Heat dissipation structure and testing device

Abstract

The application relates to a heat dissipation structure and a testing device, and relates to the technical field of vehicle testing equipment. The heat dissipation structure comprises a base assembly, a heat dissipation shielding assembly and an air cooling assembly. The base assembly comprises a base and a carrier module. The carrier module is arranged on the top of the base and is configured to carry a to-be-tested module. The heat dissipation shielding assembly is arranged outside the carrier module and forms a testing cavity. The air cooling assembly is arranged inside the heat dissipation shielding assembly and is configured to abut against the to-be-tested module and conduct heat. The heat dissipation shielding assembly is configured to provide electromagnetic shielding and to conduct heat to the outside environment. The technical scheme disclosed by the application can solve the problem that the existing testing device cannot meet the heat dissipation requirement of an intelligent cockpit module during the testing process.

Description

Technical Field

[0001] This application relates to the field of vehicle testing equipment technology, and in particular to a heat dissipation structure and testing device. Background Technology

[0002] With the development of intelligent and connected vehicles, smart cockpit modules are becoming increasingly complex and integrated to meet diverse market demands. To ensure the stability and reliability of smart cockpit modules, multi-dimensional testing is necessary, with radio frequency (RF) testing being crucial for evaluating their wireless communication capabilities. During testing, to meet signal shielding requirements, the module under test (DUT) must be placed in a sealed shielded enclosure. However, this sealed environment leads to heat dissipation difficulties, preventing the heat generated by the module from being effectively dissipated. This affects the stability of RF devices, especially causing the FT calibration curve to exceed the linear region, resulting in distorted test data and impacting test results. This has become a technical bottleneck restricting testing efficiency and quality. Utility Model Content

[0003] This application provides a heat dissipation structure and testing device to solve the problem that existing testing devices cannot meet the heat dissipation requirements of smart cockpit modules during testing.

[0004] In a first aspect, this application provides a heat dissipation structure, including: A base assembly includes a base and a carrier module, wherein the carrier module is disposed on top of the base and is configured to carry the module under test; A heat dissipation shielding assembly is installed on the outside of the vehicle module to form a test cavity; An air-cooling component is disposed inside the heat dissipation shielding component, and the air-cooling component is configured to come into contact with the module under test and conduct heat. The heat dissipation shielding component is configured to provide electromagnetic shielding and dissipate the heat to the external environment.

[0005] In some embodiments, the heat dissipation shielding component includes a heat dissipation housing, on which a heat dissipation hole array is provided, wherein the aperture d of the heat dissipation hole array satisfies d < λ / 20, and λ is the wavelength corresponding to the highest frequency of the module under test.

[0006] In some embodiments, the air-cooled assembly includes: A support module is disposed inside the heat dissipation box and above the carrier module, and the support module is provided with a vent that runs through the height direction; A heat dissipation block is disposed on the support module and located between the support module and the carrier module. The heat dissipation block is configured to be movable along the height direction to abut against the module under test. A suction module is located at the top of the support module; Specifically, on a plane perpendicular to the height direction, the projected outline of the air vent is located within the projected outline of the heat dissipation block, and the projected outline of the air vent is located within the projected outline of the air intake module, so as to introduce air from the external environment into the heat dissipation block.

[0007] In some embodiments, the heat dissipation structure includes an exhaust module located outside the heat dissipation box and connected to the top of the heat dissipation box; wherein, on a plane perpendicular to the height direction, the projection of the exhaust module does not overlap with the projection of the suction module.

[0008] In some embodiments, the heat dissipation hole array includes: Two first heat dissipation hole groups are disposed on the top of the heat dissipation box and arranged at intervals along the length direction, and the two first heat dissipation hole groups correspond one-to-one with the air intake module and the air exhaust module, respectively; Two second heat dissipation hole groups are respectively disposed on both sides of the heat dissipation box in the width direction; wherein, on a plane perpendicular to the width direction, the projected outline of the second heat dissipation hole group overlaps at least partially with the projected outline of the heat dissipation pressure block, and the projected outline of the second heat dissipation hole group does not overlap with the projected outline of the exhaust module.

