Liquid cooling plate and electronic device

Abstract

The utility model discloses a liquid cooling panel and electronic equipment, this liquid cooling panel includes bottom plate, apron and two shunt plate, bottom plate includes base plate and heat exchange flow guide structure, and base plate has the setting surface, and heat exchange flow guide structure sets up in the setting surface, and heat exchange flow guide structure includes a plurality of interval setting's heat exchange block, and the outer periphery of heat exchange block forms cooling liquid flow channel, and apron seal cover is located base plate and covers and sets up heat exchange flow guide structure, and apron has two mutually independent containing groove, and apron still is equipped with respectively in two containing groove's liquid inlet and liquid outlet that communicate, and two shunt plate respectively cover and set up in the slot mouth of two containing groove, and shunt plate is equipped with the flow -through hole that communicates in containing groove and cooling liquid flow channel, and the side of shunt plate away from containing groove abuts at the end face of heat exchange block far away from the setting surface, to this liquid cooling panel, can effectively promote the flow rate of cooling liquid in cooling liquid flow channel, makes the consistency of the heat dissipation performance of each position of liquid cooling panel better.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a liquid cooling plate and electronic equipment. Background Technology

[0002] To prevent electronic devices from overheating during use, liquid cooling plates are typically used to dissipate heat from the heat-generating electronic components within the device.

[0003] In this technology, the liquid cooling plate has cooling channels, and its outer surface has inlet and outlet ports connected to these channels. However, the liquid cooling plates in this technology typically have high flow resistance, meaning the coolant experiences significant flow resistance, resulting in a slow flow velocity of the coolant within the cooling channels. Furthermore, during the heat exchange process between the coolant and the heat exchange zone of the liquid cooling plate, a larger temperature difference leads to higher heat exchange efficiency, while a smaller temperature difference results in lower efficiency. Therefore, the longer the coolant remains within the cooling channels, the lower its heat exchange efficiency, leading to a relatively low overall heat exchange efficiency for the liquid cooling plate. Utility Model Content

[0004] The first objective of this invention is to provide a liquid cooling plate that can effectively increase the flow rate of the coolant in the coolant channel, thereby improving the consistency of heat dissipation performance at various locations of the liquid cooling plate.

[0005] The second objective of this invention is to provide an electronic device that, by using the aforementioned liquid cooling plate, can significantly alleviate the overheating of some heat-generating electronic components during use.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] In a first aspect, a liquid-cooled plate is provided, comprising:

[0008] The base plate includes a substrate and a heat exchange and flow guiding structure. The substrate has a mounting surface, and the heat exchange and flow guiding structure is disposed on the mounting surface. The heat exchange and flow guiding structure includes a plurality of spaced heat exchange blocks, and a coolant flow channel is formed on the outer periphery of the heat exchange blocks.

[0009] A cover plate, which is sealed and disposed on the substrate and covers the heat exchange and flow guiding structure, has two independent receiving grooves, the openings of which face the heat exchange and flow guiding structure. The cover plate also has an inlet and an outlet respectively connected to the two receiving grooves; and...

[0010] Two flow dividers are located between the cover plate and the heat exchange guiding structure, and the two flow dividers are respectively covered on the openings of the two receiving tanks. The flow dividers are provided with flow holes that connect the receiving tanks and the coolant flow channels. The side of the flow divider away from the receiving tanks abuts against the end face of the heat exchange block away from the setting surface.

[0011] In one embodiment, the substrate is made of diamond copper, and / or the heat exchange block is made of pure copper or a copper alloy.

[0012] In one embodiment, a groove is provided on one side of the substrate, and the bottom surface of the groove is formed as the mounting surface. The substrate includes a thinning portion and a frame portion connected to each other. The frame portion surrounds the outer periphery of the thinning portion, and the groove is formed between the frame portion and the thinning portion.

[0013] The cover plate is sealed to the frame portion.

[0014] In one embodiment, the border portion has a thickness h1, where 1.1 mm ≤ h1 ≤ 1.4 mm.

[0015] In one embodiment, the thinned portion has a thickness h2, where 0.9 mm ≤ h2 ≤ 1.1 mm.

[0016] In one embodiment, the flow hole is a cross-shaped hole.

[0017] In one embodiment, the two receiving slots are spaced apart along a first direction;

[0018] The flow hole includes a first strip hole and a second strip hole that are arranged in opposite directions and connected to each other. The first strip hole extends along the first direction, and the second strip hole extends along the second direction.

[0019] Wherein, the first direction is perpendicular to the second direction, and both the first direction and the second direction are parallel to the setting surface.

[0020] In one embodiment, the flow divider plate is provided with a plurality of flow holes spaced apart.

