Battery protection plate and battery

Abstract

The application relates to the technical field of batteries, in particular to a battery protection plate and a battery. The battery protection plate comprises a soft plate and a hard plate. The soft plate comprises a plate body, a first surface copper foil layer, a second surface copper foil layer, a copper-plated via, a first surface insulating layer and a second surface insulating layer. The plate body comprises a first surface and a second surface which are opposite to each other in the thickness direction of the plate body. The first surface insulating layer and the second surface insulating layer are respectively arranged on the first surface and the second surface. Part of the copper foil of the first surface copper foil layer is exposed to the first surface insulating layer to form a solder pad. The second surface copper foil layer comprises a current-carrying copper foil corresponding to the solder pad. The solder pad and the current-carrying copper foil are electrically connected through the copper-plated via. The second surface insulating layer covers the current-carrying copper foil. The solder pad is welded with a connecting solder pad of the hard plate. The battery protection plate and the battery provided by the application solve the problem that the existing soft plate solder pad is generally designed as a double-sided window, which not only increases the process and cost, but also increases the thickness of the PCM.

Description

Technical Field

[0001] This application relates to the field of battery technology, and in particular to a battery protection board and a battery. Background Technology

[0002] A battery protection circuit module (PCM) is a crucial component that protects batteries from damage caused by overcharging, over-discharging, and short circuits. PCMs include flexible printed circuit boards (FPCs) and printed circuit boards (PCBs).

[0003] In this system, protection devices are typically mounted on rigid boards, while flexible boards are generally used to connect the battery and the main unit. Currently, the connection between flexible and rigid boards is mainly achieved through soldering. Flexible board pads are generally designed with double-sided openings. Because of this design, the process is relatively simple when connecting copper-plated vias to both sides of the pads. However, this double-sided opening design requires that after one side of the flexible board pad is soldered to the rigid board pad, the other side of the flexible board pad needs to be coated with UV adhesive to prevent exposed copper or solder. This adhesive application for insulation not only increases the number of steps and costs but also increases the PCM thickness. Utility Model Content

[0004] The purpose of this application is to provide a battery protection board and a battery, thereby solving the problem that the existing flexible circuit board pads are generally designed with double-sided openings, which not only increases the process and cost, but also increases the thickness of the PCM.

[0005] A first aspect of this application provides a battery protection board, which includes a flexible board and a rigid board. The flexible board includes a board body, a first surface copper foil layer, a second surface copper foil layer, copper-plated vias, a first surface insulating layer, and a second surface insulating layer. The board body includes a first surface and a second surface opposite to each other in its thickness direction. The first surface insulating layer and the second surface insulating layer are respectively disposed on the first surface and the second surface. A portion of the copper foil in the first surface copper foil layer is exposed on the first surface insulating layer to form a pad. The second surface copper foil layer includes a current-carrying copper foil corresponding to the pad. The pad and the current-carrying copper foil are electrically connected through copper-plated vias. The second surface insulating layer covers the current-carrying copper foil. The pad is soldered to the connection pad of the rigid board.

[0006] In any of the above technical solutions, the number of copper-plated vias is multiple, and the copper-plated vias are formed into a hollow structure.

[0007] In any of the above technical solutions, the copper-plated via is further formed into an annular ring structure, and the copper-plated via penetrates the pad and the copper foil; the surface of the pad is provided with an exhaust groove; the exhaust groove passes through multiple copper-plated vias, the two ends of the exhaust groove are open, and there is an exhaust gap between the two ends of the exhaust groove and the first surface insulating layer.

[0008] In any of the above technical solutions, the board body further includes a width direction and a length direction perpendicular to the thickness direction, and the pads are parallel to the length direction; a plurality of copper-plated vias are arranged in a matrix, and there are multiple venting grooves, which are spaced apart along the width direction, and each venting groove extends along the length direction to pass through the copper-plated vias included in the same row; and / or, a plurality of venting grooves are spaced apart along the length direction, and each venting groove extends along the width direction to pass through the copper-plated vias included in the same column.