[0009] In some embodiments, the air-cooled assembly includes: A linear guide module is movably inserted through the support module along the height direction, and the lower end of the linear guide module is connected to the heat dissipation pressure block; A positioning module is disposed on the support module, and the positioning module is used to abut against the vehicle module; The air-cooling assembly also includes a fixing module. The heat dissipation block is connected to the support module through the fixing module, and the linear guide module is configured to drive the heat dissipation block to move along the height direction.

[0010] In some embodiments, the heat sink includes: The housing has a top opening and a bottom opening that are connected to each other. A lid is detachably provided on the top of the housing to selectively open or close the upper opening; The base is located on the side of the housing.

[0011] In some embodiments, the base assembly includes: A relay module is disposed on top of the base to close the opening of the base, and a vehicle module is disposed on top of the relay module; A lifting module is movably installed in the relay module along the height direction. The lifting module is connected to the heat dissipation shielding component and is configured to drive the heat dissipation shielding component to move along the height direction to open and close the test chamber.

[0012] In some embodiments, the air-cooling assembly includes a temperature sensor disposed inside the heat dissipation block to detect the temperature inside the test chamber.

[0013] Secondly, this application provides a testing apparatus, including the heat dissipation structure as described in the first aspect.

[0014] The technical solutions provided in this application have the following advantages compared with the prior art: The heat dissipation structure provided in this application embodiment can meet the electromagnetic shielding requirements of radio frequency testing and conduct heat to the external environment through the heat dissipation shielding component, thus solving the core contradiction between shielding and heat dissipation. By connecting the air-cooling component with the module under test, a heat dissipation path is constructed between the air-cooling component and the module under test, ensuring the stability of heat conduction, effectively suppressing the temperature rise of the module under test, avoiding the FT calibration curve from deviating from the linear region due to the temperature rise of the module under test, reducing test data distortion, and ensuring the accuracy and validity of radio frequency test results. Attached Figure Description

[0015] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0018] Figure 1 This is a three-dimensional structural diagram of the heat dissipation structure provided in the embodiments of this application; Figure 2 This is an exploded view of the heat dissipation structure provided in the embodiments of this application; Figure 3 A three-dimensional structural diagram of the base assembly provided in the embodiments of this application; Figure 4 This is an exploded structural diagram of the base assembly provided in an embodiment of this application; Figure 5 A three-dimensional structural schematic diagram of the heat dissipation shielding component provided in an embodiment of this application; Figure 6 An exploded view of the heat dissipation shielding assembly provided in an embodiment of this application; Figure 7 A three-dimensional structural schematic diagram of the air-cooled component provided in the embodiments of this application; Figure 8 This is an exploded structural diagram of the air-cooled component provided in an embodiment of this application.

[0019] Explanation of reference numerals in the attached figures: 10. Base assembly; 110. Base; 120. Lifting module; 130. Vehicle module; 140. Relay module; 1401. Tank; 150. Locking module; 20. Heat dissipation shielding assembly; 210. Heat dissipation enclosure; 2101. Housing; 2102. Cover; 2103. Base; 220. Heat dissipation hole array; 2201. First heat dissipation hole group; 2202. Second heat dissipation hole group; 230. Quick-release module; 30. Air-cooled assembly; 310. Support module; 3101. Positioning base plate; 3102. Positioning bracket; 3103. Air vent; 320. Heat dissipation block; 330. Air intake module; 340. Linear guide module; 350. Positioning module; 360. Fixing module; 40. Exhaust module. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] The following disclosure provides numerous different embodiments or examples for implementing various structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0022] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0023] To ensure the stable operation and functional reliability of smart cockpit modules in complex in-vehicle environments, their performance indicators need to be verified through multi-dimensional testing. Among these, radio frequency (RF) testing is a crucial step in evaluating the wireless communication capabilities of smart cockpit modules. During RF testing, to avoid external electromagnetic interference and meet stringent signal shielding standards, the smart cockpit module under test is typically placed in a sealed shielded enclosure. However, this sealed environment leads to heat dissipation difficulties, preventing the heat generated by the module from being effectively dissipated and affecting the stability of RF components. For example, during calibration, the calibration temperature of the main frequency crystal needs to be between 20 and 40°C. After the smart cockpit module is powered on, the crystal temperature can reach around 50°C, causing the FT calibration curve to exceed the linear region, resulting in distorted test data and affecting test results. This has become a technical bottleneck restricting testing efficiency and quality.

