Solid state relay

Abstract

The utility model provides a kind of solid-state relay, including power module, control module and connecting piece.Power module includes first circuit board, at least one power component and multiple conductive pads.Power component is electrically connected with conductive pad and is configured on the opposite surface of first circuit board.Control module includes second circuit board and control component, control component is electrically connected and is configured on second circuit board.Connecting piece is electrically connected and is arranged in first circuit board and second circuit board, wherein second circuit board is supported above first circuit board by connecting piece.

Description

Technical Field

[0001] This utility model relates to a solid-state relay. Background Technology

[0002] Solid-state relays (SSRs) have always held an important position in industrial electronic applications. They are essentially electronic switch control circuits. For ease of use, the finished products are standardized and packaged into a component with locking contacts on both sides for electrical connection to the power supply line. One side is the input control terminal, and the other side is the controlled load terminal. When a small voltage is applied to the input control terminal, it can form a conduction with the controlled load terminal.

[0003] While the original package design offers ease of use and connection, there is room for improvement in the packaged form factor. In particular, issues that need to be considered and addressed by those skilled in the art include fitting the space required for the application environment and avoiding parasitic inductance caused by the solid-state relay and surrounding electronic components or circuitry. Utility Model Content

[0004] This invention provides a solid-state relay whose size and circuit configuration meet the space utilization requirements of the usage environment and can effectively reduce parasitic inductance.

[0005] This utility model discloses a solid-state relay, comprising a power module, a control module, and a connector. The power module includes a first circuit board, at least one power component, and multiple conductive pads. The power component is electrically connected to the conductive pads and disposed on opposite surfaces of the first circuit board. The control module includes a second circuit board and a control component, the control component being electrically connected and disposed on the second circuit board. The connector is electrically connected and passes through the first and second circuit boards, wherein the second circuit board is supported above the first circuit board by the connector.

[0006] In one embodiment of this utility model, the power component, the first circuit board and the conductive pad form a via-in-pad (VIP) structure so that the power component is electrically connected to the conductive pad.

[0007] In one embodiment of this utility model, the aforementioned through hole is a hollow structure, and the hole wall is provided with a conductive layer.

[0008] In one embodiment of this utility model, the aforementioned through-hole is filled with conductive material.

[0009] In one embodiment of this invention, the power component described above is a metal-oxide-semiconductor field-effect transistor (MOSFET).

[0010] In one embodiment of the present invention, the connector includes a conductive post and a stop block. The conductive post passes through the stop block and is soldered to a first circuit board and a second circuit board. The second circuit board is supported on the stop block.

[0011] In one embodiment of this utility model, the solid-state relay further includes adhesive material covering the power module, control module, and connectors.

[0012] In one embodiment of the present invention, the solid-state relay further includes a housing, which is assembled to a first circuit board to cover the power components, connectors, control module and adhesive material, and the adhesive material fills the space between the housing and the first circuit board.

[0013] Based on the above, since the solid-state relay is configured with the first and second circuit boards on top of each other, the power module and control module are separated. This effectively reduces the footprint of the solid-state relay during configuration, thus improving its configuration efficiency in its operating environment. Furthermore, the top-bottom configuration allows for easier component replacement and maintenance, in addition to the stacked assembly of the solid-state relay, thereby meeting usage requirements and extending its service life.

[0014] To make the above-mentioned features and advantages of this utility model more apparent and understandable, specific embodiments are described below, and detailed descriptions are provided in conjunction with the accompanying drawings. Attached Figure Description

[0015] Figure 1 This is an exploded view of a solid-state relay according to an embodiment of the present invention.

[0016] Figure 2 Drawing from another perspective Figure 1 Solid-state relays.

[0017] Figure 3 yes Figure 1 A partial cross-sectional view of the first circuit board.

[0018] Figure 4 This is a partial cross-sectional view of the first circuit board in another embodiment.

[0019] Figure 5 This is a schematic diagram of another embodiment of a solid-state relay.

[0020] Explanation of reference numerals in the attached figures 100: Solid State Relay 110: Power Module 111: First circuit board 112: Power Components 113: Conductive pad 114, 124: Through holes 115, 116: Through holes 115a: Conductive layer 116a: Conductive material 120: Control Module 121: Second circuit board 122: Control Components 123: Passive Components 130: Connector 131: Conductive post 132: Stop block 140: Outer shell 150, 250: Adhesive material S1: First surface S2: Second surface Detailed Implementation Figure 1 This is an exploded view of a solid-state relay according to an embodiment of the present invention. Figure 2 Drawing from another perspective Figure 1 Solid-state relays. Please also refer to... Figure 1 and Figure 2 In this embodiment, the solid-state relay 100 includes a power module 110, a control module 120, and a connector 130. The power module 110 includes a first circuit board 111, at least one power component 112, and a plurality of conductive pads 113. The power component 112 is, for example, a metal-oxide-semiconductor field-effect transistor (MOSFET), which is electrically connected to the conductive pads 113 and disposed on opposite surfaces of the first circuit board 111 (here, the power component 112 is disposed on the first surface S1, and the conductive pads 113 are disposed on the second surface S2). The control module 120 includes a second circuit board 121, a control component 122, and a passive component 123, wherein the control component 122 and the passive component 123 are electrically connected and disposed on opposite surfaces of the second circuit board 121. The connector 130 is electrically connected through the first circuit board 111 and the second circuit board 121, wherein the second circuit board 121 is supported above the first circuit board 111 by the connector 130.

