Mobile phone VC heat dissipation fin based on cold stamping process

Abstract

The utility model discloses a kind of mobile phone VC radiating fins based on cold stamping process, belong to mobile phone radiating assembly technical field, comprising: bottom cover, first interface is provided on bottom cover;Multiple convex points are arranged on bottom cover in array;Net cover, net cover and bottom cover buckle connection;Second interface is provided on net cover, first interface and second interface are correspondingly arranged, to form injection port;Multiple microgrooves are arranged on net cover in array, multiple microgrooves cooperate with multiple convex points.The utility model provides a kind of mobile phone VC radiating fins based on cold stamping process, the utility model aims at providing a kind of VC radiating fin based on cold stamping process, realize lightweight, high heat conduction, low-cost high efficient heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the field of mobile phone heat dissipation components technology, specifically a mobile phone VC heat sink based on cold stamping process. Background Technology

[0002] As mobile phone chip performance improves, heat generation becomes increasingly prominent. As a core heat dissipation component, the performance and cost of VC heat sinks directly affect the user experience and production economy of mobile phones.

[0003] Currently, most mainstream mobile phone VC heat sinks on the market are made of SUS316L-O stainless steel, formed by multi-station progressive die stamping, followed by laser welding, vacuuming, and liquid injection. However, this existing technology has the following drawbacks:

[0004] Stainless steel has a high density (approximately 7.9 g / cm³). 3 This results in a heavy heatsink with a low thermal conductivity (approximately 15 W / m·K) and low heat dissipation efficiency. The material cost of mobile phone VC heatsinks is high, with the raw material thickness typically being 0.08 mm. The material cost is high, and the processing technology is complex, resulting in a low yield, slow thermal response, and a tendency to cause heat buildup on the chip.

[0005] Therefore, there is an urgent need for a lightweight, high thermal conductivity, low cost, and easy-to-manufacture mobile phone VC heat sink solution. Utility Model Content

[0006] To achieve the above technical objectives, this utility model provides a mobile phone VC heat sink based on cold stamping process, adopting the following technical solution:

[0007] A mobile phone VC heat sink based on cold stamping process, comprising:

[0008] A bottom cover, wherein a first interface is provided on the bottom cover; and multiple protrusions are arranged in an array on the bottom cover;

[0009] A mesh cover is fastened to the bottom cover; a second interface is provided on the mesh cover, and the first interface and the second interface are correspondingly provided to form an injection port; a plurality of microgrooves are arrayed on the mesh cover, and the plurality of microgrooves cooperate with a plurality of protrusions.

[0010] Furthermore, the edge of the mesh cover is provided with a folded edge that bends towards the bottom cover, and the folded edge has a planar structure.

[0011] Furthermore, the width of the folded edge is 0.5-1.2 mm.

[0012] Furthermore, both the bottom cover and the mesh cover are made of cold-rolled aluminum alloy sheet.

[0013] Furthermore, the protrusion is hemispherical.

[0014] Furthermore, the height of the protrusion is 0.15-0.25 mm, and the diameter is 0.3-0.5 m.

[0015] Furthermore, the distance between two adjacent protrusions is 0.6-1.2 mm.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0017] Both the bottom cover and the mesh cover are made of cold-rolled aluminum alloy sheet with a density of only 2.7 g / cm³. 3 It achieves lightweight design, improves user experience, and has low material cost and simple processing technology, making it suitable for mass production; the VC heat sink has a thermal conductivity of up to 210W / m·K, a thermal resistance as low as 0.25℃ / W, improves heat dissipation uniformity by 14%, significantly improves heat dissipation efficiency, and has high structural strength and strong compatibility, and can be used in combination with heat pipes, graphite sheets, etc. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the bottom cover of this utility model;

[0020] Figure 2 This is a schematic diagram of the structure of the mesh cover of this utility model;

[0021] Figure 3 This is a schematic diagram of the structure of the VC heat sink of this utility model;

[0022] In the diagram: 1. Bottom cover; 2. Mesh cover; 3. VC heat sink; 4. Overlapping edge; 5. Liquid injection port; 6. Protrusion. Detailed Implementation

[0023] The technical solutions of the utility model embodiments will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the utility model, and not all embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the utility model.

[0024] Example 1

[0025] like Figures 1 to 3As shown, a mobile phone VC heat sink based on cold stamping process is characterized by comprising:

[0026] Bottom cover 1, with a first interface provided on bottom cover 1; multiple protrusions 6 are arrayed on bottom cover 1;

[0027] Mesh cover 2 and bottom cover 1 are fastened together; a second interface is provided on mesh cover 2, and the first interface and the second interface are correspondingly provided to form an injection port 5; multiple microgrooves are arrayed on mesh cover 2, and the multiple microgrooves cooperate with multiple protrusions 6.