[0024] To address the aforementioned technical issues, such as Figure 1 , Figure 2 As shown, this application embodiment provides a heat dissipation structure, including a base assembly 10, a heat dissipation shielding assembly 20, and an air-cooling assembly 30; the base assembly 10 includes a base 110 and a carrier module 130, the carrier module 130 is disposed on the top of the base 110, and the carrier module 130 is configured to carry the module under test; the heat dissipation shielding assembly 20 covers the outside of the carrier module 130 and forms a test cavity; the air-cooling assembly 30 is disposed inside the heat dissipation shielding assembly 20, and the air-cooling assembly 30 is configured to come into contact with the module under test and conduct heat; wherein, the heat dissipation shielding assembly 20 is configured to provide electromagnetic shielding and conduct heat to the external environment.

[0025] As can be seen from the above, the heat dissipation shielding component 20 can not only meet the electromagnetic shielding requirements of RF testing, but also conduct heat to the external environment, thus solving the core contradiction between shielding and heat dissipation. By connecting the air-cooling component 30 with the module under test, a heat dissipation path is constructed between the air-cooling component 30 and the module under test, ensuring the stability of heat conduction, effectively suppressing the temperature rise of the module under test, avoiding the FT calibration curve from deviating from the linear region due to the temperature rise of the module under test, reducing test data distortion, and ensuring the accuracy and validity of RF test results.

[0026] It should be noted that, as Figure 1 , Figure 2 As shown, the height direction is parallel to the Z direction, the length direction is parallel to the X direction, and the width direction is parallel to the Y direction.

[0027] It should also be noted that the module under test is a smart cockpit module; the vehicle module 130 and the heat dissipation block 320 can be replaced as needed to adapt to and be compatible with different specifications of the module under test. Specifically, the vehicle module 130 is provided with a first positioning groove to adapt to the shape of the module under test and serve a positioning function; the heat dissipation block 320 includes an upper end surface and a lower end surface arranged opposite each other in the height direction, the upper end surface is provided with multiple heat sinks, and the lower end surface is provided with a second positioning groove to adapt to the shape of the module under test and serve a positioning function. It can be understood that vehicle modules 130 and heat dissipation modules that are compatible with various specifications of smart cockpit modules can be set. The heat dissipation structure of this application can achieve compatibility with different specifications of smart cockpit modules through the matching vehicle module 130 and heat dissipation module, thereby eliminating the need to replace the entire heat dissipation structure and saving investment costs.

[0028] like Figure 2 , Figure 5 , Figure 6 As shown in some embodiments, the heat dissipation shielding component 20 includes a heat dissipation box 210, on which a heat dissipation hole array 220 is provided, wherein the aperture d of the heat dissipation hole array 220 satisfies d < λ / 20, where λ is the wavelength corresponding to the highest frequency of the module under test.

[0029] By creating an airflow channel through the heat dissipation hole array 220, the heat generated by the module under test (DUT) on the carrier module 130 can be exhausted through the heat dissipation hole array 220, while external air can also enter through the heat dissipation hole array 220, thus forming convection cooling. Compared with existing sealed shielded enclosures, this application can remove heat in a timely manner, avoiding test data distortion. Since the aperture d of the heat dissipation hole array 220 is less than λ / 20, it can not only block external interference signals from entering the test area but also prevent the leakage of RF signals generated by the DUT, thereby meeting the environmental requirements for RF testing without electromagnetic interference.

[0030] It should be noted that electromagnetic waves leak when passing through the aperture, and the degree of attenuation is directly related to the aperture / wavelength ratio (d / λ). The wavelength λ corresponding to the highest frequency is the smallest. Therefore, using the highest frequency as a reference can cover the shielding requirements of all low-frequency components. For example, when the operating frequency band of the module under test is 1GHz to 77GHz, the aperture d is calculated using the wavelength corresponding to 77GHz.