[0009] In any of the above technical solutions, the venting groove is further defined as a through groove that penetrates the pad itself.

[0010] In any of the above technical solutions, the copper-plated via is further formed as a semi-annular ring structure, and the copper-plated via penetrates the pad and the current-carrying copper foil; a semi-circular notch structure is provided on the edge of the pad, and the semi-circular notch structure is electrically connected to the current-carrying copper foil through the copper-plated via; there is an exhaust gap between the cut surface of the copper-plated via and the first surface insulating layer, the cut surface extends along the thickness direction, the cut surface passes through the diameter of the semi-circular notch structure, and is aligned with the edge of the pad.

[0011] In any of the above technical solutions, the board body further includes a width direction and a length direction that are perpendicular to the thickness direction, and the pads are parallel to the length direction; the pads have semi-circular notch structures on their opposite sides in the width direction; and / or the pads have semi-circular notch structures on their opposite sides in the length direction.

[0012] In any of the above technical solutions, the copper-plated via is further formed into an annular ring structure; the copper-plated via does not penetrate the pad, and the surface of the copper-plated via is electrically connected to the pad through a wire.

[0013] In any of the above technical solutions, the number of copper-plated vias is further multiplied, and the hollow area of ​​the copper-plated vias is filled to form a solid structure; the copper-plated vias penetrate the pads and contact the copper foil.

[0014] According to a second aspect of this application, a battery is provided, including the battery protection board as described above.

[0015] The battery protection board of this application includes a flexible board and a rigid board. The flexible board includes a board body, a first surface copper foil layer, a second surface copper foil layer, copper-plated vias, a first surface insulating layer, and a second surface insulating layer. The board body includes a first surface and a second surface opposite to each other in its thickness direction. The first and second surface insulating layers respectively cover the first and second surfaces. A portion of the copper foil in the first surface copper foil layer is exposed on the first surface insulating layer to form pads. The second surface copper foil layer includes current-carrying copper foil corresponding to the pads. The pads and current-carrying copper foil are electrically connected through copper-plated vias. The second surface insulating layer covers the current-carrying copper foil. The pads are soldered to the connection pads of the rigid board.

[0016] Based on the above technical features, the beneficial effects of this application are as follows: In this application's battery protection board, after the pads on the first side of the flexible circuit board are soldered to the connection pads on the rigid circuit board, the solder joints do not expose copper or solder. Furthermore, the second side of the flexible circuit board (the copper foil corresponding to the pads) is covered by a second surface insulating layer, so there is also no exposed copper or solder. Therefore, this application eliminates the need for UV adhesive for insulation protection, reducing costs and PCM thickness compared to existing technologies. In other words, this application sets the flexible circuit board to a single-sided opening, meaning the side soldered to the rigid circuit board exposes copper to form pads, while the non-soldering side is covered by an insulating layer, preventing copper exposure. Compared to existing technologies, this application eliminates the need for adhesive application for insulation protection, reducing costs and PCM thickness.

[0017] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This diagram shows a schematic representation of the flexible printed circuit board in the first embodiment of this application. Figure 2 This invention provides a schematic diagram of the flexible printed circuit board structure in a second embodiment. Figure 3 A schematic diagram of the flexible printed circuit board according to the third embodiment of this application is shown; Figure 4 A schematic diagram of the flexible printed circuit board according to the fourth embodiment of this application is shown; Figure 5 A structural schematic diagram of the other side of the flexible printed circuit board in this application; Figure 6 This application provides a schematic diagram of the structure after the flexible and rigid boards are welded together.

