Embedded general-purpose variable frequency drive
Patent Information
- Application Number
- CN202522077554.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-26
- Publication Date
- 2026-10-16
- Estimated Expiration
- 2035-09-26
AI Technical Summary
[0003]变频驱动器在工作时,不可能避免地会产生一定的热量,常见的变频驱动器一般会通过设置散热孔进行被动式散热,但是,被动式散热对于高负载的变频驱动器散热不佳,而且对于嵌入式的变频驱动器,周边遮挡物多,其外露的面较少,仅于其外露面上设置散热孔来依靠被动式散热的散热效果不佳,热量容易积蓄于变频驱动器内部而影响变频驱动器的工作
[0006] The beneficial effects of this invention are as follows: In this invention, the cooling fan operates in tandem with the motherboard, allowing the heat generated by the motherboard during operation to be transferred to the heatsink through the through-holes. The cooling fan, by accelerating airflow, generates airflow to carry away the heat from the heatsink, effectively preventing heat accumulation within the housing and ensuring the reliability of the motherboard. Furthermore, the heatsink can be positioned within the recesses of the housing, reducing its protrusion relative to the housing and thus decreasing the size of the inverter driver, enabling it to be better suited for embedded applications.
Smart Images

Figure CN224863273U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of frequency converter driver design, and in particular to an embedded universal frequency converter driver. Background Technology
[0002] A variable frequency drive, or frequency converter for short, is used in motor products such as asynchronous motors or synchronous motors to change the operating frequency of the motor and thus change its speed, so as to meet the needs of different working conditions and achieve energy saving.
[0003] When a frequency converter is working, it is inevitable that it will generate a certain amount of heat. Common frequency converters usually use heat dissipation holes for passive heat dissipation. However, passive heat dissipation is not good for frequency converters with high loads. Moreover, for embedded frequency converters, there are many surrounding obstructions and little exposed surface. Relying on passive heat dissipation by only setting heat dissipation holes on the exposed surface is not effective. Heat can easily accumulate inside the frequency converter and affect its operation. Utility Model Content
[0004] The purpose of this invention is to provide an embedded universal frequency converter driver that can solve one or more of the above-mentioned problems.
[0005] According to one aspect of the present invention, an embedded universal frequency converter driver is provided, comprising a motherboard, a cooling fan, a heat sink, and a housing. The outer casing has a receiving cavity, and the outer casing has a groove. The bottom of the groove has a through hole, which communicates with the receiving cavity. The motherboard is embedded in the cavity, the heat sink is embedded in the groove and covers the through hole, and the cooling fan is fixedly connected to the heat sink and electrically connected to the motherboard.
[0006] The beneficial effects of this invention are as follows: In this invention, the cooling fan operates in tandem with the motherboard, allowing the heat generated by the motherboard during operation to be transferred to the heatsink through the through-holes. The cooling fan, by accelerating airflow, generates airflow to carry away the heat from the heatsink, effectively preventing heat accumulation within the housing and ensuring the reliability of the motherboard. Furthermore, the heatsink can be positioned within the recesses of the housing, reducing its protrusion relative to the housing and thus decreasing the size of the inverter driver, enabling it to be better suited for embedded applications.
[0007] In some embodiments, this invention further includes an operation panel and an I / O board (Input / Output). The operation panel is located on one side of the housing, and the I / O board is located on the other side of the housing. The operation panel and the I / O board are electrically connected to the main board. In this inverter driver, the I / O board and the operation panel are located on opposite sides of the housing. Therefore, when the inverter driver is embedded and the operation panel is facing the user, the I / O board and its connected cables can be hidden from the user, preventing accidental touches.
[0008] In some embodiments, the housing has a first hole that communicates with the receiving cavity, and the operation panel has a protrusion that is embedded in the first hole and engages with the inner wall of the first hole. The first hole and the protrusion increase the contact area between the operation panel and the housing, thereby improving the reliability of the operation panel's placement on the housing.
[0009] In some embodiments, the housing has a second hole communicating with the receiving cavity, and the I / O plate has a terminal block that extends through and is exposed from the second hole. The second hole can limit the position of the terminal block.