[0031] It should also be noted that heat dissipation holes include, but are not limited to, round holes.

[0032] like Figure 2 , Figure 7 , Figure 8 As shown, in some embodiments, the air-cooled assembly 30 includes a support module 310, a heat dissipation block 320, and an air intake module 330. The support module 310 is disposed inside the heat dissipation box 210 and above the carrier module 130. The support module 310 is provided with a vent 3103 that extends through the height direction. The heat dissipation block 320 is disposed on the support module 310 and located between the support module 310 and the carrier module 130. The heat dissipation block 320 is configured to be movable along the height direction to abut against the receiving module. The air intake module 330 is disposed on the top of the support module 310. In a plane perpendicular to the height direction, the projected outline of the vent 3103 is located within the projected outline of the heat dissipation block 320, and the projected outline of the vent 3103 is located within the projected outline of the air intake module 330, so as to introduce air from the external environment into the heat dissipation block 320.

[0033] External air is introduced through the suction module 330 and acts on the heat dissipation block 320. Since the projected contours of the air vents 3103 and the suction module 330 are both located within the projected contours of the heat dissipation block 320, external air can directly act on the heat dissipation block 320, quickly removing heat from the module under test conducted by the heat dissipation block 320. This forms an airflow circulation path: external air—suction module 330—air vents 3103—heat dissipation block 320—hot air inside the enclosure—heat dissipation hole array 220—external environment, achieving directional cooling and improving heat dissipation efficiency. Furthermore, the heat dissipation block 320 can move along its height to ensure close contact with the module under test, further enhancing heat conduction.

[0034] It should be noted that the number of air vents 3103 can be one or multiple, such as Figure 8 As shown, there are multiple air vents 3103.

[0035] It should also be noted that, such as Figure 7 , Figure 8As shown, the support module 310 includes a positioning base plate 3101 and a positioning bracket 3102. The two positioning brackets 3102 are arranged at intervals in the width direction and are connected to the positioning base plate 3101 by fasteners. The positioning brackets 3102 are connected to the inner wall of the heat dissipation box 210 by fasteners.

[0036] It should also be noted that, such as Figure 7 , Figure 8 As shown, the suction module 330 is mounted on the positioning base plate 3101 by fasteners; in addition, the suction module 330 includes, but is not limited to, a reverse turbine suction structure, which achieves convection heat dissipation through centrifugal negative pressure suction.

[0037] like Figure 2 , Figure 7 , Figure 8 As shown, in some embodiments, the heat dissipation structure includes an exhaust module 40, which is located outside the heat dissipation box 210 and connected to the top of the heat dissipation box 210; wherein, on a plane perpendicular to the height direction, the projection of the exhaust module 40 does not overlap with the projection of the suction module 330.

[0038] The suction module 330 and the exhaust module 40 work together to create an airflow drive mechanism for suction and exhaust. Specifically, the suction module 330 draws in air from the outside, which is directed to the heat sink 320 through the air vents 3103 for heat dissipation. The exhaust module 40 draws hot air from the top of the heat sink 210. Since the two modules are on a plane perpendicular to the height direction, their projections do not overlap, preventing airflow short-circuiting and forming an orderly airflow path. This accelerates the rate at which hot air is exhausted from the heat sink, achieving rapid heat dissipation and further suppressing performance fluctuations in the module under test caused by high temperatures. Simultaneously, because hot air has a low density and rises easily, the top of the heat sink 210 is an area where hot air easily accumulates. The exhaust module 40 is directly connected to the top of the heat sink and actively exhausts air from this area, further ensuring the temperature stability of all components in the module under test.

[0039] It should be noted that the exhaust module 40 and the suction module 330 can be arranged at intervals in the length direction and / or the width direction to avoid airflow short-circuiting and form an orderly airflow path.

