Welded structures and electronic components

Abstract

The application provides a welding structure and an electronic component. The pin has a connecting part and at least two welding parts. The welding parts are connected to the connecting part. The pin is assembled to the assembling part through the connecting part. The welding parts are configured to be welded to the external substrate. The connecting part of the pin is assembled to the assembling part in a better secure mode such as embedding or one-piece forming. The pin has a plurality of welding parts configured to be welded to the external substrate. Therefore, the connecting strength of the pin is improved in at least two aspects. The first aspect is that the pin is assembled to the assembling part in a secure mode such as embedding or one-piece forming. The second aspect is that the number of the welding parts is increased and the positions of the welding parts are set, so that the number of the welding points between the pin and the substrate is increased and the balance of the stress of the pin after welding is improved. Through the two aspects, the pin is securely assembled to the assembling part and the substrate in the electronic component, and the anti-vibration effect is improved.

Description

Technical Field

[0001] This application relates to the field of electronic components technology, to technologies related to the pin structure of electronic components, and in particular to a welding structure and electronic components. Background Technology

[0002] When assembling electronic components, pins are typically soldered to pads on a substrate. The soldering point for each pin is usually the point where the pin tip contacts the substrate. Generally, this soldering method ensures a secure electrical connection between the electronic component and the substrate, preventing breakage or detachment at the solder joint.

[0003] However, when electronic components are used in automotive applications, in addition to meeting standard performance requirements, the vibration resistance requirements are higher than in ordinary applications. In high-intensity automotive vibration environments, if the pins of electronic components are not securely soldered, defects such as component detachment, loose solder joints, or cracks can easily occur.

[0004] A common solution is to reinforce the electronic components with glue between the component body and the substrate after soldering, or to apply glue directly to the soldered terminals. However, this adds an additional glue application step, resulting in low production efficiency and increased production costs. Utility Model Content

[0005] Therefore, it is necessary to provide a welding structure and an electronic component using the welding structure to address the aforementioned technical problems.

[0006] This application provides a welding structure for electronic components, the welding structure comprising:

[0007] Assembly Department;

[0008] The pin has a connecting portion and at least two solder portions, a plurality of the solder portions being connected to the connecting portion, the pin being assembled to the assembly portion via the connecting portion, and the solder portions being configured for soldering to an external substrate.

[0009] In one embodiment, the connecting portion is configured to be partially or wholly embedded in the assembly portion; and / or,

[0010] The connecting portion has two ends facing different directions, and each end of the connecting portion is provided with a welding portion; and / or

[0011] The plurality of welded portions are bent relative to the plane of the connecting portion, and the plurality of welded portions are bent in the same direction, or the plurality of welded portions are bent in different directions; and / or,

[0012] Any one of the aforementioned welding portions is welded to the surface of the external substrate facing the pin, or to the surface of the external substrate away from the pin.

[0013] In one embodiment, the two ends of the connector face opposite directions along a straight line; and / or,

[0014] The number of welding portions is configured to be two, namely a first welding portion and a second welding portion; the first welding portion includes a first bending section and a first welding section, the first bending section is inclined relative to the plane of the connecting portion, and the first welding section is connected to the connecting portion through the first bending section; the second welding portion includes a second bending section and a second welding section, the second bending section is inclined relative to the plane of the connecting portion, and the second welding section is connected to the connecting portion through the second bending section, and the first welding section and the second welding section are welded to the external substrate by solder.

[0015] In one embodiment, the connecting portion, the first bent segment, the first welded segment, the first bent segment, and the first welded segment are integrally formed; and / or,

[0016] The first welded segment is arranged at an angle or parallel to the first bent segment; and / or,

[0017] The second welding section is arranged at an angle or parallel to the second bending section.

[0018] In one embodiment, the first welding segment and the second welding segment are arranged parallel to the plane of the connection portion, and the first welding segment and the second welding segment extend in the same or opposite directions.

[0019] In one embodiment, the first bent segment has an inclination angle of less than 90 degrees relative to the plane containing the connecting portion; and / or,

[0020] The second bent segment is perpendicular to the plane of the connecting portion; and / or,

[0021] The outer surface of the substrate of at least one of the first welding segment and the second welding segment is configured as a concave-convex surface or a curved surface.