[0020] Icons: 100-Flexible board; 110-Board body; 120-Copper plated via; 130-Pad; 131-Ventilation groove; 140-Electrical connector; 132-Semi-circular notch structure; 200-Rigid board; X-Length direction; Y-Width direction; Z-Thickness direction. Detailed Implementation

[0021] The following detailed embodiments are provided to help the reader gain a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will be apparent after understanding the disclosure of this application. For example, the order of operations described herein is merely illustrative and is not limited to the order set forth herein; changes that will be apparent after understanding the disclosure of this application are possible, except for operations that must occur in a specific order. Furthermore, for clarity and brevity, descriptions of features known in the art may be omitted.

[0022] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many feasible ways of implementing the methods, apparatus, and / or systems described herein that will be apparent upon understanding the disclosure of this application.

[0023] Throughout the specification, when an element (such as a layer, region, or substrate) is described as being "on" another element, "connected to" another element, "bonded to" another element, "on" another element, or "covering" another element, it may be directly "on" another element, "connected to" another element, "bonded to" another element, "on" another element, or "covering" another element, or there may be one or more other elements in between. In contrast, when an element is described as being "directly on" another element, "directly connected to" another element, "directly bonded to" another element, "directly on" another element, or "directly covering" another element, there may be no other elements in between.

[0024] As used herein, the term “and / or” includes any one of the relevant items listed and any combination of any two or more items.

[0025] Although terms such as “first,” “second,” and “third” may be used herein to describe individual components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts are not limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Therefore, without departing from the teachings of the examples described herein, the first component, assembly, region, layer, or part referred to as the second component, assembly, region, layer, or part may also be referred to as the second component, assembly, region, layer, or part.

[0026] For ease of description, spatial relation terms such as “above,” “upper,” “below,” and “lower” are used herein to describe the relationship between one element and another, as shown in the accompanying drawings. Such spatial relation terms are intended to include not only the orientation depicted in the drawings but also different orientations of the device during use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “upper” relative to another element will subsequently be “below” or “lower” relative to that other element. Therefore, the term “above” includes both “above” and “below” orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relation terms used herein will be interpreted accordingly.

[0027] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms “comprising,” “including,” and “having” enumerate the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0028] Variations in the shapes shown in the accompanying drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include changes in shape that may occur during manufacturing.

[0029] The features of the examples described herein can be combined in various ways that will be apparent upon understanding the disclosure of this application. Furthermore, although the examples described herein have a wide variety of constructions, other constructions are possible, as will be apparent upon understanding the disclosure of this application.

[0030] The first aspect of this application provides a battery protection board, thereby solving the problem that existing flexible circuit board pads generally have a double-sided window design, which not only increases the process and cost, but also increases the PCM thickness. See below for reference. Figures 1 to 6This application describes a battery protection board according to some embodiments. For ease of description, the board body 110 will be described below with reference to the pairwise perpendicular length direction X, width direction Y, and thickness direction Z, where perpendicularity can be 90° ± 5°.

[0031] like Figures 1 to 6 As shown, the battery protection board of this application includes a flexible board 100 and a rigid board 200. The flexible board 100 includes a board body 110, a first surface copper foil layer, a second surface copper foil layer, copper-plated vias 120, a first surface insulating layer, and a second surface insulating layer. The board body 110 includes a first surface and a second surface opposite to each other in its thickness direction Z. The first and second surface insulating layers respectively cover the first and second surfaces. A portion of the copper foil in the first surface copper foil layer is exposed to form a pad 130. The second surface copper foil layer includes a current-carrying copper foil corresponding to the pad 130. The pad 130 and the current-carrying copper foil are electrically connected through the copper-plated vias 120, which are used for electrical conduction. The current in the first surface copper foil layer (pad 130) and the second surface copper foil layer (current-carrying copper foil) is used to increase the current flow. The second surface insulating layer covers the current-carrying copper foil. The pad 130 is soldered to the connection pad of the rigid board 200.

