple optical fibers.

[0019] As an optional solution for an integrated optical communication circuit board, some components on both sides of the circuit board body are connected to the optical fiber coupler using multiple optical fibers.

[0020] The beneficial effects of this utility model are:

[0021] In this application, fiber optic couplers are integrated into the circuit board itself, providing a configured optical path. Furthermore, the "through-board" optical path connection, compared to a planar configuration, effectively saves the area occupied by the fiber optic lines, thus reducing the size of the circuit board, especially in scenarios with multiple cabling rows. Additionally, the "through-board" optical path connection is easier and simpler than a planar configuration, solving problems such as increased assembly difficulty, difficulty in troubleshooting, and maintenance. By integrating fiber optic couplers throughout the circuit board, efficient and flexible optical path organization in three-dimensional space is achieved, expanding the options for fiber optic line layout, improving space utilization efficiency, and enhancing cabling flexibility. This is crucial for space-sensitive applications such as modern data centers and 5G base stations, meaning that more powerful computing and communication capabilities can be deployed within the same space. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of the optical communication integrated circuit board provided in this embodiment of the utility model;

[0023] Figure 2 This is a schematic diagram of the structure provided by the embodiment of the present invention, showing that the mounting holes are vertically arranged on the circuit board body;

[0024] Figure 3 This is a schematic diagram of the structure provided by the embodiment of the present invention, showing that the mounting holes are inclinedly arranged on the circuit board body.

[0025] In the picture:

[0026] 1. Circuit board body; 11. First side; 12. Second side; 13. Mounting hole; 2. Fiber optic coupler; 3. Fiber optic cable; 4. Device; 5. Connector; 6. External device. Detailed Implementation

[0027] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0028] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0029] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0030] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0031] Please see the appendix Figure 1 -Appendix Figure 3 This embodiment relates to an optical communication integrated circuit board (hereinafter referred to as "circuit board"). The circuit board includes a circuit board body 1 and an optical fiber coupler 2. The circuit board body 1 has a first surface 11 and a second surface 12 facing each other, both of which are used to integrate devices 4. The optical fiber coupler 2 penetrates the circuit board body 1 in the direction from the first surface 11 to the second surface 12. Devices 4 located on the first surface 11 are connected to the optical fiber coupler 2 through optical fibers 3, and devices 4 located on the second surface 12 are also connected to the optical fiber coupler 2 through optical fibers 3, so that devices 4 on both sides of the circuit board body 1 are signal connected through the optical fiber coupler 2.

[0032] Specifically, the circuit board body 1 is typically flat, and various devices 4 are arranged on its first surface 11 and second surface 12. These devices 4 may include circuit connectors, electro-optical signal conversion devices, and optical path connectors. Circuit connectors include various electronic devices 4 and chips used in integrated circuits, while optical path connectors include lasers, fiber amplifiers, optical isolators, and other optical system devices. The fiber optic coupler 2 is an indispensable connection structure in optical communication systems, efficiently managing the optical signal path. Fiber optic couplers 2 can be classified in various ways according to different standards. For example, based on the fiber mode 3, they can be divided into single-mode fiber couplers, multimode fiber couplers, and polarization-maintaining fiber couplers. Single-mode fiber couplers typically operate at wavelengths of 1310nm or 1550nm and are used for long-distance trunk transmission; multimode fiber couplers typically operate at wavelengths of 850nm or 1300nm and are commonly used for short-distance transmission; polarization-maintaining fiber couplers are used to maintain the polarization state of optical signals and are used in special applications sensitive to polarization. The fiber optic coupler 2 is installed through the circuit board body 1 and connects the devices 4 on both sides through the optical fiber 3.

[0033] In this embodiment, by setting the fiber optic coupler 2 in the circuit board body 1, an optical path configuration is provided. Simultaneously, the "through-board" optical path connection, compared to a planar configuration, effectively saves the area occupied by the fiber optic coupler 2 and the fiber optic cable 3, thereby reducing the size of the circuit board, especially in scenarios with multiple cabling rows. Furthermore, the "through-board" optical path connection is easier and simpler than a planar configuration, thus solving problems such as high assembly difficulty, difficulty in troubleshooting, and high maintenance difficulty. By integrating the fiber optic coupler 2 through the circuit board body 1, efficient utilization and flexible organization of the optical path in three-dimensional space are achieved, expanding the selectivity of the fiber optic cable 3 layout, improving space utilization efficiency, and enhancing cabling flexibility. This is crucial for space-sensitive applications such as modern data centers and 5G base stations, allowing for the deployment of more powerful computing and communication capabilities within the same space.