[0022] In one embodiment, the first welded segment is arranged parallel to the plane containing the connection portion; and / or,

[0023] The second welded segment is arranged parallel to the second bent segment, and both the second bent segment and the second welded segment are arranged perpendicular to the plane of the connecting part.

[0024] In one embodiment, the second welding segment is welded to the surface of the external substrate facing the pin; or,

[0025] The second welding segment penetrates the outer substrate and is welded to the surface of the outer substrate opposite to the pin.

[0026] In one embodiment, the welded structure includes:

[0027] The branching part is connected to the connecting part.

[0028] This application provides an electronic component, which includes the welding structure.

[0029] In the aforementioned welding structures and electronic components, the pin connection portion can be assembled with the assembly portion using a more reliable method such as embedding or integral molding, thereby improving the assembly strength between the pin and the assembly portion and making the assembly between the pin and the assembly portion more secure. At the same time, the pin also has one, two, or other numbers of welding portions for welding to an external substrate.

[0030] Therefore, the above-mentioned welding structure improves the connection strength of the pins on at least two levels. First, it utilizes a reliable assembly method such as embedding or integral molding between the pin's connecting part and the assembly part. Second, it increases the number and location of the welding parts, thereby increasing the number of welding points between the pin and the substrate and improving the stress balance after welding. Through these two methods, the pins can form a reliable assembly with the assembly part and the substrate in electronic components, thus eliminating the need for additional adhesive processes to ensure the overall structural reliability and improve shock resistance. Attached Figure Description

[0031] Figure 1 A perspective view of the electronic components provided in the first embodiment of this application.

[0032] Figure 2 For example Figure 1 The front view of the electronic components shown.

[0033] Figure 3 For example Figure 1 A top view of the electronic components shown.

[0034] Figure 4 For example Figure 1 The cross-sectional view of the electronic component shown.

[0035] Figure 5 For example Figure 4 A magnified view of a portion of the electronic components shown.

[0036] Figure 6 A perspective view of the electronic components provided in the second embodiment of this application.

[0037] Figure 7 For example Figure 6 The front view of the electronic components shown.

[0038] Figure 8 For example Figure 6 A top view of the electronic components shown.

[0039] Figure 9 For example Figure 6 The cross-sectional view of the electronic component shown.

[0040] Figure 10 For example Figure 9 A magnified view of a portion of the electronic component shown.

[0041] Figure 11 A perspective view of the electronic components provided in the third embodiment of this application.

[0042] Figure 12 For example Figure 11 The front view of the electronic components shown.

[0043] Figure 13 For example Figure 11 A top view of the electronic components shown.

[0044] Figure 14 For example Figure 11 The cross-sectional view of the electronic component shown.

[0045] Figure 15 For example Figure 14 A magnified view of a portion of the electronic component shown.

[0046] Figure 16 A perspective view of the electronic components provided in the fourth embodiment of this application.

[0047] Figure 17 For example Figure 16 The front view of the electronic components shown.

[0048] Figure 18 For example Figure 16 A top view of the electronic components shown.

[0049] Figure 19 For example Figure 16 The cross-sectional view of the electronic component shown.

[0050] Figure 20 For example Figure 19 A magnified view of a portion of the electronic component shown.

[0051] Icon labels:

[0052] 1000, Assembly section; 2000, Pins; 3000, Substrate;

[0053] 2100. Connecting part; 2200. Welding part;

[0054] 2210, First welding section; 2220, Second welding section;

[0055] 2211, First bending section; 2212, First welding section; 2221, Second bending section; 2222, Second welding section. Detailed Implementation

[0056] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0057] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0058] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0059] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0060] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0061] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0062] In order to improve the soldering reliability of the pins 2000 of electronic components in high-intensity vehicle vibration environments and to reasonably control production costs, this application provides an improved electronic component manufacturing process. The main improvement of this electronic component lies in the soldering structure of its pins 2000.