[0021] In one embodiment, the side of the base plate facing away from the cover plate is configured to face at least one heat source, and corresponding to any one of the heat sources, the flow-through plate has at least one flow hole.

[0022] In one embodiment, the two receiving grooves are arranged at intervals along a first direction, and all the heat exchange blocks and the flow holes are symmetrically arranged along a second direction;

[0023] Wherein, the first direction is perpendicular to the second direction, and both the first direction and the second direction are parallel to the setting surface.

[0024] In one embodiment, the coolant flow channel includes a main flow channel, a plurality of secondary flow channels, and an edge flow channel. The main flow channel is connected to the flow holes on the two manifolds. The secondary flow channels are connected to the main flow channel. The edge flow channels extend along at least a portion of the edge of the mounting surface and are connected to the main flow channel through the secondary flow channels.

[0025] The main flow channel and the secondary flow channel extend at an angle, and the width d1 of the main flow channel is greater than or equal to the width d2 of the secondary flow channel.

[0026] In one embodiment, the width d2 of the secondary flow channel is greater than or equal to 0.2 mm.

[0027] In one embodiment, 0.2mm ≤ d1 ≤ 2mm, 0.2mm ≤ d2 ≤ 0.5mm; and / or,

[0028] The heat exchange block (120) has a height h3, 1.5mm≤h3≤2.5mm.

[0029] In one embodiment, the two receiving tanks are spaced apart along a first direction, the extension direction of the main channel is inclined relative to the first direction, and the liquid inlet end of the main channel is adjacent to the middle of the setting surface along a second direction, and the liquid outlet end of the main channel is adjacent to the edge of the setting surface along the second direction.

[0030] Wherein, the first direction is perpendicular to the second direction, and both the first direction and the second direction are parallel to the setting surface.

[0031] In one embodiment, the coolant flow channel includes a plurality of main channels, which are spaced apart along a second direction;

[0032] Multiple secondary channels are connected between two adjacent main channels.

[0033] In one embodiment, the coolant flow channel includes two first main flow channels and two second main flow channels. The two first main flow channels are disposed between the two second main flow channels. The width of the first main flow channels gradually decreases from the middle of the first main flow channels to both ends. The width of the second main flow channels gradually increases from the inlet end of the second main flow channels to the outlet end adjacent to the second main flow channels. The outlet end of the second main flow channels is connected to the edge flow channel.

[0034] In one embodiment, the plurality of secondary channels include a plurality of parallel channels extending along a first direction. The parallel channels are located between the liquid inlet end of the main channel and the edge channel. The plurality of parallel channels are spaced apart along a second direction. One end of the parallel channel is connected to the edge channel, and the other end of the parallel channel is connected to the main channel or the secondary channel.

[0035] In one embodiment, a portion of the plurality of heat exchange blocks is a turbulence forming block. There are multiple turbulence forming blocks, and the cross-sectional shape of the turbulence forming block is a rhombus with smooth transitions at the edges and corners. The turbulence forming block is located at the center of the setting surface along the second direction, and the plurality of turbulence forming blocks are arranged at intervals along the first direction.

[0036] In one embodiment, the heat exchange guiding structure is 3D printed and disposed on the disposed surface; and / or,

[0037] The cover plate is detachably connected to the substrate, and the flow divider plate is detachably or 3D printed onto the heat exchange block; or, both the cover plate and the flow divider plate are 3D printed onto the base plate.

[0038] In a second aspect, an electronic device is provided, including a heat-generating electronic device and the liquid cooling plate, wherein the bottom plate of the liquid cooling plate is disposed facing the heat-generating electronic device on the side opposite to the cover plate.

[0039] The beneficial effects of this utility model are:

[0040] This utility model discloses a liquid cooling plate. By setting a receiving groove in the cover plate and a flow divider plate with flow holes at the opening of the receiving groove, the receiving groove can serve as a buffer space between the flow holes and the inlet and outlet, making the flow of coolant between the flow holes and the inlet and outlet more smooth and less prone to flow interruption at the flow holes. At the same time, the flow path of the coolant flow channel connected to the flow holes can be flexibly adjusted by adjusting the size, shape, and number of flow holes. This allows for flexible adjustment of the flow path of coolant flowing into and out of the coolant flow channel from the flow holes. By increasing the total inflow and outflow path of the coolant flow channel, the flow rate of coolant flowing through the coolant flow channel per unit time can be increased, thereby effectively increasing the flow velocity of coolant in the coolant flow channel, reducing the time that a unit volume of coolant flows in the coolant flow channel, and improving the consistency of heat dissipation performance at all locations of the liquid cooling plate. Attached Figure Description

[0041] Figure 1 This is a three-dimensional structural diagram of the liquid cooling plate described in the embodiment;

[0042] Figure 2 This is a cross-sectional view of the liquid cooling plate described in the embodiment;

[0043] Figure 3 This is an exploded view of the liquid cooling plate structure at one angle as described in the embodiment.