[0028] In this embodiment, the edge of the mesh cover 2 is provided with a folded edge that bends toward the bottom cover 1, and the folded edge is a planar structure.

[0029] In this embodiment, the width of the folded edge is 0.5-1.2mm.

[0030] Through the above technical solution, the folded edge setting facilitates the welding process after the bottom cover is inserted into the mesh cover for positioning. After welding, the mesh cover, as the upper cover of the cavity, is fastened to the bottom cover with the convex structure. The folded edge of the edge plane structure is laser welded to form a highly sealed flat cavity, which is the cavity of the VC heat sink 3.

[0031] In this embodiment, both the bottom cover 1 and the mesh cover 2 are made of cold-rolled aluminum alloy sheet.

[0032] Preferably, the bottom cover 1 and the mesh cover 2 are made of 3003 series aluminum alloy cold-rolled sheet formed by stamping and multi-station progressive die stamping, reducing the thickness of the raw material to 0.05mm and reducing material costs.

[0033] In this embodiment, the protrusion 6 is hemispherical.

[0034] In this embodiment, the height of the protrusion 6 is 0.15-0.25mm and the diameter is 0.3-0.5mm.

[0035] In this embodiment, the distance between two adjacent protrusions 6 is 0.6-1.2mm.

[0036] Through the above technical solution, the bottom cover 1 has an array of hemispherical protrusions 6, which can ensure the structural strength of the bottom cover 1 and improve heat dissipation efficiency.

[0037] The manufacturing process of a mobile phone VC heat sink based on cold stamping technology provided by this utility model is as follows:

[0038] S1, bottom cover 1, and mesh cover 2 are formed by continuous stamping using multi-station progressive dies:

[0039] S1.1, First station: Blanking blank, with dimensional tolerance controlled within ±0.03mm;

[0040] S1.2, Second station: Pre-forming protrusion 6, the height of protrusion 6 is controlled at 70% to 80% of the design value;

[0041] S1.3, Third station: Precision pressing of protrusion 6 to achieve final dimensional requirements;

[0042] S1.4, Fourth station: Punching;

[0043] S1.5, Fifth station: Hemming and forming;

[0044] S1.6, Sixth Station: Unloading;

[0045] S2. The bottom cover 1 and the mesh cover 2 are interlocked in opposite directions as required. The overlapping edge 4 is fully laser welded to ensure the product's airtightness. The liquid injection port 5 is left unwelded to form the VC heat sink 3.

[0046] Vacuum was drawn into the cavity of S3 and VC heat sink 3, and coolant was injected.

[0047] S4, Laser welding of the liquid injection port 5, sealing the entire VC heat sink 3.

[0048] Among them, the progressive die makes the stamping mold tooling for the product; the laser machine achieves micron-level precision welding through a non-contact heat source, so that the overlapping edge 4 of the bottom cover 1 and the mesh cover 2 is fused; the vacuum machine extracts the air from the inner cavity of the VC heat sink 3 to ensure that the injected coolant can smoothly enter the inner cavity.

[0049] Obviously, those skilled in the art can make various modifications and variations to the utility model without departing from the spirit and scope of the utility model. Therefore, if these modifications and variations of the utility model fall within the scope of the utility model claims and their equivalents, the utility model is also intended to include these modifications and variations.

Claims

1. A mobile phone VC heat sink based on cold stamping process, characterized in that, include: A bottom cover, wherein a first interface is provided on the bottom cover; and multiple protrusions are arranged in an array on the bottom cover; A mesh cover is fastened to the bottom cover; a second interface is provided on the mesh cover, and the first interface and the second interface are correspondingly provided to form an injection port; a plurality of microgrooves are arrayed on the mesh cover, and the plurality of microgrooves cooperate with a plurality of protrusions.

2. The mobile phone VC heat sink based on cold stamping process as described in claim 1, characterized in that, The edge of the mesh cover is provided with a folded edge that bends towards the bottom cover, and the folded edge has a planar structure.

3. A mobile phone VC heat sink based on cold stamping process as described in claim 2, characterized in that, The width of the folded edge is 0.5-1.2mm.

4. A mobile phone VC heat sink based on cold stamping process as described in claim 1, characterized in that, Both the bottom cover and the mesh cover are made of cold-rolled aluminum alloy sheet.

5. A mobile phone VC heat sink based on cold stamping process as described in claim 1, characterized in that, The protrusion is hemispherical.

6. A mobile phone VC heat sink based on cold stamping process as described in claim 5, characterized in that, The height of the protrusion is 0.15-0.25mm, and the diameter is 0.3-0.5mm.

7. A mobile phone VC heat sink based on cold stamping process as described in claim 5, characterized in that, The distance between two adjacent protrusions is 0.6-1.2 mm.

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