[0040] like Figure 2 , Figure 5As shown, in some embodiments, the heat dissipation hole array 220 includes two first heat dissipation hole groups 2201 and two second heat dissipation hole groups 2202; the two first heat dissipation hole groups 2201 are disposed on the top of the heat dissipation box 210 and arranged at intervals along the length direction, and the two first heat dissipation hole groups 2201 correspond one-to-one with the air intake module 330 and the air exhaust module 40 respectively; the two second heat dissipation hole groups 2202 are respectively disposed on both sides of the heat dissipation box 210 in the width direction; wherein, on the plane perpendicular to the width direction, the projected outline of the second heat dissipation hole group 2202 overlaps at least partially with the projected outline of the heat dissipation pressure block 320, and the projected outline of the second heat dissipation hole group 2202 does not overlap with the projected outline of the air exhaust module 40.

[0041] By setting up first heat dissipation hole groups 2201 that correspond one-to-one with the suction module 330 and the exhaust module 40 respectively, channels are provided for the suction module 330 and the exhaust module 40 to communicate with the interior of the heat dissipation box 210, providing a structural basis for forming airflow channels for suction and exhaust. By having the projected outline of the second heat dissipation hole group 2202 at least partially overlap with the projected outline of the heat dissipation block 320, the heat conducted by the heat dissipation block 320 can be quickly diffused to the external environment through the second heat dissipation hole group 2202, avoiding the accumulation of heat in the heat dissipation box 210. At the same time, the projected outline of the second heat dissipation hole group 2202 is set to not overlap with the projected outline of the exhaust module 40, preventing the exhaust module 40 from directly drawing the airflow of the second heat dissipation hole group 2202, ensuring that the airflow can fully act on the heat dissipation block 320 before being discharged.

[0042] It should be noted that both the first heat dissipation hole group 2201 and the second heat dissipation hole group 2202 include multiple heat dissipation holes.

[0043] like Figure 7 , Figure 8 As shown, in some embodiments, the air-cooling assembly 30 includes a linear guide module 340 and a positioning module 350; the linear guide module 340 is movably disposed through the support module 310 along the height direction, and the lower end of the linear guide module 340 is connected to the heat dissipation block 320; the positioning module 350 is disposed on the support module 310 and is used to abut against the carrier module 130; wherein, the air-cooling assembly 30 also includes a fixing module 360, the heat dissipation block 320 is connected to the support module 310 through the fixing module 360, and the linear guide module 340 is configured to drive the heat dissipation block 320 to move along the height direction.

[0044] By setting the linear guide module 340 to drive the heat dissipation module downward, and combining the positioning module 350 with the carrier module 130 for abutment calibration, the positioning accuracy of the heat dissipation block 320 in the height direction can be improved, avoiding poor contact due to offset. The fixing module 360 ​​connects the heat dissipation block 320 and the support module 310, ensuring that the two can maintain a fixed relative position and avoiding offset due to vibration or external force.

[0045] It should be noted that the linear guide module 340 includes, but is not limited to, the lead screw linear module and the cylinder linear module. The specific structure and working principle of the linear guide module 340 are existing technologies and will not be described in detail in this application. In addition, the positioning module 350 includes, but is not limited to, the positioning rod, and the positioning accuracy of the positioning module 350 is ±0.02mm.

[0046] It should also be noted that the fixing module 360 ​​can be a height-equalizing bolt, which serves as a height-equalizing positioning and lateral limiting mechanism, so that after the heat dissipation block 320 is installed on the support module 310, the lower end face of the heat dissipation block 320 is at the same height as the support module 310. In addition, the connection between the height-equalizing bolt and the heat dissipation block 320 can adopt a dynamic floating connection, for example, by reserving an active gap or using an elastic element, so that the heat dissipation block 320 can float in the height direction, thereby enabling the linear guide module 340 to drive the heat dissipation block 320 to move relative to the support module 310, improving the contact accuracy between the heat dissipation block 320 and the module under test.

[0047] It should also be noted that there can be multiple linear guide modules 340 and positioning modules 350; for example, Figure 7 , Figure 8 As shown, four linear guide modules 340 are respectively disposed at the corners of the heat dissipation pressure block 320, and four positioning modules 350 are respectively disposed at the corners of the support module 310.

[0048] It should also be noted that there can be multiple fixed modules 360; for example, such as Figure 7 , Figure 8 As shown, two fixed modules 360 are respectively set on both sides of the heat dissipation pressure block 320.