[0034] External devices 6 can also be connected between device 4 and optical fiber 3 via connector 5. External devices 6 include, but are not limited to, devices for processing, manufacturing and transmitting optical signals.

[0035] In some embodiments, some components 4 on one side of the circuit board body 1 are circuit connectors and electro-optic signal conversion devices, while some components 4 on the other side are optical path connectors.

[0036] By separating the circuit connectors and optical connectors in device 4 on both sides of the circuit board body 1, the electrical (including CPU and electro-optic converter) module and the external optical path can be effectively separated, while also enhancing the selectivity of device 4 in structural layout design. The electronic circuit test points and optical circuit test points on the circuit board can be orthogonally arranged (i.e., arranged on both sides of the circuit board body 1 respectively), which can effectively avoid mutual interference during circuit and device 4 troubleshooting.

[0037] In some embodiments, the circuit board body 1 has a mounting hole 13 extending through the circuit board body 1 from the first surface 11 to the second surface 12, and the fiber optic coupler 2 is partially located within the mounting hole 13.

[0038] Specifically, the mounting hole 13 is typically a cylindrical hole. Part of the structure of the fiber optic coupler 2 can be adapted to form a cylindrical shape, with a diameter slightly smaller than the inner diameter of the mounting hole 13. Part of the fiber optic coupler 2 is inserted into the mounting hole 13, thus completing the positioning and installation. The fiber optic coupler 2 forms an annular limiting platform along its circumference, which abuts against the first surface 11 or the second surface 12, thereby achieving axial positioning along the mounting hole 13.

[0039] By embedding the fiber optic coupler 2 part into the mounting hole 13, the ease of installing and removing the fiber optic coupler 2 is effectively improved, and the assemblability is enhanced.

[0040] In other embodiments, the fiber optic coupler 2 is entirely located within the mounting hole 13.

[0041] Specifically, the fiber optic coupler 2 can be completely embedded in the mounting hole 13, thereby hiding the fiber optic coupler 2 inside the circuit board body 1, reducing space occupation and improving space utilization efficiency.

[0042] In some embodiments, the fiber optic coupler 2 is bonded to the inner wall of the mounting hole 13.

[0043] The fiber optic coupler 2 can be directly bonded to the inner wall of the mounting hole 13 using an adhesive. The type of adhesive can be adjusted according to usage requirements. Firstly, adhesive bonding ensures stable and reliable installation, preventing displacement or detachment of the fiber optic coupler 2 due to vibration or other factors during use. Secondly, the adhesive effectively absorbs vibrations and shocks from both internal and external sources, which is crucial for equipment that frequently needs to be moved or may be used in harsh vibration environments. This prevents the fiber optic coupler 2 from shifting due to physical disturbances, ensuring stable optical path alignment. Furthermore, using specialized thermally conductive adhesives not only provides bonding and fixation but also establishes a more efficient heat conduction channel between the fiber optic coupler 2 and the circuit board body 1. This helps dissipate the heat generated by the fiber optic coupler 2 during operation more quickly, preventing overheating from affecting performance and lifespan.

[0044] In some embodiments, the fiber optic coupler 2 is interference-fitted to the inner wall of the mounting hole 13.

[0045] By optimizing the mating dimensions between the fiber optic coupler 2 and the mounting hole 13, the fiber optic coupler 2 is interference-fitted onto the inner wall of the mounting hole 13.

[0046] The rigid connection formed by the interference fit of the fiber coupler 2 helps maintain the precise angle of the fiber 3 end face, avoiding optical path deviation caused by the shaking of the fiber coupler 2, which is very important for applications requiring high directional stability. The interference fit eliminates the need for additional screws, clips, or adhesives, simplifying the structural design around the mounting hole 13, making the assembly process faster, and facilitating automated production.

