A controller structure

Abstract

The utility model provides a kind of controller structure, comprising: insulating shell, side wall is enclosed a containing space, bottom includes first opening, top includes second opening;Insulating cover plate is located above second opening, and at least part covers second opening;First circuit board covers first opening;Second circuit board is located above the first circuit board, and main part is located in the containing space, part edge leaks outside insulating shell;Metal connecting line, part is embedded in the insulating shell, another part is exposed in the containing space enclosed by insulating shell;The part circuit of first circuit board and second circuit board is connected by metal connecting line;The part edge area of second circuit board is formed with metal terminal, insulating shell separates metal terminal into two parts, part in containing space, for electrically connected with first circuit board, part that leaks outside insulating shell, for electrically connected with external circuit.

Description

Technical Field

[0001] This utility model relates to the field of motor controller technology, and specifically to a controller structure. Background Technology

[0002] With technological advancements and industry demands, various motor controllers are increasingly evolving towards higher reliability and higher power density. Traditional motor controllers often consist of independent power devices and control boards connected by soldering. These traditional control boards typically lack insulation and are quite large due to safety regulations, while the controller's size is often determined by the control board size. Furthermore, the large control board area is often a key challenge affecting vibration reliability.

[0003] Therefore, how to reduce the size of the controller while ensuring good reliability is a problem that needs to be solved. Utility Model Content

[0004] The purpose of this invention is to propose a controller structure that highly integrates power devices with the control board, thereby reducing the size of the controller while ensuring good reliability.

[0005] To achieve the above objectives, this utility model provides a controller structure, including:

[0006] An insulating housing, the sidewalls of which enclose a receiving space; the bottom of the insulating housing includes a first opening, and the top of the insulating housing includes a second opening;

[0007] An insulating cover plate, the insulating cover plate being located above the second opening and at least partially covering the second opening;

[0008] A first circuit board and devices mounted thereon, the first circuit board covering the first opening, the devices thereon facing the receiving space;

[0009] A second circuit board and devices mounted thereon, the second circuit board being located above the first circuit board and the main body being located within the accommodating space, with a portion of its edges protruding outside the insulating housing;

[0010] A portion of the metal connecting wire is embedded inside the insulating shell, while the other portion is exposed in the accommodating space enclosed by the insulating shell; a portion of the circuitry of the first circuit board and the second circuit board is connected through the metal connecting wire.

[0011] Metal terminals are formed on a portion of the edge area of ​​the second circuit board. The insulating shell divides the metal terminals into inner and outer parts. The part located inside the accommodating space is used for electrical connection with the first circuit board, and the part exposed outside the insulating shell is used for electrical connection with an external circuit.

[0012] In an optional embodiment, the devices mounted on the first circuit board include power devices, and the devices mounted on the first circuit board include power devices and / or parts of the control circuit. The devices mounted on the second circuit board include at least parts of the control circuit.

[0013] In an optional embodiment, the devices on the first circuit board are electrically connected to the metal connection lines and the metal terminals via bonding wires or copper bridges; and / or,

[0014] The second circuit board is electrically connected to the metal connecting wire via bonding wires or copper bridges.

[0015] In an optional embodiment, the controller structure further includes a shielding layer located between the first circuit board and the second circuit board.

[0016] In an optional embodiment, the controller structure further includes a locking structure, which includes a first locking hole in the insulating housing, a second locking hole in the insulating cover, and fasteners passing through the first locking hole and the second locking hole.

[0017] In an optional embodiment, the portion of the metal connecting wire exposed in the accommodating space is divided into upper and lower layers. The lower layer of the metal connecting wire is electrically connected to the first circuit board, and the upper layer of the metal connecting wire is electrically connected to the second circuit board.

[0018] In an optional embodiment, the controller structure further includes a third circuit board and devices mounted thereon. The third circuit board is disposed on the inner edge of the bottom of the insulating housing, located on the side of the first circuit board, and disposed vertically with the second circuit board. The third circuit board is connected to at least one of the metal connecting wire, the first circuit board, and the second circuit board.

[0019] In an optional embodiment, the devices mounted on the first circuit board, the second circuit board, and the third circuit board include at least a portion of power devices and control circuit devices; wherein the power devices and / or a portion of the control circuit devices are mounted on the first circuit board, and at least a portion of the control circuit devices are mounted on the second circuit board and / or the third circuit board.

[0020] In the optional embodiment, the first circuit board consists of a first insulating layer, a first wiring layer, a second insulating layer, and a second wiring layer from bottom to top.