[0032] With this configuration, in the battery protection board of this application, after the pads 130 on the first side of the flexible board 100 and the connecting pads of the rigid board 200 are soldered, the solder joints do not expose copper or solder. Furthermore, the second side of the flexible board 100 (the current-carrying copper foil corresponding to the pads 130) is covered by the second surface insulating layer, so there is also no exposed copper or solder. Therefore, this application does not require UV adhesive for insulation protection, reducing costs and PCM thickness compared to existing technologies. In other words, this application sets the flexible board 100 to a single-sided opening, meaning the soldering side connected to the rigid board 200 exposes copper, forming the pads 130, while the non-soldering side is covered by an insulating layer and does not expose copper. Compared to the existing double-sided opening scheme for flexible board pads, although the copper-plated vias 120 have a relatively complex process when connecting the pads 130 and the current-carrying copper foil, this application eliminates the need for subsequent adhesive application for insulation protection, reducing costs and PCM thickness.

[0033] Furthermore, when soldering the pads 130 of the flexible circuit board 100 to the connection pads of the rigid circuit board 200, soldering bubbles and solder balls are easily generated due to the copper-plated vias 120. Therefore, the flexible circuit board 100 of this application is designed as follows: In the first embodiment, as Figure 1 As shown: Multiple copper-plated vias 120 are used, forming hollow copper-plated through-holes in annular shape, penetrating the pad 130 and the current-carrying copper foil. This arrangement increases the conductive path, reduces resistance, and improves current-carrying capacity. Furthermore, compared to solid copper-plated vias, hollow copper-plated vias do not require filler material or complex electroplating processes to fill the holes, reducing manufacturing steps and production costs.

[0034] Furthermore, the surface of the pad 130 is provided with an venting groove 131. The venting groove 131 is either a through groove that penetrates the pad 130 itself or a blind groove that does not penetrate the pad 130 itself. The venting groove 131 passes through multiple copper-plated vias 120. Both ends of the venting groove 131 are open, and there is a venting gap between the two ends of the venting groove 131 and the first surface insulating layer. With this configuration, when the pad 130 of the flexible board 100 is reflow soldered to the connection pad of the rigid board 200, the gas in the copper-plated vias 120 will be discharged through the two ends of the venting groove 131, avoiding soldering bubbles and solder balls.

[0035] In this embodiment, preferably, the pad 130 is parallel to the length direction X, and the plurality of copper-plated vias 120 are arranged in a matrix. There are multiple venting grooves 131, spaced apart along the width direction Y. Each venting groove 131 extends along the length direction X to pass through the copper-plated vias 120 included in the same row. Alternatively, the plurality of venting grooves 131 are spaced apart along the length direction X, and each venting groove 131 extends along the width direction Y to pass through the copper-plated vias 120 included in the same column. This arrangement etches away copper between the copper-plated vias 120 on the surface of the pad 130 and between the copper-plated vias 120 and the edge of the pad 130 to form venting grooves 131, which are used to expel gas from the copper-plated vias 120 during reflow soldering, avoiding soldering bubbles and solder ball problems.

[0036] In this embodiment, preferably, the venting groove 131 is a through groove that penetrates the solder pad 130 itself. This can prevent solder from flowing into the venting groove 131 and blocking the venting groove 131, thus preventing the gas from being difficult to expel.

[0037] In the second embodiment, as Figure 2 As shown: Multiple copper-plated vias are used, forming a hollow structure that penetrates the pad 130 and the current-carrying copper foil. This arrangement increases the conductive path, reduces resistance, and improves current-carrying capacity. Furthermore, compared to solid copper-plated vias, hollow copper-plated vias do not require filler material or complex electroplating processes to fill the holes, reducing manufacturing steps and production costs.

