An insulating housing for an electronic assembly and a controller

Abstract

The utility model provides an insulating shell and controller of electronic assembly, wherein the insulating shell comprises: an insulating shell body and a metal sheet; a bottom and a side wall of the insulating shell body 1 enclose to form a containing space; the metal sheet is arranged in the insulating shell body in the way of embedded forming, and the metal sheet comprises at least two exposed parts, which are a first connecting part and a second connecting part respectively; the first connecting part leaks out from the bottom of the insulating shell body; the second connecting part leaks out from the side wall of the insulating shell body to the inner cavity, or leaks out from the top of the side wall; the containing space is used for containing a circuit board, and the second connecting part is configured to be electrically connected with a circuit on the circuit board.

Description

Technical Field

[0001] This utility model relates to the field of motor controller technology, specifically to an insulating shell for electronic components and a controller used in motor drives or a combination of motor and electric heater. Background Technology

[0002] With the continuous development of power electronics technology, various converters are evolving towards higher frequencies, higher efficiency, and higher power density. To improve efficiency, it is usually necessary to accelerate the switching speed of power devices, but this brings significant electromagnetic interference (EMI) problems. EMI not only affects the stable operation of the equipment itself but can also interfere with surrounding electronic equipment, thus affecting the electromagnetic compatibility of the entire system. In traditional converter components or packaging structures, common methods for solving EMI include using external shielding. However, external shielding increases the product's size and assembly process.

[0003] Therefore, how to ground the interference source nearby and effectively suppress high-frequency electromagnetic interference is a problem that needs to be solved. Utility Model Content

[0004] The purpose of this invention is to provide an insulating shell for electronic components and a controller for motor drives or a combination of motor and electric heater, which can enable interference sources to be grounded nearby and effectively suppress high-frequency electromagnetic interference.

[0005] To achieve the above objectives, this utility model provides an insulating shell for an electronic component, comprising: an insulating shell body and a metal sheet;

[0006] The bottom and side walls of the insulating outer shell body enclose and form an accommodating space;

[0007] The metal sheet is embedded in the insulating outer shell body and includes at least two exposed portions, namely a first connecting portion and a second connecting portion.

[0008] The first connecting portion protrudes outward from the bottom of the insulating outer shell body;

[0009] The second connection portion protrudes from the side wall of the insulating outer shell body into the inner cavity, or from the top of the side wall;

[0010] The accommodating space is used to accommodate a circuit board, and the second connecting portion is configured to be electrically connected to the circuitry on the circuit board.

[0011] In an optional configuration, the circuit is an EMC filter circuit or an ESD protection circuit.

[0012] In an optional embodiment, the number of metal sheets is one or more; the number of the first connecting portion or the second connecting portion exposed on one of the metal sheets is one or more.

[0013] This utility model also provides a controller for motor drive or a combination of motor and electric heater, the controller including the above-mentioned insulating shell, and further including:

[0014] A first circuit board, on which multiple power semiconductor switching devices are integrated;

[0015] The second circuit board integrates at least one of a drive circuit and a control circuit.

[0016] The connecting terminal is partially embedded inside the insulating shell and partially exposed in the accommodating space enclosed by the insulating shell; a portion of the circuitry of the first circuit board and the second circuit board is connected through the connecting terminal.

[0017] The power terminal is embedded in the insulating shell, with one end exposed in the accommodating space for electrical connection with the first circuit board, and the other end extending outward through the side wall of the insulating shell.

[0018] In an alternative embodiment, the power semiconductor switching device is configured in one of the following topologies:

[0019] Six sets of power semiconductor switching devices form a three-phase full-bridge for motor control;

[0020] Six sets of power semiconductor switching devices form a three-phase full bridge for motor control, and six sets of power semiconductor switching devices form a three-phase full bridge for another motor control.

[0021] Six sets of power semiconductor switching devices form a three-phase full bridge for motor control, two sets of power semiconductor switching devices are used for electric heater control, and one set of power semiconductor switching devices is used for electric heater protection.

[0022] Six sets of power semiconductor switching devices form a three-phase full-bridge for motor control, two sets of power semiconductor switching devices are used for electric heater control, and two sets of power semiconductor switching devices are used for electric heater protection.