[0063] See Figures 1 to 20 As shown, in various embodiments of welding structures, the welding structure of electronic components may include an assembly part 1000 and pins 2000. The assembly part 1000 is the skeleton structure in the electronic components and is the basic structure for the pins 2000 to assemble. When the pins 2000 are set on the assembly part 1000, the pins 2000 can form a defined assembly position in the electronic components.

[0064] The pins 2000 in the aforementioned electronic components may have a certain number, such as Figures 1 to 20As shown in the various embodiments, the pins 2000 can be divided into two columns, with the two columns of pins 2000 arranged approximately parallel to each other. In addition, those skilled in the art can choose other arrangement methods according to actual needs, which are not limited here.

[0065] refer to Figures 1 to 20 In the various embodiments shown, the pin 2000 has a connecting portion 2100 and at least two solder portions 2200. For example, the pin 2000 may have one solder portion 2200 or two solder portions 2200. When the pin 2000 has two solder portions 2200, the two solder portions 2200 can be a first solder portion 2210 and a second solder portion 2220, thereby distinguishing the two solder portions 2200. Several solder portions 2200 are connected to the connecting portion 2100. For example, when the pin 2000 has two solder portions 2200, the first solder portion 2210 and the second solder portion 2220 are respectively connected to the two ends of the connecting portion 2100, thereby making the pin 2000 configured as a generally elongated shape.

[0066] The connection (or soldering) method of the pin 2000 between the assembly part 1000 and the substrate 3000 is the main improvement of this electronic component, thus forming a soldering structure for the pin 2000 that differs from existing designs. Specifically, the function of the connecting part 2100 and the soldering part 2200 in the pin 2000 is that the pin 2000 can be assembled to the assembly part 1000 via the connecting part 2100, and the pin 2000 is simultaneously soldered to the external substrate 3000 using the soldering part 2200. Therefore, the connecting part 2100 or the soldering part 2200 in the pin 2000 can be determined by the mating relationship between different parts of the pin 2000 and the substrate 3000 after the assembly part 1000.

[0067] like Figures 1 to 20 In various embodiments, the connecting portion 2100 of the pin 2000 can be assembled with the assembly portion 1000 in a more reliable manner, such as by embedding or integral molding, thereby improving the assembly strength between the pin 2000 and the assembly portion 1000 and making the assembly between the pin 2000 and the assembly portion 1000 more reliable. At the same time, the pin 2000 also has one, two or other numbers of welding portions 2200, which are used for welding to the external substrate 3000.

[0068] Therefore, the above-mentioned welding structure improves the connection strength of the pin 2000 on at least two levels. First, it utilizes a reliable assembly method such as embedding or integral molding between the connecting portion 2100 of the pin 2000 and the assembly portion 1000. Second, it increases the number and position of the welding portions 2200, thereby increasing the number of welding points between the pin 2000 and the substrate 3000 and improving the stress balance after welding. Through these two methods, the pin 2000 can form a reliable assembly with the assembly portion 1000 and the substrate 3000 in electronic components, thus eliminating the need for additional adhesive processes to ensure the overall structural reliability and improve shock resistance.

[0069] Regarding the assembly between the connecting part 2100 and the assembly part 1000 mentioned above, please refer to... Figures 1 to 20 In each of the embodiments shown, the connecting portion 2100 of the pin 2000 is configured to be partially or completely embedded in the assembly portion 1000. The embedding method enables the connecting portion 2100 and the assembly portion 1000 to form an integral structure. This embedding method also improves the reliability between the connecting portion 2100 and the assembly portion 1000.

[0070] Furthermore, the connecting portion 2100 has two ends facing different directions, and each end of the connecting portion 2100 is provided with a welding portion 2200. Therefore, in the above embodiments, the pin 2000 may have two welding portions 2200, and two welding points are formed between the two welding portions 2200 and the substrate 3000. The two welding points are on both sides of the pin 2000. After the pin 2000 is welded to the substrate 3000 through the two welding portions 2200, the two welding points with roughly opposite and roughly symmetrical orientations can make the pin 2000 and the substrate 3000 form a stable welding relationship, and the force is relatively balanced, which can provide good connection reliability.

