Modular self-locking board card device for substation point devices
Patent Information
- Application Number
- CN202522348645.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-05
- Publication Date
- 2026-10-16
- Estimated Expiration
- 2035-11-05
AI Technical Summary
[0005]为克服现有技术的不足,本实用新型旨在提供一种用于变电站对点设备的模块化自锁板卡装置,解决传统板卡安装方式中存在的易松动、接触不良、安装和维护不便等问题,实现板卡的快速安装、可靠锁定、便捷解锁以及良好的电气连接性能,提升变电站对点设备的稳定性和维护效率
[0011] The beneficial effects of this utility model are as follows: the module PCB board can be quickly blindly inserted thanks to the chamfered design of the card slot rail. During the insertion process, the L probe and the card slot rail cooperate to achieve automatic locking. The additional locking force provided by the spring enhances the firmness of the board installation and effectively avoids loosening problems caused by vibration and other factors.
Smart Images

Figure CN224863254U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of substation equipment technology, specifically to a modular self-locking board device for point-to-point equipment in a substation. Background Technology
[0002] During the operation of a substation, point-to-point equipment plays a crucial role in ensuring the stable and accurate operation of the power system. These point-to-point devices typically consist of multiple circuit boards, and the installation and fixing methods of these boards directly affect the equipment's performance, ease of maintenance, and overall reliability.
[0003] Traditional substation point-to-point equipment board installation methods have several shortcomings. Some methods use a simple plug-and-play design, which makes the boards susceptible to loosening due to vibration, electromagnetic interference, and other factors after installation. This leads to poor contact, affecting the stability of electrical signal transmission and causing data transmission errors or equipment malfunctions. Other methods use screw fixing, which, while providing a more secure hold, makes board replacement or maintenance cumbersome, time-consuming, and labor-intensive, severely impacting substation equipment maintenance efficiency, prolonging power outages, and negatively affecting the continuity of power supply.
[0004] With the continuous improvement of the intelligence level of substations, the requirements for miniaturization and modular design of equipment are also increasing. Existing board installation structures are insufficient to meet this development trend, failing to enable rapid and accurate installation and replacement of boards, thus hindering further upgrades and optimizations of substation point-to-point equipment. Therefore, developing a new type of board device with modular self-locking function is of significant practical importance for improving the performance and reliability of substation point-to-point equipment and enhancing the operating efficiency of the power system. Utility Model Content
[0005] To overcome the shortcomings of existing technologies, this utility model aims to provide a modular self-locking card device for substation point-to-point equipment, solving problems such as easy loosening, poor contact, and inconvenience in installation and maintenance in traditional card installation methods. It achieves rapid installation, reliable locking, convenient unlocking, and good electrical connection performance of the card, thereby improving the stability and maintenance efficiency of substation point-to-point equipment.
[0006] This utility model provides the following technical solution: a modular self-locking board card device for point-to-point equipment in substations, including PCB-related components, card slot rail components, unlocking components, and auxiliary fixing and connection components;
[0007] The PCB-related components include a module PCB and a mother PCB. The module PCB has external interfaces soldered on it and has probe mounting holes and pin mounting holes. The probe mounting holes are connected to the copper-plated area of the module PCB to form a common ground. The pin mounting holes are connected to the device pins of the external interfaces on the module PCB to form an electrical path. The mother PCB is used to carry the module PCB and other components and to achieve electrical connection and fixation with the module PCB.
[0008] The card slot rail assembly is mirror-distributed on both sides of the module PCB board to form a slot for the module PCB board to be inserted.
[0009] The unlocking component includes an unlocking block and a first patch neodymium iron boron and a second patch neodymium iron boron;
[0010] The auxiliary fixing and connection components include a limiting cover, a spring, an L-probe, and a spring pin.
[0011] The beneficial effects of this utility model are as follows: the module PCB board can be quickly blindly inserted thanks to the chamfered design of the card slot rail. During the insertion process, the L probe and the card slot rail cooperate to achieve automatic locking. The additional locking force provided by the spring enhances the firmness of the board installation and effectively avoids loosening problems caused by vibration and other factors.