[0010] In some embodiments, the cooling fan includes a fan body, a cover plate, and connecting screws. The fan body is placed on a heat sink, and the cover plate abuts against the fan body. The cover plate has a connecting arm, and the connecting screws are located on the connecting arm and connected to the heat sink. Thus, the cover plate can press the fan body onto the heat sink, ensuring effective contact between the fan body and the heat sink, thereby guaranteeing that the airflow generated by the fan body can effectively pass through the heat sink.
[0011] In some embodiments, the heat sink has a recess, and the cooling fan is disposed within the recess. The recess serves two purposes: firstly, it limits the movement of the cooling fan, and secondly, it reduces the outward protrusion of the cooling fan relative to the housing, thereby further reducing the size of the inverter driver and enabling it to be better suited for embedded applications.
[0012] In some embodiments, the motherboard has components that abut against a heatsink. This allows the components to better transfer heat to the heatsink.
[0013] In some embodiments, the housing includes a base and a top cover, the top cover being connected to the base and forming an accommodating cavity with the base, and the groove being provided on the top cover. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the structure of an embedded universal frequency converter driver according to one embodiment of the present invention.
[0015] Figure 2This is a schematic diagram of the structure of an embedded universal frequency converter driver according to one embodiment of the present invention.
[0016] Figure 3 This is an exploded view of the structure of an embedded universal frequency converter driver according to one embodiment of the present invention.
[0017] In the diagram: 1. Motherboard, 2. Cooling fan, 3. Heatsink, 4. Housing, 5. Control panel, 6. I / O board, 11. Components, 21. Fan body, 22. Cover plate, 23. Connecting screw, 221. Connecting arm, 31. Recess, 41. Base, 42. Top cover, 421. Groove, 422. Through hole, 423. Heat dissipation hole, 43. First hole, 44. Second hole, 51. Protrusion, 61. Terminal block. Detailed Implementation
[0018] The present invention will now be described in further detail with reference to the accompanying drawings.
[0019] refer to Figure 1 , Figure 2 and Figure 3 The present invention relates to an embedded universal frequency converter driver, comprising a motherboard 1, a cooling fan 2, a heat sink 3, and a housing 4.
[0020] The outer casing 4 includes a base 41 and a top cover 42. The top cover 42 is fixedly connected to the base 41 by screws. The connected top cover 42 and base 41 enclose a receiving cavity, that is, the outer casing 4 has a receiving cavity. The top surface of the top cover 42 has a groove 421, and the bottom of the groove 421 has a through hole 422, which communicates with the receiving cavity. In addition, the top surface of the top cover 42 may also have heat dissipation holes 422.
[0021] The motherboard 1 is fixedly connected to the base 41 by screws, and the motherboard 41 is embedded in the accommodating cavity. The heat sink 3 is fixedly connected to the top cover 42 by screws, and the heat sink 3 is embedded in the groove 421, and the heat sink 3 covers the through hole 422.
[0022] The motherboard 1 is provided with components 10, which can be capacitors, resistors or chips, etc. Some components 10 extend into the through hole 422 and directly abut against the heat sink 3 so that the heat of the component 10 can be directly transferred to the heat sink 3.
[0023] The heat sink 3 also has a recess 31.
[0024] The cooling fan 2 includes a fan body 21, a cover plate 22, and connecting screws 23. The fan body 21 is placed on the heat sink 3 and located in the recess 31. The cover plate 22 abuts against the top of the fan body 21 and has a connecting arm 221. There can be multiple connecting arms 221 and connecting screws 23. The connecting arms 221 can be equipped with connecting screws 23, and all connecting screws 23 are fixedly connected to the heat sink 3 through threaded engagement. This allows the cover plate 22 to effectively press the fan body 21 onto the heat sink 3. The fan body 21 of the cooling fan 2 is also electrically connected to the motherboard 1 through wires.
[0025] Furthermore, the total height of the heat sink 3 and cooling fan 2 after installation is no higher than the top height of the housing 4, allowing the heat sink 3 and cooling fan 2 to be embedded in the housing 4, thereby reducing the size of this embedded universal frequency converter. This allows the embedded universal frequency converter to be easily embedded in the space of most devices, saving installation area for users while providing stronger adaptability and deployment flexibility, fully meeting diverse field application needs.