[0021] Figure 3 yes Figure 1 A partial cross-sectional view of the first circuit board. Please also refer to... Figures 1 to 3Furthermore, in this embodiment, the power component 112, the first circuit board 111, and the conductive pad 113 form a via-in-pad (VIP) structure, so that the power component 112 is electrically connected to the conductive pad 113. This effectively reduces the area occupied by the power component 112 on the first circuit board 111 while maintaining electrical conductivity, thus effectively reducing the actual area occupied by the first circuit board 111. More importantly, the via-in-pad structure also reduces the path for current transmission between the power component 112 and external components. Compared to existing solid-state relays that require pin-based electrical connections to external components, this application significantly improves electrical transmission efficiency while also greatly reducing parasitic inductance. Figure 3 The diagram shows one embodiment of the present invention, in which the through hole 115 has a hollow structure, but a conductive layer 115a is provided on the hole wall to achieve the desired electrical conductivity effect.

[0022] Figure 4 This is a partial cross-sectional view of the first circuit board according to another embodiment. Please refer to... Figure 4 And compare Figure 3 Unlike the previous embodiment, this embodiment achieves the purpose of vertical conductivity by filling the through hole 116 with conductive material 116a.

[0023] In addition, please refer to Figure 1 and Figure 2 In this embodiment, the connector 130 (shown in four parts, but not limited to this) includes a conductive post 131 and a stop block 132. The conductive post 131 passes through the stop block 132 and is soldered to the through hole 114 of the first circuit board 111 and the through hole 124 of the second circuit board 121. The upper end of the conductive post 131 passes through the through hole 124, thereby supporting the second circuit board 121 on the stop block 132 to maintain the required gap between the first circuit board 111 and the second circuit board 121. It should be noted that, in order to facilitate the integration of the solid-state relay 100 with external components, such as electrically connecting the solid-state relay 100 to a circuit board (not shown), when the connector 130 is soldered to the first circuit board 111, care must be taken to ensure that the conductive post 131 and the soldering material of the connector 130 do not extend beyond the second surface S2 of the first circuit board 111.

[0024] On the other hand, the solid-state relay 100 of this embodiment also includes a housing 140 and an adhesive material 150. The housing 140 is assembled to the first circuit board 111 and covers the power component 112, the connector 130 and the control module 120. The adhesive material 150 fills the space between the housing 140 and the first circuit board 111. The adhesive material 150 has better electrical insulation and thermal conductivity, so as to maintain the insulation space required for the relevant electronic components inside the solid-state relay 100, and can also quickly conduct the heat generated by the electronic components to the housing 140, so as to dissipate the heat to the external environment.

[0025] Figure 5 This is a schematic diagram of another embodiment of a solid-state relay. Please refer to it. Figure 5 Unlike the previous embodiments, this embodiment changes the manufacturing process so that the adhesive 250 can smoothly cover the power module 110, control module 120 and connector 130 on the first circuit board 111, and does not require the outer shell 140 of the previous embodiments, thereby reducing manufacturing costs.

[0026] In summary, in the above embodiments of this utility model, the solid-state relay is configured with the first circuit board and the second circuit board arranged vertically, thus separating the power module and the control module. This effectively reduces the footprint of the solid-state relay during configuration, thereby improving its configuration efficiency in its operating environment. Furthermore, the power component, the first circuit board, and the conductive pads form a through-hole pad structure, further reducing the area occupied by the power component on the first circuit board while ensuring electrical connection between the power component and the conductive pads. This reduces the electrical transmission path between external components and the power component, significantly lowering the parasitic inductance generated by the related circuitry. In addition, the vertically arranged configuration allows for easy component replacement and maintenance of the solid-state relay, facilitating component replacement and improving service life, thus meeting usage requirements.

[0027] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A solid-state relay, characterized in that, include: A power module includes a first circuit board, at least one power component, and a plurality of conductive pads, wherein the power component is electrically connected to the plurality of conductive pads and is disposed on opposite surfaces of the first circuit board. A control module, including a second circuit board and a control component, wherein the control component is electrically connected to and configured on the second circuit board; and A connector electrically connects and passes through the first circuit board and the second circuit board, wherein the second circuit board is supported above the first circuit board by the connector.

2. The solid-state relay according to claim 1, characterized in that, The power component, the first circuit board, and the plurality of conductive pads form a through-hole pad structure to allow the power component to be electrically connected to the plurality of conductive pads.

3. The solid-state relay according to claim 2, characterized in that, The through hole has a hollow structure and the hole wall is provided with a conductive layer.

4. The solid-state relay according to claim 2, characterized in that, The through-hole is filled with conductive material.

5. The solid-state relay according to claim 1, characterized in that, The power component is a metal-oxide-semiconductor field-effect transistor.

6. The solid-state relay according to claim 1, characterized in that, The connector includes a conductive post and a stop block. The conductive post passes through the stop block and is soldered to the first circuit board and the second circuit board. The second circuit board is supported on the stop block.

7. The solid-state relay according to claim 1, characterized in that, It also includes adhesive material covering the power module, the control module and the connector.

8. The solid-state relay according to claim 7, characterized in that, It also includes a housing, which is assembled to the first circuit board to cover the power components, the connectors, the control module and the adhesive, and the adhesive fills the space between the housing and the first circuit board.

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