[0044] Figure 4 This is an exploded view of the liquid cooling plate from another angle, as described in the embodiment.

[0045] Figure 5 This is a schematic diagram of the base plate structure (viewed from the front of the mounting surface) as described in the embodiment.

[0046] In the picture:

[0047] 1. Base plate; 11. Base plate; 110. Mounting surface; 111. Groove; 112. Thinning section; 113. Frame section; 12. Heat exchange and flow guiding structure; 120. Heat exchange block; 1201. Turbulence forming block; 121. Coolant flow channel; 1211. Main flow channel; 12110. Inlet end; 12111. Outlet end; 1211a. First main flow channel; 1211b. Second main flow channel; 1212. Secondary flow channel; 1212a. Parallel flow channel; 1213. Edge flow channel;

[0048] 2. Cover plate; 20. Receiving tank; 21. Liquid inlet; 210. Inlet connector; 22. Liquid outlet; 220. Outlet connector;

[0049] 3. Diverter plate; 31. Flow hole; 311. First strip hole; 312. Second strip hole;

[0050] 4. Locking mechanism. Detailed Implementation

[0051] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0052] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0053] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0054] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0055] like Figures 1 to 4 As shown, this embodiment provides a liquid cooling plate, including a base plate 1, a cover plate 2, and two flow dividers 3. The base plate 1 includes a substrate 11 and a heat exchange and flow guiding structure 12. The substrate 11 has a mounting surface 110, and the heat exchange and flow guiding structure 12 is disposed on the mounting surface 110. The heat exchange and flow guiding structure 12 includes a plurality of spaced heat exchange blocks 120, and a cooling liquid flow channel 121 is formed on the outer periphery of the heat exchange blocks 120. The cover plate 2 is sealed and covers the substrate 11 and the heat exchange and flow guiding structure 12. The cover plate 2 has two independent containers. The trough 20 has its opening facing the heat exchange guiding structure 12. The cover plate 2 is also provided with an inlet 21 and an outlet 22 that are respectively connected to the two troughs 20. The flow divider 3 is located between the cover plate 2 and the heat exchange guiding structure 12, and the two flow dividers 3 are respectively covered on the openings of the two troughs 20. The flow divider 3 is provided with a flow hole 31 that is connected to the trough 20 and the coolant flow channel 121. The side of the flow divider 3 away from the trough 20 abuts against the end face of the heat exchange block 120 away from the setting surface 110.

[0056] By providing a receiving groove 20 in the cover plate 2 and a flow divider 3 with a flow hole 31 at the opening of the receiving groove 20, the receiving groove 20 can serve as a buffer space between the flow hole 31 and the inlet 21 and outlet 22. This allows for smoother flow of coolant between the flow hole 31 and the inlet 21 and outlet 22, reducing the likelihood of flow interruption at the flow hole 31. Furthermore, the coolant flow rate connected to the flow hole 31 can be flexibly adjusted by changing the size, shape, and number of the flow holes 31. The flow path of the flow channel 121 can be flexibly adjusted so that the flow path of the coolant flowing into and out of the coolant flow channel 121 through the flow hole 31 can be increased. This can increase the flow rate of the coolant flowing through the coolant flow channel 121 per unit time by increasing the total inflow and outflow path of the coolant flow channel 121, thereby effectively increasing the flow velocity of the coolant in the coolant flow channel 121 and reducing the time that a unit volume of coolant flows in the coolant flow channel 121, resulting in better consistency of heat dissipation performance at various locations of the liquid cooling plate.

[0057] Optionally, the substrate 11 is made of diamond copper, which gives the substrate 11 excellent thermal conductivity, reaching 800W / mK to 1000W / mK, and the liquid cooling plate has a high upper limit for heat dissipation.

[0058] Optionally, the heat exchange block 120 is made of pure copper or copper alloy, so that the material of the heat exchange block 120 has good bonding performance with the substrate 11. In particular, when the heat exchange block 120 is set on the substrate 11 by 3D printing, the connection between the heat exchange block 120 and the substrate 11 is tight and stable. In addition, the material of the heat exchange block 120 is suitable for 3D printing, and the heat exchange block 120 also has good thermal conductivity.