[0021] In an optional embodiment, the insulating cover includes a support post that passes through the second circuit board and contacts the upper surface of the first circuit board.

[0022] The advantages of this invention are: it highly integrates the power device and the control board, reduces the size of the controller, and ensures good reliability. Attached Figure Description

[0023] The above and other objects, features and advantages of the present invention will become more apparent from the more detailed description of exemplary embodiments of the present invention in conjunction with the accompanying drawings, in which the same reference numerals generally represent the same components.

[0024] Figure 1 This is a schematic diagram of the controller structure before assembly in Embodiment 1 of this utility model.

[0025] Figure 2 This is a cross-sectional view of the controller structure in Embodiment 1 of this utility model.

[0026] Figure 3 This is a top view of the controller structure in Embodiment 1 of this utility model.

[0027] Figure 4 This is a schematic diagram of the structure of the first circuit board in Embodiment 3 of this utility model.

[0028] Explanation of reference numerals in the attached figures:

[0029] 1-Insulating outer shell; 2-Insulating cover plate; 3-First circuit board; 4-Second circuit board; 5-First opening; 6-Second opening; 7-Upper metal connecting wire; 8-Lower metal connecting wire; 9-Metal terminal connection part; 10-Metal terminal locking part; 11-Support column; 12-First locking hole; 13-Second locking hole; 14-Bond wire; 15-Power device; 16-Passive device; 17-Insulating sealant; 18-Side wall; 21-First insulating layer; 22-First wiring layer; 23-Second insulating layer; 24-Second wiring layer; 25-Heat dissipation layer; 26-Metal connecting wire; 27-Metal terminal. Detailed Implementation

[0030] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer from the following description and drawings. However, it should be noted that the concept of the present invention can be implemented in many different forms and is not limited to the specific embodiments described herein. The accompanying drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the present invention.

[0031] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this utility model, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion.

[0032] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein for convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, then the element or feature described as “below” or “under” the other element or feature will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly.

[0033] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0034] Example 1

[0035] Reference Figures 1 to 3 This embodiment provides a controller structure, including:

[0036] An insulating housing 1, the sidewalls 18 of which enclose an accommodating space; the bottom of the insulating housing 1 includes a first opening 5, and the top of the insulating housing 1 includes a second opening 6;

[0037] An insulating cover plate 2 is located above the second opening 6 and at least partially covers the second opening 6;

[0038] A first circuit board 3 and the devices mounted thereon, the first circuit board 3 covering the first opening 5, the devices thereon facing the receiving space;

[0039] The second circuit board 4 and the devices mounted thereon are located above the first circuit board 3, and the main body is located within the accommodating space, with some edges protruding outside the insulating housing 1.

[0040] The metal connecting wire 26 is partially embedded inside the insulating shell 1 and partially exposed in the accommodating space enclosed by the insulating shell 1; a portion of the circuitry of the first circuit board 3 and the second circuit board 4 is connected through the metal connecting wire 26.

[0041] A portion of the edge area of ​​the second circuit board 4 has metal terminals 27 formed therein. The insulating shell 1 divides the metal terminals 27 into inner and outer parts. The part located within the accommodating space is used for electrical connection with the first circuit board 3, and the part exposed outside the insulating shell 1 is used for electrical connection with external circuits. The part of the metal terminal 27 exposed within the accommodating space is defined as the metal terminal connection portion 9, and the part exposed outside the insulating shell 1 is defined as the metal terminal locking portion 10. The metal terminal connection portion 9 is used to realize internal electrical connection, and the metal terminal locking portion 10 is used to connect external devices.

[0042] Specifically, the devices mounted on the first circuit board 3 and the second circuit board 4 include power devices 15 and at least some components of the control circuit. The control circuit components include a microprocessor and its peripheral circuits, a sampling circuit, a communication circuit, and an isolation power supply. The second circuit board may also mount a drive circuit, a sampling circuit, and passive components 16 (such as decoupling capacitors, sampling resistors, etc.). The drive circuit includes a gate drive chip and its peripheral circuits, a gate drive resistor, and a gate absorption circuit. In this embodiment, the power device 15, or a portion of the power device 15 and the control circuit components, is soldered onto the first circuit board 3, while the remaining components are distributed on the first circuit board 3 and the second circuit board 4 according to design requirements. The power device 15 is electrically connected to the metal connection wire and the metal terminal (metal terminal connection part 9) via a bonding wire 14 or a copper bridge; the second circuit board 4 is electrically connected to the metal connection wire via a bonding wire 14 or a copper bridge. In a specific example, the devices mounted on the first circuit board 3 include power devices 15 and passive components 16, and the devices mounted on the second circuit board include a control circuit, a drive circuit, a sampling circuit, etc.