[0047] In some embodiments, the fiber optic coupler 2 can also be threaded into the inner wall of the mounting hole 13, which facilitates the installation and disassembly of the fiber optic coupler 2, especially for mass production operations, and can effectively improve production efficiency.

[0048] In some embodiments, the axis of the mounting hole 13 is perpendicular to the extension plane where the first surface 11 is located or the extension plane where the second surface 12 is located.

[0049] Specifically, when fiber coupler 2 is installed vertically, the transmission path of the optical signal is the shortest and most direct. This coupling method effectively reduces reflections and scattering caused by changes in orientation in the optical path, thereby significantly reducing insertion loss. At the same time, the vertical structure is generally less sensitive to polarization and wavelength, which helps maintain the quality of the signal waveform, crucial for high-speed optical communication.

[0050] In some embodiments, the axis of the mounting hole 13 is set at a first angle to the extended plane of the first surface 11 or the extended plane of the second surface 12 on the circuit board body 1, and the first angle is an acute angle.

[0051] Specifically, when the fiber optic coupler 2 is installed at an acute angle (e.g., 45° or 60° relative to the plane containing the first surface 11 or the second surface 12), the fiber optic cable 3 extending from the fiber optic coupler 2 can connect to the device 4 or adjacent circuit boards on the same side of the circuit board with a more natural and smoother arc. This smooth transition effectively reduces the bending radius of the fiber optic cable 3, lowering the risk of optical signal attenuation due to excessive bending. Simultaneously, the mechanical stress on the fiber optic cable 3 at the bend is also reduced, which helps improve the long-term reliability of the fiber optic cable 3 and reduce potential failure points. The inclined installation also provides convenience during equipment maintenance and commissioning, allowing operators to observe and approach the end face of the fiber optic coupler 2 from a better angle, making cleaning and plugging / unplugging operations easier and more precise. The optical signal is no longer limited to vertically "penetrating the board," but can travel along an inclined path towards a specific direction on the circuit board plane, facilitating connection to devices 4 in different locations. When the layout of device 4 is limited or needs to avoid certain areas of the circuit board body 1, the inclined optical path provides a flexible connection method.

[0052] In some embodiments, an array of multiple fiber optic couplers 2 is disposed on the circuit board body 1.

[0053] Specifically, the array-based layout significantly increases port density and transmission capacity, enabling parallel high-speed data transmission. It extends optical signal connections from the two-dimensional plane of the circuit board to three-dimensional space, achieving compact, three-dimensional stacking, which is crucial for accommodating more optical channels within a limited space. The array-based layout is typically fixed to the circuit board as a single module; this integrated mechanical structure helps improve mechanical stability. Modular design also greatly simplifies the operation and maintenance process. When a fault occurs in an optical path, maintenance personnel can quickly locate and replace the entire coupler array module, avoiding complex operations on individual fiber couplers at the board level, significantly improving maintainability.

[0054] In some embodiments, some devices 4 on one side of the circuit board body 1 are connected to the fiber optic coupler 2 using a single optical fiber 3, and some devices 4 on the other side are connected to the fiber optic coupler 2 using a single optical fiber 3.

[0055] By employing a one-to-one connection method, the optical signal path is more direct, avoiding the additional power distribution losses that may occur in complex branching, and helping to maintain higher signal strength. This reduces the number of fiber optic connection points and end faces, improving signal transmission quality, and is particularly suitable for high-speed communication.

[0056] In some embodiments, some devices 4 on one side of the circuit board body 1 are connected to the fiber optic coupler 2 using a single optical fiber 3, while some devices 4 on the other side are connected to the fiber optic coupler 2 using multiple optical fibers 3.

[0057] Specifically, a high-speed optical signal from a single device 4 (such as a core switching chip) on one side of the circuit board can be distributed to multiple optical fibers 3 on the other side after entering the optical fiber coupler 2, and then transmitted to multiple different users or processing units (such as multiple server nodes or access devices). This is suitable for scenarios such as data centers or distributed antenna systems that require one-to-many signals.