[0059] Optionally, a groove 111 is provided on one side of the substrate 11, and the bottom surface of the groove 111 is formed as a setting surface 110. The substrate 11 includes a thinning portion 112 and a frame portion 113 connected to each other. The frame portion 113 surrounds the outer periphery of the thinning portion 112, and a groove 111 is formed between the frame portion 113 and the thinning portion 112. The cover plate 2 is sealed and connected to the frame portion 113. Thus, on the one hand, the groove 111 can provide a certain setting space for the heat exchange and flow guiding structure 12, so that the structure of the liquid cooling plate is more compact and thinner. On the other hand, the thicker frame portion 113 can make the structure of the substrate 11 better, so that the substrate 11 is less likely to undergo significant deformation during use, thereby making the heat dissipation effect of the liquid cooling plate on the heat-generating electronic devices more stable.

[0060] The frame portion 113 has a thickness h1. It is understood that the larger the thickness h1, the better the deformation resistance of the frame portion 113. However, the substrate 11 occupies a larger installation space. Therefore, the thickness h1 can be relatively large but not too large. Based on this, the thickness h1 of the frame portion 113 can optionally satisfy: 1.1mm≤h1≤1.4mm. For example, the thickness h1 of the frame portion 113 can be 1.1mm, 1.15mm, 1.2mm, 1.25mm, 1.3mm, 1.35mm or 1.4mm, etc.

[0061] The thinning portion 112 has a thickness h2. It is understood that the smaller the thickness h2, the larger the volume of the groove 111, and the larger the space that can be provided for the heat exchange flow guiding structure 12 by setting the groove 111. However, if the thickness h2 is too small, the structural strength of the thinning portion 112 will be too poor, and it will be easy to undergo obvious deformation or breakage. Therefore, the thickness h2 can be small but not too small. Based on this, the thickness h2 of the thinning portion 112 can optionally satisfy: 0.9mm≤h2≤1.1mm. For example, the thickness h2 of the thinning portion 112 can be 0.9mm, 0.95mm, 1mm, 1.05mm or 1.1mm, etc.

[0062] Optionally, the flow hole 31 is a cross-shaped hole, thus increasing the communication area between the flow hole 31 and the coolant flow channel 121. Furthermore, compared to non-irregularly shaped holes such as circular or square holes of the same area, the cross-shaped flow hole 31 has less impact on the structural strength of the distributor plate 3. Of course, the flow hole 31 is not limited to a cross shape; it can also consist of multiple small holes arranged in a cross shape, or multiple small holes distributed in a matrix, etc.

[0063] Optionally, the two receiving grooves 20 are arranged at intervals along the first direction S1, and the flow hole 31 includes a first strip hole 311 and a second strip hole 312 that are arranged in a cross direction and connected to each other. The first strip hole 311 extends along the first direction S1, and the second strip hole 312 extends along the second direction S2. The first direction S1 and the second direction S2 are perpendicular to each other, and both the first direction S1 and the second direction S2 are parallel to the setting surface 110. Thus, the flow hole 31 is formed as a cross-shaped hole with a large communication area with the coolant flow channel 121 along both the first direction S1 and the second direction S2.

[0064] Optionally, the flow divider 3 is provided with a plurality of flow holes 31 at intervals, so that by increasing the number of flow holes 31, the communication area and communication position between the flow holes 31 and the coolant flow channel 121 can be adjusted more flexibly.

[0065] Because the coolant in the coolant channel 121 near the flow hole 31 has good flow smoothness, the coolant flow rate is stable and relatively fast, and the heat exchange efficiency of the coolant is stable, on the basis of this, the side of the base plate 1 away from the cover plate 2 is optionally set to face at least one heat source. Corresponding to any heat source, the flow plate 3 is provided with at least one flow hole 31 so that the liquid cooling plate can dissipate heat to the heat source more stably and efficiently.

[0066] Optionally, all heat exchange blocks 120 and flow holes 31 are symmetrically arranged along the second direction S2, so that the heat dissipation function of the two halves of the liquid cooling plate along the second direction S2 is more consistent.

[0067] Please combine Figure 5 As shown, optionally, the coolant flow channel 121 includes a main flow channel 1211, a plurality of secondary flow channels 1212, and an edge flow channel 1213. The main flow channel 1211 is connected to the flow holes 31 on the two manifolds 3. The secondary flow channels 1212 are connected to the main flow channel 1211. The edge flow channels 1213 extend along at least a portion of the edge of the surface 110. The edge flow channels 1213 and the main flow channel 1211 are connected through the secondary flow channels 1212. The extension directions of the main flow channel 1211 and the secondary flow channels 1212 form an angle, and the main flow channel 1211... The width d1 of the main flow channel 1211 is greater than or equal to the width d2 of the secondary flow channel 1212, thereby enabling a portion of the coolant to flow quickly between the flow hole 31, which serves as the inlet of the coolant flow channel 121, and the flow hole 31, which serves as the outlet of the coolant flow channel 121, through the main flow channel 1211. At the same time, the area that the coolant can reach can be expanded through the secondary flow channel 1212, thereby increasing the total surface area of ​​all the heat exchange blocks 120 included in the heat exchange guiding structure 12, and thus improving the heat exchange efficiency between the coolant and the heat exchange guiding structure 12, so as to improve the heat dissipation performance of the liquid cooling plate.