[0023] Six sets of power semiconductor switching devices form a three-phase full-bridge for motor control, one set of power semiconductor switching devices is used for electric heater control, and one set of power semiconductor switching devices is used for electric heater protection.

[0024] In an optional embodiment, the controller further includes a freewheeling diode, which is integrated on the same circuit board as the power semiconductor switching device, or the freewheeling diode is integrated on the same circuit board as the driving circuit; the power semiconductor switching device and the freewheeling diode are configured in one of the following topologies:

[0025] Six sets of power semiconductor switching devices form a three-phase full bridge for motor control, two sets of power semiconductor switching devices are used for electric heater control, one set of power semiconductor switching devices is used for electric heater protection, and two sets of freewheeling diodes are used for electric heater freewheeling.

[0026] Six sets of power semiconductor switching devices form a three-phase full bridge for motor control, two sets of power semiconductor switching devices are used for electric heater control, two sets of power semiconductor switching devices are used for electric heater protection, and two sets of freewheeling diodes are used for electric heater freewheeling.

[0027] Six sets of power semiconductor switching devices form a three-phase full-bridge for motor control, one set of power semiconductor switching devices is used for electric heater control, one set of power semiconductor switching devices is used for electric heater protection, and one set of freewheeling diodes is used for electric heater freewheeling.

[0028] In an optional embodiment, the controller further includes a third circuit board; the third circuit board is disposed in the accommodating space and is connected to at least one of the connection terminal, the first circuit board, and the second circuit board;

[0029] When the driving circuit is integrated on the second circuit board, the control circuit is integrated on the third circuit board;

[0030] When the control circuit is integrated on the second circuit board, the drive circuit is integrated on the third circuit board.

[0031] In an optional embodiment, the bottom of the insulating housing includes a first opening, and the top includes a second opening; the controller further includes:

[0032] An insulating cover plate, the insulating cover plate being located above the second opening and at least partially covering the second opening;

[0033] The first circuit board covers the first opening, with the devices on it facing the accommodating space;

[0034] The second circuit board is located above the first circuit board and within the accommodating space.

[0035] The beneficial effects of this utility model are as follows: This utility model sets the metal sheet in the insulating shell body by embedding it in a molded manner, so that when the first connecting part is electrically connected to the external structure, the grounding effect can be achieved. Attached Figure Description

[0036] The above and other objects, features and advantages of the present invention will become more apparent from the more detailed description of exemplary embodiments of the present invention in conjunction with the accompanying drawings, in which the same reference numerals generally represent the same components.

[0037] Figure 1 This is a schematic diagram of the bottom structure of the insulating shell in Embodiment 1 of this utility model.

[0038] Figure 2 and Figure 3 This is a schematic diagram of the arrangement of the first connecting part and the second connecting part of the insulating shell in Embodiment 1 of this utility model.

[0039] Figure 4 This is a cross-sectional view of the controller structure in Embodiment 2 of this utility model.

[0040] Explanation of reference numerals in the attached figures:

[0041] 1-Insulating outer shell body; 2-First connecting part; 3-Second connecting part; 4-Side wall; 5-First circuit board; 6-Second circuit board; 7-Connecting terminal; 8-Interconnecting line; 9-Power terminal; 10-Insulating cover plate; 11-First opening; 12-Bottom; 13-Circuit board. Detailed Implementation

[0042] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer from the following description and drawings. However, it should be noted that the concept of the present invention can be implemented in many different forms and is not limited to the specific embodiments described herein. The accompanying drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the present invention.

[0043] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this utility model, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion.

[0044] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein for convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, then the element or feature described as “below” or “under” the other element or feature will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly.

[0045] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0046] Example 1

[0047] Reference Figures 1 to 3 This embodiment provides an insulating housing for an electronic component, comprising:

[0048] Insulating outer shell body 1 and metal sheet;

[0049] The bottom 12 and side wall 4 of the insulating outer shell body 1 enclose and form an accommodating space;

[0050] The metal sheet is embedded in the insulating outer shell body 1, and the metal sheet includes at least two exposed parts, namely the first connecting part 2 and the second connecting part 3.