[0058] In some embodiments, some components 4 on both sides of the circuit board body 1 are connected to the fiber optic coupler 2 by multiple optical fibers 3.

[0059] Specifically, multiple optical fibers 3 are connected to optical fiber couplers 2 on both sides of the circuit board body 1, constructing a high-performance parallel optical interconnect channel. The most direct advantage of this design is that it can easily achieve ultra-high bandwidth data transmission. Splitting a single high-speed data stream into multiple optical fibers 3 for simultaneous transmission meets the interconnect bandwidth requirements of AI data centers and high-performance computing clusters. At the same time, it maximizes the number of connected ports per unit panel area, allowing for the placement of more electronic and optical components 4 on both sides of the circuit board body 1. The parallel arrangement of multiple optical fibers 3 has inherent redundancy characteristics; when some optical channels in the system fail, it can automatically switch to the normal channel, thereby improving reliability and maintainability.

[0060] In some embodiments, based on the fiber optic coupler 2 that penetrates the circuit board body 1, the co-packaged optical devices 4 such as CPU / GPU are directly transmitted through the fiber optic coupler 2 via laser. The fiber optic coupler 2 is connected to the devices 4 on the other side via the fiber optic 3 located on the other side of the circuit board body 1.

[0061] In this manner, the fiber optic coupler 2 can be directly connected to the fiber optic cable 3 on the other side via laser, and the other fiber optic cable 3 can be used to connect to some devices 4 on the other side. This reduces the number of fibers 3, further reduces the space occupied by fibers 3 on one side of the circuit board body 1, and improves space utilization efficiency and the neatness of the circuit layout.

[0062] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. An integrated circuit board for optical communication, characterized in that, include: The circuit board body (1) has a first surface (11) and a second surface (12) opposite to each other, both of which are used to integrate devices (4). The fiber optic coupler (2) extends through the circuit board body (1) in the direction from the first surface (11) to the second surface (12). The device (4) located on the first surface (11) is connected to the fiber optic coupler (2) through the fiber optic cable (3), and the device (4) located on the second surface (12) is connected to the fiber optic coupler (2) through the fiber optic cable (3), so that the devices (4) on both sides of the circuit board body (1) are connected by the fiber optic coupler (2).

2. The optical communication integrated circuit board according to claim 1, characterized in that, The circuit board body (1) has a mounting hole (13) extending from the first surface (11) to the second surface (12) through the circuit board body (1), and the fiber optic coupler (2) is partially located within the mounting hole (13); or, All of the fiber optic couplers (2) are located inside the mounting holes (13).

3. The optical communication integrated circuit board according to claim 2, characterized in that, The fiber optic coupler (2) is bonded to the inner wall of the mounting hole (13).

4. The optical communication integrated circuit board according to claim 2, characterized in that, The fiber optic coupler (2) is interference-fitted to the inner wall of the mounting hole (13).

5. The optical communication integrated circuit board according to claim 2, characterized in that, The axis of the mounting hole (13) is perpendicular to the extension plane where the first surface (11) is located or the extension plane where the second surface (12) is located.

6. The optical communication integrated circuit board according to claim 2, characterized in that, The axis of the mounting hole (13) is set at a first angle to the extended plane of the first surface (11) or the extended plane of the second surface (12) on the circuit board body (1), and the first angle is an acute angle.

7. The optical communication integrated circuit board according to any one of claims 1-6, characterized in that, An array of multiple optical fiber couplers (2) is disposed on the circuit board body (1).

8. The optical communication integrated circuit board according to any one of claims 1-6, characterized in that, The circuit board body (1) has some components (4) on one side that are circuit connectors and electro-optic signal conversion devices, and some components (4) on the other side that are optical path connectors.

9. The optical communication integrated circuit board according to any one of claims 1-6, characterized in that, On one side of the circuit board body (1), some components (4) are connected to the fiber optic coupler (2) using a single optical fiber (3), while on the other side, some components (4) are connected to the fiber optic coupler (2) using multiple optical fibers (3).

10. The optical communication integrated circuit board according to any one of claims 1-6, characterized in that, The components (4) on both sides of the circuit board body (1) are connected to the fiber optic coupler (2) by multiple optical fibers (3).

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