[0068] Optionally, the heat exchange guiding structure 12 can be 3D printed and disposed on the setting surface 110, so that the heat exchange guiding structure 12 and the substrate 11 can be connected as one piece, and the manufacturing difficulty of the heat exchange guiding structure 12 is relatively low.

[0069] To ensure strong confluence of the main channel 1211, its width d1 can be relatively large. However, an excessively large width d1 would result in an excessively large installation space occupied by the main channel 1211, reducing the number of heat exchange blocks 120, decreasing the heat exchange area between the coolant and the heat exchange guiding structure 12, and decreasing the heat exchange efficiency of the liquid cooling plate. Therefore, the width d1 of the main channel 1211 should not be too large. Furthermore, to prevent adjacent heat exchange blocks 120 from sticking together before solidification, [further measures are needed]. The main channel 1211 is disconnected. The width d1 of the main channel 1211 cannot be too small. Based on this, the width d1 of the main channel 1211 can optionally satisfy 0.2mm≤d1≤2mm. For example, the width d1 of the main channel 1211 can be 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, 1.2mm, 1.5mm, 1.8mm or 2mm, etc.

[0070] To reduce the manufacturing difficulty of the heat exchange guiding structure 12, especially when using 3D printing technology to manufacture the heat exchange guiding structure 12, in order to avoid the adjacent heat exchange blocks 120 sticking together before curing and causing the secondary flow channel 1212 to break, the width d2 of the secondary flow channel 1212 cannot be too small. Based on this, the width d2 of the secondary flow channel 1212 can optionally be greater than or equal to 0.2 mm. For example, the width d2 of the secondary flow channel 1212 can be 0.2 mm, 0.21 mm, 0.22 mm, 0.23 mm, 0.24 mm, 0.25 mm, 0.28 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, or 0.8 mm, etc.

[0071] Furthermore, in order to facilitate the filling of the secondary flow channel 1212 by the coolant, thereby increasing the actual heat exchange area between the coolant and the heat exchange block 120, the width d2 of the secondary flow channel 1212 can be relatively small, so that the coolant can fill the secondary flow channel 1212 under capillary action. Based on this, preferably, the width d2 of the secondary flow channel 1212 can satisfy 0.2mm≤d2≤0.5mm. For example, the width d2 of the secondary flow channel 1212 can be 0.2mm, 0.22mm, 0.24mm, 0.25mm, 0.26mm, 0.28mm, 0.3mm, 0.32mm, 0.34mm, 0.35mm, 0.38mm, 0.4mm, 0.42mm, 0.45mm, 0.48mm or 0.5mm, etc.

[0072] The heat exchange block 120 has a height h3, and thus the height of the coolant flow channel 121 is also h3. In order to reduce the flow resistance in the coolant flow channel 121, the height h3 can be made larger, thereby increasing the flow diameter of the coolant flow channel 121. However, if the height h3 is too large, the space required for the heat exchange guiding structure 12 will be too large, making it difficult to achieve a thinner and lighter design for the liquid cooling plate. Therefore, the height h3 cannot be too large. Optionally, the height h3 of the heat exchange block 120 can satisfy: 1.5mm ≤ h3 ≤ 2.5mm. For example, the height h3 can be 1.5mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm, 2mm, 2.1mm, 2.2mm, 2.3mm, 2.4mm, or 2.5mm, etc.

[0073] Optionally, the extension direction of the main channel 1211 is inclined relative to the first direction S1, and the liquid inlet end 12110 of the main channel 1211 is adjacent to the middle part of the setting surface 110 along the second direction S2, and the liquid outlet end 12111 of the main channel 1211 is adjacent to the edge of the setting surface 110 along the second direction S2. In this way, a portion of the coolant can be quickly guided through the main channel 1211 to the flow hole 31 near the outlet along the first direction S1, and at the same time, to the position near the edge of the setting surface 110 along the second direction S2, so that a portion of the coolant can quickly flow from the position near the flow hole 31 near the outlet and the edge of the setting surface 110 to the flow hole 31, and exchange heat with the heat exchange block 120 between the edge of the setting surface 110 and the flow hole 31, so that the heat dissipation performance of the liquid cooling plate near the flow hole 31 is also better.