[0071] Continue reading Figures 1 to 20 In various embodiments, the plurality of solder portions 2200 of the pin 2000 are bent relative to the plane of the connecting portion 2100. Therefore, the connecting portion 2100 and the plurality of solder portions 2200 can be distinguished by the mutual bending design of different parts on the pin 2000. The plurality of solder portions 2200 can be bent in the same direction or bent in different directions, which is not limited here.

[0072] Furthermore, when any one of the welding portions 2200 is welded to the substrate 3000, the welding portion 2200 can be welded to the surface of the outer substrate 3000 facing the pin 2000, or when the welding portion 2200 can pass through the substrate 3000, the welding portion 2200 can also be welded to the surface of the outer substrate 3000 away from the pin 2000. Those skilled in the art can design according to actual needs, and no limitation is made here.

[0073] In one embodiment, the two ends of the connector 2100 can face opposite directions along a straight line, and the two soldering portions 2200 of the pin 2000 can also face opposite directions along a straight line.

[0074] Alternatively, in one embodiment, the number of welding portions 2200 can be configured to be two, namely a first welding portion 2210 and a second welding portion 2220. The first welding portion 2210 includes a first bending segment 2211 and a first welding segment 2212, which can be distinguished by the bending position in the first welding portion 2210. The first bending segment 2211 is inclined relative to the plane of the connecting portion 2100, and the first welding segment 2212 is connected to the connecting portion 2100 through the first bending segment 2211. Similarly, the second welding part 2220 includes a second bending section 2221 and a second welding section 2222. The second bending section 2221 and the second welding section 2222 can be distinguished by the bending position in the second welding part 2220. The second bending section 2221 is inclined relative to the plane of the connecting part 2100. The second welding section 2222 is connected to the connecting part 2100 through the second bending section 2221. The first welding section 2212 and the second welding section 2222 are welded to the external substrate 3000 by solder.

[0075] In one embodiment, the connecting portion 2100, the first bending segment 2211, and the first welding segment 2212 are integrally formed. The first welding segment 2212 may be inclined or parallel to the first bending segment 2211. Similarly, the second welding segment 2222 may be inclined or parallel to the second bending segment 2221. Those skilled in the art can design according to actual needs, and no limitations are imposed here.

[0076] like Figures 1 to 5 In the illustrated embodiment, the first welding segment 2212 and the second welding segment 2222 may be arranged parallel to the plane containing the connecting portion 2100, and the first welding segment 2212 and the second welding segment 2222 extend in the same direction. In addition, as shown... Figures 6 to 10In the embodiment shown, the extension directions of the first welding segment 2212 and the second welding segment 2222 may also be opposite, and this is not limited here.

[0077] like Figures 1 to 20 In the various embodiments shown, the inclination angle of the first bending segment 2211 relative to the plane where the connecting portion 2100 is located can be designed to be less than 90 degrees, such as 30 degrees, 40 degrees, 50 degrees, 60 degrees, 70 degrees, 80 degrees, etc., which are not limited here. The second bending segment 2221 can be designed to be perpendicular to the plane where the connecting portion 2100 is located.

[0078] like Figures 1 to 20 In the various embodiments shown, the first welding segment 2212 may be arranged parallel to the plane of the connecting portion 2100. And as... Figures 11 to 15 In the embodiment shown, the second welding segment 2222 may be arranged parallel to the second bending segment 2221. This parallel arrangement may be manifested in that the second welding segment 2222 and the second bending segment 2221 are on a straight line, and the second bending segment 2221 and the second welding segment 2222 are simultaneously arranged perpendicular to the plane where the connecting portion 2100 is located.

[0079] The surface of the substrate 3000 facing outward of at least one of the first welding segment 2212 and the second welding segment 2222 is configured as a concave-convex surface or a curved surface. Therefore, when the first welding segment 2212 and the second welding segment 2222 are welded to the substrate 3000, if there is a concave-convex surface or a curved surface design, the welding area of ​​the first welding segment 2212 and the second welding segment 2222 to the substrate 3000 can be increased, thereby improving the welding effect and improving the reliability.