[0051] The first connecting part 2 protrudes outward from the bottom 12 of the insulating outer shell body 1;

[0052] The second connecting part 3 protrudes from the side wall 4 of the insulating outer shell body 1 into the inner cavity (see reference). Figure 2 ), or leak from the top of the sidewall 4 (see reference) Figure 3 );

[0053] The accommodating space is used to accommodate the circuit board 13, and the second connecting part 3 is configured to be electrically connected to the circuit on the circuit board 13.

[0054] In this embodiment, the circuit on the circuit board 13 can be an EMC filter circuit or an ESD protection circuit. The number of metal sheets can be one or more; the number of exposed first or second connecting parts on a metal sheet can also be one or more. To facilitate the electrical connection between the second connecting part of the metal sheet and the circuit on the circuit board 13, the metal sheet can be designed in a bent form, so that the second connecting part extends laterally from the side wall.

[0055] In this embodiment, a locking hole can be provided on the insulating shell to achieve connection with the external structure. At the same time, the first connecting part is connected with the external structure to achieve the effect of grounding.

[0056] This invention embeds a metal sheet into the insulating shell using a recessed molding process. When the bottom of the insulating shell contacts the external grounding system, grounding is achieved, making the process more convenient. The insulating shell can be integrally molded from the metal sheet and the plastic insulating material using an injection molding process.

[0057] Example 2

[0058] Reference Figure 4 This embodiment provides a controller for motor drive or a combination of motor and electric heater, comprising the insulating housing of Embodiment 1, and further including:

[0059] First circuit board 5, on which multiple power semiconductor switching devices are integrated;

[0060] The second circuit board 6 integrates at least one of a drive circuit and a control circuit.

[0061] The connecting terminal 7 is partially embedded inside the insulating shell and partially exposed in the accommodating space enclosed by the insulating shell; a portion of the circuitry of the first circuit board 5 and the second circuit board 6 are connected through the connecting terminal 7.

[0062] Power terminal 9 is embedded in the insulating shell, with one end exposed in the accommodating space for electrical connection with the first circuit board 5, and the other end extending outward through the side wall of the insulating shell.

[0063] The power semiconductor switching devices can be configured in one of the following topologies: 6 sets of power semiconductor switching devices forming a three-phase full-bridge for motor control; 6 sets of power semiconductor switching devices forming a three-phase full-bridge for motor control and 6 sets of power semiconductor switching devices forming a three-phase full-bridge for another motor control; 6 sets of power semiconductor switching devices forming a three-phase full-bridge for motor control, 2 sets of power semiconductor switching devices for electric heater control, and 1 set of power semiconductor switching devices for electric heater protection; 6 sets of power semiconductor switching devices forming a three-phase full-bridge for motor control, 2 sets of power semiconductor switching devices for electric heater control, and 2 sets of power semiconductor switching devices for electric heater protection; 6 sets of power semiconductor switching devices forming a three-phase full-bridge for motor control, 1 set of power semiconductor switching devices for electric heater control, and 1 set of power semiconductor switching devices for electric heater protection.

[0064] In this embodiment, the controller further includes a freewheeling diode, which is integrated on the same circuit board as the power semiconductor switching device, or the freewheeling diode is integrated on the same circuit board as the driving circuit. The power semiconductor switching device and the freewheeling diode are configured in one of the following topologies: 6 sets of power semiconductor switching devices form a three-phase full-bridge for motor control, 2 sets of power semiconductor switching devices are used for electric heater control, 1 set of power semiconductor switching devices is used for electric heater protection, and 2 sets of freewheeling diodes are used for electric heater freewheeling; 6 sets of power semiconductor switching devices form a three-phase full-bridge for motor control, 2 sets of power semiconductor switching devices are used for electric heater control, 2 sets of power semiconductor switching devices are used for electric heater protection, and 2 sets of freewheeling diodes are used for electric heater freewheeling; 6 sets of power semiconductor switching devices form a three-phase full-bridge for motor control, 1 set of power semiconductor switching devices is used for electric heater control, 1 set of power semiconductor switching devices is used for electric heater protection, and 1 set of freewheeling diodes is used for electric heater freewheeling.