[0038] In this embodiment, the copper-plated via is further formed into a semi-annular ring structure. A semi-circular notch structure 132 is provided at the edge of the pad 130. The semi-circular notch structure 132 is electrically connected to the current-carrying copper foil through the copper-plated via. An venting gap exists between the cut surface of the copper-plated via and the first surface insulating layer. Here, the cut surface refers to the vertical cut surface in the semi-annular ring structure used to cut the circle (forming a semi-annular opening). The cut surface extends along the thickness direction Z, passing through both the diameter of the copper-plated via and the diameter of the semi-circular notch structure, and is aligned with the edge of the pad. That is, an venting gap exists between the "opening" of the semi-annular ring structure and the first surface insulating layer. With this configuration, when the pad 130 of the flexible board 100 is reflow soldered to the connection pad of the rigid board 200, the gas inside the copper-plated via will be discharged through the venting gap, avoiding soldering bubbles and solder ball problems. Furthermore, preferably, the current-carrying copper foil includes at least a semi-circular notch structure corresponding to the semi-circular notch structure 132 to facilitate the connection of the copper-plated via 120.

[0039] In this embodiment, preferably, the pad 130 is parallel to the length direction X, and the pad 130 has semi-circular notch structures 132 on its opposite sides in the width direction Y; and / or, the pad 130 has semi-circular notch structures 132 on its opposite sides in the length direction X. This configuration moves the copper-plated via to the edge of the pad 130, forming a half-hole, through which electrical connections are made. Because the copper-plated via is at the edge of the pad 130, soldering bubbles and solder balls are avoided.

[0040] In the third embodiment, as Figure 3 As shown: Multiple copper-plated vias 120 are used, and each via 120 is formed into a hollow structure. This arrangement increases the conductive path, reduces resistance, and improves current carrying capacity. Furthermore, compared to solid copper-plated vias, hollow copper-plated vias do not require filler material or complex electroplating processes to fill the holes, reducing manufacturing steps and production costs.

[0041] In this embodiment, the copper-plated via 120 is further formed as an annular structure, and does not penetrate the pad 130. The surface of the copper-plated via 120 is electrically connected to the pad 130 via a wire. This arrangement moves the copper-plated via 120 outside the pad 130, allowing it to be electrically connected via a trace or copper foil. Because the copper-plated via 120 is outside the pad 130, soldering bubbles and solder balls are avoided. Preferably, in this embodiment, the current-carrying copper foil is also connected to the bottom surface of the copper-plated via via a trace or copper foil.

[0042] In the fourth embodiment, as Figure 4 As shown: Multiple copper-plated vias 120 are formed as solid structures, meaning the hollow areas of the copper-plated vias are filled to create a solid structure. The copper-plated vias 120 penetrate the pads 130 and contact the copper foil. This configuration transforms the copper-plated through-holes in the three embodiments described above into copper-plated blind vias. By using electroplating to fill the vias 120 with copper plating, no gas escapes, avoiding soldering bubbles and solder ball issues. For example, the process can employ laser-drilled blind vias followed by electroplating to fill the holes.

[0043] As described above, in the embodiments of this application, the pads 130 of the flexible circuit board 100 are output pads. Figures 1 to 4 The diagram illustrates the configuration of four pads 130. Similarly, there are also four current-carrying copper foils, each corresponding to one of the four pads 130, and the current-carrying copper foils are connected to their corresponding pads 130 via copper-plated vias 120. In addition, an electrical connector 140 is formed on the second surface copper foil layer of the flexible circuit board 100.

[0044] In summary, in this application's battery protection board, after the pads 130 on the first side of the flexible board 100 and the connecting pads of the rigid board 200 are soldered, the solder joints do not expose copper or solder. Furthermore, the second side of the flexible board 100 (the current-carrying copper foil corresponding to the pads 130) is covered by a second-surface insulating layer, so there is also no exposed copper or solder. Therefore, this application does not require UV adhesive for insulation protection, reducing costs and PCM thickness compared to existing technologies, and saving space occupied by the battery protection board within the battery. In other words, this application sets the flexible board 100 to a single-sided opening, meaning the side soldered to the rigid board 200 exposes copper to form the pads 130, while the non-soldering side is covered by an insulating layer, preventing copper exposure. Compared to the existing double-sided opening scheme for flexible board pads, although the process of connecting the pads and current-carrying copper foil using copper-plated vias 120 is relatively complex, this application eliminates the need for subsequent adhesive application for insulation protection, reducing costs and PCM thickness.