[0074] Optionally, the coolant flow channel 121 includes multiple main flow channels 1211, which are arranged at intervals along the second direction S2. Multiple secondary flow channels 1212 are connected between two adjacent main flow channels 1211. By increasing the number of main flow channels 1211, the proportion of coolant flowing directly from the inlet end 12110 of the main flow channel 1211 to the vicinity of the outlet end 12111 is increased, thereby further improving the heat dissipation of the liquid cooling plate near the flow hole 31, which serves as the outlet.

[0075] Preferably, the extension direction of all main channels 1211 can be inclined relative to the first direction S1, and the liquid inlet end 12110 of the main channel 1211 is adjacent to the middle part of the setting surface 110 along the second direction S2, and the liquid outlet end 12111 of the main channel 1211 is adjacent to the edge of the setting surface 110 along the second direction S2, so that the heat dissipation performance of the liquid cooling plate is better when it is close to the flow hole 31 as the outlet.

[0076] For example, the coolant flow channel 121 may include two first main flow channels 1211a and two second main flow channels 1211b, with the two first main flow channels 1211a disposed between the two second main flow channels 1211b.

[0077] Preferably, the width of the first main channel 1211a gradually decreases from the middle to both ends, resulting in smaller flow paths at both ends and larger flow paths in the middle. Most of the coolant flowing from the flow hole 31 into the inlet end 12110 of the first main channel 1211a readily flows to the secondary channel 1212 connected to the inlet end 12110 of the first main channel 1211a, while the middle of the first main channel 1211a can accommodate the flow from the secondary channel. The coolant flowing out of channel 1212 is converged so that the coolant can flow more easily and quickly to the outlet end 12111 of the first main channel 1211a. During the process of flowing to the outlet end 12111 of the first main channel 1211a, as the flow diameter of the first main channel 1211a gradually decreases, some coolant can more easily flow into the secondary channel 1212 connected to the first main channel 1211a to exchange heat with the heat exchange block 120 near the outlet end 12111 of the first main channel 1211a.

[0078] Preferably, the width of the second main channel 1211b gradually increases from the liquid inlet end 12110 of the second main channel 1211b to the liquid outlet end 12111 adjacent to the second main channel 1211b, and the liquid outlet end 12111 of the second main channel 1211b is connected to the edge channel 1213, so that more coolant can be transported from the liquid inlet end 12110 of the second main channel 1211b to the part of the edge channel 1213 near the flow hole 31 which serves as the outlet. This part of coolant can flow into the secondary channel 1212 through the edge channel 1213 and finally flow to the flow hole 31 which serves as the outlet, so that the heat exchange block 120 located between the edge channel 1213 and the flow hole 31 which serves as the outlet can also obtain better heat exchange.

[0079] Optionally, the plurality of secondary flow channels 1212 include a plurality of parallel flow channels 1212a extending along the first direction S1. The parallel flow channels 1212a are located between the liquid inlet end 12110 of the main flow channel 1211 and the edge flow channel 1213. The plurality of parallel flow channels 1212a are distributed at intervals along the second direction S2. One end of the parallel flow channel 1212a is connected to the edge flow channel 1213, and the other end of the parallel flow channel 1212a is connected to the main flow channel 1211 or the secondary flow channel 1212. This allows the coolant that has just entered the coolant flow channel 121 to be quickly guided to the edge flow channel 1213 through the parallel flow channel 1212a, so as to avoid overheating when the coolant flows into the edge flow channel 1213 through other secondary flow channels 1212, thereby improving the heat exchange performance of the liquid cooling plate at the corresponding edge flow channel 1213.

[0080] Optionally, a portion of the multiple heat exchange blocks 120 is a turbulence forming block 1201. There are multiple turbulence forming blocks 1201, and the cross-sectional shape of the turbulence forming block 1201 is a rhombus with smooth transition at the edges and corners. The turbulence forming block 1201 is located at the center of the setting surface 110 along the second direction S2, and the multiple turbulence forming blocks 1201 are arranged at intervals along the first direction S1. This makes it easier for the coolant to form turbulence when it flows through the vicinity of the outer periphery of the turbulence forming block 1201, so that the coolant has greater kinetic energy, which is beneficial to improving the convective heat transfer coefficient and also beneficial to improving the flow velocity of the coolant from the vicinity of the turbulence forming block 1201 to other main channels 1211 and secondary channels 1212.

[0081] Optionally, the cover plate 2 can be detachably connected to the substrate 11, so that the cover plate 2 and the substrate 11 can be manufactured separately, which reduces manufacturing difficulty and process cost. For example, the cover plate 2 is fixed to the frame portion 113 of the substrate 11 by welding.

[0082] Additionally, a locking mechanism 4 can be provided on the frame portion 113 of the substrate 11 to fix the entire liquid cooling plate at the location where the electronic device needs to be cooled. The locking mechanism 4 can be any existing mechanism that can press and lock the two structures together, which will not be described in detail in this embodiment.