[0049] like Figure 5 , Figure 6 As shown, in some embodiments, the heat dissipation enclosure 210 includes a housing 2101, a cover 2102, and a base 2103; the top and bottom of the housing 2101 are respectively provided with a communicating upper opening and a lower opening; the cover 2102 is detachably provided with the top of the housing 2101 to selectively open or close the upper opening; the base 2103 is provided on the side of the housing 2101.

[0050] The removable cover 2102 allows for quick adjustment and replacement of the air-cooling components 30 and other components within the housing 2101. The cover 2102 and housing 2101 together form a space capable of accommodating the vehicle module 130 and the air-cooling components 30, effectively shielding the upper space of the vehicle module 130. The base 2103 facilitates the installation of the lifting module 120, providing a structural foundation for the lifting module 120 to drive the heat sink 210 to move vertically.

[0051] It should be noted that the lid 2102 is connected to the housing 2101 via a quick-release module 230. The quick-release module 230 includes, but is not limited to, snap-fit, which enables the lid 2102 to be quickly disassembled, and is simple and convenient.

[0052] It should also be noted that, such as Figure 5 , Figure 6 As shown, the bases 2103 are respectively disposed on both sides of the housing 2101 in the width direction, and the bases 2103 can be connected to the housing 2101 by fasteners.

[0053] In some embodiments, the base assembly 10 includes a relay module 140 and a lifting module 120; the relay module 140 is disposed on top of the base 110 to close the opening of the base 110, and the carrier module 130 is disposed on top of the relay module 140; the lifting module 120 is movably inserted through the relay module 140 along the height direction, the lifting module 120 is connected to the heat dissipation shielding assembly 20, and is configured to drive the heat dissipation shielding assembly 20 to move along the height direction to open and close the test chamber. Figure 3 , Figure 4 As shown, in some embodiments, the relay module 140 is provided with a slot 1401 through which the lifting module 120 passes.

[0054] By setting up a relay module 140 to enclose the base 110, not only can heat be blocked from being conducted to the base 110, but a continuous electromagnetic shielding layer can also be formed with the base 110, effectively shielding the lower space of the carrier module 130; in addition, it also prevents foreign objects and dust from entering the interior of the base 110. At the same time, the lifting module 120 drives the heat dissipation shielding component 20 to move along the height direction, so that the test chamber can be opened, and the heat dissipation pressure block 320 can flexibly avoid obstacles, making it convenient for users to place the module under test.

[0055] It should be noted that the relay module 140 is connected to the base 110 and the vehicle module 130 respectively by means of fasteners, including but not limited to fasteners.

[0056] It should also be noted that, such as Figure 3 , Figure 4As shown, the base assembly 10 also includes a locking module 150, which is used to connect the relay module 140 and the base 110. By setting the locking module 150, the relay module 140 can be prevented from shifting during the test. The locking module 150 includes, but is not limited to, mechanical grippers, electromagnetic locks, wedge block locks, and locking buckles. This application does not impose specific limitations. In addition, the locking modules 150 are located on both sides of the base 110, and multiple locking modules 150 can be arranged at intervals on each side.

[0057] It should also be noted that the lifting module 120 corresponds one-to-one with the slot 1401, and the lifting module 120 is inserted into the corresponding slot 1401; for example, as Figure 3 , Figure 4 As shown, the two lifting modules 120 are arranged at intervals along the width direction and are respectively located on the inner wall of the base 110. The relay module 140 is provided with two slots 1401, and the two slots 1401 correspond one-to-one with the two lifting modules 120.

[0058] It should also be noted that the lifting module 120 includes, but is not limited to, the lead screw linear module and the cylinder linear module. The specific structure and working principle of the lifting module 120 are existing technologies and will not be described in detail in this application.

[0059] In some embodiments, the air-cooled assembly 30 includes a temperature sensor disposed inside the heat dissipation block 320 to detect the temperature inside the test chamber.

[0060] By setting a temperature sensor, the ambient temperature of the test chamber can be detected, the heat dissipation effect can be monitored, and temperature anomalies can be detected in time, thereby improving the reliability of the heat dissipation structure.