[0065] The controller further includes a third circuit board; the third circuit board is disposed in the accommodating space; the third circuit board is connected to at least one of the connection terminal, the first circuit board, and the second circuit board; when the second circuit board integrates the driving circuit, the third circuit board integrates the control circuit; when the second circuit board integrates the control circuit, the third circuit board integrates the driving circuit.

[0066] The control circuit includes a microprocessor and its peripheral circuits, a sampling circuit, a communication circuit, and an isolation power supply; the drive circuit includes a gate drive chip and its peripheral circuits, a gate drive resistor, and a gate snubber circuit. Devices integrated into the first circuit board also include a temperature sensor, a sampling shunt resistor, and a snubber capacitor, which, together with power semiconductor switching devices and freewheeling diodes, constitute the power circuit.

[0067] In this embodiment, the bottom of the insulating housing includes a first opening 11, and the top includes a second opening. The controller further includes an insulating cover plate 10, which is located above the second opening and at least partially covers it. The first circuit board 5 covers the first opening 11, with its components facing the accommodating space. The second circuit board 6 is located above the first circuit board 5 and within the accommodating space. The first circuit board 5 or the second circuit board 6 is connected to the connection terminal 7 via an interconnecting line 8. The interconnecting line can be a bonding wire, copper bridge, etc.

[0068] In this embodiment, the portion of the connection terminal exposed in the accommodating space is divided into upper and lower layers. The lower layer of connection terminals is electrically connected to the first circuit board 5, and the upper layer of connection terminals is electrically connected to the second circuit board 6. This allows for proximity-based connection and minimizes the length of the interconnecting cable.

[0069] In this embodiment, the controller further includes a locking structure, which includes a first locking hole in the insulating housing, a second locking hole in the insulating cover plate, and fasteners (such as screws) passing through the first locking hole and the second locking hole; the locking structure fixes the insulating cover plate to the insulating housing.

[0070] In this embodiment, when installing the first circuit board 5, the component portion of the first circuit board 5 is inserted into the insulating shell from bottom to top through the first opening 11. The size of the first circuit board 5 can be slightly larger than the size of the first opening 11, thereby covering the first opening 11. In other embodiments, the first circuit board 5 can also be placed into the insulating shell from top to bottom, in which case the first circuit board 5 can rest on the inner bottom edge of the insulating shell around the first opening 11. Of course, the first circuit board 5 can also be snapped into the first opening 11, in which case the lower surface of the first circuit board 5 is basically flush with the lower surface of the insulating shell. This solution only requires that the first circuit board 5 covers the first opening 11, and the method of covering is not limited.

[0071] In this embodiment, the lower surface of the insulating cover plate 10 is provided with a downward-facing support column, which passes through the second circuit board 6 and contacts the upper surface of the first circuit board 5. The controller also includes an insulating sealant, which is filled into the space enclosed by the insulating shell, the insulating cover plate, and the first circuit board 5. The insulating sealant 17 can be silicone. In this embodiment, the support column can press down on the first circuit board 5 during product assembly and potting to prevent it from moving upward or horizontally.

[0072] This embodiment highly integrates the power devices and the control board, reducing the size of the controller while ensuring excellent reliability. Furthermore, the insulating sealant protects both the power devices and the control board simultaneously, significantly shortening the safety distances between terminals and further reducing the control board's size. Moreover, the control board, protected by the insulating sealant, exhibits excellent reliability even in harsh environments such as vibration and high humidity.

[0073] The above description is only a description of the preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. An insulating housing for an electronic component, characterized in that, include: Insulating outer shell body and metal sheet; The bottom and side walls of the insulating outer shell body enclose and form an accommodating space; The metal sheet is embedded in the insulating outer shell body and includes at least two exposed portions, namely a first connecting portion and a second connecting portion. The first connecting portion protrudes outward from the bottom of the insulating outer shell body; The second connection portion protrudes from the side wall of the insulating outer shell body into the inner cavity, or from the top of the side wall; The accommodating space is used to accommodate a circuit board, and the second connecting portion is configured to be electrically connected to the circuitry on the circuit board.