[0043] In this embodiment, the portion of the metal connecting wire exposed in the accommodating space is divided into upper and lower layers. The lower metal connecting wire 8 is electrically connected to the first circuit board 3, and the upper metal connecting wire 7 is electrically connected to the second circuit board 4. This allows for proximity-based connection and minimizes the length of the bonding wire.

[0044] In this embodiment, the first circuit board 3 and the second circuit board 4 can be ceramic substrates, copper substrates, aluminum substrates, printed circuit boards, etc.

[0045] In this embodiment, the controller structure further includes a shielding layer located between the first circuit board 3 and the second circuit board 4. The shielding layer can be made of materials with electromagnetic shielding properties, such as metal or conductive and magnetically conductive plastic.

[0046] In this embodiment, the controller structure further includes a locking structure, which includes a first locking hole 12 formed on the insulating housing 1, a second locking hole 13 formed on the insulating cover plate 2, and fasteners (such as screws) passing through the first locking hole 12 and the second locking hole 13; the locking structure fixes the insulating cover plate 2 to the insulating housing 1.

[0047] In this embodiment, when installing the first circuit board 3, the component portion of the first circuit board 3 is inserted into the insulating housing 1 from bottom to top through the first opening 5. The size of the first circuit board 3 can be slightly larger than the size of the first opening 5, thereby covering the first opening 5. In other embodiments, the first circuit board 3 can also be placed into the insulating housing 1 from top to bottom, in which case the first circuit board 3 can rest on the inner bottom edge of the insulating housing 1 around the first opening 5. Of course, the first circuit board 3 can also be snapped into the first opening 5, in which case the lower surface of the first circuit board 3 is basically flush with the lower surface of the insulating housing 1. This solution only requires that the first circuit board 3 covers the first opening 5, and the method of covering is not limited.

[0048] In this embodiment, the lower surface of the insulating cover plate 2 is provided with a downward-facing support post 11, which passes through the second circuit board 4 and contacts the upper surface of the first circuit board 1. The controller structure also includes an insulating sealant 17, which is filled into the space enclosed by the insulating shell 1, the insulating cover plate 2, and the first circuit board 3. The insulating sealant 17 completely covers the upper surface of the first circuit board 3 and at least part of the second circuit board 4. The insulating sealant 17 can be silicone or the like. In this embodiment, the support post 11 can press down on the first circuit board 3 during the product assembly stage.

[0049] This invention highly integrates the power devices and the control board, reducing the size of the controller while ensuring excellent reliability. Furthermore, the insulating sealant protects both the power devices and the control board simultaneously, significantly shortening the safety distances between terminals and further reducing the control board's size. Moreover, the control board, protected by the insulating sealant, exhibits excellent reliability even in harsh environments such as vibration and high humidity.

[0050] Example 2

[0051] The difference between this embodiment and Embodiment 1 is that the controller structure further includes a third circuit board and devices mounted thereon. The third circuit board is disposed on the inner edge of the bottom of the insulating housing 1, located on the side of the first circuit board 3, and positioned vertically above and below the second circuit board 4. The third circuit board is connected to at least one of the metal connecting wire, the first circuit board 3, and the second circuit board 4. The devices mounted on the first circuit board 3, the second circuit board 4, and the third circuit board include power devices and at least some devices of the control circuit; wherein the power devices are mounted on the first circuit board 3, and at least some devices of the control circuit are mounted on the second circuit board and / or the third circuit board. The devices of the control circuit include a microprocessor and its peripheral circuits, a sampling circuit, a communication circuit, and an isolated power supply. The second and third circuit boards may also be equipped with a drive circuit, a sampling circuit, and passive devices 16 (such as decoupling capacitors, sampling resistors, etc.). The drive circuit includes a gate drive chip and its peripheral circuits, a gate drive resistor, and a gate absorption circuit. In this embodiment, the power device or power device 15 and some devices of the control circuit are mounted on the first circuit board 3, and the remaining devices are disposed on the first circuit board 3, the second circuit board 4, and the third circuit board according to design requirements.

[0052] In different specific examples, the devices mounted on the first circuit board are power devices and passive devices, such as decoupling capacitors and sampling resistors. The devices mounted on the second circuit board are control circuits, drive circuits, and sampling circuits. The devices mounted on the third circuit board are decoupling capacitors, sampling resistors, control circuits, drive circuits, and sampling circuits.