[0045] A second aspect of this application provides a battery including the battery protection board described above.

[0046] Finally, it should be noted that the above-described embodiments are merely specific implementations of this application, used to illustrate the technical solutions of this application, and not to limit them. The protection scope of this application is not limited thereto. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments within the scope of the technology disclosed in this application, or make equivalent substitutions for some of the technical features. Such modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be covered within the protection scope of this application.

Claims

1. A battery protection board, characterized in that, The battery protection board includes a flexible board and a rigid board. The flexible board includes a board body, a first surface copper foil layer, a second surface copper foil layer, copper-plated vias, a first surface insulating layer, and a second surface insulating layer. The plate body includes a first surface and a second surface that are opposite to each other in its own thickness direction, and the first surface insulating layer and the second surface insulating layer are respectively covered on the first surface and the second surface; A portion of the copper foil in the first surface copper foil layer is exposed to the first surface insulating layer to form a pad. The second surface copper foil layer includes a current-carrying copper foil corresponding to the pad. The pad and the current-carrying copper foil are electrically connected through copper-plated vias. The second surface insulating layer covers the current-carrying copper foil. The pads are welded to the connection pads of the rigid plate.

2. The battery protection board according to claim 1, characterized in that, The number of copper-plated vias is multiple, and the copper-plated vias are formed into a hollow structure.

3. The battery protection board according to claim 2, characterized in that, The copper-plated via is formed into a ring-shaped structure, and the copper-plated via penetrates the pad and the copper foil. The surface of the pad is provided with an exhaust groove, which passes through multiple copper-plated vias. Both ends of the exhaust groove are open, and there is an exhaust gap between the two ends of the exhaust groove and the first surface insulating layer.

4. The battery protection board according to claim 3, characterized in that, The board body includes a width direction and a length direction that are perpendicular to the thickness direction, and the pads are parallel to the length direction; The plurality of copper-plated vias are arranged in a matrix, and the number of venting grooves is plurality of, the plurality of venting grooves are spaced apart along the width direction, and each venting groove extends along the length direction to pass through the copper-plated vias included in the same row; And / or, a plurality of the venting grooves are spaced apart along the length direction, and each of the venting grooves extends along the width direction to pass through the copper-plated vias included in the same column.

5. The battery protection board according to claim 3, characterized in that, The venting groove is a through groove that penetrates the pad itself.

6. The battery protection board according to claim 2, characterized in that, The copper-plated via is formed into a semi-annular ring structure, and the copper-plated via penetrates the pad and the copper foil. The edge of the pad is provided with a semi-circular notch structure, and the semi-circular notch structure is electrically connected to the overcurrent copper foil through the copper-plated via. There is an venting gap between the cut surface of the copper-plated via and the first surface insulating layer. The cut surface extends along the thickness direction, passes through the diameter of the semi-circular notch structure, and is aligned with the edge of the pad.

7. The battery protection board according to claim 6, characterized in that, The board body includes a width direction and a length direction that are perpendicular to the thickness direction, and the pads are parallel to the length direction; The pads have semi-circular notches on their opposite sides in the width direction; and / or, the pads have semi-circular notches on their opposite sides in the length direction.

8. The battery protection board according to claim 2, characterized in that, The copper-plated vias are formed into an annular ring structure; The copper-plated via does not penetrate the pad, and the surface of the copper-plated via is electrically connected to the pad via a wire.

9. The battery protection board according to claim 1, characterized in that, The number of copper-plated vias is multiple, and the hollow areas of the copper-plated vias are filled to form a solid structure; The copper-plated via penetrates the pad and contacts the copper foil.

10. A battery, characterized in that, Includes the battery protection board according to any one of claims 1-9.

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