2. The insulating housing of the electronic component as described in claim 1, characterized in that, The circuit is an EMC filter circuit or an ESD protection circuit.

3. The insulating housing of the electronic component as described in claim 1, characterized in that, The number of metal sheets is one or more; the number of the first connecting portion or the second connecting portion exposed on one of the metal sheets is one or more.

4. A controller for use in motor drives or a combination of motor and electric heater, characterized in that, The controller comprises the insulating housing as described in any one of claims 1 to 3, and further comprises: A first circuit board, on which multiple power semiconductor switching devices are integrated; The second circuit board integrates at least one of a drive circuit and a control circuit. The connecting terminal is partially embedded inside the insulating shell and partially exposed in the accommodating space enclosed by the insulating shell; a portion of the circuitry of the first circuit board and the second circuit board is connected through the connecting terminal. The power terminal is embedded in the insulating shell, with one end exposed in the accommodating space for electrical connection with the first circuit board, and the other end extending outward through the side wall of the insulating shell.

5. The controller as described in claim 4, applied to a motor drive or a combination of a motor and an electric heater, characterized in that, The power semiconductor switching device is configured in one of the following topologies: Six sets of power semiconductor switching devices form a three-phase full-bridge for motor control; Six sets of power semiconductor switching devices form a three-phase full bridge for motor control, and six sets of power semiconductor switching devices form a three-phase full bridge for another motor control. Six sets of power semiconductor switching devices form a three-phase full bridge for motor control, two sets of power semiconductor switching devices are used for electric heater control, and one set of power semiconductor switching devices is used for electric heater protection. Six sets of power semiconductor switching devices form a three-phase full-bridge for motor control, two sets of power semiconductor switching devices are used for electric heater control, and two sets of power semiconductor switching devices are used for electric heater protection. Six sets of power semiconductor switching devices form a three-phase full-bridge for motor control, one set of power semiconductor switching devices is used for electric heater control, and one set of power semiconductor switching devices is used for electric heater protection.

6. The controller as described in claim 4, applied to a motor drive or a combination of a motor and an electric heater, is characterized in that, The controller further includes a freewheeling diode, which is integrated on the same circuit board as the power semiconductor switching device, or the freewheeling diode is integrated on the same circuit board as the driving circuit; the power semiconductor switching device and the freewheeling diode are configured in one of the following topologies: Six sets of power semiconductor switching devices form a three-phase full bridge for motor control, two sets of power semiconductor switching devices are used for electric heater control, one set of power semiconductor switching devices is used for electric heater protection, and two sets of freewheeling diodes are used for electric heater freewheeling. Six sets of power semiconductor switching devices form a three-phase full bridge for motor control, two sets of power semiconductor switching devices are used for electric heater control, two sets of power semiconductor switching devices are used for electric heater protection, and two sets of freewheeling diodes are used for electric heater freewheeling. Six sets of power semiconductor switching devices form a three-phase full-bridge for motor control, one set of power semiconductor switching devices is used for electric heater control, one set of power semiconductor switching devices is used for electric heater protection, and one set of freewheeling diodes is used for electric heater freewheeling.

7. The controller as described in claim 4, applied to a motor drive or a combination of a motor and an electric heater, characterized in that, The controller further includes a third circuit board; the third circuit board is disposed in the accommodating space and is connected to at least one of the connection terminal, the first circuit board, and the second circuit board; When the driving circuit is integrated on the second circuit board, the control circuit is integrated on the third circuit board; When the control circuit is integrated on the second circuit board, the drive circuit is integrated on the third circuit board.

8. The controller as described in claim 4, applied to a motor drive or a combination of a motor and an electric heater, characterized in that, The insulating housing includes a first opening at the bottom and a second opening at the top; the controller further includes: An insulating cover plate, the insulating cover plate being located above the second opening and at least partially covering the second opening; The first circuit board covers the first opening, with the devices on it facing the accommodating space; The second circuit board is located above the first circuit board and within the accommodating space.

Images