[0012] The unlocking operation only requires releasing external force, and the unlocking is automatically completed by utilizing the elasticity of the spring and the synergistic effect of the unlocking block and the L probe. The operation is simple and greatly improves the efficiency of equipment maintenance. The L probe and the spring pin ensure a reliable electrical connection between the module PCB and the PCB motherboard. The probe mounting hole and the copper area of the module PCB share the same ground. After the exposed copper area of the PCB motherboard in contact with the spring pin is treated with immersion gold, the electrical performance and oxidation resistance can be significantly improved, ensuring stable signal transmission.
[0013] Each component adopts a modular design, which facilitates the replacement and maintenance of individual parts, reducing maintenance costs. At the same time, this design is conducive to equipment upgrades and expansions, and can better meet the diverse needs of point-to-point equipment in different substations.
[0014] A further feature is provided: the insertion slot of the card slot rail assembly is chamfered to facilitate blind insertion of the module PCB board.
[0015] Further configuration: a cavity inclined towards the end is provided near the end of the card slot rail assembly, a blind hole is provided on the vertical surface of the cavity, and the card slot rail assembly is also provided with threaded holes for mounting parts and protrusions for positioning and soldering. The protrusions are precisely matched with the corresponding mounting soldering holes on the PCB motherboard, and after soldering, the module PCB board and the PCB motherboard can achieve electrical connection and common ground through the copper-plated area of the card slot rail assembly and the L probe.
[0016] The unlocking block is further configured such that: the unlocking block is placed in the cavity near the end of the card slot rail assembly; the bottom surface of the unlocking block has the same inclination angle as the cavity of the card slot rail assembly; the horizontal cross-section of the unlocking block is trapezoidal; a blind hole is provided on the vertical surface of the unlocking block that fits against the blind hole of the cavity of the card slot rail assembly; the first patch NdFeB is embedded in the blind hole of the card slot rail assembly; the second patch NdFeB is embedded in the blind hole of the unlocking block; and the first patch NdFeB and the second patch NdFeB attract each other through opposite poles to fix the unlocking block to the end of the cavity of the card slot rail assembly.
[0017] The setting is further configured such that the limiting cover is an L-shaped bent part, which is fixed by the threaded hole on the slot rail assembly. Its bottom end face is in close contact with the top end face of the slot rail assembly, and its inner end face is in close contact with the side end face of the slot rail assembly, so as to constrain the unlocking block in the cavity of the slot rail assembly.
[0018] The spring is further configured such that: the spring is fixed by a threaded hole on the side of the end of the card slot rail assembly, its inner side contacts the side of the end of the card slot rail assembly, and its end is embedded in the groove of the card slot rail assembly so as to contact the module PCB board and provide elastic force.
[0019] Further configuration: the L probe is L-shaped, its base is soldered to the probe mounting hole on the module PCB board, and the tip of the L probe is perpendicular to the side of the card slot rail assembly. When the L probe is not subjected to external force, its tip is completely pushed out under the action of internal spring force.
[0020] The configuration is further defined as follows: the base of the spring pin is soldered to the pin mounting hole on the module PCB board, and its pin tip is in contact with the exposed copper area of the PCB motherboard. The exposed copper area of the PCB motherboard is treated with immersion gold. When the spring pin is not subjected to external force, its pin tip is pushed out under the action of internal spring force to maintain stable contact with the exposed copper area of the PCB motherboard.
[0021] The parts of the device not covered herein are the same as or can be implemented using existing technologies. Attached Figure Description
[0022] Figure 1 This is a top view of the present invention;
[0023] Figure 2 This is an isometric view of the present invention;
[0024] Figure 3 This is a schematic diagram of the installation of this utility model.
[0025] In the diagram: 1. Module PCB board; 2. Card slot rail; 3. Unlocking block; 4. First surface mount neodymium iron boron; 5. Second surface mount neodymium iron boron; 6. Limiting cover; 7. Spring; 8. L probe; 9. Spring ejector pin; 10. PCB motherboard. Detailed Implementation
[0026] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be described in detail below with reference to the accompanying drawings. The description in this part is only exemplary and explanatory, and should not be used to limit the scope of protection of the present invention in any way.