[0053] This embodiment, by adding a third circuit board, allows the components to be distributed across the first circuit board 3, the second circuit board 4, and the third circuit board, which is more conducive to reducing the size of the controller. The third circuit board can be connected in various ways: it can be connected only to the first circuit board 3, only to the metal connecting wire, or simultaneously to the metal connecting wire and the first circuit board 3, etc.

[0054] Example 3

[0055] Reference Figure 4 The difference between this embodiment and Embodiment 1 or Embodiment 2 is that the first circuit board 3, from bottom to top, consists of a first insulating layer 21, a first wiring layer 22, a second insulating layer 23, and a second wiring layer 24; wherein the thermal conductivity and insulation performance of the first insulating layer 21 are superior to those of the second insulating layer 23. The first insulating layer 21 (lower layer) has high thermal conductivity and high insulation requirements, such as ceramic materials or high thermal conductivity resin materials, with a thermal conductivity greater than 2W / mK; the second insulating layer 23 is made of common materials such as PP, PI, and FR4.

[0056] The wiring layer between the first insulating layer 21 and the second insulating layer 23 is the first wiring layer 22, which can connect power devices, decoupling capacitors, sampling resistors, etc. The wiring layer above the second insulating layer 23 is the second wiring layer 24, which can connect decoupling capacitors, sampling resistors, control circuits, etc. In this embodiment, a heat dissipation layer 25 is also provided on the lower surface of the first insulating layer 21.

[0057] The above description is only a description of the preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. A controller structure, characterized in that, include: An insulating housing, the sidewalls of which enclose an accommodating space; The bottom of the insulating housing includes a first opening, and the top of the insulating housing includes a second opening; An insulating cover plate, the insulating cover plate being located above the second opening and at least partially covering the second opening; A first circuit board and devices mounted thereon, the first circuit board covering the first opening, the devices thereon facing the receiving space; A second circuit board and devices mounted thereon, the second circuit board being located above the first circuit board and the main body being located within the accommodating space, with a portion of its edges protruding outside the insulating housing; A portion of the metal connecting wire is embedded inside the insulating shell, while the other portion is exposed within the accommodating space enclosed by the insulating shell; a portion of the circuitry of the first circuit board and the second circuit board is connected via the metal connecting wire. Metal terminals are formed on a portion of the edge area of ​​the second circuit board. The insulating shell divides the metal terminals into inner and outer parts. The part located inside the accommodating space is used for electrical connection with the first circuit board, and the part exposed outside the insulating shell is used for electrical connection with an external circuit.

2. The controller structure as described in claim 1, characterized in that, The devices mounted on the first circuit board include power devices and / or parts of the control circuit, and the devices mounted on the second circuit board include at least parts of the control circuit.

3. The controller structure as described in claim 2, characterized in that, The components on the first circuit board are electrically connected to the metal connecting lines and the metal terminals via bonding wires or copper bridges; and / or The second circuit board is electrically connected to the metal connecting wire via bonding wires or copper bridges.

4. The controller structure as described in claim 1, characterized in that, The controller structure also includes a shielding layer located between the first circuit board and the second circuit board.

5. The controller structure as described in claim 1, characterized in that, The controller structure also includes a locking structure, which includes a first locking hole in the insulating housing, a second locking hole in the insulating cover, and fasteners passing through the first locking hole and the second locking hole.

6. The controller structure as described in claim 1, characterized in that, The portion of the metal connecting wire exposed in the accommodating space is divided into upper and lower layers. The lower layer of metal connecting wire is electrically connected to the first circuit board, and the upper layer of metal connecting wire is electrically connected to the second circuit board.

7. The controller structure as described in claim 1, characterized in that, The controller structure also includes a third circuit board and devices mounted thereon. The third circuit board is disposed on the inner edge of the bottom of the insulating housing, located on the side of the first circuit board, and disposed vertically with the second circuit board. The third circuit board is connected to at least one of the metal connecting wire, the first circuit board, and the second circuit board.

8. The controller structure as described in claim 7, characterized in that, The devices mounted on the first circuit board, the second circuit board, and the third circuit board include at least a portion of power devices and control circuit devices; wherein the power devices and / or a portion of the control circuit devices are mounted on the first circuit board, and at least a portion of the control circuit devices are mounted on the second circuit board and / or the third circuit board.

9. The controller structure as described in claim 1, characterized in that, The first circuit board consists of, from bottom to top, a first insulating layer, a first wiring layer, a second insulating layer, and a second wiring layer.

10. The controller structure as described in claim 1, characterized in that, The insulating cover includes a support post that passes through the second circuit board and contacts the upper surface of the first circuit board.

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