[0061] This application also provides a testing device, including the heat dissipation structure provided in the foregoing embodiments of this application.

[0062] It should be noted that the testing device includes testing instruments. For example, when the module under test is subjected to radio frequency testing, the testing instrument is a radio frequency testing instrument, which is used to generate and analyze radio frequency signals and verify the communication performance of the module under test.

[0063] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0064] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0065] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A heat dissipation structure, characterized in that, include: A base assembly includes a base and a carrier module, wherein the carrier module is disposed on top of the base and is configured to carry the module under test; A heat dissipation shielding assembly is installed on the outside of the vehicle module to form a test cavity; An air-cooling component is disposed inside the heat dissipation shielding component, and the air-cooling component is configured to come into contact with the module under test and conduct heat. The heat dissipation shielding component is configured to provide electromagnetic shielding and dissipate the heat to the external environment.

2. The heat dissipation structure according to claim 1, characterized in that, The heat dissipation shielding component includes a heat dissipation box, on which a heat dissipation hole array is provided, wherein the aperture d of the heat dissipation hole array satisfies d < λ / 20, where λ is the wavelength corresponding to the highest frequency of the module under test.

3. The heat dissipation structure according to claim 2, characterized in that, The air-cooling component includes: A support module is disposed inside the heat dissipation box and above the carrier module, and the support module is provided with a vent that runs through the height direction; A heat dissipation block is disposed on the support module and located between the support module and the carrier module. The heat dissipation block is configured to move along the height direction to abut against the module under test. A suction module is located at the top of the support module; Specifically, on a plane perpendicular to the height direction, the projected outline of the air vent is located within the projected outline of the heat dissipation block, and the projected outline of the air vent is located within the projected outline of the air intake module, so as to introduce air from the external environment into the heat dissipation block.

4. The heat dissipation structure according to claim 3, characterized in that, The heat dissipation structure includes an exhaust module located outside the heat dissipation box and connected to the top of the heat dissipation box; wherein, on a plane perpendicular to the height direction, the projection of the exhaust module does not overlap with the projection of the suction module.

5. The heat dissipation structure according to claim 4, characterized in that, The heat dissipation hole array includes: Two first heat dissipation hole groups are disposed on the top of the heat dissipation box and arranged at intervals along the length of the heat dissipation box. The two first heat dissipation hole groups correspond one-to-one with the air intake module and the air exhaust module, respectively. Two second heat dissipation hole groups are respectively disposed on both sides of the heat dissipation box in the width direction; wherein, on a plane perpendicular to the width direction, the projected outline of the second heat dissipation hole group overlaps at least partially with the projected outline of the heat dissipation pressure block, and the projected outline of the second heat dissipation hole group does not overlap with the projected outline of the exhaust module.

6. The heat dissipation structure according to claim 3, characterized in that, The air-cooling component includes: A linear guide module is movably inserted through the support module along the height direction, and the lower end of the linear guide module is connected to the heat dissipation pressure block; A positioning module is disposed on the support module, and the positioning module is used to abut against the vehicle module; The air-cooling assembly also includes a fixing module. The heat dissipation block is connected to the support module through the fixing module, and the linear guide module is configured to drive the heat dissipation block to move along the height direction.

7. The heat dissipation structure according to any one of claims 2-6, characterized in that, The heat dissipation enclosure includes: The housing has a top opening and a bottom opening that are connected to each other. A lid is detachably provided on the top of the housing to selectively open or close the upper opening; The base is located on the side of the housing.

8. The heat dissipation structure according to any one of claims 1-6, characterized in that, The base assembly includes: A relay module is disposed on top of the base to close the opening of the base, and a vehicle module is disposed on top of the relay module; A lifting module is movably installed in the relay module along the height direction. The lifting module is connected to the heat dissipation shielding component and is configured to drive the heat dissipation shielding component to move along the height direction to open and close the test chamber.

9. The heat dissipation structure according to any one of claims 3-6, characterized in that, The air-cooling component includes a temperature sensor, which is disposed inside the heat dissipation block to detect the temperature inside the test chamber.

10. A testing apparatus, characterized in that, Includes the heat dissipation structure as described in any one of claims 1-9.

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