[0027] Please see Figures 1 to 3 A modular self-locking board device for point-to-point equipment in a substation includes PCB-related components, a card slot rail assembly 2, an unlocking assembly, and auxiliary fixing and connection components.
[0028] The PCB-related components include a module PCB board 1 and a PCB motherboard 10. The module PCB board 1 has external interfaces soldered on it and has probe mounting holes and ejector pin mounting holes. The probe mounting holes are connected to the copper-plated area of the module PCB board 1 to form a common ground. The ejector pin mounting holes are connected to the device pins of the external interfaces on the module PCB board 1 to form an electrical path. The PCB motherboard 10 is used to carry the module PCB board 1 and other components, and to achieve electrical connection and fixation with the module PCB board 1.
[0029] The card slot rail assembly 2 is mirrored on both sides of the module PCB board 1 to form a slot for the module PCB board 1 to be inserted;
[0030] The unlocking components include unlocking block 3, first patch neodymium iron boron 4, and second patch neodymium iron boron 5;
[0031] The auxiliary fixing and connection components include a limiting cover 6, a spring 7, an L-probe 8, and a spring pin 9.
[0032] In this embodiment, as Figure 1 As shown, the insertion slot of the card slot rail assembly 2 is chamfered to facilitate blind insertion of the module PCB board 1.
[0033] In this embodiment, as Figure 1 As shown, a cavity inclined towards the end is provided near the end of the slot rail assembly 2. A blind hole is provided on the vertical surface of the cavity. The slot rail assembly 2 is also provided with threaded holes for mounting parts and protrusions for positioning and soldering. The protrusions are precisely matched with the corresponding mounting soldering holes on the PCB motherboard 10. After soldering, the module PCB board 1 and the PCB motherboard 10 can be electrically connected and grounded through the copper-filled area of the slot rail assembly 2 and the L probe 8.
[0034] In this embodiment, as Figure 1 and Figure 2As shown, the unlocking block 3 is placed in the cavity near the end of the card slot rail assembly 2. The bottom surface of the unlocking block 3 has the same inclination angle as the cavity of the card slot rail assembly 2. The horizontal cross-section of the unlocking block 3 is trapezoidal. A blind hole is provided on the vertical surface of the unlocking block 3 that fits with the blind hole of the cavity of the card slot rail assembly 2. The first patch neodymium iron boron 4 is embedded in the blind hole of the card slot rail assembly 2, and the second patch neodymium iron boron 5 is embedded in the blind hole of the unlocking block 3. The first patch neodymium iron boron 4 and the second patch neodymium iron boron 5 are attracted by opposite poles to fix the unlocking block 3 to the end of the cavity of the card slot rail assembly 2.
[0035] In this embodiment, as Figure 1 and Figure 3 As shown, the limiting cover 6 is an L-shaped bent part, which is fixed by the threaded hole on the slot rail assembly 2. Its bottom end face is in close contact with the top end face of the slot rail assembly 2, and its inner end face is in close contact with the side end face of the slot rail assembly 2, so as to constrain the unlocking block 3 in the cavity of the slot rail assembly 2.
[0036] In this embodiment, as Figure 1 and Figure 2 As shown, the spring 7 is fixed by the threaded hole on the side of the end of the slot rail assembly 2. Its inner side contacts the side of the end of the slot rail assembly 2, and its end is embedded in the groove of the slot rail assembly 2 so as to contact the module PCB board 1 and provide elastic force.
[0037] In this embodiment, as Figure 1 , Figure 2 and Figure 3 As shown, the L probe 8 is L-shaped, and its base is soldered to the probe mounting hole of the module PCB board 1. The tip of the L probe 8 is perpendicular to the side of the slot rail assembly 2. When the L probe 8 is not subjected to external force, its tip is completely pushed out under the action of the internal spring force.
[0038] In this embodiment, as Figure 1 and Figure 3 As shown, the base of the spring ejector pin 9 is soldered to the ejector pin mounting hole of the module PCB board 1, and its pin tip is in contact with the exposed copper area of the PCB motherboard 10. The exposed copper area of the PCB motherboard 10 is treated with immersion gold process. When the spring ejector pin 9 is not subjected to external force, its pin tip is pushed out under the action of internal wire spring force to maintain stable contact with the exposed copper area of the PCB motherboard 10.