[0083] Optionally, the flow divider 3 can be detached from the heat exchange block 120 so that the heat exchange block 120 and the flow divider 3 are set separately, thereby making both the heat exchange block 120 and the flow divider 3 easier to manufacture. Alternatively, the flow divider 3 can be 3D printed and set on the heat exchange block 120, thereby improving the tightness of the connection between the flow divider 3 and the heat exchange block 120.

[0084] Optionally, both the cover plate 2 and the flow divider 3 are 3D printed and set on the base plate 1. That is, the flow divider 3 is 3D printed and set on the heat exchange block 120, and the cover plate 2 is 3D printed and set on the flow divider 3 and the frame portion 113, so that the overall sealing performance of the liquid cooling plate is better and it is less likely to leak coolant.

[0085] Optionally, the cover plate 2 may also be provided with an inlet connector 210 at the liquid inlet 21 and an outlet connector 220 at the liquid outlet 22, so as to facilitate the connection of external liquid delivery and liquid discharge pipes.

[0086] Optionally, the inlet connector 210 and the outlet connector 220 can be 3D printed onto the cover plate 2, thereby improving the sealing performance of the connection between the inlet connector 210 and the liquid inlet 21, and between the outlet connector 220 and the liquid outlet 22.

[0087] This embodiment also provides an electronic device, including: a heat-generating electronic device and a liquid cooling plate as described in the foregoing technical solution. The bottom plate 1 of the liquid cooling plate is disposed on the side opposite to the cover plate 2 and facing the heat-generating electronic device. Since the heat dissipation performance of the liquid cooling plate described in the foregoing technical solution is more consistent in various positions, it can significantly alleviate the overheating of some heat-generating electronic devices during use.

[0088] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A liquid-cooled plate, characterized in that, include: The base plate (1) includes a substrate (11) and a heat exchange and flow guiding structure (12). The substrate (11) has a mounting surface (110). The heat exchange and flow guiding structure (12) is disposed on the mounting surface (110). The heat exchange and flow guiding structure (12) includes a plurality of spaced heat exchange blocks (120). Cooling liquid flow channels (121) are formed on the outer periphery of the heat exchange blocks (120). A cover plate (2) is provided to seal the substrate (11) and cover the heat exchange guiding structure (12). The cover plate (2) has two independent receiving grooves (20), the openings of which face the heat exchange guiding structure (12). The cover plate (2) is also provided with an inlet (21) and an outlet (22) respectively connected to the two receiving grooves (20). Two flow dividers (3) are located between the cover plate (2) and the heat exchange guide structure (12), and the two flow dividers (3) are respectively covered on the openings of the two receiving tanks (20). The flow dividers (3) are provided with flow holes (31) that connect the receiving tank (20) and the coolant flow channel (121). The side of the flow divider (3) away from the receiving tank (20) abuts against the end face of the heat exchange block (120) away from the setting surface (110).

2. The liquid cooling plate according to claim 1, characterized in that, The substrate (11) is made of diamond copper, and / or the heat exchange block (120) is made of pure copper or copper alloy.

3. The liquid cooling plate according to claim 1, characterized in that, The substrate (11) has a groove (111) on one side, and the bottom surface of the groove (111) is formed as the mounting surface (110). The substrate (11) includes a thinning portion (112) and a frame portion (113) connected to each other. The frame portion (113) surrounds the outer periphery of the thinning portion (112), and the groove (111) is formed between the frame portion (113) and the thinning portion (112). The cover plate (2) is sealed to the frame portion (113).

4. The liquid cooling plate according to claim 3, characterized in that, The border portion (113) has a thickness h1, where 1.1 mm ≤ h1 ≤ 1.4 mm.

5. The liquid cooling plate according to claim 3, characterized in that, The thinned portion (112) has a thickness h2, 0.9 mm ≤ h2 ≤ 1.1 mm.

6. The liquid cooling plate according to claim 1, characterized in that, The flow hole (31) is a cross-shaped hole.

7. The liquid cooling plate according to claim 1, characterized in that, The two receiving slots (20) are arranged at intervals along a first direction; The flow hole (31) includes a first strip hole (311) and a second strip hole (312) that are arranged in opposite directions and connected to each other. The first strip hole (311) extends along the first direction, and the second strip hole (312) extends along the second direction. Wherein, the first direction is perpendicular to the second direction, and both the first direction and the second direction are parallel to the setting surface (110).

8. The liquid-cooled plate according to any one of claims 1-7, characterized in that, The flow divider plate (3) is provided with a plurality of flow holes (31) spaced apart.