[0026] This embedded universal frequency converter driver also includes an operation panel 5. The operation panel 5 is located on one side of the housing 4. Preferably, this side of the housing 4 has a first hole 43 communicating with the receiving cavity. The back side of the operation panel 5 has a protrusion 51 that is embedded in the first hole 43, and the protrusion 51 has a locking block. The protrusion 51 engages with the inner wall of the first hole 43 through the locking block, thereby effectively fixing the operation panel 5 to this side. The operation panel 5 is connected to the main board 1 via wires to achieve electrical connection with the main board 1.
[0027] This embedded general-purpose frequency converter driver also includes an I / O board 6. The I / O board 6 is located on the other side of the housing 4. Preferably, this side of the housing 4 has a second hole 44 that communicates with a receiving cavity. The main body of the I / O board 6 is close to the housing on this side of the housing 4 and located within the receiving cavity. The I / O board 6 has multiple terminal blocks 61 arranged side-by-side, with each terminal block 61 extending through and exposed from the second hole 44, completely filling the second hole 44. The I / O board 6 is electrically connected to the main board 1 via terminals.
[0028] This embedded general-purpose frequency converter driver can be used for the operation of asynchronous motors, synchronous motors, or small custom motors. When in use, the motor can be connected to the terminal block 61 on the IO board 6 via wires, thus achieving electrical connection between the motor and the main board 1. The main board 1 can change the motor speed by changing the motor's operating frequency to meet the different operating conditions of the motor.
[0029] Furthermore, during setup, the housing 4 can be embedded, and the operation panel 5 can face the user for convenient operation, while the IO board 6 is on the opposite side, so that the wires connected to the terminal block 61 are hidden, which can effectively prevent accidental touches by the user.
[0030] As the motherboard 1 operates, the cooling fan 2 also operates to generate airflow. The heat generated by the motherboard 1 during operation can be transferred to the heat sink 3 through the through hole 422. The airflow generated by the cooling fan 2 can carry away the airflow on the heat sink 3, effectively preventing heat from accumulating in the housing cavity of the outer casing 4, ensuring long-term continuous and stable operation of the inverter driver, and effectively avoiding the risk of performance degradation or shutdown caused by overheating.
[0031] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.
Claims
1. An embedded universal frequency converter driver, characterized in that, Includes motherboard, cooling fan, heatsink, and casing. The outer casing has a receiving cavity, and the outer casing has a groove. The bottom of the groove has a through hole, which communicates with the receiving cavity. The motherboard is embedded in the cavity, the heat sink is embedded in the groove and covers the through hole, and the cooling fan is fixedly connected to the heat sink and electrically connected to the motherboard.
2. The embedded universal frequency converter driver according to claim 1, characterized in that, It includes an operation panel and an I / O board. The operation panel is located on one side of the housing, and the I / O board is located on the other side of the housing. The operation panel and the I / O board are electrically connected to the motherboard.
3. An embedded universal frequency converter driver according to claim 2, characterized in that, The outer casing has a first hole that communicates with the receiving cavity. The operation panel has a protrusion that is embedded in the first hole and engages with the inner wall of the first hole.
4. An embedded universal frequency converter driver according to claim 2, characterized in that, The outer casing has a second hole that communicates with the accommodating cavity. The I / O board has a terminal block that extends through the second hole and is exposed.
5. An embedded universal frequency converter driver according to claim 1, characterized in that, The cooling fan includes a fan body, a cover plate, and connecting screws. The fan body is placed on the heat sink, the cover plate abuts against the fan body, the cover plate has a connecting arm, and the connecting screws are located on the connecting arm and connected to the heat sink.
6. An embedded universal frequency converter driver according to claim 1, characterized in that, The heat sink has a recess, and the cooling fan is located within the recess.
7. An embedded universal frequency converter driver according to claim 1, characterized in that, The motherboard has components that abut against the heat sink.
8. An embedded universal frequency converter driver according to claim 1, characterized in that, The outer casing includes a base and a top cover. The top cover is connected to the base and together with the base, forms an accommodating cavity. The groove is provided on the top cover.