[0039] The modular self-locking board device for point-to-point equipment in substations operates as follows:
[0040] Before installing the module PCB board 1, ensure that all parts have been processed and inspected for damage; the L probe 8 and spring pin 9 have been pre-soldered on the module PCB board 1, and the external interface has also been soldered; the card slot rail 2 has been installed on the PCB motherboard 10, the first patch neodymium iron boron 4 has been embedded in the blind hole of the card slot rail 2, the second patch neodymium iron boron 5 has been embedded in the blind hole of the unlocking block 3, and the limit shield 6 and spring 7 have been installed in the corresponding positions of the card slot rail 2 respectively;
[0041] The module PCB board 1 is placed at the slot entrance of the two mirror-arranged card slot rails 2 and slowly pushed in while keeping it horizontal. During the pushing process, the tip of the L probe 8 will make point contact with the vertical surface of the card slot rail 2. Due to the pressure, the tip will retract. This process utilizes the chamfer design at the insertion slot of the card slot rail 2, making the blind insertion of the module PCB board 1 smoother and allowing for quick insertion without precise alignment.
[0042] When the tip of L probe 8 enters the cavity of the slot rail 2, the contact point between the tip and the vertical surface of the slot rail 2 disappears instantly. At this moment, the tip of L probe 8 is instantly ejected under the force of the internal spring, and a "ding" sound of metal collision can be heard when the tip is ejected. At this time, the module PCB board 1 is initially fixed in its current position by the elastic force generated by the elastic deformation of the spring 7, and cannot be removed along the original path, thus completing the initial locking of the board. This locking mechanism ensures the stability of the module PCB board 1 in subsequent operations and prevents it from accidentally coming out.
[0043] As the module PCB board 1 continues to be slowly pushed in, the tip of the L probe 8 will contact the trapezoidal side of the unlocking block 3. As the module PCB board 1 is pushed in, the tip is compressed and retracts. When it is pushed to a certain extent, the tip is compressed and retracts to its maximum value, then slides over the trapezoidal top surface of the unlocking block 3 and enters another trapezoidal side of the unlocking block 3. At this time, the pressure on the tip is gradually released, and it will be gradually pushed out again. During this process, the module PCB board 1 continues to move forward until it reaches the limit position. Due to the complete ejection of the L probe 8 and the cavity restriction of the slot rail 2, the module PCB board 1 cannot be pushed in further. At the same time, the elastic deformation of the spring 7 intensifies, generating a large pushing force on the module PCB board 1, causing the module PCB board 1 to tend to exit along the slot.
[0044] After the module PCB board 1 is installed and locked, the tip of the spring pin 9 makes contact with the exposed copper area of the PCB motherboard 10 under the action of the internal spring force. If the exposed copper area of the PCB motherboard 10 adopts the immersion gold process, the stability and reliability of the electrical connection can be further improved. At this time, the onboard external interface devices of the module PCB board 1 (such as devices connected by a 4-port RJ45 interface) and the PCB motherboard 10 form a complete electrical circuit, realizing functions such as data transmission and electrical signal interaction, and meeting the working requirements of the substation's point-to-point equipment. During the operation of the substation, even if the equipment is subjected to a certain degree of vibration or electromagnetic interference, the module PCB board 1 is firmly locked by the cooperation of the L probe 8 and the card slot rail 2 and the elastic force of the spring 7, and the electrical connection between each part is stable and reliable. Therefore, it can effectively avoid the problem of poor contact caused by loose board cards and ensure the stable operation of the equipment.
[0045] The contents not described in detail in this specification are existing technologies known to those skilled in the art.
[0046] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0047] This article uses specific examples to illustrate the principles and implementation methods of this utility model. The above examples are only for the purpose of helping to understand the method and core ideas of this utility model. The above description is only a preferred embodiment of this utility model. It should be noted that due to the limitations of textual expression, there are objectively infinite specific structures. For those skilled in the art, several improvements, modifications, or changes can be made without departing from the principles of this utility model, and the above technical features can also be combined in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the concept and technical solution of the utility model to other occasions without modification, should all be considered within the protection scope of this utility model.