9. The liquid-cooled plate according to any one of claims 1-7, characterized in that, The side of the base plate (1) facing away from the cover plate (2) is arranged to face at least one heat source. Corresponding to any one of the heat sources, the flow divider plate (3) has at least one flow hole (31).

10. The liquid cooling plate according to claim 1, characterized in that, The two receiving slots (20) are arranged at intervals along the first direction, and all the heat exchange blocks (120) and the flow holes (31) are symmetrically arranged along the second direction; Wherein, the first direction is perpendicular to the second direction, and both the first direction and the second direction are parallel to the setting surface (110).

11. The liquid-cooled plate according to any one of claims 1-7 or claim 10, characterized in that, The coolant flow channel (121) includes a main flow channel (1211), a plurality of secondary flow channels (1212), and an edge flow channel (1213). The main flow channel (1211) is connected to the flow holes (31) on the two flow dividers (3). The secondary flow channels (1212) are connected to the main flow channel (1211). The edge flow channels (1213) extend along at least a portion of the edge of the setting surface (110). The edge flow channels (1213) and the main flow channel (1211) are connected through the secondary flow channels (1212). The main flow channel (1211) and the secondary flow channel (1212) extend at an angle, and the width d1 of the main flow channel (1211) is greater than or equal to the width d2 of the secondary flow channel (1212).

12. The liquid cooling plate according to claim 11, characterized in that, The width d2 of the secondary flow channel (1212) is greater than or equal to 0.2 mm.

13. The liquid cooling plate according to claim 11, characterized in that, 0.2mm≤d1≤2mm, 0.2mm≤d2≤0.5mm; and / or, The heat exchange block (120) has a height h3, 1.5mm≤h3≤2.5mm.

14. The liquid-cooled plate according to claim 11, characterized in that, The two receiving tanks (20) are spaced apart along a first direction, the extension direction of the main channel (1211) is inclined relative to the first direction, and the liquid inlet (12110) of the main channel (1211) is adjacent to the middle of the setting surface (110) along the second direction, and the liquid outlet (12111) of the main channel (1211) is adjacent to the edge of the setting surface (110) along the second direction; Wherein, the first direction is perpendicular to the second direction, and both the first direction and the second direction are parallel to the setting surface (110).

15. The liquid-cooled plate according to claim 11, characterized in that, The coolant flow channel (121) includes a plurality of main flow channels (1211), which are spaced apart along a second direction; Multiple secondary channels (1212) are connected between two adjacent main channels (1211).

16. The liquid-cooled plate according to claim 15, characterized in that, The coolant flow channel (121) includes two first main flow channels (1211a) and two second main flow channels (1211b). The two first main flow channels (1211a) are located between the two second main flow channels (1211b). The width of the first main flow channel (1211a) gradually decreases from the middle of the first main flow channel (1211a) to both ends. The width of the second main flow channel (1211b) gradually increases from the inlet end (12110) of the second main flow channel (1211b) to the outlet end (12111) adjacent to the second main flow channel (1211b). The outlet end (12111) of the second main flow channel (1211b) is connected to the edge flow channel (1213).

17. The liquid cooling plate according to claim 11, characterized in that, Among the plurality of secondary channels (1212), there are a plurality of parallel channels (1212a) extending along a first direction. The parallel channels (1212a) are located between the liquid inlet end (12110) of the main channel (1211) and the edge channel (1213). The plurality of parallel channels (1212a) are distributed at intervals along a second direction. One end of the parallel channel (1212a) is connected to the edge channel (1213), and the other end of the parallel channel (1212a) is connected to the main channel (1211) or the secondary channel (1212).

18. The liquid-cooled plate according to any one of claims 1-7 or claim 10, characterized in that, A portion of the multiple heat exchange blocks (120) is a turbulence forming block (1201). There are multiple turbulence forming blocks (1201). The cross-sectional shape of the turbulence forming block (1201) is a rhombus with smooth corner transitions. The turbulence forming block (1201) is located at the center of the setting surface (110) along the second direction, and the multiple turbulence forming blocks (1201) are arranged at intervals along the first direction.

19. The liquid cooling plate according to any one of claims 1-7 or claim 10, characterized in that, The heat exchange guiding structure (12) is 3D printed and disposed on the setting surface (110); and / or, The cover plate (2) is detachably connected to the substrate (11), and the flow divider (3) is detachably or 3D printed on the heat exchange block (120); or, the cover plate (2) and the flow divider (3) are both 3D printed on the base plate (1).

20. An electronic device, characterized in that, include: The heat-generating electronic device and the liquid cooling plate as described in any one of claims 1-19, wherein the bottom plate (1) of the liquid cooling plate is disposed on the side opposite to the cover plate (2) facing the heat-generating electronic device.

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