[0080] like Figures 1 to 15 In the various embodiments shown, the second solder segment 2222 can be soldered to the surface of the external substrate 3000 facing the pin 2000, or as... Figures 16 to 20 In the illustrated embodiment, when the substrate 3000 has a through hole, the second soldering segment 2222 can also penetrate the outer substrate 3000 and be soldered to the surface of the outer substrate 3000 away from the pin 2000.

[0081] In one embodiment, as Figures 1 to 20 Based on the various embodiments shown, the welding structure may further include a branch portion connected to the connecting portion 2100. Since the connecting portion 2100 of the pin 2000 is embedded in the assembly portion 1000 in the above embodiments, the branch portion can extend (or protrude) from the interior of the assembly portion 1000 to the exterior of the assembly portion 1000 for winding and connecting the lead ends of the electronic components.

[0082] Without a branch point, the end of the winding can only be wound around the connection 2100 and exit the base of the assembly 1000. This can cause the terminal to float due to stress, affecting the overall flatness of the mounting. In cases of densely packed terminals, short circuits can easily occur when soldering the winding end. However, adding a branch point provides a winding location, avoiding these problems.

[0083] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0084] The embodiments described above are merely examples of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. For example, the assembly part 1000 is described in this embodiment as a skeleton structure in electronic components, but it is also applicable to parts of electronic components such as housings and bases used for setting pins. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A welding structure for electronic components, characterized in that, The welded structure includes: Assembly Department; The pin has a connecting portion and at least two solder portions, a plurality of the solder portions being connected to the connecting portion, the pin being assembled to the assembly portion via the connecting portion, and the solder portions being configured for soldering to an external substrate.

2. The welded structure according to claim 1, characterized in that, The connecting portion is configured to be partially or completely embedded in the assembly portion; and / or, The connecting portion has two ends facing different directions, and each end of the connecting portion is provided with a welding portion; and / or The plurality of welded portions are bent relative to the plane of the connecting portion, and the plurality of welded portions are bent in the same direction, or the plurality of welded portions are bent in different directions; and / or, Any one of the aforementioned welding portions is welded to the surface of the external substrate facing the pin, or to the surface of the external substrate away from the pin.

3. The welded structure according to claim 2, characterized in that, The two ends of the connecting portion are oriented in opposite directions along a straight line; and / or, The number of welding portions is configured to be two, namely a first welding portion and a second welding portion; the first welding portion includes a first bending section and a first welding section, the first bending section is inclined relative to the plane of the connecting portion, and the first welding section is connected to the connecting portion through the first bending section; the second welding portion includes a second bending section and a second welding section, the second bending section is inclined relative to the plane of the connecting portion, and the second welding section is connected to the connecting portion through the second bending section, and the first welding section and the second welding section are welded to the external substrate by solder.

4. The welded structure according to claim 3, characterized in that, The connecting portion, the first bent section, the first welded section, the first bent section, and the first welded section are integrally formed; and / or, The first welded segment is arranged at an angle or parallel to the first bent segment; and / or, The second welding section is arranged at an angle or parallel to the second bending section.

5. The welded structure according to claim 4, characterized in that, The first welding segment and the second welding segment are arranged parallel to the plane of the connection portion, and the first welding segment and the second welding segment extend in the same or opposite directions.

6. The welded structure according to claim 5, characterized in that, The first bent segment has an inclination angle of less than 90 degrees relative to the plane containing the connecting portion; and / or, The second bent segment is perpendicular to the plane of the connecting portion; and / or, The outer surface of the substrate of at least one of the first welding segment and the second welding segment is configured as a concave-convex surface or a curved surface.

7. The welded structure according to claim 4, characterized in that, The first welded segment is arranged parallel to the plane containing the connecting portion; and / or, The second welded segment is arranged parallel to the second bent segment, and both the second bent segment and the second welded segment are arranged perpendicular to the plane of the connecting part.

8. The welded structure according to claim 7, characterized in that, The second welding segment is welded to the surface of the external substrate facing the pin; or, The second welding segment penetrates the outer substrate and is welded to the surface of the outer substrate opposite to the pin.

9. The welded structure according to any one of claims 1-8, characterized in that, The welded structure includes: The branching part is connected to the connecting part.

10. An electronic component, characterized in that, The electronic components include the welding structure as described in any one of claims 1-9.

Images