Claims
1. A modular self-locking board device for point-to-point equipment in a substation, characterized in that, This includes PCB-related components, card slot rail components (2), unlocking components, and auxiliary fixing and connecting components; The PCB-related components include a module PCB board (1) and a PCB motherboard (10). The module PCB board (1) has an external interface soldered on it and has probe mounting holes and pin mounting holes. The probe mounting holes are connected to the copper-filled area of the module PCB board (1) to form a common ground. The pin mounting holes are connected to the device pins of the external interface on the module PCB board (1) to form an electrical path. The PCB motherboard (10) is used to carry the module PCB board (1) and other components, and to achieve electrical connection and fixation with the module PCB board (1). The card slot rail assembly (2) is mirror-distributed on both sides of the module PCB board (1) to form a slot for the module PCB board (1) to be inserted; The unlocking component includes an unlocking block (3) and a first patch neodymium iron boron (4) and a second patch neodymium iron boron (5); The auxiliary fixing and connecting components include a limiting shield (6), a spring (7), an L-probe (8), and a spring pin (9).
2. The apparatus according to claim 1, characterized in that, The slot of the card slot assembly (2) is chamfered to facilitate blind insertion of the module PCB board (1).
3. The apparatus according to claim 1, characterized in that, The slot rail assembly (2) has a cavity that is inclined towards the end near its end. A blind hole is provided on the vertical surface of the cavity. The slot rail assembly (2) also has threaded holes for mounting parts and protrusions for positioning and welding. The protrusions are precisely matched with the corresponding mounting soldering holes on the PCB motherboard (10). After soldering, the module PCB board (1) and the PCB motherboard (10) can be electrically connected and grounded through the copper-filled area of the slot rail assembly (2) and the L probe (8).
4. The apparatus according to claim 1, characterized in that, The unlocking block (3) is placed in the cavity near the end of the card slot rail assembly (2). The bottom surface of the unlocking block (3) is inclined at the same angle as the cavity of the card slot rail assembly (2). The horizontal cross section of the unlocking block (3) is trapezoidal. A blind hole is provided on the vertical surface of the unlocking block (3) that fits with the blind hole of the cavity of the card slot rail assembly (2). The first patch neodymium iron boron (4) is embedded in the blind hole of the card slot rail assembly (2). The second patch neodymium iron boron (5) is embedded in the blind hole of the unlocking block (3). The first patch neodymium iron boron (4) and the second patch neodymium iron boron (5) attract each other through opposite poles to fix the unlocking block (3) to the end of the cavity of the card slot rail assembly (2).
5. The apparatus according to claim 1, characterized in that, The limiting cover (6) is an L-shaped bent part, which is fixed by the threaded hole on the slot rail assembly (2). Its bottom end face is in close contact with the top end face of the slot rail assembly (2), and its inner end face is in close contact with the side end face of the slot rail assembly (2) so as to constrain the unlocking block (3) in the cavity of the slot rail assembly (2).
6. The apparatus according to claim 1, characterized in that, The spring (7) is fixed by the threaded hole on the side of the end of the slot rail assembly (2), and its inner side contacts the side of the end of the slot rail assembly (2) and its end is embedded in the groove of the slot rail assembly (2) to contact the module PCB board (1) and provide elastic force.
7. The apparatus according to claim 1, characterized in that, The L probe (8) is L-shaped, and its base is soldered to the probe mounting hole of the module PCB board (1). The tip of the L probe (8) is perpendicular to the side of the slot rail assembly (2). When the L probe (8) is not subjected to external force, its tip is completely pushed out under the action of the internal spring force.
8. The apparatus according to claim 1, characterized in that, The base of the spring pin (9) is soldered to the pin mounting hole of the module PCB board (1), and its pin tip is in contact with the exposed copper area of the PCB motherboard (10). The exposed copper area of the PCB motherboard (10) is treated with immersion gold process. When the spring pin (9) is not subjected to external force, its pin tip is pushed out under the action of internal wire spring force to maintain stable contact with the exposed copper area of the PCB motherboard (10).